Chemnitz UT: Center for Microtechnol...: Equipment and services
Center for Microtechnologies






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Equipment and service offer

The ZfM facilities include 1000m2 of clean rooms (300m2 of them class 10 / ISO 4 ). Modern equipments were installed for processing of 100 mm, 150mm and 200 mm wafers as well as design and testing laboratories providing the basis for the following processes, partly in cooperation with the Fraunhofer ENAS:

Design
  • MEMS/NEMS,
  • IC, ASICs and FPGAs
    • low power and low noise, analogue-mixed signal integrated circuits
    • integrated high-voltage circuits
  • Design Support
  • Optimization by means of novel approaches, methodologies and dedicated design tools
  • Design for reliability
Modelling and Simulation
  • Equipment and processes for micro and nanoelectronics
  • Physical domains and their interaction
  • Thermal simulation
  • Electronic devices
  • Defects and their influence
Mask fabrication
  • 3” ... 7”
  • Electron beam lithography
  • Proximity and contact double-side
Processes
  • High temperature processes: Diffusion / Thermal oxidation / Annealing / RTP
  • PVD (Cr, Au, Ag, Ti, TiN, Ta, TaN, Cu , Pt, Co, Al, W, TiW, AlSix ,CrNi, MoNi, MOFe, Pyrex )
  • Chemical vapor deposition CVD (MOCVD, PECVD, LPCVD)
    • PECVD / LPCVD (SiO2 , Si3N4 , Polysilicon, SixOyNz, SiCOH, SiCH)
    • PECVD (diamond-like Carbon films, a-C:H)
    • Cu-MOCVD, TiN-MOCVD
  • Plasma treatment (low pressure and atmospheric plasma)
  • Electroplating: Cu, Ni, Au
  • Etching (dry: Plasma- and RIE-mode & wet: isotropic / anisotropic)
    • Dry etching (Si, SiO2, Si3N4 , Polysilicon, Silicides, Al, refr. metals, TiN, Cr, DLC, low k dielectrics)
    • Wet etching (SiO2, Si3N4 , Si, Polysilicon, Al, Cr, Au, Pt, Cu, Ti, W )
  • Wafer lithography / Electron beam lithography
  • Chemical mechanical polishing CMP (Copper, Silicon, SiO2 )
  • Wafer bonding: silicon direct, anodic, eutectic, glass frit
  • Packaging (sawing, bonding)
Characterization and Test:
  • MEMS/NEMS
  • Nanoelectronic devices
  • Parametric testing: Waferprober, HP Testsystem
  • Characterization of analogue-mixed signal circuits up to 500 MHz
  • Characterization and modelling of devices from low-voltage and high-voltage microtechnologies
Analytics:
  • Scanning electron microscopy SEM / EDX
  • Atomic force microscopy AFM
  • Variable angle spectroscopic ellipsometry
  • Laser profilometry (UBM, TENCOR FLX-2900 )
  • Surface profilometer
  • US-Microscope
  • Fluorescence microscopy
  • Tension/Compression testing machine Zwick 4660 universal
  • Perkin-Elmer DMA 7e dynamic mechanical analyser
  • Micromechanical testing instrument
  • Lifetime scanner
  • Contact angle / surface tension
 

Contact:
Norbert Zichner
Phone: +49 (0) 371 531 33650
E-Mail: norbert.zichner@zfm.tu-chemnitz.de