International Research Training Group - "Materials and Concepts for Advanced Interconnects and Nanosystems" - Internationales Graduiertenkolleg






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Materials and Concepts for Advanced Interconnects

Scientific Publications by Members of the IRTG

2012

N. Ahner, S. Zimmermann, M. Schaller, S.E. Schulz, "Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants", Solid State Phenomena, 187, 201-205 (2012). DOI: 10.4028/www.scientific.net/SSP.187.201

J. Chen, D. Chen, T. Yuan, X. Chen, J. Zhu, A. Morschhauser, J. Nestler, T. Otto, T. Gessner, "A microfluidic 3D chip for cell capture", Lab Chip, submitted (2012).

L. Ding, M. Friedrich, O. Gordan, D.R.T. Zahn, "Surface Modification Effect on Optical Anisotropy and Molecular Orientation of CuPc Thin Films", DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

L. Ding, L. Chen, M. Friedrich, O.D. Gordan, C. Cobet, D.W. Zhang, N. Esser, D.R.T. Zahn, "Optical Gap and Aging Effect of Ultra-thin High-k Films Grown by Atomic Layer Deposition", 7th Workshop Ellipsometry, Leipzig (Germany), 5-7 March 2012.

H. Fiedler, M. Toader, S. Hermann, M. Rennau, S.E. Schulz, M. Hietschold, T. Gessner, "Fabrication and characterization of CNT via interconnects for application in integrated circuits", talk, DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

F. Ganss, B. Hebler, A. Cattoni, A.-M. Haghiri-Gosnet, M. Albrecht, "Co/Pd multilayers on SiOx pillar arrays at ultra-high density", talk, DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

O.D. Gordan, D. Lehmann, F. Haidu, S. Mueller, T. Waechtler, S.E. Schulz, H. Lang, W. Braun, T. Gessner, D.R.T. Zahn, "Copper Oxidation and Reduction: A Combined Ellipsometry and Photoemission Study", poster presentation, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 11-14 March 2012.

M. Ludemann, B. Mahns, O.D. Gordan, M. Knupfer, D.R.T. Zahn, "Raman Spectroscopy on Potassium Doped Manganese Phthalocyanine Thin Films", poster presentation, DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

M. Melzer, T. Waechtler, S. Mueller, H. Fiedler, S. Hermann, R.D. Rodriguez, A. Villabona, A. Sendzik, R. Mothes, S.E. Schulz, T. Gessner, D.R.T. Zahn, M. Hietschold, H. Lang, "Copper oxide ALD on thermally pretreated CNTs for interconnect applications", talk, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 11-14 March 2012.

M. Melzer, T. Waechtler, S. Mueller, H. Fiedler, S. Hermann, R.D. Rodriguez, A. Villabona, A. Sendzik, R. Mothes, S.E. Schulz, T. Gessner, D.R.T. Zahn, M. Hietschold, H. Lang, "Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs",poster presentation, DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

M. Melzer, A. Foerster, T. Waechtler, C. Wagner, H. Fiedler, J. Schuster, S. Hermann, S.E. Schulz, T. Gessner, "Controlling the growth morphology of ALD copper oxide on CNTs by thermal oxidation prior to the ALD", talk, AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 17-20 June 2012.

M. Melzer, D. Karnaushenko, D. Makarov, L. Baraban, A. Calvimontes, I. Moench, R. Kaltofen, Y.F. Mei, O.G. Schmidt, "Elastic magnetic sensor with isotropic sensitivity for in-flow detection of magnetic objects", RSC Advances, 2(6), 2284-2288 (2012). DOI: 10.1039/c2ra01062c

S. Mueller, T. Waechtler, A. Tuchscherer, R. Mothes, O. Gordan, D. Lehmann, F. Haidu, S.E. Schulz, H. Lang, D.R.T. Zahn, T. Gessner, "An Approach for Cu ALD on Co/Ni as Liners for ULSI Interconnects and Magnetic Film Systems for Spintronic Applications", talk, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 11-14 March 2012.

G. Salvan, M. Fronk, S. Mueller, T. Waechtler, S.E. Schulz, R. Mothes, H. Lang, C. Schubert, M. Albrecht, D.R.T. Zahn, "Magneto-optical Kerr Effect Studies of Heterostructures of Ferromagnetic and Copper Oxide Layers Produced by Atomic Layer Deposition", poster presentation, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 11-14 March 2012.

G. Salvan, M. Fronk, P. Robaschik, D.R.T. Zahn, M. Albrecht, S. Mueller, T. Waechtler, S.E. Schulz, R. Mothes, H. Lang, "Heterostructures of Copper Oxide Layers Produced by ALD with Ferromagnetic Layers Studied by Magneto-Optical Kerr Effect Spectroscopy", poster presentation, AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 17-20 June 2012.

J. Sommer, A. Zienert, S. Gemming, J. Schuster, S.E. Schulz, T. Gessner, "Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study", poster presentation, IEEE 9th International Multi-Conference on Systems, Signals & Devices (SSD-SCI), Chemnitz (Germany), 20-23 March 2012.

J. Sommer, A. Zienert, J. Schuster, "Band structure und electronic transport properties of cobalt decorated carbon nanotubes", poster presentation, 76th DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

J. Sommer, A. Zienert, S. Gemming, J. Schuster, S.E. Schulz, T. Gessner, "Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study", Transactions on Systems, Signals and Devices, in press (2012).

P. Streit, R. Schulze, D. Billep, T. Otto, T. Gessner, "Comparison of lumped and finite element modeling for thermoelectric devices", poster presentation, Smart System Integration (SSI), Zurich (Switzerland), 21-22 March 2012.

A. Tuchscherer, D. Schaarschmidt, S. Schulze, M. Hietschold, H. Lang, "Gold Nanoparticles Generated by Thermolysis of "All-in-One" Gold(I) Carboxylate Complexes", Dalton Trans., 41 2738–2746 (2012). DOI: 10.1039/C2DT11748G

A. Tuchscherer, R. Packheiser, T. Rüffer, H. Schletter, M. Hietschold, H. Lang, "Rhodium Nanoparticles from Dirhodium(II) Ethylene Glycol tetracarboxylates", Eur. J. Inorg. Chem., 13, 02251–2258 (2012). DOI: 10.1002/ejic.201101424

T. Waechtler, S. Mueller, H. Fiedler, M. Melzer, S.E. Schulz, T. Gessner, "ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks", talk, EFDS Workshop on Atomic Layer Deposition, Dresden (Germany), 7 March 2012.

M. Woehrmann, M.Toepper, "A Critical Review: Adhesion Measurement of Thin Polymer Films for Microelectronic Applications", talk, The Fifteenth Meeting of the Symposium on Polymers for Microelectronics, Wilmington, Delaware (USA), 8-10 May 2012.

M. Woehrmann, M. Toepper, "Polymerization of Thin Film Polymers" in: Polymerization / Book 2, ed. by A. De Souza Gomes, published by InTech (2012)

H.-X. Zhang, S.-H. Wang, K. Jiang, A. Tuchscherer, W.-B. Cai, "In situ spectroscopic investigation of CO accumulation and poisoning on Pd black surfaces in concentrated HCOOH", Journal of Power Sources, 199, 165-169 (2012). DOI: 10.1016/j.jpowsour.2011.10.033

A. Zienert, C. Wagner, S. Mohammadzadeh, J. Schuster, R. Streiter, S.E. Schulz, T. Gessner, "Simulation of Nanostructures for Sensor and Circuit Applications", talk, IEEE 9th International Multi-Conference on Systems, Signals & Devices (SSD-SCI), Chemnitz (Germany), 20-23 March 2012.

A. Zienert, J. Schuster, T. Gessner, "Quantum transport simulations in metallic carbon nanotubes with metal contacts", talk, 76th DPG Spring Meeting, Berlin (Germany), 25-30 March 2012.

A. Zienert, C. Wagner, S. Mohammadzadeh, J. Schuster, R. Streiter, S.E. Schulz, T. Gessner, "Simulation of Nanostructures for Sensor and Circuit Applications", Transactions on Systems, Signals and Devices, in press (2012).

 

2011

L. Ding, L. Chen, M. Friedrich, O. Gordan, W. Zhang, D.R.T. Zahn, "Dielectric Function of Ultra-thin High-k Films Grown by Atomic Layer Deposition", poster presentation, DPG Spring Meeting of the Condensed Matter Division, Dresden (Germany), 13-18 March 2011.

L. Ding, M. Friedrich, O. Gordan, D.R.T. Zahn, "Molecular Orientation of CuPc Thin Films Grown on Vicinal H-Si(111) by in situ Investigation", 6th Workshop of Spectroscopic Ellipsometry, Berlin (Germany), 21-24 February 2011.

S.-F. Ding, Q. Xie, S. Mueller, T. Waechtler, H.-S. Lu, S.E. Schulz, C. Detavernier, X.-P. Qu, T. Gessner, "The Inhibition of Enhanced Cu Oxidation on Ruthenium/Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru", J. Electrochem. Soc., 158 (12), H1228-H1232 (2011). Online via DOI: 10.1149/2.041112jes

H. Fiedler, S. Hermann, S.E. Schulz, T. Gessner, "Influence of copper on catalytic carbon nanotube growth process", poster presentation, IEEE International Interconnect Technology Conference (IITC) & Materials for Advanced Metallization (MAM), Dresden (Germany), 9-12 May 2011, IEEE Proceedings, online via DOI: 10.1109/IITC.2011.5940346

M. Fronk, S. Mueller, T. Waechtler, S.E. Schulz, D.R.T. Zahn, G. Salvan, "Magneto-optical Kerr effect studies of copper oxide and cobalt thin films", poster presentation, DPG Spring Meeting 2011, Dresden (Germany), 13-18 March 2011.

M. Fronk, S. Müller, T. Waechtler, S.E. Schulz, R. Mothes, H. Lang, D.R.T. Zahn, G. Salvan, "Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2", Thin Solid Films, in press (2011). Online via DOI: 10.1016/j.tsf.2011.10.204

N.T.N. Ha, T.G. Gopakumar, M. Hietschold, "Polymorphism Driven by Concentration at the Solid-Liquid Interface", J. Phys. Chem. C, 115 (44), 21743–21749 (2011). Online via DOI: 10.1021/jp111640t

N.T.N. Ha, T.G. Gopakumar, M. Hietschold, "Co-operative adsorption of TMA-alcohol mixture controlled by sonication time", oral presentation, DPG Spring Meeting, Dresden (Germany), 22-27 March 2011.

F. Haidu, D. Lehmann, M. Fronk, B. Mahns, M. Ludemann, O.D. Gordan, P. Schäfer, M. Knupfer, W. Braun, D.R.T. Zahn, "Determining the Molecular Orientation of CoPc on in- and out-of-plane Magnetised Substrates by NEXAFS Spectroscopy", poster presentation, BESSY User Meeting, Berlin (Germany), 1-2 December 2011.

L. Hofmann, R. Ecke, S.E. Schulz, T. Gessner, "Investigations regarding Through Silicon Via filling for 3D integration by Periodic Pulse Reverse plating with and without additives", Microelectron. Eng., 88, 705-708 (2011). Online via DOI: 10.1016/j.mee.2010.06.040

K. Jiang, H.-X. Zhang, Y.-Y. Yang, R. Mothes, H. Lang, W.-B. Cai, "Facile Synthesis of Ag@Pd Satellites - Fe3O4 Core Nanocomposite as Efficient and Reusable Hydrogenation Catalysts", Chem. Commun., 47, 11924-11926 (2011). DOI: 10.1039/C1CC14675K

M. Ludemann, I.E. Brumboiu, O.D. Gordan, D.R.T. Zahn, "Surface-enhanced Raman effect in ultra-thin CuPc films employing periodic silver nanostructures", J. Nanoparticle Research, 13 (11), 5855-5861 (2011). DOI: 10.1007/s11051-011-0564-z

M. Ludemann, O.D. Gordan, D.R.T. Zahn, "In Situ Surface Enhanced Raman Spectroscopy of Ultra-Thin CuPc Films", oral presentation, DPG Spring Meeting 2011, Dresden (Germany), 13-18 March 2011.

M. Ludemann, I.E. Brumboiu, O.D. Gordan, D.R.T. Zahn, "Vibrational Properties of Metal Phthalocyanine Thin Films", poster presentation, DPG Spring Meeting 2011, Dresden (Germany), 13-18 March 2011.

M. Ludemann, O.D. Gordan, D.R.T. Zahn, "Ultra-thin CuPc Films Investigated by a Combination of Surface Enhanced, Interference Enhanced, and Resonance Raman Spectroscopy", talk, Optics of Surfaces and Interfaces 9 (OSI9), Akumal (Mexico), 19-23 September 2011.

Y.F. Mei, A.A. Solovev, S. Sanchez, O.G. Schmidt, "Rolled-up nanotech on polymers: from basic perception to self-propelled catalytic microengines", Chem. Soc. Rev., 40(5), 2109-2119 (2011). DOI: 10.1039/c0cs00078g

M. Melzer, D. Makarov, A. Calvimontes, D. Karnaushenko, S. Baunack, R. Kaltofen, Y.F. Mei, O.G. Schmidt, "Stretchable Magnetoelectronics", ACS Nano, 11(6), 2522-2526 (2011). DOI: 10.1021/nl201108b

R. Mothes, H. Lang, "New Phosphine Copper(I) and Silver(I) Dithiocarbamates as Suitable Precursors for the Deposition of Copper and Silver Sulfide", poster presentation, EuroCVD 18, Kinsale, Co. Cork (Ireland), 4-9 Sept. 2011.

S. Mueller, T. Waechtler, A. Tuchscherer, R. Mothes, O. Gordan, D. Lehmann, F. Haidu, S.E. Schulz, T. Gessner, H. Lang, D.R.T. Zahn, "An Approach for Cu ALD via Reduction of Ruthenium-Containing CuxO Films for the Metallization in Spintronic and ULSI Interconnect Systems", oral presentation, 11th International Conference on Atomic Layer Deposition (AVS ALD 2011), Cambridge, MA (USA), 26-29 June 2011.

S. Mueller, T. Waechtler, L. Hofmann, A. Tuchscherer, R. Mothes, O. Gordan, D. Lehmann, F. Haidu, M. Ogiewa, L. Gerlich, S.-F. Ding, S.E. Schulz, T. Gessner, H. Lang, D.R.T. Zahn, X.-P. Qu, "Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems" oral presentation, IEEE 2011 Semiconductor Conference Dresden, Dresden (Germany), 27-28 September 2011. Online via DOI: 10.1109/SCD.2011.6068736

M. de Pauli, A. Malachias, H. Westfahl, J. Bettini, A. Ramirez, G.S. Huang, Y.F. Mei, O.G. Schmidt, "Study of roughness evolution and layer stacking faults in short-period atomic layer deposited HfO2/Al2O3 multilayers", J. Appl. Phys., 109(6), 063524 (2011). DOI: 10.1063/1.3555624

M. Toader, M. Hietschold, "Tuning the Energy Level Alignment at the SnPc/Ag(111) Interface Using an STM Tip", J. Phys. Chem. C, 115, 3099-3105 (2011). Online via DOI: 10.1021/jp111478v

M. Toader, M. Knupfer, D. R. T. Zahn, M. Hietschold, "Initial Growth of Lutetium(III) Bis-phthalocyanine on Ag(111) Surface", J. Am. Chem. Soc., 133, 5538-5544 (2011). Online via DOI: 10.1021/ja200168a

M. Toader, M. Knupfer, D.R.T. Zahn, M. Hietschold, "Initial growth at the F16CoPc/Ag(111) interface", Surf. Sci., 605, 1510-1515 (2011). Online via DOI: 10.1016/j.susc.2011.05.024

M. Toader, M. Hietschold, "SnPc on Ag (111): a Scanning Tunneling Microscopy Study at the Sub-molecular Level", J. Phys. Chem. C, 115, 12494–12500 (2011). Online via DOI: 10.1021/jp201933s

M. Toader, M. Hietschold, "Tuning the Energy Level Alignment at the SnPc/Ag(111) Interface Using an STM Tip", poster presentation, DPG Spring Meeting of the Surface Science Division, Dresden (Germany), 13-18 March 2011.

A. Tuchscherer, Y. Shen, A. Jakob, R. Mothes, M. Al-Anber, B. Walfort, T. Rüffer, S. Frühauf, R. Ecke, S. E. Schulz, T. Gessner, H. Lang, "Lewis-base Copper(I) Formates: Synthesis, Reaction Chemistry, Structural Characterization and Their Use as Spin-Coating Precursors for Copper Deposition", Inorg. Chim. Acta, 365 (1), 10-19 (2011). Online via DOI: 10.1016/j.ica.2010.05.048

A. Tuchscherer, D. Schaarschmidt, S. Schulze, M. Hietschold, H. Lang, "Simple and Efficient: Gold Nanoparticles from Triphenylphosphane Gold(I) Carboxylates Without Addition of any Further Stabilising and Reducing Reagent", Inorg. Chem. Commun., 14 (5), 676-678 (2011). Online via DOI: 10.1016/j.inoche.2011.02.003

A. Tuchscherer, D. Schaarschmidt, S. Schulze, M. Hietschold, H. Lang, "Simple and Efficient: Ethylene Glycol Isonitrile Gold(I) Chlorides for the Formation and Stabilization of Gold Nanoparticles", Eur. J. Inorg. Chem., 28, 4421-4428 (2011).

A. Tuchscherer, H. Lang, "Precursor Synthesis and Thermal Studies for Ruthenium and Ruthenium Oxide Deposition", poster presentation, EuroCVD 18, Kinsale, Co. Cork (Ireland), 4-9 Sept. 2011.

M. Woehrmann, M. Toepper, H. Walter, K.D. Lang, "Low Temperature Cure of BCB and the Influence on the Mechanical Stress", talk, Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL (USA), 31 May - 3 June 2011, proceedings, pp. 392-400

T. Waechtler, S.-F. Ding, L. Hofmann, R. Mothes, Q. Xie, S. Oswald, C. Detavernier, S.E. Schulz, X.-P. Qu, H. Lang, T. Gessner, "ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems", Microelectron. Eng., 88, 684-689 (2011). Online via DOI: 10.1016/j.mee.2010.07.004

T. Waechtler, S. Mueller, L. Hofmann, R. Mothes, S.-F. Ding, S.E. Schulz, H. Lang, X.-P. Qu, T. Gessner, "Copper Films Grown via Copper Oxide ALD Integrated with Different Liner Materials for Interconnect Applications", oral presentation, 11th International Conference on Atomic Layer Deposition (AVS ALD 2011), Cambridge, MA (USA), 26-29 June 2011.

T. Waechtler, S. Mueller, S.E. Schulz, T. Gessner, "Process Development for the ALD of Thin Copper Films for ULSI Metallization Systems and Magnetosensors", invited talk, SENTECH Plasma Process Technology Seminar, 22 November 2011.

T. Waechtler, S. Mueller, R. Mothes, A. Tuchscherer, C. Schubert, D. Lehmann, F. Haidu, P. Schaefer, S.E. Schulz, H. Lang, M. Albrecht, D.R.T. Zahn, T. Gessner, "Copper ALD for Applications in ULSI Metallization Systems and Spintronic Layer Stacks", poster presentation, IMEC Workshop on Atomic Layer Deposition for Applications in Nanotechnology, Leuven (Belgium), 28-29 November 2011.

D.R.T. Zahn, M. Ludemann, O.D. Gordan, P. Schäfer, G. Salvan, "The incorporation of metal nanostructures at organic/inorganic semiconductor interfaces" oral presentation, DPG Spring Meeting, Dresden (Germany), 13-18 March 2011.

S. Zimmermann, N. Ahner, T. Fischer, M. Schaller, S.E. Schulz, T. Gessner, "A less damage patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices", oral presentation, MRS Spring Meeting 2011, San Francisco, CA (USA), 25-29 April 2011.

A. Zienert, J. Schuster, R. Streiter, T. Gessner, "Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes", poster presentation, Materials for Advanced Metallization (MAM) & International Interconnect Technology Conference (IITC), Dresden (Germany), 8-12 May 2011, IEEE proceedings, p. 1-3. Online via DOI: 10.1109/IITC.2011.5940363

 

2010

N. Ahner, S. Zimmermann, M. Schaller, S.E. Schulz, "Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants", 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (ICPSS), Ostende (Belgium), 20-22 September 2010.

L. Ding, M. Friedrich, O. Gordan, and D. R. T Zahn, "In situ investigation of CuPc thin films grown on vicinal Si(111)", Oral presentation, 37th Conference on the Physics and Chemistry of Surfaces and Interfaces (PCSI-37), Santa Fe, NM (USA), 10-14 January 2010.

L. Ding, C. Himcinschi, M. Friedrich, and D. R. T Zahn, "Optical investigation of CuPc thin films on vicinal Si(111)" Phys. Stat. Sol. C, 7, 312-315 (2010). Online via DOI: 10.1002/pssc.200982455

L. Ding, M. Friedrich, O. Gordan, and D. R. T Zahn, "In situ investigation of CuPc thin films grown on vicinal Si(111)" J. Vac. Sci. Technol. B, 28, C5F17 (2010). Online via DOI: 10.1116/1.3442797

L. Ding, M. Friedrich, O. Gordan, D.R.T. Zahn, "In situ investigation of CuPc thin films grown on vicinal Si(111)", poster presentation, 3rd NanoCharm School on Ellipsometry, Salzburg (Austria), 27 February - 5 March 2010.

L. Ding, M. Friedrich, O. Gordan, D.R.T. Zahn, "In situ investigation of CuPc thin films grown on vicinal Si(111)", oral presentation, DPG Spring Meeting of the Condensed Matter Division, Regensburg (Germany), 21-26 March 2010.

S.-F. Ding, T. Waechtler, Q. Xie, H.-S. Lu, S.E. Schulz, X.-P. Qu, "Inhibition of enhanced Cu oxidation on ruthenium", Poster Presentation, 2010 International Interconnect Technology Conference (IITC), Burlingame, CA (USA), 6-9 June 2010, Proceedings, pp. 1-3. Online: 10.1109/IITC.2010.5510315

M. Falke, R. Terborg, A. Käppel, M. Rohde, M. Gass, B. Andrew, S. Hermann, "Coated Multiwall-Carbon-Nanotubes: EELS in Cs-corrected STEM and Liquid Nitrogen free EDS", poster presentation, 17th International Microscopy Congress (IMC17), Rio de Janeiro (Brasil), 2010.

P. Feng, I. Moench, G.S. Huang, S. Harazim, E.J. Smith, Y.F. Mei, O.G. Schmidt, "Local-Illuminated Ultrathin Silicon Nanomembranes with Photovoltaic Effect and Negative Transconductance", Adv. Mater., 22(33), 3667 (2010). DOI: 10.1002/adma.201000583

T. Fischer, N. Ahner, S. Zimmermann, M. Schaller, S.E. Schulz, "Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials", oral presentation, Advanced Metallization Conference (AMC), Albany, NY (USA), 5-7 October 2010.

N.T.N. Ha, M. Dieblich, M. Mehring, M. Hietschold, "Self-Assembly Structure of 3D-Molecule Benzene 1,3,5 Triphosphonic Acid (BTP) studied by Scanning Tunneling Microscopy (STM) at the Liquid- Solid Interface", poster presentation, DPG Spring Meeting, Regensburg (Germany), 22-27 March 2010.

N.T.N. Ha, T.G. Gopakumar, M. Hietschold, "Control of molecular self-assembly at the liquid- solid interface (LSI) studied by scanning tunneling microscopy (STM)", oral presentation, 27th European Conference on Surface Sciences (ECOSS 27), Groningen (The Netherlands), 28 August - 3 September 2010.

N.T.N. Ha, T.G. Gopakumar, R. Gutzler, M. Lackinger, H. Tang, M. Hietschold, "Influence of Solvophobic Effects on Self-Assembly of Trimesic Acid at the Liquid-Solid Interface", J. Phys. Chem. C, 114 (8), 3531–3536 (2010). Online via DOI: 10.1021/jp907781a

S. Hermann, H. Fiedler, T. Waechtler, M. Falke, R. Ecke, S.E. Schulz, T. Gessner, "Approaches for Fabrication of Carbon Nanotube Vias", poster presentation, Nanoelectronic Days 2010, Aachen (Germany), 4-7 October 2010.

S. Hermann, B. Pahl, R. Ecke, S.E. Schulz, T. Gessner, "Carbon Nanotubes for Nanoscale Low Temperature Flip Chip Connections", Microelectron. Eng., 87, 438-442 (2010). Online via DOI: 10.1016/j.mee.2009.05.027

S. Hermann, S. Loschek, Y. Haibo, J. Bonitz, S.E. Schulz, T. Gessner, "Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen", oral presentation, 10. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 20-21 October 2010.

M. Hietschold, N.T.N. Ha, T.G. Gopakumar, "Control of self-assembled pattern at the solid-liquid interface: Trimesic Acid (TMA) on HOPG(0001)", poster presentation, International Conference on Molecular Materials (MOLMAT), Montpellier (France), 5-8 July 2010.

L. Hofmann, R. Ecke, S.E. Schulz, T. Geßner, "Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik", Galvanotechnik, 101 (8), 1880-1884 (2010).

L. Hofmann, R. Ecke, S.E. Schulz, T. Gessner, "Investigations Regarding Through Silicon Via Filling for 3D Integration by Periodic Pulse Reverse Plating with and without Additives", poster presentation, Materials for Advanced Metallization - MAM, Mechelen (Belgium), 8-10 March 2010.

L. Hofmann, R. Ecke, S.E. Schulz, T. Gessner, "Pulse Reverse Electroplating for TSV Filling in 3D Integration", poster presentation, Smart Systems Integration, Como (Italy), 23-24 April 2010. proceedings, VDE Verlag GmbH, ISBN 978-3-8007-3081-0

G.S. Huang, V.A.B. Quinones, F. Ding, S. Kiravittaya, Y.F. Mei, O.G. Schmidt, "Rolled-Up Optical Microcavities with Subwavelength Wall Thicknesses for Enhanced Liquid Sensing Applications", ACS Nano, 4(6), 3132-3130 (2010). DOI: 10.1021/nn100456r

A. Jakob, T. Rueffer, H. Schmidt, P. Djiele, K. Koerbitz, P. Ecorchard, T. Haase, K. Kohse-Hoeinghaus, S. Fruehauf, T. Waechtler, S.E. Schulz, T. Gessner, H. Lang, "Disilver(I) Coordination Complexes: Synthesis, Reaction Chemistry, and Their Potential Use in CVD and Spin-Coating Processes for Silver Deposition", Eur. J. Inorg. Chem., 2010, 2975-2986 (2010). Online via DOI: 10.1002/ejic.201000159

A. Jakob, A. Tuchscherer, S. Dietrich, R. Mothes, H. Lang, "Metal and Metal Oxid Nanoparticles", poster presentation, 6. Thüringer Grenz- und Oberflächentage (ThGOT) 2010, Gera (Germany), 7-9 Sept. 2010.

H.X. Ji, X.L. Wu, L.Z. Fan, C. Krien, I. Fiering, Y.G. Guo, Y.F. Mei, O.G. Schmidt, "Self-Wound Composite Nanomembranes as Electrode Materials for Lithium Ion Batteries", Adv. Mater., 22(41), 4591-4595 (2010). DOI: 10.1002/adma.201001422

M. Ludemann, O.D. Gordan, C. Brombacher, M. Albrecht, D.R.T. Zahn, "Surface Enhanced Raman Effect of CuPc Employing Silver Nanostructures Prepared by Nanosphere Lithography", poster presentation, DPG Spring Meeting, Regensburg (Germany), 21-26 March 2010.

M. Ludemann, O.D. Gordan, D.R.T. Zahn, "Surface Enhanced Raman Effect of Ultra-Thin CuPc Films Employing Silver Nanostructures Prepared by Nanosphere Lithography", oral presentation, X International Conferece on Nanostructured Materials (NANO2010), Rome (Italy), 13-17 September 2010.

M. Ludemann, O.D. Gordan, D.R.T. Zahn, "Surface Enhanced Raman Effect of CuPc Employing Silver Nanostructures", poster presentation, Symposium - Confocal Raman Imaging, Ulm (Germany), 5-6 October 2010.

Y.F. Mei, S. Kiravittaya, S. Harazim, O.G. Schmidt, "Principles and applications of micro and nanoscale wrinkles", Mat. Sci. Eng. R, 70(3-6), 209-224 (2010). DOI: 10.1016/j.mser.2010.06.009

R. Mothes, T. Rüffer, Y. Shen, A. Jakob, B. Walfort, H. Petzold, S. E. Schulz, R. Ecke, T. Gessner, H. Lang, "Phosphite Copper(I) Trifluoroacetates [((RO)3P)mCuO2CCF3] (m = 1, 2, 3): Synthesis, Solid State Structures and Their Use as CVD Precursors", Dalton Trans., 39 (46), 11235-11247 (2010). Online via DOI: 10.1039/C0DT00347F

R. Mothes, H. Lang, "New Materials and Chemistry: Small Molecules - Great Progress", poster presentation, Global Challenges for Sustainable Development, (GCSD'2010), Sustainable Chemistry and Related Areas, Rennes (France), 25-26 Feb. 2010.

S. Mueller, T. Waechtler, A. Tuchscherer, R. Mothes, S.E. Schulz, T. Gessner, H. Lang, "Investigation of Formic Acid Reduction of Ruthenium-Containing Copper Oxide Layers Prepared by ALD ", oral presentation, Baltic ALD 2010 & GerALD 2, Hamburg (Germany), 16-17 September 2010.

T. Oszinda, M. Schaller, D. Fischer, C. Walsh, and S. E. Schulz, "Investigation of physical and chemical property changes of ultra low-k SioCH in aspect of cleaning and chemical repair processes", Microelectron. Eng., 87, 457 (2010), online via DOI: 10.1016/j.mee.2009.06.028

T. Oszinda, M. Schaller, K. Dittmar, Le Jinag, S. E. Schulz, "How to Evaluate Surface Free Energies of Dense and Ultra Low-k Dielectrics in Pattern Structure", Oral presentation, Materials for Advanced Metalization Conference (MAM) , Mechelen (Belgium), 07-10 March 2010

T. Oszinda, M. Schaller, K. Dittmar, Le Jinag and S. E. Schulz, "How to Evaluate Surface Free Energies of Dense and Ultra Low-k Dielectrics in Pattern Structure", Oral presentation, Electrochemical Society Meeting (217th ECS) , Vancouver (Canada), 25-30 April 2010

T. Oszinda, M. Schaller, K. Dittmar, Le Jinag, S. E. Schulz, "How to Evaluate Surface Free Energies of Dense and Ultra Low-k Dielectrics in Pattern Structure", ECS Trans., 28 (2), 355-360 (2010). Online via DOI: 10.1149/1.3372590

T. Oszinda, M. Schaller, S. E. Schulz, "Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film using a Vapor Phase Process", ECS Trans., 25 (38), 19-30 (2010). Online via DOI: 10.1149/1.3390654

S. Sanchez, A.A. Solovev, Y.F. Mei, O.G. Schmidt, "Dynamics of Biocatalytic Microengines Mediated by Variable Friction Control", J. Am. Chem. Soc., 132(38), 13144-13145 (2010). DOI: 10.1021/ja104362r

P. Shukrynau, M. Toader, M. Hietschold, "Adsorption of cobalt phthalocyanine on rutile TiO2 (110) surfaces: interface formation", oral presentation, DPG Spring Meeting of the Surface Science Division, Regensburg (Germany), 21-26 March 2010.

P. Singh, S. Zimmermann, S. Schulze, S. Schulz, M. Hietschold, "TEM/EELS analysis of ultra low-k inter-metal dielectric", 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Shanghai (China), 1-4 Nov. 2010, proceedings, pp. 1015-1017 (2010). Online via DOI: 10.1109/ICSICT.2010.5667524

L. Smykalla, M. Toader, P. Shukrynau, M. Hietschold, "Exploring the CoPc@HOPG interface: STM and STS study", poster presentation, DPG Spring Meeting of the Surface Science Division, Regensburg (Germany), 21-26 March 2010.

M. Toader, T. G. Gopakumar, M. Abdel-Hafiez, M. Hietschold, "Exploring the F16CoPc/Ag(110) Interface Using Scanning Tunneling Microscopy and Spectroscopy. Part 1: Template-Guided Adlayer Structure Formation", J. Phys. Chem. C 114, 3537–3543 (2010). Online via DOI: 10.1021/jp9078019

M. Toader, T. G. Gopakumar, P. Shukrynau, M. Hietschold, "Exploring the F16CoPc/Ag(110) Interface Using Scanning Tunneling Microscopy and Spectroscopy. Part 2: Adsorption-Induced Charge Transfer Effect", J. Phys. Chem. C 114, 21548-21554 (2010). Online via DOI: 10.1021/jp1078295

M. Toader, P. Shukrynau, M. Hietschold, "In-situ growth and electronic structure monitoring at the F16CoPc/Ag(111) interface", poster presentation, IVth International Conference on Molecular Materials, Montpellier ( France), 5-8 July 2010.

M. Toader, P. Shukrynau, M. Hietschold, "STM and STS study at the organic-metal interface: Adsorption of CoPc on Ag(111) surface", oral presentation, DPG Spring Meeting of the Surface Science Division, Regensburg (Germany), 21-26 March 2010.

A. Tuchscherer, H. Lang, "Gold Nanoparticles Generated by Thermolysis of Gold(I) Carboxylates", poster presentation, 3rd EuCheMS Chemistry Congress, Nuremberg (Germany), 29 August - 2 September 2010.

T. Waechtler, "Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices", PhD Thesis, Chemnitz University of Technology, published by Universitätsverlag Chemnitz, ISBN 978-3-941003 17 0. Online: http://archiv.tu-chemnitz.de/pub/2010/0072

T. Waechtler, S.-F. Ding, L. Hofmann, R. Mothes, Q. Xie, S. Oswald, C. Detavernier, S.E. Schulz, X.-P. Qu, H. Lang, T. Gessner, "ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems" Oral presentation, Materials for Advanced Metallization (MAM), Mechelen (Belgium), 7-10 March 2010.

S. Zimmermann, N. Ahner, F. Blaschta, M. Schaller, H. Zimmermann, H. Ruelke, N. Lang, J. Roepcke, S.E. Schulz, T. Gessner, "Etch processes for dense and porous SiCOH materials: plasma states and process results", 3rd International Workshop Plasma Etch and Strip in Microelectronics (PESM 2010), Grenoble (France), 4-5 March 2010.

A. Zienert, J. Schuster, R. Streiter, T. Gessner, "Transport in carbon nanotubes: Contact models and size effects", phys. stat. sol. (b), 247, 3002–3005 (2010). Online via DOI: 10.1002/pssb.201000178

A. Zienert, J. Schuster, R. Streiter, T. Gessner, "Electronic Transport through Carbon Nanotubes with Metal Contacts", poster presentation, IWEPNM, Kirchberg (Austria), 6-13 March 2010.

A. Zienert, J. Schuster, R. Streiter, T. Gessner, "Electronic Transport in Carbon Nanotubes with Copper Contacts", poster presentation, Psi-k Conference, Berlin (Germany), 12-16 September 2010.

S. Zimmermann, N. Ahner, T. Fischer, S.E. Schulz, T. Gessner, "A combined Etch, Cleaning and k-restore Process for less damage integration of ultra low-k materials", oral presentation, SEMICON 2010, Dresden (Germany), 19-21 October 2010.

 

2009

N. Ahner, M. Schaller, C. Bartsch, E. Baryschpolec, S.E. Schulz, "Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions", Solid State Phenomena, 145-146, 319-322 (2009). Online via DOI: 10.4028/www.scientific.net/SSP.145-146.319

N. Ahner, T. Fischer, S. Zimmermann, M. Schaller, L. Prager, S.E. Schulz, "UV assisted curing of plasma damaged porous ultralow-k materials for a k-recovery process: influence of curing-cycle modifications", poster presentation, Advanced Metallization Conference (AMC), Baltimore, MD (USA), 13-15 October 2009.

N. Ahner, S.E. Schulz, M. Zacher, "Surfactants as an Additive to Wet Cleaning Solutions for Plasma Etch Residue Removal: Compatibility to a Porous CVD-SiCOH Ultra Low-k Dielectric Material" 216th ECS Meeting, Vienna (Austria), 4-9 October 2009; ECS Trans., 25 (5), 87-94 (2009). Online via DOI: 10.1149/1.3202639

M. Baum, L. Hofmann, M. Wiemer, T. Geßner, "Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging", Oral presentation, MST-Kongress 2009, Berlin (Deutschland), 2009 Oct. 12-14; Proceedings

J. Bonitz, S. Hermann, S. Loschek, P. Liu, S.E. Schulz, "Selective deposition of aligned carbon nanotubes for NEMS applications", poster presentation, GMM-Workshop Mikro-Nano-Integration, Seeheim (Germany), 12-13 March 2009.

J. Bräuer, L. Hofmann, T. Werner, M. Wiemer, T. Geßner, "Herstellung und Evaluierung nanoskaliger reaktiver Strukturen für den Einsatz von Niedertemperatur-Bondverfahren in der Mikrosystemtechnik", Poster presentation, MST-Kongress 2009, Berlin (Deutschland), 2009 Okt. 12-14; Proceedings

L. Ding, F. Seidel, C. Himcinschi, M. Friedrich and D. R. T. Zahn, "In Situ Investigation of Phthalocyanine Thin Films Grown on H-Si(111)", Poster presentation, 5th Workshop of Spectroscopic Ellipsometry, Zweibrücken (Germany), 2-4 March 2009

L. Ding, F. Seidel, S. Pop, C. Himcinschi, M. Friedrich and D. R. T. Zahn, "Optical Properties and Morphology of CuPc Films on Vicinal Si(111)", Oral presentation, DPG Spring Meeting of the Condensed Matter Division, Dresden (Germany), 22-27 March 2009

L. Ding, F. Seidel, S. Pop, C. Himcinschi, M. Friedrich and D. R. T. Zahn, "Optical properties and morphology of CuPc films on vicinal Si(111)", Oral presentation, DPG Spring Meeting of the Condensed Matter Division, 2009.03.22-27, Dresden (Germany)

L. Ding, C. Himcinschi, M. Friedrich, and D. R. T Zahn, "Optical investigation of CuPc thin films on vicinal Si(111)", Poster presenation, 12th International Conference on the Formation of Semiconductor Interfaces, 2009.07.05-12, Weimar (Germany)

L. Ding, F. Seidel, C. Himcinschi, M. Friedrich and D. R. T. Zahn, "In situ investigation of phthalocyanine thin films grown on H-Si(111)", Poster presentation, 5th Workshop of Spectroscopic Ellipsometry, 2009.03.02-04, Zweibrücken (Germany)

I. Eidner, B. Wunderle, K.L. Pan, M.J. Wolf, O. Ehrmann, H. Reichl, "Design Study of the Bump on Flexible Lead by FEA for Wafer Level Packaging", 10th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), 348-354, 27-29 April 2009, Delft (The Nederlands) ISBN 978-1-4244-4159-4

T. Gessner, S. Leidich, M. Nowack, J. Froemel, L. Hofmann, S. Kurth, A. Bertz, "Micro Devices for RF Applications", Invited talk, ISMOT 2009, Dec 16-19, New Delhi (India), Proceedings

M. Guttmann, K. Kaiser, S. Muth,H. M. Moritz, R. Schmidt, M. Zwanzig, L. Hofmann, I. Schubert, "Modular aufgebaute „process-unit“ – neues Anlagenkonzept für nasschemische Ätzprozesse und die Wafergalvanoformung, Galvanotechnik", Oral presentation, ZVO-Oberflächentage, Sept. 2009, Bremen, Proceedings

S. Hermann, R. Ecke, B. Pahl, S.E. Schulz, "Growth of carbon nanotubes on different support/catalyst systems for interconnect and sensor applications", oral presentation, DPG Spring Meeting, Dresden (Germany), 22-27 March 2009.

S. Hermann, S. Loschek, J. Bonitz, L. Ping, S.E. Schulz, "Low temperature aligned deposition of carbon nanotubes for nanoscale interconnects and NEMS applications", poster presentation, DPG Spring Meeting, Dresden (Germany), 22-27 March 2009.

S. Hermann, B. Pahl, R. Ecke, T. Waechtler, S.E. Schulz, "Carbon Nanotubes for Low Temperature Flip Chip Connections", poster presentation, Tenth International Conference on the Science and Application of Nanotubes - NT09, Beijing (China), 21-26 June 2009.

S. Hermann, R. Ecke, B. Pahl, S.E. Schulz, "Growth of carbon nanotubes on different support/catalyst systems for interconnect and sensor applications", oral presentation, China International Micro-Nano Expo (CIMNE), Shanghai (China), 1-3 April 2009.

L. Hofmann, R. Ecke, S. E. Schulz, T. Geßner, "Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik", Oral presentation, Tagungsband zum 12. Werkstofftechnisches Kolloquium WTK, 01./02.10.2009, ISBN 978-3-00-029007-7

L. Hofmann, J. Braeuer, M. Baum, S. E. Schulz, T. Gessner, "Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration", Oral presentation, Advanced Metallization Conference (AMC), 2009 Oct 13-15, Baltimore, Md (USA), Proceedings

Y.-C. Lin, J. Bräuer, L. Hofmann, M. Baum, J. Froemel, M. Wiemer, M. Esashi, T. Gessner, "Nanofabrication of Reactive Structure for Low Temperature Bonding", Oral presentation, IEEE Nanomed Conference, 2009 Oct. 18-21, Proceedings

D. Makarov, P. Krone, D. Lantiat, C. Schulze, A. Liebig, C. Brombacher, M. Hietschold, S. Hermann, C. Laberty, D. Grosso, M. Albrecht, "Magnetization Reversal in Arrays of Magnetic Nanoperforations", IEEE Trans. Magn., 45 (10), 3515-3518 (2009). Online via DOI: 10.1109/TMAG.2009.2025181

P. Moeck, M. Toader, M. Abdel-Hafiez, M. Hietschold, "Quantifying and enforcing two-dimensional symmetries in scanning probe microscopy images", Frontiers of Characterization and Metrology for Nanoelectronics: 2009, AIP Conference Proceedings 1173, 294-298 (2009). Online via DOI: 10.1063/1.3251237

S. Mohammadzadeh, R. Streiter, and T. Gessner, "Theoretical study of geometry dependent I-V characteristics of copper and gold quantum point contacts", Oral presentation, DPG Spring Meeting, Dresden (Germany), 22-27 March 2009.

S. Mohammadzadeh, R. Streiter, and T. Gessner, "Geometry dependent of I-V characteristics of gold atomic-sized contacts", Oral presentation, 9th Nanotechnology Conference, Genoa (Italy), 26-30 July 2009.

S. Mohammadzadeh, R. Streiter, and T. Gessner, "Electronic transport properties of copper atomic wires", Poster presentation, AMC - Advanced Metallization Conference, Maryland (USA), 13-15 Oct. 2009.

Mohammadzadeh, R. Streiter, and T. Gessner, "Geometry dependent of I-V characteristics of gold atomic-sized contacts”, 9th Nanotechnology Conference, Genoa (Italy), 26-30 July 2009, IEEE, not published

S. Mohammadzadeh, R. Streiter, and T. Gessner, "Electronic transport properties of copper atomic wires", AMC 2009 - Advanced Metallization Conference, Maryland (USA), 13-15 Oct. 2009, accepted in Material Research society, not published.

S. Mohammadzadeh, R. Streiter, and T. Gessner, "I-V curve, conductance, and potential difference of copper and gold (110) nanowires", Journal of Nanoscience and Nanotechnology, not published.

R. Mothes, H. Lang, "New Materials and Chemistry: Small Molecules – Great Progress”", Poster presentation, Global Challenges for Sustainable Development, (GCSD’2010), Sustainable Chemistry and Related Areas, Rennes, France, 25-26 Feb. 2010

T. Oszinda, M. Schaller, D. Fischer, S. Leppack, and S. E. Schulz, "Investigation of physical and chemical properties of ultra low-k SiCOH layers with respect to cleaning and repair processes", Oral presentation, Materials for Advanced Metallization Conference (MAM), Grenoble (France), 8-11 March 2009

T. Oszinda, M. Schaller, D. Fischer, S. Leppack, and S. E. Schulz, "Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals", Poster presentation, IEEE International Interconnect Technology Conference (IITC), Sapporo (Japan), June 2009

T. Oszinda, V. Beyer, M. Schaller, D. Fischer, C. Bartsch, and S. E. Schulz, "Improved characterization of Fourier transform infrared spectra analysis for post-etched ultra-low-k SiOCH dielectric using chemometric methods", published in Journal of Vacuum Science and Technology B (JVST B), 27 (1), 521-526 (2009), online via DOI: 10.1116/1.3043466

T. Oszinda, M. Schaller, D. Fischer, S. Leppack, and S. E. Schulz, "Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals", Proceedings of the 12th IEEE International Interconnect Technology Conference (IITC), Sapporo (Japan), June 2009

T. Oszinda, M. Schaller, S. E. Schulz, "Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film using a Vapor Phase Process", Oral presentation, Electrochemical Society Meeting (216th ECS), Vienna (Austria), 4-9 October 2009

T. Oszinda, M. Schaller, S. E. Schulz, "Restoration of Plasma Damaged Porous Ultra Low-k SiOCH Films: A Coating Process with UV Activation Versus a Vapor Phase Process with Thermal Activation", Oral presentation, Advanced Metallization Conference (AMC) , Baltimore (USA), 13-15 October 2009

T. Oszinda, M. Schaller, S. E. Schulz, "Restoration of Plasma Damaged Porous Ultra Low-k SiOCH Films: A Coating Process with UV Activation Versus a Vapor Phase Process with Thermal Activation", to be published in the MRS Proceeding of the AMC 2009

S. E. Schulz, T. Waechtler, L. Hofmann, "Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials", Invited Talk; Advanced Metallization Conference 2009, 19th Asian Session (ADMETA 2009), Tokyo (Japan), 2009 Oct 19-21

M. Toader, T. G. Gopakamur, M. Abdel-Hafiez, and M. Hietschold, "STM and STS study of the F16CoPc / Ag(110) interface", Oral presentation, 15. Tagung Festkörperanalytik, 12-16 July 2009, Chemnitz (Germany)

M. Toader, T. G. Gopakamur, M. Abdel-Hafiez, and M. Hietschold, "Template-guided self-assembly mechanism at F16CoPc / Ag(110) interface, revealed by STM", Poster presentation, 15. Tagung Festkörperanalytik, 12-16 July 2009, Chemnitz (Germany)

M. Toader, T. G. Gopakamur, M. Abdel-Hafiez, and M. Hietschold, "Adsorption induce charge transfer effect at the F16CoPc / Ag(110) interface, revealed by STM / STS", Poster presentation, 15. Tagung Festkörperanalytik, 12-16 July 2009, Chemnitz (Germany)

M. Toader, T. G. Gopakamur, M. Abdel-Hafiez, and M. Hietschold, "STM and STS study of F16CoPc adsorbed onto Ag(110) surface", Oral presentation, DPG Spring Meeting of the Surface Science Division, 22-27 March 2009, Dresden (Germany)

T. Waechtler, T. Gessner, S. Schulz, H. Lang, and A. Jakob, "Substrate having a coating comprising copper and method for the production thereof by means of atomic layer deposition", Patent Application Publication, WO 2009/071076 A1 (2009)

T. Waechtler, S. E. Schulz, L. Hofmann, "Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials", Invited Talk, Advanced Metallization Conference (AMC), Baltimore, Md (USA), 2009 Oct 13-15, Proceedings

T. Waechtler, S. Oswald, N. Roth, A. Jakob, H. Lang, R. Ecke, S.E. Schulz, T. Gessner, A. Moskvinova, S. Schulze, and M. Hietschold, "Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2", J. Electrochem. Soc., 156 (6), H453-H459 (2009), (ISSN 0013-4651), online via MONARCH, online via DOI: 10.1149/1.3110842

T. Waechtler, S. Schulze, L. Hofmann, S. Hermann, N. Roth, S. E. Schulz, T. Gessner, H. Lang, M. Hietschold, "Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru", Oral presentation, AVS 9th International Conference on Atomic Layer Deposition (ALD 2009), 2009 Jul 19-22, Monterey, CA (USA)

T. Waechtler, L. Hofmann, R. Mothes, S. Schulze, S. E. Schulz, T. Gessner, H. Lang, M. Hietschold, "Copper Oxide ALD from a Cu(I) beta-Diketonate: Growth Studies and Application as Seed Layers for Electrochemical Copper Deposition", 216th ECS Meeting, Vienna (Austria), 2009 Oct 4-9

T. Waechtler, L. Hofmann, S. E. Schulz, "Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials" Invited Talk; 2009 Advanced Metallization Conference (AMC 2009), Baltimore, MD (USA), 2009 Oct 13-15

T. Waechtler, N. Roth, R. Mothes,S. Schulze, S. E. Schulz, T. Gessner, H. Lang, M. Hietschold, "Copper Oxide ALD from a Cu(I) beta-Diketonate: Detailed Growth Studies on SiO2 and TaN", ECS Trans., 25 (2009) pp 277-287 (ISSN 1938-5862) DOI: 10.1149/1.3205062, MONARCH: http://archiv.tu-chemnitz.de/pub/2009/0174/index.html

T. Waechtler, S. Schulze, L. Hofmann, S. Hermann, N. Roth, S. E. Schulz, T. Gessner, H. Lang, M. Hietschold, "Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru", AVS 9th International Conference on Atomic Layer Deposition (ALD 2009), Monterey, CA (USA), 2009 Jul 19-22 MONARCH: http://archiv.tu-chemnitz.de/pub/2009/0129

H. Wolf, R. Streiter, M. Friedemann, P. Belsky, O. Bakaeva, T. Letz, T. Gessner, "Simulation of TaNx deposition by Reactive PVD", to be published in Microelectronic Engineering, online via DOI: 10.1016/j.mee.2009.11.044

S. Zimmermann, N. Ahner, F. Blaschta, M. Schaller, H. Zimmermann, H. Ruelke, N. Lang, J. Roepcke, S.E. Schulz, T. Gessner, "Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods", Advanced Metallization Conference (AMC), Baltimore, MD (USA), 13-15 October 2009, proceedings, p. 101-110.

S. Zimmermann, N. Ahner, F. BLaschta, M. Schaller, H. Ruelke, S.E. Schulz, T. Gessner, "Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS", Materials for Advanced Metallization Conference (MAM), Grenoble (France), 9-11 March 2009.

S. Zimmermann, N. Ahner, F. Blaschta, M. Schaller, H. Zimmermann, H. Ruelke, N. Lang, J. Roepcke, S.E. Schulz, T. Gessner, "Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods", oral presentation, Advanced Metallization Conference (AMC), Baltimore, MD (USA), 13-15 October 2009.

H.-X. Zhang, U. Siegert, R. Liu, W.-B. Cai, "Facile Fabrication of Ultrafine Copper Nanoparticles in Organic Solvent", Nanoscale Res. Lett., 4, 705-708 (2009). DOI: 10.1007/s11671-009-9301-2

Zh. Zong, S. Mohammadzadeh, Y. Cao, Zh. Qiu, R. Liu, R. Streiter, T. Gessner , "Electrical resistivity calculations for copper nanointerconnect", Poster presentation, MAM 2009 - Materials for Advanced Metallization Conference, Grenoble (France), 8-11 March 2009.

Zh. Zong, S. Mohammadzadeh, Y. Cao, Zh. Qiu, R. Liu, R. Streiter, T. Gessner , "Electrical resistivity calculations for copper nanointerconnect", MAM 2009 - Materials for Advanced Metallization Conference, Grenoble (France), 8-11 March 2009; in press, online via DOI: 10.1016/j.mee.2009.07.012.

 

2008

M. Abdel-Hafiez, M. Toader, T. Gopakumar, M. Hietschold, "STM and STS on Ultrathin Organic Layers of Fluorinated Cobalt Phthalocyanine (F16CoPc) on Crystalline Substrates", Oral presentation, 72nd Annual Meeting of the DPG and DPG Spring Meeting of the Condensed Matter Division, Berlin (Germany), 25-29 February 2008.

M. Abdel-Hafiez, M. Toader, T. Gopakumar, A. Abbasi, M. Hietschold, "Adsorption Structure of Fluorinated Cobalt Phthalocyanine (F16CoPc) Layers on Crystalline Substrates", Poster presentation, Materials for Advanced Metallization Conference (MAM), Dresden (Germany), 2-5 March 2008.

N. Ahner, M. Schaller, C. Bartsch, E. Baryschpolec, S.E. Schulz, "Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions", 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Bruges (Belgium), 21-24 September 2008; Proceedings, 119-120.

N. Ahner, S.E. Schulz, F. Blaschta, M. Rennau, "Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range", Materials for Advanced Metallization -- MAM, Dresden (Germany), 2-5 March 2008; published in Microelectron. Eng. 85, 2111-2113 (2008). online via DOI: 10.1016/j.mee.2008.05.029

N. Ahner, S.E. Schulz, L. Prager, M. Schaller, "UV assisted curing of plasma damaged porous ultralow-k material after a k-restore process: influence of UV-wavelength and curing ambient", Advanced Metallization Conference -- AMC 2008, San Diego, CA (USA), 23-25 September 2008.

I. Eidner, K. Buschick, L. Dietrich, K. L. Pan, M. Minkus, M. J. Wolf, O. Ehrmann, H. Reichl, "Bump on Flexible Lead for Wafer Level Packaging", 41st Annual International Symposium on Microelectronics (IMAPS), Providence, Rhode Island (USA), 2-6 November 2008.

S. Hermann, S.E. Schulz, T. Gessner, "Controlling the formation of Nanoparticles for definite growth of Carbon Nanotubes", poster presentation, DPG Spring Meeting, Berlin (Germany), 25-29 February 2008.

S. Hermann, R. Ecke, S.E. Schulz, T. Gessner, "Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications", MAM 2008 -- Materials for Advanced Metallization Conference, Dresden (Germany), 2-5 March 2008; published in Microelectron. Eng. 85 (10), 1979-1983 (2008). online via DOI: 10.1016/j.mee.2008.06.019

S. Hermann, S.E. Schulz, T. Gessner, "Growth of Multi-Walled Carbon Nanotubes on different Support/Catalyst Systems for Interconnect Applications", Ninth International Conference on the Science and Application of Nanotubes -- NT08, Montpellier (France), 29 June - 4 July 2008.

A. Jakob, Y. Shen, T. Waechtler, S.E. Schulz, T. Gessner, R. Riedel, C. Fasel, H. Lang, "Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) -- Synthesis, Properties, and their Use as CVD Precursors", Z. Anorg. Allg. Chem. 634, 2226-2234 (2008). online via DOI: 10.1002/zaac.200800189

X.M. Jing, G. Engelmann, D. Chen, J. Wolf, O. Ehrmann, H. Reichl, "Profile of the wafer level ECD gold bumps under variable parameters", J. Mater. Sci.: Mater. Electron. 19 (6), 563-568 (2008). online via DOI: 10.1007/s10854-007-9387-1

S. Mohammadzadeh, D. Pouladsaz, R. Streiter, T. Gessner, "Quantum conductance of copper nanowires", DPG Spring Meeting, Berlin (Germany), 25-29 February 2008.

S. Mohammadzadeh, D. Pouladsaz, R. Streiter, T. Gessner, "Electronic transport properties in copper nanowire", MAM 2008 -- Materials for Advanced Metallization Conference, Dresden (Germany), 2-5 March 2008; published in Microelectron. Eng. 85, 1992-1994 (2008). online via DOI: 10.1016/j.mee.2008.06.005

S. Mohammadzadeh, D. Pouladsaz, R. Streiter, T. Gessner, "Theoretical study of electron transfer through copper and gold nanowires", Nanoelectronics Day, Aachen (Germany), 13-16 May 2008.

S. Mohammadzadeh, D. Pouladsaz, R. Streiter, T. Gessner, "Theoretical study of electronic transfer through gold and copper quantum point contacts", AMC -- Advanced Metallization Conference, San Diego, California (USA), 23-25 September 2008.

A. Moskvinova, S. Schulze, M. Hietschold, I. Schubert, R. Ecke, S. E. Schulz, "Analysis of damascene-fabricated Cu lines by electron backscatter diffraction and X-ray diffraction", 72nd Annual Meeting of the DPG and DPG Spring Meeting of the Condensed Matter Division, Berlin (Germany), 25-29 February 2008.

A. Moskvinova, S. Schulze, M. Hietschold, I. Schubert, R. Ecke, S. E. Schulz, "Effects of annealing on the microstructural evolution of copper films using texture analysis", EMC 2008 -- 14th European Microscopy Congress, Aachen (Germany), 1-5 September 2008.

J.A.T. Norman, M. Perez, S.E. Schulz, T. Waechtler, "New precursors for CVD copper metallization", MAM 2008 -- Materials for Advanced Metallization Conference, Dresden (Germany), 2-5 March 2008; published in Microelectron. Eng. 85 2159-2163 (2008). online via DOI: 10.1016/j.mee.2008.05.036; online via MONARCH

T. Oszinda, M. Schaller, S. Schulz, "Enhanced FTIR spectrum characterization of post etched ultra low-k SioCH with PCA and PLS", Workshop on Dielectrics in Microelectronics, Bad Saarow, Berlin (Germany), 23-25 June 2008.

D. Pouladsaz, S. Mohammadzadeh, T. Gessner, M. Schreiber, R. Streiter, "Theoretical study of electron transfer through polyacetylene nanowires in different contact structures", DPG Spring Meeting, Berlin (Germany), 25-29 February 2008.

N. Roth, A. Jakob, W. Wächtler, S.E. Schulz, T. Geßner, H. Lang, "Silver, Copper and Ruthenium Precursors for ALD and CVD - An Overview", Poster presentation, GerALD 2008 -- German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 22-23 September 2008.

N. Roth, "Copper Complexes as Precursors for CVD Processes", 1. LUC-MitarbeiterInnen Workshop, Graz (Austria), TU Graz, Institute of Inorganic Chemistry, 27 September 2008.

S. Rudra, T. Wächtler, M. Friedrich, S.J. Louis, C. Himcinschi, S. Zimmermann, S.E. Schulz, S. Silaghi, C. Cobet, N. Esser, T. Gessner, D.R.T. Zahn, "Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits", phys. stat. sol. (a) 205 (4), 922-926 (2008). online via DOI: 10.1002/pssa.200777831

J. Sindu, S. Rudra, D. Lehmann, M. Friedrich, D.R.T. Zahn, "Vacuum ultraviolet ellipsometry investigation of ultrathin organic films and their heterostructures", Appl. Surf. Sci. 255 (3), 694-697 (2008). online via DOI: 10.1016/j.apsusc.2008.07.055

T. Toader, J. Ivanco, G. Gavrila, W. Braun, D.R.T. Zahn, "Growth of CuPc thin films and metal contact formation: A photoemission study", Poster presentation, 72nd Annual Meeting of the DPG and DPG Spring Meeting of the Condensed Matter Division, Berlin (Germany), 25-29 February 2008.

T. Toader, J. Ivanco, G. Gavrila, A. Firsov, W. Braun, D.R.T. Zahn, "Growth of CuPc Thin Films and Metal Top Contact Formation: A Photoemission Study", 14th International Conference on Solid Films and Surface, Dublin (Ireland), 29 June - 4 July 2008.

T. Waechtler, S. Oswald, A. Pohlers, S. Schulze, S.E. Schulz, T. Gessner, "Copper and Copper Oxide Composite Films Deposited by ALD on Tantalum-Based Diffusion Barriers", Proceedings, Advanced Metallization Conference 2007, Mater. Res. Soc. Conf. Proc. AMC XXIII, 23-29 (2008).

T. Waechtler, S. Oswald, N. Roth, H. Lang, R. Ecke, S.E. Schulz, T. Gessner, "Atomic Layer Deposition of Ultra-Thin Copper and Copper Oxide Films for ULSI Metallization Purposes", Advanced Metallization Conference -- AMC 2008, San Diego, CA (USA), 23-25 September 2008.

T. Waechtler, S. Oswald, N. Roth, H. Lang, S.E. Schulz, T. Gessner, "ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices", 8th International Conference on Atomic Layer Deposition -- ALD 2008, Bruges (Belgium), 29 June - 2 July 2008. online via MONARCH

T. Waechtler, N. Roth, S. Oswald, H. Lang, S.E. Schulz, T. Gessner, "Atomic layer deposition of copper and copper oxide thin films for applications in microelectronic metallization systems", GerALD 2008 -- German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 22-23 September 2008.

T. Waechtler, S.E. Schulz, "Copper Oxide and Copper Thin Films Grown by ALD for Seed Layer Applications", Invited Talk, Twenty Fifth International VLSI Multilevel Interconnection Conference -- VMIC, Fremont, California (USA), 28-30 October 2008.

 

2007

N. Ahner, S.E. Schulz, F. Blaschta, M. Rennau, "Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics", Microelectron. Eng. 84 (11), 2606-2609 (2007). online via DOI: 10.1016/j.mee.2007.06.007

N. Ahner, S.E. Schulz, F. Blaschta, M. Rennau, "Thermal stability of spin-on MSQ low-k dielectrics", Poster presentation, European Congress on Advanced Materials and Processes - EUROMAT, Nuremberg (Germany), 10-13 September 2007.

O. Chukhrai, N. Schwarzer, F. Richter, "Determination of intrinsic stresses in thin films by nanoindentation", 71st Annual Meeting of the Deutsche Physikalische Gesellschaft and DPG Spring Meeting of the Division Condensed Matter, Regensburg (Germany), 26-30 March 2007.

O. Chukhrai, N. Schwarzer, F. Richter, "Concept for determination of intrinsic stresses by nanoindentation", 8th European Symposium on nano-mechanical Testing, Hückelhoven (Germany), 3-5 September 2007.

S. Frühauf, T. Gessner, T. Haase, A. Jakob, K. Kohse-Hoeinghaus, H. Lang, S.E. Schulz, T. Wächtler, "Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver", Smart Systems Integration 2007, Paris (France), 27-28 March 2007, Proceedings pp. 531-533.

B. Graffel, F. Müller, A.-D. Müller, M. Hietschold, "Feedforward correction of nonlinearities in piezoelectric scanner constructions and its experimental verification", Rev. Sci. Instrum. 78, 053706 (2007). online via DOI: 10.1063/1.2736786

A. Moskvinova, S. Schulze, M. Hietschold, "EBSD and EDX characterisation of copper films", Poster presentation, E-MRS Fall Meeting 2007, Warsaw (Poland), 17-21 September 2007.

N. Roth, A. Jakob, T. Waechtler, S.E. Schulz, T. Gessner, H. Lang, "Phosphane copper(I) complexes as CVD precursors", Surf. Coat. Technol. 201 (22-23), 9089-9094 (2007). online via DOI: 10.1016/j.surfcoat.2007.05.004

N. Roth, "Copper(I) Precursors for CVD and Spin-Coating", Talk, The 4th International Copper Interconnect Technology Symposium, Shanghai (China), 31 May 2007.

N. Roth, A. Jakob, T. Waechtler, S.E. Schulz, T. Gessner, H. Lang, "Phosphane copper(I) complexes as CVD precursors", Poster presentation, 16th EuroCVD, Den Haag (The Netherlands), September 2007.

N. Roth, A. Jakob, T. Waechtler, S.E. Schulz, T. Gessner, H. Lang, "Phosphane copper(I) complexes as CVD precursors", Poster presentation, Symposium "Molekulare Systeme", Chemnitz (Germany), November 2007.

S. Rudra, M. Friedrich, S. Louis, O. Gordan, T. Wächtler, D. Zahn, "Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits", Poster presentation, 71st Annual Meeting of the Deutsche Physikalische Gesellschaft and DPG Spring Meeting of the Division Condensed Matter, Regensburg (Germany), 26-30 March 2007.

S. Rudra, M. Friedrich, S.J. Louis, T. Wächtler, C. Himcinschi, D.R.T. Zahn, "Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits", Poster presentation, 4th International Conference on Spectroscopic Ellipsometry, Stockholm (Sweden), 11-15 June 2007.

S.E. Schulz, N. Ahner, "Deposition and properties of porous ultra-low-k dielectric films", Invited Talk, 8th Seminar Porous Glasses - Special Glasses, Wroclaw (Poland), 4-8 September 2007.

T. Toader, et al., "Controlling of the molecular orientation in ordered CuPc films via different passivations of vicinal Si(111) surfaces", Poster presentation, European Conference on Molecular Electronics (ECME), Metz (France), 5-8 September 2007.

T. Waechtler, N. Roth, S. Oswald, S.E. Schulz, H. Lang, T. Gessner, "Composite films of copper and copper oxide deposited by ALD", Poster presentation, AVS 7th International Conference on Atomic Layer Deposition - ALD 2007, San Diego, California (USA), 24-27 June 2007.

T. Waechtler, A. Jakob, N. Roth, S. Oswald, S.E. Schulz, H. Lang, T. Gessner, "Copper thin films grown via ALD of copper oxide", Oral presentation, European Congress on Advanced Materials and Processes - EUROMAT, Nuremberg (Germany), 10-13 September 2007.

T. Waechtler, S. Oswald, A. Pohlers, S. Schulze, S.E. Schulz, T. Gessner, "Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers", Poster presentation, Advanced Metallization Conference (AMC), Albany, NY (USA), 9-11 October 2007.

 

2006

T. Waechtler, B. Gruska, S. Zimmermann, S.E. Schulz, T. Gessner, "Characterization of Sputtered Ta and TaN Films by Spectroscopic Ellipsometry", Oral presentation, 8th International Conference on Solid-State and Integrated Circuit Technology (ICSICT-2006), 23-26 October 2006, Shanghai (China), Proceedings pp. 2184-2186. online via IEEE or MONARCH

T. Waechtler, Y. Shen, A. Jakob, R. Ecke, S.E. Schulz, L. Wittenbecher, H.-J. Sterzel, K. Tiefensee, S. Oswald, S. Schulze, H. Lang, M. Hietschold, T Gessner, "Evaluation of Phosphite and Phosphane Stabilized Copper(I) Trifluoroacetates as Precursors for the Metal-Organic Chemical Vapor Deposition of Copper", Poster presentation, Materials for Advanced Metallization Conference - MAM, Grenoble (France), 6-8 March 2006. online via MONARCH

T. Waechtler, B. Gruska, S. Zimmermann, S.E. Schulz, T. Gessner, "Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry", Oral presentation, 4th Workshop Ellipsometry, Berlin (Germany), 20-22 February 2006. online via MONARCH