Today micro and nano systems (MEMS/NEMS) are integrated in almost every high tech or smart product. Miniaturized acceleration sensors help to prevent injuries during accidents or even prevent accidents by car. Other MEMS devices help to monitor medical parameters, allow low cost telecommunication, print crystal sharp colour images and so on. While the devices themselves have matured significantly over the last decade to become commonplace products, packaging of these tiny sensitive components and systems has not been addressed thoroughly. Hence the packaging plays a significant role for the manufacturing costs at least. In cooperation with Fraunhofer ENAS we develop solutions for exactly these packaging problems starting with zero level packaging on wafer level up to module or board level packaging.
For more details about bonding technologies please see Waferbonding.