Annual Report 2005

Please see the table of contents below:

1. Preface
2. Organization
3. Memberships & connected institutes: Fraunhofer Institute, Nanotechnology Center of Excellence
4. Research activities
   
   • Current research projects
   • Collaborative Research Center No. 379 (Sonderforschungsbereich) "Arrays of micromechanical sensors and actuators"
     
     • A1: Design of micromechanical components: Development of accelerometer arrays for drift compensation
     • A2: Acceleration sensor modeling using SystemC-AMS
     • A4: Micromachined force coupled sensor system for frequency selective vibration monitoring
     • B2: Experimental characterization, model adaption - reliability: Characterization on MEMS on the base of Eigenfrequencies
     • B5: A new microactuator with transmission grating for a spectral imaging technology
     • B6: Non-optical distance detection with force-sensor arrays for dynamic Atomic Force Microscopy
     • C2: A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers
     • C4: Low temperature bonded resonator arrays with adjustable stiffness
   • Special reports
     • W(Si)N layer as diffusion barrier for Copper metallization
     • Mechanical characterization of porous ultra low-k films with k -2.2
     • H2-strip processes and their impact on porous low-k materials
     • Air gap formation using wet etch of sacrificial PECVD SiOx
     • Electrical characterization and simulation of air gap structures
     • "Spin on metal" - preparation of metal Cu and Ag films by spin coating of metallo-carboxylate and formiate precursors for electronic applications
     • CMP process development for Cu/low-k based interconnect systems
     • Simulation of advanced PVD in Copper Damascene process flows
     • Different approaches to integrate patterned buried CoSi2 layers in SOI substrates
     • First principle calculations of silicon-oxynitride gate dielectrics
     • System identification for MEMS devices
     • Multiparametric simulation for MEMS based on automatic differentiation and series expansion of Finite Element Codes
     • Methods for model validation and wafer level test, PARTEST-Project
     • Modeling and Simulation of MicroElectroMechanical Systems
     • Microwave phase shifter in MEMS-technology
     • A MEMS friction vacuum gauge suitable for high temperature environment
     • Coplanar electromagnetic signal coupler for RF-MEMS devices
     • High resolution low-g AIM sensor
     • Development and integration of inertial sensors within active smart RF-ID label for transportation monitoring
     • Integrated analogue, mixed-signal and high-voltage design and device modelling
     • pn-junction formation at RIE textured silicon surfaces
     • Silicon standard for the calibration of instruments of micro hardness testing
     • Deposition of amorphous hydrogenated diamond-like carbon films (a-C:H)
     • Advanced supercaps based on nanostructured materials
5. Cooperations with industry and universities
6. Equipment and service offer
7. Education
   • Lectures
   • Student exchange programmes
   • Project reports / Diploma theses / PhD
8. Colloquia / Workshops at the Institute
9. Scientific publications
10. Guests & special international relations