Chemnitz UT: Center for Microtechnologies: Current Publications
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Publications at the ZfM

For publications of years before 2003 please see our annual reports.

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BOOKS

2012
Forke,R.:; Mikromechanisches kraftgekoppeltes Sensor-Aktuator-System für die resonante Detektion niederfrequenter Schwingungen(ISBN978-3-941003-74-3)
Wiemer,M.; Wuensch,D.; Braeuer,J.; Gessner,T.: Chapter Plasma-Activated Bonding. ; in the book: Handbook of Wafer Bonding, ed. by Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo (2012) pp 101-118(ISBN978-3-527-32646-4)
2010
Leidich,S.:; Entwicklung eines integrierten Mikroresonators für die kernmagnetische Resonanzspektroskopie kleinster Probenvolumen(ISBN9783941003149)
Waechtler,T.:; Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices. published by Universitätsverlag Chemnitz, 2010(ISBN978-3-941003-17-0)
2009
Gessner,T.; Baum,M.; Gessner,W.; Lugert,G.: Chapter Smart integrated systems - from components to products. ; in the book: More than Moore: Creating High Value Micro/Nanoelectronics Systems, ed. by Guo Qi Zhang, Mart Graef, Alfred J. van Roosmalen (2009)(ISBN978-0387755922)
2008
Klumpp,A.; Wieland,R.; Ecke,R.; Schulz,S.E.: Chapter Metallization by CVD of W and Cu. ; in the book: Handbock of 3D Integration - Technology and Applications of 3D Integrated Circuits, Volume I, ed. by Garrou,P.;Bower,C.;Ramm,P. (2008)(ISBN978-3-527-32034-9 )
2007
Gottfried,K.; Schubert,I.; Schulze,K.; Schulz,S.E.; Gessner,T.: Chapter CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices. ; in the book: ICPT - International Conference on Planarization/CMP, ed. by Dr. Zwicker, Gerfried (2007) pp 297-302(ISBN9783800730650)
2005
Lohmann,C.; Reuter,D.; Bertz,A.; Geßner,T.: Chapter High Aspect Ratio Micromachining using the AIM Technology. ; in the book: The World of Electronic Packaging and System Integration, pp 544-548(ISBN3-932434-76-5)
Wiemer,M.; Frömel,J.; Geßner,T.; Otto,T.: Chapter Wafer bonding in micro mechanics and microelectronics – an overview. ; in the book: The World of Electronic Packaging and System Integration, pp 307-313(ISBN3-932434-76-5)
2004
Herrmann,G.; Dost,G.: Chapter Entwurf und Technologie von Mikroprozessoren. ; in the book: Taschenbuch Mikroprozessortechnik, ed. by Beierlein, T.; Hagenbruch, O. (2004)
Herrmann,G.; Müller,D.:; ASIC – Entwurf und Test(ISBN3446217096)
2003
Lohmann,C.; Bertz,A.; Küchler,M.; Geßner,T.: Chapter A Novel High Aspect Ratio Technology for MEMS Fabrication Using Standard Silicon Wafers. ; in the book: Advanced Microsystems for Automotive Applications 2003, pp 59-66(ISBN3-540-00597-8)
Schulz,S.E.; Geßner,T.: Chapter Spin-on Si-based low-k materials. ; in the book: Interlayer Dielectrics for Semiconductor Technologies, ed. by Murarka,S.P.;Eizenberg,M.;Sinha,A.K. (2003)
Uhlig,M.; Geßner,T.: Chapter Chemical vapor deposition of C-F- low-k materials. ; in the book: Interlayer Dielectrics for Semiconductor Technologies, ed. by Murarka,S.P.;Eizenberg,M.;Sinha,A.K. (2003)
Valenta,J.; Linros,J.; Juhasz,R.; Cichos,F.; Martin,J.: Chapter Optical Spectroscopy of Single Quantum Dots. ; in the book: Towards the First Silicon Laser, ed. by Pavesi, L. et al. (2003) pp 89-108
2002
Wiemer,M.; Frömel,J.; Geßner,T.: Chapter Applikationsfelder für Waferbondverfahren in der Mikromechanik und Mikroelektronik. ; in the book: Festschrift für prof. Meusel – TU Dresden
PAPERS

2013
Braeuer,J.; Tomoscheit,E.; Hertel,S.; Besser,J.; Wiemer,M.; Gessner,T.: Hermetic and Room-Temperature Wafer-Level-Packaging Based on Nanoscale Energetic Systems . ICMCTF, San Diego, CA, 2013 April 29 - May 3; Proceedings, Invited Talk
F.Fuchs; Wagner,C.; Schuster,J.: Ab-initio study of metal-decorated carbon nanotubes for interconnect and sensor applications. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Poster; Abstract in: Verhandlungen der DPG(ISSN0420-0195)
Haas,S.; Schramm,M.; Loebel,K.-U.; Heinz,S.; Reuter,D.; Bertz,A.; Horstmann,J.T.; Gessner,T.: Studies on the piezoresistive effect in MOS transistors for use in integrated MEMS sensors. Smart Systems Integration, Amsterdam(NL), 2013 Mar 13-14(ISBN978-3-8007-3081-0)
Hofmann,L.; Schubert,I.; Ecke,R.; Gottfried,K.; Schulz,S.E.; Gessner,T.: Vertical Integration techniques for MEMS using HAR TSV. Smart Systems Integration, Amsterdam(NL), 2013 Mar 13-14; Proceedings(ISBN978-3-8007-3081-0)
Kurth,S.; Voigt,S.; Haas,S.; Bertz,A.; Kaufmann,C.; Gessner,T.; Akiba,A.; Ikeda,K.: Analysis of metal-metal contacts in RF MEMS switches . ; SPIE Proceedings, 8614 (2013)
Reuter,D.; Banerjee,S.; Fronk,M.; Salvan,G.; Hiller,K.; Zahn,D.R.T.; Gessner,T.: Laterally stacked organic devices fabricated by trench technology. Smart Systems Integration, Amsterdam (NL), 2013 Mar 13-14; Proceedings(ISBN978-3-8007-3081-0)
Teichert,F.; Zienert,A.; Schuster,J.: Electronic structure and transport properties of crossed carbon nanotubes. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Poster presentation; Abstract in: Verhandlungen der DPG(ISSN0420-0195)
Wagner,C.; Fuchs,F.; Teichert,F.; Schuster,J.; Gessner,T.: Theoretical investigation of CNT transistors used as strain sensors. IWEPNM, Kirchberg in Tirol (Austria), 2013 Mar 2-9; Poster presentation
Wagner,C.; Schuster,J.; Gessner,T.: Analytical and numerical transistor models for Carbon nanotubes under strain. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Talk; Abstract in: Verhandlungen der DPG(ISSN0420-0195)
Weiss,A.; Besser,J.; Baum,M.; Saupe,R.; Otto,T.; Gessner,T.: Fabrication of subwavelength holes using nanoimprint lithography. Proc. SPIE 8613, San Francisco, California (USA) , 2013 Feb 2-7; Advanced Fabrication Technologies for Micro/Nano Optics and Photonics VI, 86131N
Zienert,A.; Schuster,J.; Gessner,T.: Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes. ; Microelectron. Eng., 106 (2013) pp 100-105
Zienert,A.; Schuster,J.; Gessner,T.: Extended Hückel Theory for Carbon Nanotubes: Band Structure and Transport Properties. ; J. Phys. Chem. A, 117 (2013) pp 3650-3654
Zienert,A.; Schuster,J.; Gessner,T.: Electronic transport properties of metallic carbon nanotubes with metal contacts. IWEPNM 2013, Kirchberg in Tirol (Austria), 2013 Mar 2-9; Poster presentation
Zienert,A.; Schuster,J.; Gessner,T.: Electron Transport properties of metallic carbon nanotubes with metal contacts. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2013 Mar 10-15; Talk; Abstract in: Verhandlungen der DPG(ISSN0420-0195)
2012
Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. ; Solid State Phenomena, 187 (2012) pp 201-205(ISSN1012-0394)
Arekapudi,P.K.; Reuter,D.; Lehmann,D.; Zahn,D.R.T.: Structural and Electrical Characterization of 3D Gate Organic Field Effect Transistor . Poster presentation, DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30
Balaj,I.; Raschke,R.; Baum,M.; Uhlig,S.; Wiemer,M.; Gessner,T.; Grafe,J.: Development of transfer Electrostatic Carriers (T-ESC) for thin 300 mm wafer handling using seal glass bonding technology. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, Paper 53 (2012)(ISBN978-3-8007-3423-8)
Baum,M.; Besser,J.; John,B.; Keiper,B.; Haenel,J.; Wiemer,M.; Gessner,T.: Micro hot embossing and micro laser welding technologies for fluidic applications. Micromechanics and Microsystems Europe Workshop MME 2012, Ilmenau, 2012 Sep 9-12; Proceedings, Paper 1673, A 12 (2012)(ISBN978-3-938843-71-0)
Benchirouf,A.; Sowade,E.; Al-Hamry,A.; Blaudeck,T.; Kanoun,O.; Baumann,R.R.: Investigation of RFID passive strain sensors based on carbon nanotubes using printing technology. SSD (Signals, Systems and Devices), Chemnitz, 2012 March 20-23; Proceedings(ISBN978-1-4673-1590-6)
Besser,J.; Baum,M.; Wiemer,M.; Gessner,T.; Sanchez-Ordonez,S.; Thanner,C.; Vetter,C.: Thermal and UV nanoimprint lithography for applications from the micro to the nano scale. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, Paper 28 (2012)(ISBN978-3-8007-3423-8)
Blaudeck,T.; Adner,D.; Hermann,S.; Lang,H.; Schulz,S.E.; Gessner,T.: Wafer-level Integration of Functionalized Carbon Nanotubes as Prototypes for Tunable Sensors. MRS Fall Meeting 2012, Boston, 2012 November 25-30
Blaudeck,T.; E.I.Zenkevich; M.M.S.Abdel-Mottaleb; K.Szwaykowska; D.Kowerko; F.Cichos; C.von Borczyskowski: Formation Principles and Ligand Dynamics of CdSe Quantum Dots and Functionalised Dye Molecules. ; ChemPhysChem, 13 (2012) pp 959-972(ISSN1439-4235)
Blaudeck,T.; P.Andersson Ersman; M.Sandberg; S.Heinz; A.Laiho; J.Liu; I.Engquist; M.Berggren; Baumann,R.R.: Simplified large-area manufacturing of organic electrochemical transistors combining printing and a self-aligning laser ablation step. ; Advanced Functional Materials, 22 (2012) pp 2939-2948(ISSN1616-3028)
Blaudeck,T.; S.Heinz; P.Andersson Ersman; M.Sandberg; A.Laiho; J.Liu; I.Engquist; M.Berggren; Baumann,R.R.: Manufacturing of Organic Electrochemical Transistors combining Two Printing Technologies and a Self-Aligning Laser Ablation Step. ILACOS (International Laser and Coating Symposium, Dresden (Germany), 2012 Oct 17-18
Bonitz,J.: Reaktive nanoskalige Mehrschichtsysteme lösen Temperaturprobleme bei Mikrosystemen. ; MECHATRONIK, 12 (2012) pp 14-15
Braeuer,J.: Reaktive nanoskalige Mehrschichtsysteme lösen Temperaturprobleme bei Mikrosystemen. ; MECHATRONIK, 12 (2012) pp 14-15
Braeuer,J.; Besser,J.; Froemel,J.; Wiemer,M.; Gessner,T.: Robust and high-reliability packages for high pressure sensors by using reactive wafer bonding. Semicon Japan, Tokio, Japan, 2012 December 5-7; Proceedings, STS Session 11 Packaging
Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings(ISBN978-3-8007-3423-8)
Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: A novel technique for MEMS packaging: Reactive bonding with integrated material systems. ; Sensors and Actuators A: Physical, 188 (2012) pp 212-219(ISSN0924-4247)
Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Using of Different Nano Scale Energetic Material Systems for Reactive Bonding . ECS - Honolulu PRiME 2012 , Honolulu, Hawaii, October 7 - October 12, 2012; Proceedings, p 2976(ISSN2151-2043)
Braeuer,J.; Schneider,W.; Dietrich,T.R.; Brode,W.; Schaefer,R.: Erarbeitung einer Raumtemperatur-Bondtechnologie in der Mikrosystemtechnik. ; PLUS, 7 (2012) pp 1631-1637
Braeuer,J.; Wiemer,M.; Gessner,T.: Hermetic and Room-Temperature Wafer-Level-Packaging Based On Nano Scale Energetic Systems. MRS Fall Meeting, Boston, MA, November, 25-30; Proceedings, Invited Talk
Brombacher,C.; Grobis,M.; Lee,J.; Fidler,J.; Eriksson,T.; Werner,T.; Hellwig,O.; Albrecht,M.: L10 FePtCu bit patterned media. ; Nanotechnology, 2 (2012)
Enderlein,T.; Baum,M.; Nestler,J.; Otto,T.; Besser,J.; Wiemer,M.; John,B.; Haenel,J.; Gessner,T.: Laser Micromachining and micro hot embossing for highly integrated Lab-on-Chip Systems. Smart System Integration (SSI), Zürich, 2012 Mar 21-22; Proceedings(ISBN978-3-8007-3423-8)
Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. ICNFA, Montreal, 2012 Aug 7-9; Talk
Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. ; Proceedings of the 3rd International Conference on Nanotechnology: Fundamentals and Applications(ISBN978-0-9867183-3-5)
Fiedler,H.; Melzer,M.; Waechtler,T.; Hermann,S.; Schulz,S.E.; Gessner,T.: Nanomaterials for Interconnects. 8th Interregional Workshop on Advanced Nanomaterials (IWAN 2012), Frankfurt (Oder) (Germany), 2012 Nov 12-13
Fiedler,H.; Toader,M.; Hermann,S.; Rennau,M.; Schulz,S.E.; Hietschold,M.; Gessner,T.: Fabrication and characterization of CNT via interconnects for application in integrated circuits. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30; Talk(ISBNAbstract in: Verh. Dtsch. Phys. Ges. (ISSN 0420-0195))
Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Sheremet,E.; Rennau,M.; Schulze,S.; Waechtler,T.; Hietschold,M.; Zahn,D.R.T.; Schulz,S.E.; Gessner,T.: Distinguishing between Individual Contributions to the Via Resistance in Carbon Nanotubes Based Interconnects. ; ECS Journal of Solid State Science and Technology, 1 (2012) pp M47-M51(ISSN2162-8769)
Fischer,T.; Prager,L.; Hohage,J.; Ruelke,H.; Schulz,S.E.; Richter,R.; Gessner,T.: A two-step UV curing process for producing high tensile stressed silicon nitride layers. MRS Spring Meeting, San Francisco; 2012 MRS Spring Meeting Proceedings
Fischer,T.; Schulz,S.E.; Gessner,T.; Prager,L.; Hohage,J.; Ruelke,H.; Richter,R.: A complimentary study of vacuum ultraviolet curing procedures on high tensile stress SiXNYHZ PECVD silicon nitride layers. ; JVST:B
Froemel,J.; Lin,Y.; Wiemer,M.; Gessner,T.; Esashi,M.: Low temperature metal interdiffusion bonding for micro devices . Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on, Tokyo, Japan, 22-23 May 2012 p 163(ISBN978-1-4673-0743-7)
Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2. ; Thin Solid Films, 520 (2012) pp 4741-4744(ISSN0040-6090)
Gebauer,C.; Schueller,M.; Hiller,K.; Schulze,R.; Otto,T.; Gessner,T.: Design and Manufacturing of Micro Synthetic Jet Actuators. Smart System Integration (SSI), Zürich, 2012 Mar 21-22; Proceedings(ISBN978-3-8007-3423-8)
Geidel,S.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Otto,T.; Gessner,T.: Laserbasierter Multilayer-Fügeprozess zur Erzeugung heterogener und druckstabiler mikrofluidischer Systeme. 11. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2012 Oct 23-24; Proceedings(ISBN978-3-00-039162-0)
Gessner,T.; Schulz,S.E.; Waechtler,T.; Lang,H.; Jakob,A.: Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition und Verwendung des Verfahrens. ; Patent, DE 10 2007 058 571 B4 (2012)
Gessner,Thomas; Koehler,Thomas: Smart Systems Integration - short review and further development of smart systems. Smart Systems Integration SSI2012, Zurich (Switzerland), 2012 Mar 21 - 22; Proceedings (CD-ROM), Paper 0, 2012
Gordan,O.D.; Lehmann,D.; Haidu,F.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Lang,H.; Braun,W.; Gessner,T.; Zahn,D.R.T: Copper Oxidation and Reduction: A Combined Ellipsometry and Photoemission Study. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14
Gossler,C.; Kunzer,M.; Baum,M.; Wiemer,M.; Moser,R.; Passow,T.; Koehler,K.; Schwarz,U.T.; Wagner,J.: Aluminum-Germanium Wafer Bonding of (AlGaIn)N Thin Film Light-Emitting Diodes. ; Microsystem Technologies, in press (2012)(ISSN1432-1858)
Haas,S.; Schramm,M.; Heinz,S.; Loebel,K.-U.; Reuter,D.; Bertz,A.; Gessner,T.; Horstmann,J.T.:11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings, pp 242-246(ISBN978-3-00-039162-0)
Harazim,S.; Helke,C.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Sanchez,S.; Grimm,D.; Otto,T.; Schmidt,O.; Gessner,T.: LoC Integrationsstrategien für aufgerollte Sensoren. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings, pp 147-152(ISBN978-3-00-039162-0)
Haubold,M.; Lin,Y.; Froemel,J.; Wiemer,M.; Esashi,M.; Gessner,T.: A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface. ; Microsystem Technologies
Helke,C.; Schueller,M.; Hiller,K.; Schulze,R.; Braeuer,J.; Nestler,J.; Otto,T.; Gessner,T.: Bonding technologies for standard bulk PZT ceramics without the need of after process polarization especially on thin silicon membranes. Actuator, Bremen, 2012 Jun 18-20; Proceedings, pp 705-708(ISBN978-3-933339-19-5)
Hermann,S.; Bonitz,J.; Kaufmann,C.; Schulz,S.E.; Gessner,T.; Shaporin,A.; Voigt,S.; Mehner,J.; Hartmann,S.; Wunderle,B.: Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes. Herrenhausen Conference „Downscaling Science“ , Hanover (Germany), 2012 Dec 12-14
Hermann,S.; Fiedler,H.; Loschek,S.; Schulz,S.E.; Gessner,T.: Processes for wafer level integration of carbon nanotubes in electronic and sensor applications. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings(ISBN9783000391620)
Hermann,S.; Fiedler,H.; Yu,H.; Loschek,S.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications. Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Systems, Signals and Devices (SSD), 2012 9th International Multi-Conference on(ISBN978-1-4673-1589-0)
Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration in Interconnects and MEMS/NEMS. Advanced metallization conference 2012, Albany, 2012 Oct 9-11; Invited Talk
Hermann,S.; Schulz,S.E.; Gessner,T.: Novel form of carbon nanotube films with a self-assembled carbon-metal heterostructure. Vth International Conference on Molecular Materials, Barcelona (Spain), 2012 Jul 03-06
Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration beyond CMOS and MEMS/NEMS. INC8 - International Nanotechnology Conference on Communication and Cooperation, Tsukuba; invited Talk, 2012 May 8-11
Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schaefer,P.; Zahn,DRT; Albrecht,M.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure. ; Carbon, 50 (2012) pp 4765-4772(ISSN0008-6223)
Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schulz,S.E.; Gessner,T.: Novel carbon nanotube film with a self-assembled carbon-metal heterostructure. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27
Hofmann,K.; Billep,D.; Forke,R.; Hiller,K.; Gessner,T.: Robust Design of MEMS structures. Smart System Integration, Dresden (Germany), 2011 Mar 22-23; Proceedings, Paper 72(ISBN978-3-8007-3324-8)
Jia,C.; Reuter,D.; Wen,Zhiyu; Baum,M.; Wiemer,M.; Gessner,T.: FEM simulation and its application in MEMS design . Proceedings of 2011 Semiconductor Conference Dresden (SCD) , Dresden, 27-28 Sept. 2011(ISBN978-1-4577-0431-4 )
Koehler,D.; Hiller,K.; Forke,R.; Konietzka,S.; Billep,D.; Heinz,S.; Lange,A.: Development and Characterization of a high precision vibratory MEMS gyroscope system with low-noise integrated readout and control electronics. Sensorsysteme 2012, 14th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 2012 Oct 18-19
Koehler,D.; Hiller,K.; Forke,R.; Konietzka,S.; Pohle,A.; Billep,D.; Heinz,S.; Lange,A.: Development and Characterization of a high precision vibratory MEMS gyroscope system. International MEMS Forum, Moscow (Russia), 2012 Oct 03-04
Koehler,D.; Hiller,K.; Forke,R.; Konietzka,S.; Pohle,A.; Billep,D.; Heinz,S.; Lange,A.: Development and Characterization of a high precision vibratory MEMS gyroscope system with low-noise integrated readout and control electronics. 11. Chemnitzer Fachtagung Mikrosystemtechnik-, Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2012 Oct 23-24
Kurth,S.; Hiller,K.; Meinig,M.; Gessner,T.: Tunable Fabry-Pérot Interferometers for Infrared Spectroscopy. ; Mikrosystemtechnik in Deutschland 2012, pp 48-49(ISSN2191-7183)
Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Specht,H.; Meinig,M.; Gessner,T.: Fabry-Perot tunable infrared filter based on structured reflectors. SPIE Photonics Europe, Brussels, 2012 Apr 16-20; Proc. of SPIE, 8428 (2012) p 84281O
Loschek,S.; Hermann,S.; Haibo,Y.; Schulz,S.E.: Structuring of carbon nanotubes for field emission based movement sensors. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz (Germany), 2012 March 20-23(ISBN978-1-4673-1589-0)
Loschek,S.; Hermann,S.; Haibo,Y.; Schulz,S.E.: Field emitting carbon nanotubes in MEMS-structures for movement sensors. 11. Chemnitzer Fachtagung Mikrosystemtechnik , Chemnitz (Germany), 2012 Oct 23-24(ISBN978-3-00-039162-0)
Melzer,M.; Foerster,A.; Waechtler,T.; Wagner,C.; Fiedler,H.; Schuster,J.; Hermann,S.; Schulz,S.E.; Gessner,T.: Controlling the growth morphology of ALD copper oxide on CNTs by thermal oxidation prior to the ALD. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20
Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30
Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Copper oxide ALD on thermally pretreated CNTs for interconnect applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14
Moebius,M.; Weiss,A.; Otto,T.; Gessner,T.: Chip-based optical sensor to determine the arterial oxygen concentration. Smart System Integration (SSI), Zürich, 2012 Mar 21-22(ISBN978-3-8007-3423-8)
Morschhauser,A.; Stiehl,C.; Geidel,S.; Nestler,J.; Otto,T.; Gessner,T.: Towards integration of silica membrand based DNA extraction on chip. Smart System Integration (SSI), Zürich, 2012 Mar 21-22(ISBN978-3-8007-3423-8)
Morschhauser,A.; Stiehl,C.; Grosse,A.; Nestler,J.; Otto,T.; Gessner,T.: Membrane based sample preparation chip. ; Biomedical Engineering, 57 (2012) pp 923-925(ISSN0013-5585)
Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Schulz,S.E.; Lang,H.; Zahn,D.R.T.; Gessner,T.: An Approach for Cu ALD on Co/Ni as Liners for ULSI Interconnects and Magnetic Film Systems for Spintronic Applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14
Nestler,J.; Enderlein,T.; Geidel,S.: Laser Micromachining for Micro- and Lab-on- Chip-Systems. ILACOS (International Laser and Coating Symposium), Dresden (Germany), 2012 Oct 17-18
Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Micro arc welding for electrode gap reduction of high aspect ratio microstructures. ; Sensors and Actuators A: Physical, 188 (2012) pp 495-502
Raukopf,S.; Gebhardt,C.; Roscher,F.; Baum,M.; Kinner,R.; Wiemer,M.; Gessner,T.: Si Interposer Technologies for three dimensional AMR Sensor Systems. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, p Paper 40(ISBN978-3-8007-3423-8)
Reuter,D.; Ghosh,J.; Rennau,M.; Hiller,K.; Salvan,G.; Fronk,M.; Zahn,D.R.T.; Bof Bufon,C.C.; Schmidt,O.G.: I-V Characteristics of Copper Phthalocyanine Based Laterally Stacked Devices Fabricated by Semiconductor Processing. Poster presentation, DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30
Reuter,D.; Nowack,M.; Shaporin,A.; Rockstroh,J.; Haas,S.; Bertz,A.; Mehner,J.; Gessner,T.: Out of Plane Capacitive Transducer in Air Gap Insulation Microstructures Technology for High Precision Monolithic 3-Axis Sensors. Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22; Proceedings(ISBN978-3-8007-3423-8 )
Rodriguez,R.D.; Toader,M.; Hermann,S.; Mueller,S.; Gordan,O.D.; Yu,H.; Schulz,S.E.; Hietschold,M.; Zahn,D.R.T.: Nanoscale Optical and Electrical Characterization of Aligned Semiconducting Single-Walled Carbon Nanotubes in a Field Effect Transistor. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27
Salvan,G.; Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Schubert,C.; Albrecht,M.; Zahn,D.R.T.: Magneto-optical Kerr Effect Studies of Heterostructures of Ferromagnetic and Copper Oxide Layers Produced by Atomic Layer Deposition. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14
Salvan,G.; Fronk,M.; Robaschik,P.; Zahn,D.R.T.; Albrecht,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.: Heterostructures of Copper Oxide Layers Produced by ALD with Ferromagnetic Layers Studied by Magneto-Optical Kerr Effect Spectroscopy. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20
Schmeisser,M.; Schuster,J.; Schulz,S.E.; Auer,A.: Quantum chemical modeling of basic reaction steps for the reduction of ALD-grown copper oxide films. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden, 2012 June 17-20; Poster
Schulze,R.; Gessner,T.; Schueller,M.; Forke,R.; Billep,D.; Heinrich,M.; Sborikas,M.; Wegener,M.: Integration of Piezoelectric Polymer Transducers into Microsystems for Sensing Applications. Applications of Ferroelectrics held jointly with 2012 European Conference on the Applications of Polar Dielectrics and 2012 International Symp Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials (ISAF/ECAPD/PFM), 2012 Intl Symp, Aveiro (Portugal), 2012 Jul 9-13 pp 1-4(ISBN978-1-4673-2668-1 )
Schumacher,S.; Nestler,J.; Otto,T.; Wegener,M.; Ehrentreich-Foerster,E.; Michel,D.; Wunderlich,K.; Palzer,S.; Sohn,K.; Weber,A.; Burgard,M.; Grzesiak,A.; Teichert,A.; Brandenburg,A.; Koger,B.; Albers,J.; Nebling,E.; Bier,F.F.: Highly-integrated lab-on-chip system for point-of-care multiparameter analysis. ; Lab Chip, 12 (2012) pp 464-473(ISSN1473-0197)
Schuster,J.; Mohammadzadeh,S.; Streiter,R.; Wagner,C.; Zienert,A.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Nanodevices. Nanofair 2012, Dresden, June 13; Talk
Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact Metallization and Stress Liner Technologies for Strained Silicon. Materials for Advanced Metallization Conference (MAM), Grenoble, 2012 Mar 11-14; Talk, Book of Abstracts
Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact Metallization and Stress Liner Technologies for Strained Silicon. ; Microelectronic Eng., submitted
Schuster,J.; Streiter,R.; Wolf,H.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Equipment and Processes for the Deposition of Thin Films . SEMICON Europa , Dresden, Oct 9-11; Talk
Sickmann,J.; Schuster,J.; Richter,R.; Wuerfel,A.; Geisler,H.; Engelmann,H.-J.; Lichte,H.: Strain mapping of tensile strained transistors by dark-field off-axis electron holography. Proceedings of 15th European Microscopy Congress (EMC), Manchester, September,16th - 21st ; Poster
Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Poster presentation; Summary Proceedings, Vol. IV (2012)(ISBN978-3-9814766-4-4)
Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23(ISBN978-1-4673-1590-6)
Sommer,J.; Zienert,A.; Schuster,J.: Band structure und electronic transport properties of cobalt decorated carbon nanotubes. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Poster presentation; Abstract in: Verhandlungen der DPG(ISSN0420-0195)
Sowade,E.; Belgardt,C.; Blaudeck,T.; Baumann,R.R.: Bottom-up Nanoengineering by Combining Directed Self-assembly and Inkjet Printing. MRS Fall Meeting 2012 , Boston, 2012 November 25-30
Sowade,E.; Blaudeck,T.; Baumann,R.R.: Preparation of spherical, ordered colloidal aggregates using inkjet printing. MRS Spring Meeting , San Francisco, 2012 Apr 9-13; MRS Proceedings, 1453 (2012) p 1292 (5 pp)(ISSN0272-9172)
Sowade,E.; Hammerschmidt,J.; Blaudeck,T.; Baumann,R.R.: In-flight inkjet self-assembly of spherical nanoparticle aggregates. ; Advanced Engeneering Materials, 14 (2012) pp 98-100(ISBN1527-2648 (electronic version))
Streit,P.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: Comparison of lumped and finite element modeling for thermoelectric devices. Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22; Proceedings(ISBN978-3-8007-3423-8)
Toader,M.; Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.; Hietschold,M.:International Confererence on Superlattices, Nanostructures and Nanodevices, Dresden (Germany), 2012 Jul 22-27
Toader,M.; Fiedler,H.; Schulz,S.E.; Hietschold,M.: Conductive AFM for CNTs characterisation. DPG Frühjahrstagung, Berlin, 2012 Mar 25-30; Poster
Tuchscherer,A.; Georgi,C.; Roth,N.; Schaarschmidt,D.; Rueffer,T.; Waechtler,T.; Schulze,S.E.; Oswald,S.; Gessner,T.; Lang,H.: Ruthenocenes and Half-Open Ruthenocenes: Synthesis, Characterization, and Their Use as CVD Precursors for Ruthenium Thin Film Deposition. ; Eur. J. Inorg. Chem., 2012 (2012) pp 4867-4876(ISSN1099-0682)
Vogel,K.; Baum,M.; Roscher,F.; Kinner,R.; Rank,H.; Mayer,T.; Wiemer,M.; Gessner,T.: Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung. 11. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2012, Oktober 23-24; Proceedings, pp S5-2, 6S.(ISBN978-3-00-039162-0)
Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.: Mechanical characterization of glass frit bonded wafers. YSESM, Brasov, 2012 May 30 - June ; Proceedings of 11th Youth Symposium on experimental solid mechanics, pp 239-245(ISBN978-606-19-0078-7)
Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.: Influence of test speed on the bonding strength of glass frit bonded wafers. YSESM, Brasov, 2012 May 30 - June 2; Abstract Book of 11th Youth Symposium on experimental solid mechanics, pp 100-101(ISBN978-606-19-0079-4)
Vogel,M.; Braeuer,J.; Wiemer,M.; Nestler,J.; Kurth,S.; Otto,T.; Gessner,T.: Smart Systems for Different Applications from Fraunhofer ENAS. ; in: Mikrosystemtechnik in Deutschland 2012, pp 72-73(ISSN2191-7183)
Voigt,S.; Kurth,S.; Gessner,T.: Sensornetzwerk zum Monitoring von Hochspannungsleitungen. 3. Landshuter Symposium Mikrosystemtechnik, Landshut, 2012 Mar 13-14
Voigt,S.; Kurth,S.; Gessner,T.: Autonomous sensor network for power line monitoring. SSI - Smart System Integration Conference, Zürich, 2012 Mar 21-22
Voigt,S.; Pfeiffer,M.; Grolms,A.; Kurth,S.; Keutel,T.; Brockmann,C.; Braunschweig,M.: Autarkes Sensornetzwerk zum Monitoring von Hochspannungsleitungen. Chemnitzer Fachtagung Mikrosystemtechnik – Mikromechanik & Mikroelektronik, Chemnitz, 2012 Oct 23-24
Voigt,S.; Wolfrum,J.; Pfeiffer,M.; Keutel,T.; Brockmann,C.; Grosser,V.; Lissek,S.; During,H.; Rusek,B.; Braunschweig,M.; Kurth,S.; Gessner,T.: Sensornetzwerk zum Monitoring von Hochspannungsleitungen. , VDE-Kongress Smart Grid - Intelligente Energieversorgung der Zukunft, Stuttgart, 2012 Nov 5-6
Waechtler,T.: Atomic Layer Deposition Processes for Integration in ULSI Metallization Systems and Spintronic Sensor Devices. SEMICON Europa 2012, Dresden, 2012 Oct 9-11
Waechtler,T.; Auerswald,E.; Hoebelt,I.; Nowack,M.; Noack,E.; Gollhardt,A.; Vogel,D.; Michel,B.; Schulz,S.E.; Gessner,T.: FIB/SEM Analysis for Smart Systems Integration. Smart Systems Integration (SSI 2012), Zürich (Switzerland), 2012 Mar 21-22
Waechtler,T.; Mueller,S.; Fiedler,H.; Melzer,M.; Schulz,S.E.; Gessner,T.: ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks. EFDS Workshop on Atomic Layer Deposition, Dresden (Germany), 2012 Mar 7
Wagner,C.; Hartmann,S.; Schuster,J.; Wunderle,B.; Schulz,S.E.; Gessner,T.: Nanomechanics of CNTs for Sensor Simulation. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk; Summary Proceedings, Vol. IV (2012)(ISBN978-3-9814766-4-4)
Wagner,C.; Schuster,J.; Gessner,T.: Piezoresistance of semimetallic carbon nanotubes. 76. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Poster, Abstract in: Verhandlungen der DPG (2012)(ISSN0420-0195)
Wagner,C.; Schuster,J.; Gessner,T.: DFT investigations of the piezoresistive effect of carbon nanotubes for sensor application. ; physica status solidi (b), 249 (2012) pp 2450-2453
Wagner,C.; Schuster,J.; Gessner,T.: DFT simulations for CNT sensors. International Alumni Workshop AMASING, Dresden (Germany), 2012 Jun 04-09; Invited Talk
Wagner,C.; Schuster,J.; Gessner,T.: Simulation von Kohlenstoffnanoröhrchen für NEMS. MST 2012, Chemnitz (Germany), 2012 Oct 23-24(ISBN978-3-00-039162-0)
Wagner,C.; Schuster,J.; Gessner,T.: Simulation von Kohlenstoffnanoröhrchen für NEMS. MST 2012, Chemnitz (Germany), 2012 Oct 23-24; Talk
Wagner,C.; Schuster,J.; Gessner,T.: Piezoresistance of semimetallic nanotubes. International Winterschool on Electronic Properties of Novel Materials, Kirchberg (Austria), 2012 Mar 03-10; Poster presentation
Wagner,C.; Schuster,J.; Hartmann,Steffen; Wunderle,B.; Schulz,S.E.; Gessner,T.: Nanomechanics of CNTs for Sensor Application. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23(ISBN978-1-4673-1590-6)
Zenkevich,E.I.; Blaudeck,T.; A.Milekhin; C.von Borczyskowski: Size-dependent non-FRET photoluminescence quenching in nanocomposites based on semiconductor quantum dots CdSe/ZnS and functionalized porphyrin ligands. ; International Journal of Spectroscopy, 2012 (2012) p 971791 (14 pp)(ISSN1687-9449)
Zenkevich,E.I.; Blaudeck,T.; D.Kowerko; A.P.Stupak; F.Cichos; C.von Borczyskowski: Ligand Exchange Dynamics and Temperature Effects upon Formation of Nanocomposites Based on Semiconductor CdSе/ZnS Quantum Dots and Porphyrins: Ensemble and Single Object Measurements. ; Macroheterocycles, 5 (2012) pp 98-114(ISSN1998-9539)
Zienert,A.; Schuster,J.; Gessner,T.: Quantum transport simulations in metallic carbon nanotubes with metal contacts. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Talk; Abstract in: Verhandlungen der DPG(ISSN0420-0195)
Zienert,A.; Schuster,J.; Gessner,T.: Quantum Transport Through Carbon Nanotubes with Metal Contacts. International Alumni Workshop AMASING, Dresden (Germany), 2012 Jun 04-09; Invited Talk
Zienert,A.; Schuster,J.; Gessner,T.: Quantum Transport Through Carbon Nanotubes with Metal Contacts. MolMat, Barcelona (Spain), 2012 Jul 3-6; Poster presentation
Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk, Summary Proceedings, Vol. IV (2012)(ISBN978-3-9814766-4-4)
Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, Mar 20-23(ISBN978-1-4673-1590-6)
Zimmermann,S.; Ahner,N.; Fischer,T.; Oszinda,T.; Uhlig,B.; Schulz,S.E.; Gessner,T.: A Low Damage Patterning Scheme for Ultra Low-k Dielectrics. ; Future Fab International, vol. 42 (2012) pp 94-101
2011
Auersperg,J.; Dudek,R.; Oswald,J.; Michel,B.: Interaction Integral and Mode Separation for BEoL-cracking and -delamination Investigations under 3D-IC Integration Aspects. 12th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011; Proceedings (on Conf-CD-ROM, paper 68), Linz (Austria), 2011 Apr 18-20
Auersperg,J.; Vogel,D.; Auerswald,E.; Rzepka,S.; Michel,B.: Nonlinear Copper Behavior of TSV for 3D-IC-Integration and Cracking Risks during BEoL-Built-up.. 13th Electronics Packaging Technology Conference EPTC 2011; Proceedings (on stick file: F5.1-P0129.pdf), Singapore
Auersperg,J.; Vogel,D.; Lehr,M.U.; Grillberger,M.; Rzepka,S.; Michel,B.: Aspects of Chip/Package Interaction and 3-D Integration Assessed by the Investigation of Crack and Damage Phenomena in low-k BEoL Stacks. IEEE Inf. Conf. IITC/MAM; Proceedings, 2011 May 8-12
Balaj,I.; Raschke,R.; Baum,M.; Uhlig,S.; Wiemer,M.; Gessner,T.: New generation of electrostatic carrier technology (T-ESC)for reversible thin wafer clamping with seal glass bonding. Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, 2011 (2011) p 111
Baum,M.: Nanoeffekte bieten neue Möglichkeiten für das Waferlevel-Packaging. 11. Chemnitzer Seminar Nanotechnology, Nanomaterials, and Nanoreliability, Chemnitz, 2011 Nov 24; Presentation
Baum,M.: Nanostrukturen und Nanomaterialien in Elektronik, Sensorik und Mikrosystemtechnik. Kuratoriumssitzung des Fraunhofer ENAS, Chemnitz, 2011 Sep 27; Presentation
Baum,M.; Besser,J.; Vetter,C.; Sanchez Ordonez,S.; Wang,X.; Harazim,S.; Schmidt,O.; Wiemer,M.; Gessner,T.: Nano patterned surfaces and their influence on living cells. Biomedizinische Technik 2011, Freiburg, 2011 Sep 27-30; Proceedings Biomed Tech 2011, 56 (Supplement 1) (2011) p Poster P86(ISSN0939-4990)
Baum,M.; Gessner,T.: Nano Technologies for Smart Systems Integration. Sensors Expo 2011, Conference and Exhibition, Rosemont/Chicago (USA), 2011 Jun 6-8; Presentation
Baum,M.; Roscher,F.; Froemel,J.; Jia,C.; Rank,H.; Hausner,R.; Reichenbach,R.; Wiemer,M.; Gessner,T.: Metal Thermo Compression Bonding at Wafer Level and its Capabilities for 3D Integration. Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, p 83
Baum,M.; Roscher,F.; Wiemer,M.; Gessner,T.; Raukopf,S.; Gebhardt,C.: Sensormodul und Verfahren zum Herstellen eines Sensormoduls. ; Patentanmeldung, DE 10 2011 001 422.5-54 (2011)
Baum,M.; Wiemer,M.: An investigation of nano patterned surfaces and their influence on cell behavior. Tech Connect World - BioNanotech 2011, Boston (USA), 2011 Jun 13-16; Poster and Presentation
Baumann,R.R.: Printed Functionalities and the Concept of Functional Layer Separations (keynote). WAN-AFRA Printing Summit 2011, Mainz (Germany), 2011 Apr 6-7
Baumann,R.R.: Printed Smart Objects and their Digital Fabrication (invited). International Conference on Additive Manufacturing, Loughborogh University, Loughborogh (United Kingdom), 2011 July 12
Baumann,R.R.: Digital Manufacturing of Printed Smart Objects (invited). German-Thai Symposium on Nanoscience and Nanotechnology 2011 on GREEN TECHNOLOGY FOR THE FUTURE, Nakhon Ratchasima (Thailand), 2011 Sept 11-14
Baumann,R.R.: Printed Smart Objects and their Digital Fabrication (Keynote). IS&Ts Digital Fabrication Conference 2011 , Minneapolis/Minnesota (USA), 2011 Oct 10
Baumann,R.R.: Printing Beyond Color: Printed Smart Objects and their Digital Fabrication (keynote). ISL Asia 2011 - International Symposium on Laser-Microprocessing, Hong Kong Science Park, Hong Kong (China), 2011 Oct 20
Baumann,R.R.: Functionality Formation in Printed Flexible Electronics (invited). International Workshop on "Subsecond thermal processing of Advanced Materials 2011" (subtherm-2011), Dresden (Germany), 2011 Oct 27
Baumann,R.R.: Digital Manufacturing of Printed Electronics (invited). Symposium on Roll-to-Roll Processing of Printed Electronics and Functional Films, Singapore Institute of Manufacturing Technology, 2011 Nov 23
Baumann,R.R.: Organic and Printed Electronics enabling Electronics Everywhere (keynote). swiss e-print conference on printed electronics and functional materials, Basel (Switzerland), 2011 Dec 1
Belsky,P.; Streiter,R.; Wolf,H.; Schulz,S.E.; Aubel,O.; Gessner,T.: Modeling of TDDB in advanced Cu interconnect systems under BTS conditions. ; Microelectronic Eng. (2011), in press
Besser,J.; Braeuer,J.; Wiemer,M.; Gessner,T.: Elektrochemische Abscheidung von Pd/Zn-Multilagen für das Fügen mit reaktiven Materialsystemen. Mikrosystemtechnik Kongress, Darmstadt, 2011 Oct 10-12; Proceedings
Bigot,S.; Nestler,J.; Dorrington,P.; Dimov,S.: A Costing Methodology for Products Based on Emerging Micro and Nano Manufacturing Technologies. ; Micro and Nanosystems, 3 (2011) pp 254-262(ISSN1876-4029)
Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Room-temperature reactive bonding by using nano scale multilayer systems. Transducers 11, Beijing (China), 2011 Jun 5-9; Proceedings, pp 1332-1335(ISBN978-1-4577-0157-3)
Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Nano scale Al/Pd multilayer systems for reactive bonding in Microsystems technology. XI International Symposium on Self-Propagating High Temperature Synthesis, Anavyssos (GREECE), 2011 Sep 5-9; Proceedings
Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, pp 79-80
Ding,S.-F.; Xie,Q.; Mueller,S.; Waechtler,T.; Lu,H.-S.; Schulz,S.E.; Detavernier,C.; Qu,X.-P.; Gessner,T.: The Inhibition of Enhanced Cu Oxidation on Ruthenium/Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru. ; J. Electrochem. Soc., 158 (2011) pp H1228-H1232(ISSN0013-4651)
Dudek,R.: Popcorn Cracking (book chapter in G. Grossmann, C. Zardini (eds.): The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. Springer Verlag, London, 2011).
Dudek,R.: Thermal Fatigue Analysis. (book chapter in G. Grossmann, C. Zardini (eds.): The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. Springer Verlage, London, 2011).
Dudek,R.; Pufall,R.; Seiler,B.; Michel,B.: Studies on the Reliability of Power Packages Based on Strength and Fracture Criteria. EuroSimE 2011; Proceedings, Brussels (Belgium), 2011 May
E.I.Zenkevich; E.I.Sagun; V.N.Knyukshto; A.S.Stasheuski; V.A.Galievsky; A.P.Stupak; Blaudeck,T.; C.von Borczyskowski: Quantitative Analysis of Singlet Oxygen 1O2 Generation via Energy Transfer in Bioconjugates Based on Semiconductor Quantum Dots and Porphyrin Ligands. ; Journal of Physical Chemistry C, 115 (2011) pp 21535-21545(ISSN1932-7447)
Ebermann,M.; Meinig,M.; Kurth,S.; Hiller,K.; Gittler,E.; Neumann,N.: Tiny MID- and Long-Wave Infrared Spectrometer Module with a mems Dual-Band Fabry-Pérot Filter. IRS², Nürnberg (Germany), 2011 Jun 7-9; Proceedings
Ebermann,M.; Neumann,N.; Meinig,M.; Kurth,S.; Hiller,K.; Gittler,E.: Tunable micromachined Fabry-Pérot Filters for infrared spectroscopy: current state and prospects. Smart Systems Integration, Dresden (Germany), 2011 Mar 22-23; Proceedings(ISBN978-3-8007-3324-8)
Fiedler,H.; Hermann,S.; Rennau,M.; Schulz,S.E.; Gessner,T.: Fabrication and characterisation of CNT via interconnects for application in ULSI circuits. AMC 2011, San Diego (USA), 2011 Oct 4-6; Poster presentation
Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.: Influence of copper on catalytic carbon nanotube growth process. IITC / MAM, Dresden (Germany), 2011 May 09-12; IEEE Proceedings(ISBN978-1-4577-0501-4)
Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.: Influence of copper on the catalytic carbon nanotube growth process. MAM / IITC, Dresden (Germany); Poster presentation
Fischer,T.; Ahner,N.; Zimmermann,S.; Schulz,S.E.: Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials. ; Microelectronic Eng.
Freed,Y.; Rzepka,S.: An implementation of an accelerated testing methodology to obtain static, creep and fatigue master curves of a T300/913 unidirectional composite material. 26th ICAF Symposium, Montreal, 2011 Jun 1-3; in: Komorowski, J.: ICAF 2011 Structural Integrity: Influence of Efficiency and Green Imperatives., pp 145-153
Froemel,J.; Baum,M.; Wiemer,M.; Roscher,F.; Haubold,M.; Jia,C.; Gessner,T.: Investigations of Thermocompression Bonding with thin Metal Layers. 16th International IEEE Conference on Solid-State Sensors, Actuators & Microsystems, Peking, 2011 Jun 5-9; proceedings, pp 990-994(ISBN978-1457701573)
Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2. E-MRS Spring Meeting, Nice (France), 2011 May 9-13
Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr effect studies of copper oxide and cobalt thin films. Poster presentation, DPG Frühjahrstagung, Dresden (Germany), 2011 Mar 13-18
Gossler,C.; Kunzer,M.; Baum,M.; Wiemer,M.; Moser,R.; Passow,T.; Koehler,K.; Schwarz,U.T.; Wagner,J.: Aluminum-Germanium Wafer Bonding of (AlGaIn)N Thin Film Light-Emitting Diodes. Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, 2011 (2011) p 23f
Graaf,H.; Frideriszik,F.; Wagner,C.; Borczyskowski,C.v.: Optical spectroscopy of trap states in amorphous perylene derivative films. ; Journal of Physical Chemistry C, 115 (2011) pp 8150-8154
Hammerschmidt,J.; Baumann,R.R.: Inkjet Printed Functionalities in Chemnitz. 7th ROND Conference, Örnsköldsvik (Sweden), 2011 March 1
Hammerschmidt,J.; Weise,D.; Baumann,R.R.: Micro-three-dimensional patterning by inkjet printing of UV curable inks. NP27-27th International Conference on Digital Printing Technologies / Digital Fabrication 2011; Proceedings, page 811-814, Minneapolis (USA, 2011 Oct 2-6(ISBN978-0-89208-296-4)
Haubold,M.; Baum,M.; Schubert,I.; Leidich,S.; Wiemer,M.; Gessner,T.: Low Temperature Wafer Bonding Technologies. European Microelectronics Packaging Conference EMPC 2011, Hilton Brighton Metropole, Brighton (United Kingdom), 12.-15.09.2011
Haubold,M.; Baum,M.; Wiemer,M.; Gessner,T.: Mechanical and electrical packaging technologies by the application of functional layers at micro and nano scale. 4. Fachkongress MicroCar 2011, Leipzig (Germany), 2011 March 1
Haubold,M.; Schubert,I.; Leidich,S.; Wiemer,M.; Gessner,T.: Entwicklung einer Verkappungstechnologie für optisch transparente NEMS/MEMS Gehäuse mit niedrigem Temperatureintrag. Mikrosystemtechnik-Kongress, Darmstadt (Germany), 10.-12.10.2011
Heinrich,M.; Schulze,R.; Wegener,M.; Kroll,L.; Walther,M.; Schueller,M.; Gessner,T.: Polymer-based piezoelectric modules by microinjection moulding technology for SHM. 5th International Conference on Structural Health Monitoring of Intelligent Infrastructure (SHMII-5), Cancún (Mexico), 2011 Dec 11-15
Hermann,S.; Ecke,R.; Schulz,S.E.; Gessner,T.: Novel nanostructure with vertically aligned carbon nanotubes: Synthesis, structural properties and applications. NT2011, Campridge (UK), 2011 Jul 10-16; Poster
Hoelck,O.; Dermitzaki,E.; Wunderle,B.; Bauer,J.; Michel,B.: Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modeling. ; J. Microelectronics Reliability, 51 (2011) pp 1027-1034
Hofmann,T.; Sommer,J.-P.; Michel,B.: Project VISA: Fully Integrated Power Electronic Systems for Automotive Electronics (Poster). MicroCar 2011, Leipzig (Germany), 2011 Mar 1; Series Micromaterials and Nanomaterials, pp 234-235(ISSN1619-2486)
Imhof,S.; Wagner,C.; Chernikov,A.; Koch,M.; Koester,N.S.; Kolata,K.; Chatterjee,S.; Koch,S.W.; Lu,X.; Johnson,S.R.; Beaton,D.A.; Tiedje,T.; Rubel,O.; Thraenhardt,A.: Evidence of two disorder scales Ga(AsBi). ; Phys. Status Solidi B, 248 (2011) pp 851-854
Imhof,S.; Wagner,C.; Thraenhardt,A.; Chernikov,A.; Koch,M.; Koester,N.S.; Kolata,K.; Chatterjee,S.; Koch,S.W.; Rubel,O.; Lu,X.; Johnson,S.R.; Beaton,D.A.; Tiedje,T.: Luminescence dynamics in Ga(AsBi). ; Appl. Phys. Lett. , 98 (2011) p 161104
Jaschinsky,P.; Erben,J.; Choi,K.-H.; Schulze,K.; Gutsch,M.; Freitag,M.; Schulz,S.E.; Steidel,K.; Hohle,C.; Gessner,T.; Kuecher,P.: Variable-shaped e-beam lithography enabling process development for future copper damascene technology. ; Microelectronic Eng., 88 (2011) pp 1978-1981(ISSN0167-9317)
Krasselt,C.; Schuster,J.; von Borczyskowski,C.: Photoinduced hole trapping in single semiconductor quantum dots at specific sites at silicon oxide interfaces. ; Phys. Chem. Chem. Phys., 13 (2011) pp 17084 - 17092
Kurth,S.; Leidich,S.; Bertz,A.; Nowack,M.; Kaufmann,C.; Faust,W.; Gessner,T.: Reliability enhancement of Ohmic RF MEMS switches. SPIE Photonics West, San Francisco (USA), 2011 Jan 22-27; Proceedings, Vol. 7928-11 (2011)
Kurth,S.; Seifert,M.; Zajadacz,J.; Ebermann,M.; Hiller,K.; Neumann,N.; Gessner,T.: Application of sub-wavelength structures in infrared optical filters. Smart System Integration, Dresden, 2011 March 22-23(ISBNISBN 978-3-8007-3324-8)
Kurth,S.; Voigt,S.; Leidich,S.; Nowack,M.; Bertz,A.; Gessner,T.: Kapazitiver MEMS-Mischer und Signalfilter für wake up receiver. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 988-991(ISBN978-3-8007-3367-5)
Leidich,S.; Kurth,S.; Nowack,M.; Bertz,A.; Froemel,J.; Kaufmann,C.; Gessner,T.: HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 976-979(ISBN978-3-8007-3367-5)
Magorian-Friedlmeier,T.; Ahlswede,E.; Romanyuk,Y.; Uhl,A.; Tiwari,A.; Baumann,R.R.; Kololuoma,T.; McAdam,C.; Kaelin,M.; Cemernjak,M.; Van Genechten,D.; Stassin,F.; Quintilla,A.: Non-Vacuum Processes for Deposition of the CIGS Active Layer in PV Cells. 26th EU PVSEC; Proceedings, paper ID 3DV.1.15, Hamburg (Germany), 2011 Sept 5-9(ISBNhttp://www.eupvsec-planner.com/presentations/c10677/nova-cigs_non-vacuum_processes_for_depostion_of_the_cigs_active_layer_in_pv_cells.htm)
Marjanovic,A.; Hammerschmidt,J.; Perelaer,J.; Farnsworth,S.; Rawson,I.; Kus,M.; Yenel,E.; Tilki,S.; Schubert,U.; Baumann,R.R.: Inkjet printing and low temperature sintering of CuO and CdS as functional electronic layers and Schottky diodes. ; Journal of Materials Chemistry , 35 (2011) pp 13634-13639(ISBN1573-4803 (electronic version))
Marjanovic,A.; Sridhar,A.; Kus,M.; Ozel,F.; Akin,I.; Yenel,E.; Baumann,R.R.: Low temperature processing of inkjet printed metal oxides and nanoparticles. Large-Area, Organic and Polymer Electronics Convention 2011 (LOPE-C 11); Proceedings, p 111, Frankfurt/Main (Germany), 2011 June; Organic Electronics Association (OE-A)(ISBN978-3-00-034957-7)
Martin,J.; Piasta,D.; Kiessling,T.; Otto,T.; Gessner,T.; Staudinger,U.; Demir,E.; Poetschke,P.; Voit,B.: Material integrated sensor films based on photoluminescent quantum dots. Euromat, Montpellier, 2011 Sept 12-15
Martin,J.; Piasta,D.; Kiessling,T.; Otto,T.; Gessner,T.; Staudinger,U.; Demir,E.; Poetschke,P.; Voit,B.: Materialintegrierte Zustandsüberwachung mit Halbleiter-Nano-Kristallen. Öffentliches Statusmeeting zum Kompetenznetzwerk für Nanosystemintegration, Chemnitz, 2011 Nov 3
Martin,J.; Piasta,D.; Kiessling,T.; Otto,T.; Gessner,T.; Staudinger,U.; Demir,E.; Poetschke,P.; Voit,B.: Materialintegrierte Sensorschicht basierend auf Quantum-Dot Limineszenz. Mikrosystemtechnikkongress (MST), Darmstadt, 2011 Okt 10-12; Proceedings, CD-ROM(ISBN978-3-8007-3367-5)
Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Influence of Charges on the Photolumindescence of Semiconductor Nanocrystals. Smart System Integration (SSI), Dresden, 2011 Mar 22-23; Proceedings, p paper 85(ISBN978-3-8007-3324-8)
Martin,J.; Piasta,D.; Weiss,A.; Otto,T.; Gessner,T.: The Fluorescence of Semiconductor Nanocrystals - From Basics to Nanosensor Technology. MicroCar, Leipzig, 2011 Mar 1; Micromaterials, Nanomaterials for Automotives, pp 202-205(ISSN1619-2486)
Meinig,M.; Ebermann,M.; Neumann,N.; Kurth,S.; Hiller,K.; Gessner,T.: Dual-band MEMS Fabry-Pérot filter with two movable reflectors for mid- and long-wave infrared microspectrometers. TRANSDUCERS, Beijing (China), 2011 Jun 5-9; Proceedings, pp 2538-2541(ISBN978-1-4577-0157-3 )
Meinig,M.; Kurth,S.; Hiller,K.; Neumann,N.; Ebermann,M.; Gittler,E.; Gessner,T.: Tunable mid-infrared filter based on Fabry-Perot interferometer with two movable reflectors. SPIE, San Francisco (USA), 2011 Jan 22-27; Proceedings, 7930 (2011) p 79300K
Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Ogiewa,M.; Gerlich,L.; Ding,S.-F.; Schulz,S.E.; Gessner,T.; Lang,H; Zahn,D.R.T.; Qu,X.-P.: Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems. Semiconductor Conference Dresden, Dresden, 2011 Sep 27-28; Oral presentation
Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Ogiewa,M.; Gerlich,L.; Ding,S.-F.; Schulz,S.E.; Gessner,T.; Lang,H; Zahn,D.R.T.; Qu,X.-P.: Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems. Semiconductor Conference Dresden, Dresden, 2011 Sep 27-28; IEEE proceedings
Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Schulz,S.E.; Gessner,T.; Lang,H.; Zahn,D.R.T.: An Approach for Cu ALD via Reduction of Ruthenium- Containing CuxO Films for the Metallization in Spintronic and ULSI Interconnect Systems. 11th International Conference on Atomic Layer Deposition (ALD 2011), Cambridge, MA USA, June 26-29; Oral presentation
Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Novel Post-Process Gap Reduction Technology of High Aspect Ratio Microstructures Utilizing Micro Welding. Transducers 11, Beijing (China), 2011 Jun 5-9; Proceedings, pp 1352-1355(ISBN978-1-4577-0156-6)
Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 610-613(ISBN978-3-8007-3367-5)
Roscher,F.; Baum,M.; Gebhardt,C.; Raukopf,S.; Wiemer,M.; Gessner,T.: Si Interposer Technologies for three dimensional Sensor Systems. Smart Systems Integration, Dresden, Germany, 2012 Mar 22-23; Proceedings, p Paper 94(ISBN978-3-8007-3324-8)
Rzepka,S.; Walter,H.; Pantou,R.; Freed,Y.; Michel,B.: Accelerated fatigue testing methodology for reliability assessments of fiber reinforced composite polymer materials in micro/nano systems. 12th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011; Proceedings (CD-ROM, paper 58), Linz (Austria), 2011 Apr 18-20
Schueller,M.; Schulze,R.; Gebauer,C.; Lipowski,M.; Kaulfersch,E.; Nestler,J.; Otto,T.; Gessner,T.: Netzwerkmodellierung von Doppelwandler Synthetic Jet Aktoren. Deutscher Luft- und Raumfahrtkongress 2011, Bremen, 2011 Sept 27-29
Schueller,M.; Schulze,R.; Zeising,V.; Gebauer,C.; Otto,T.; Gessner,T.: Model based design of micro actuators for flow control applications. Smart System Integration (SSI), Dresden, 2011 Mar 22-23; Proceedings, p paper 97(ISBN978-3-8007-3324-8)
Schulz,B.; Taeuber,D.; Schuster,J.; Baumgaertel,T.; von Borczyskowski,C.: Influence of mesoscopic structures on single molecule dynamics in thin smectic liquid crystal films. ; Soft Matter, 7 (2011) pp 7431 - 7440
Schulze,R.; Billep,D.; Bach,D.; Gratias,A.; Gessner,T.: Wake-up-generator detecting external events of mechanical excitation for the improvement of energy efficient wireless inertial sensor systems. Smart System Integration (SSI), Dresden, 2011 Mar 22-23; Proceedings, paper 98 (2011)(ISBN978-3-8007-3324-8 )
Schulze,R.; Heinrich,M.; Wegener,M.; Schueller,M.; Kroll,L.; Gessner,T.: Mikrosysteme auf Basis der Mehrkomponentenmikrospritzgießtechnologie (Microsystems based on Multi Component Micro Injection Moulding Technology). Mikrosystemtechnik Konferenz 2011, Darmstadt (Germany), 2011 Oct 10-12 pp 583-586(ISBN978-3-8007-3367-5 )
Sommer,J.-P.; Hofmann,T.; Gottwald,T.; Podlasky,A.: Leistungselektronik im Automobil mit hoher Integrationsdichte (Vortrag). MicroCar 2011; Proceedings, Leipzig (Germany), 2011 Mar 1; Series Micromaterials and Nanomaterials, pp 126-129(ISSN1619-2486)
Sowade,E.; Hammerschmidt,J.; Blaudeck,T.; Baumann,R.R.: In-flight inkjet self-assembly of spherical nanoparticle aggregates. ; Advanced Engeneering Materials(ISBN1527-2648 (electronic version))
Specht,H.; Meinig,M.; Kurth,S.; Hiller,K.; Ebermann,M.; Neumann,N.; Gittler,E.; Gessner,T.: Neuartiger frequenz- und amplitudenabstimmbarer Infrarotfilter. Mikrosystemtechnik Kongress, Darmstadt (Germany), 2011 Oct 10-12; Proceedings, pp 106-109(ISBN978-3-8007-3367-5)
Sridhar.A.; Baumann,R.R.: Printed Smart Objects for the Internet of Things. ; Industrial Materials, 292 (2011) pp 101-106(ISSN1022-9787)
Sridhar.A.; Blaudeck,T.; Baumann,R.R.: Inkjet Printing as Key Enabling Technology for Printed Electronics. ; Material Matters , 6 (2011) pp 12-15(ISSN1933-9631)
Tonndorf,P.; Hietschold,M.; Schulze,S.; Erben,J.-W.; Korodi,I.: Low Energy SEM - High Resolution, Low Charging, Low Damage. . Microscopy Conference 2011- MC2011, Kiel (Germany), 2011 Aug 28-Sep 01; Poster presentation
Vogel,K.; Wuensch,D.; Shaporin,A; Mehner,J.; Billep,D.; Wiemer,M.: Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers. ; Frattura ed Integrità Strutturale, 15 (2011) pp 21-28(ISSN1971-8993)
Voigt,S.; Leidich,S.; Gratias,A.; Kurth,S.; Keutel,T.; Gessner,T.: Radio transmission system for power line monitoring. Smart System Integration, Dresden, 2011 March 22-23; Proceedings, p Paper 53(ISBN978-3-8007-3324-8)
Voigt,S.; Nowack,M.; Bertz,A.; Leidich,S.; Meinig,M.; Kurth,S.; Gessner,T.; Grosser,V.; Braunschweig,M.; Krumm,R.: Autarkes Sensornetzwerk zur Ãœberwachung von Hochspannungsleitungen. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 354-357(ISBN978-3-8007-3367-5)
Waechtler,T.; Auerswald,E.; Hoebelt,I.; Nowack,M.; Noack,E.; Gollhardt,A.; Vogel,D.; Michel,B.; Schulz,S.E.; Gessner,T.: REM/FIB-Analytik für die Smart Systems Integration. ZEISS CrossBeam Workshop, Jena (Germany), 2011 May 3-4
Waechtler,T.; Ding,S.-F.; Hofmann,L.; Mothes,R.; Xie,Q.; Oswald,S.; Detavernier,C.; Schulz,S.E.; Qu,X.-P.; Lang,H.; Gessner,T.: ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. ; Microelectron. Eng., 88 (2011) pp 684-689(ISSN0167-9317)
Waechtler,T.; Mueller,S.; Hofmann,L.; Mothes,R.; Ding,S.-F.; Schulz,S.E.; Lang,H.; Qu,X.P.; Gessner,T.: Copper Films Grown via Copper Oxide ALD Integrated with Different Liner Materials for Interconnect Applications. 11th International Conference on Atomic Layer Deposition (ALD 2011), Cambridge, MA USA, June 26-29; Oral presentation
Waechtler,T.; Mueller,S.; Mothes,R.; Tuchscherer,A.; Schubert,C.; Lehmann,D.; Haidu,F.; Schaefer,P.; Schulz,S.E.; Lang,H.; Albrecht,M.; Zahn,D.R.T.; Gessner,T.: Copper ALD for Applications in ULSI Metallization Systems and Spintronic Layer Stacks. IMEC Workshop on Atomic Layer Deposition for Applications in Nanotechnology, Leuven (Belgium), 2011 Nov 28-29
Waechtler,T.; Mueller,S.; Schulz,S.E.; Gessner,T.: Process Development for the ALD of Thin Copper Films for ULSI Metallization Systems and Magnetosensors. SENTECH Plasma Process Technology Seminar, Berlin (Germany), 2011 Nov 22
Wagner,C.; Imhof,S.; Thraenhardt,A.; Chatterjee,S.; Koch,M.; Koch,S.W.; Johnson,S.R.; Beaton,D.A.; Kolata,K.; Koester,N.S.; Lu,X.; Rubel,O.; Tiedje,T.: Disorder Effects in Ga(AsBi). DPG Frühjahrstagung, Dresden, 2011 Mar 13-18; Posterbeitrag
Weiss,A.; Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Fabrication of an all-spin-coated CdSe/ZnS Quantum Dot Light-Emitting Diode. SPIE Photonics West 2011, San Francisco, USA, 2011 Jan 22-27; Proceedings, 79452Q (2011)
Weiss,A.; Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Fabrication of an all-spincoated CdSe/ZnS Quantum Dot Light-Emitting Diode. Smart System Integration (SSI), Dresden, 2011 Mar 22-23; Proceedings, p paper 106(ISBN978-3-8007-3324-8)
Wen,Q.; Billep,D.; Schulze,R.; Gessner,T.: Rotating free fluid kinetic energy harvester based on Karman vortex street. Smart System Integration (SSI); Proceedings, paper 107 (2011)(ISBN978-3-8007-3324-8)
Wiemer,M.; Baum,M.; Braeuer,J.; Wuensch,D.: Fügetechnologien zur Integration von MEMS und Elektronik. Packaging von Mikrosystemen, Magdeburg, 2011 Mar 17; Proceedings
Wiemer,M.; Braeuer,J.; Besser,J.; Wuensch,D.: Developement trends in the field of wafer bonding technologies. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, pp 13-14
Wietstruck,M; Kaynak,M.; Tillak,B.; Kurth,S.; Erler,B.: Materialcharakterisierung eines komplexen Metallschichtstapels für einen monolithischintegrierten RF-MEMS-Schalter. Mikrosystemtechnik Kongress, Darmstadt, 2011 Oct. 10-12(ISBNISBN 978-3-8007-3367-5 ISBN 978-3-8007-3367-5 ISBN 978-3-8007-3367-5 ISBN 978-3-8007-3367-5)
Willert,A.; Hammerschmidt,J.; Baumann,R.R.: Mass Printing Technologies for Technical Applications. ; Scientific Papers of the University of Pardubice, Series A, 17 (2011)
Zichner,R.; Baumann,R.R.: 3-D transponder antennas for future SHF RFID applications. ; Advances in Radio Science, 9 (2011) pp 401-405(ISBN1684-9965 (printed), 1684-9973 (electronic))
Zienert,A.; Schuster,J.; Gessner,T.: Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes. IITC/MAM, Dresden (Germany), 2011 May 9-12; Poster presentation
Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes. IITC/MAM, Dresden (Germany), 2011 May 8-12; Proceedings, pp 1-3(ISBN978-1-4577-0503-8)
Zimmermann,S.; Ahner,N.; Fischer,T.; Schaller,M.; Schulz,S.E.; Gessner,T.: Talk: A less damage patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices . MRS Spring Meeting 2011, San Francisco (USA), April 25 - 29, 2011
Zimmermann,S.; Reich,R.; Zacher,M.; Schulz,S.E.; Gessner,T.: Prediction of wafer homogeneity maps using a virtual metrology scheme consisting of time resolved OES measurements and a neural network. 11th European Advanced Equipment Control / Advanced Process Control Conference, AEC/APC 2011, Dresden (Germany), April 4-6, 2011
2010
Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Ostende (Belgium), 2010 Sep 20-22; Proceedings, pp 48-49
Akiba,A.; Mitarai,S.; Morita,S.; Ikeda,I.; Kurth,S.; Leidich,S.; Bertz,A.; Nowack,M.; Froemel,J.; Gessner,T.: A fast and low actuation voltage MEMS switch for mm-wave and its integration. IEEE International Electron Devices Meeting, San Francisco (USA), 2010 Dec 6-8 pp 828-831
Baum,M.; Jia,C.; Haubold,M.; Wiemer,M.; Schneider,A.; Rank,H.; Trautmann,A.; Gessner,T.: Eutectic Wafer Bonding for 3-D Integration. Electronic System-Integration Technology Conference (ESTC), 2010, Berlin, 2010 Sep 14-16; Proceedings, 3rd (2010)(ISBN978-1-4244-8553-6)
Baum,M.; Vetter,C.; Haehnel,M.; Haenel,J.; Wiemer,M.; Gessner,T.: Mikrostrukturierung von dünnen Kunststofffolien durch Heißprägen. Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, Darmstadt (Germany), 2010 May 10-11; GMM-Fachbericht, 65 (2010) pp 88-90(ISBN978-3-8007-3253-1)
Baum,M.; Wiemer,M.; Gessner,T.: Untersuchungen zur in-vivo Zustandsbestimmung von Gelenkendoprothesen mit integrierten Mikrosensoren. Intelligente Implantate und Prothesen - Entwicklungen in Medizin und Technik, Charité - Universitätsmedizin Berlin, 2010 Jul 1; Poster, 24. Treffpunkt Medizintechnik (2010)
Baumann,R.R.: Roadmap for Organic and Printed Electronics. Functional Printing Workshop, Plataforma 3NEO, Madrid (Spain), 2010 Dec 2
Baumann,R.R.: Printable Components for Smart Objects. Proceedings of The International Conference on Flexible and Printed Electronics (ICFPE 2010), Hsinchu (Taiwan), Oct 2010
Baumann,R.R.: Drucktechnische Herstellung dünner Schichten aus Funktionstinten.. Workshop: Organische Dünne Schichten - Grundlagen und Anwendungen, Dresden (Germany), 2010 Oct 22
Baumann,R.R.: Printed Electronics - Eine Zukunft für Verlage?. (Podiumsdiskussion) Forum Verlagsherstellung Hot Spot Publishing Services, Frankfurt SPARKS, Frankfurter Buchmesse, Frankfurt/Main (Germany), 2010 Sept 6
Baumann,R.R.: Development of intelligent printing systems for patterned material deposition. PRODI Workshop and Seminar,Fraunhofer EMFT, Munich (Germany), 2010 Oct 4 - 6
Baumann,R.R.: Functional Layers and Device Manufacturing based on Printing Technologies. Academia 2010 Workshop: Transparent and flexible Electronics, Univ. Leipzig, Leipzig (Germany), 2010 Sept 28
Baumann,R.R.: Highly Flexible Printed Thin Film Battery. Micromachine/MEMS, Tokyo (Japan), 2010 July 28 - 30
Baumann,R.R.: Neue Druckprodukte Drucken in der Zukunft. Japanisch-Deutsches Forum 2010 Druckmaschinen und Druckindustrie, driven by drupa, Tokyo (Japan), 2010 July 8
Baumann,R.R.: Printable Batteries for Smart Objects. CIMTEC 2010: 5th Forum on New Materials, Montecatini Terme (Italy), 2010 June 13 - 18
Baumann,R.R.: Printed Smart Objects: Energy and Communication Considerations. Proceedings of Large-Area, Organic and Polymer Electronics Convention 2010 (LOPE-C 10), Frankfurt/Main (Germany), June 2010
Baumann,R.R.: Solution Processing of Inorganic and Hybrid Materials for Electronics and Photonics. Functional Materials, 2010 MRS Spring Meeting, Moscone West and San Francisco, CA (USA), 2010 Apr 6 - 8
Baumann,R.R.: Die Zukunft des Inkjets. designforum, Wien (Austria), 2010 Mar 18
Baumann,R.R.: Industrielle Druckverfahren und ihre Anwendungen im Funktionsdruck. OTTI-Fachforum Gedruckte Elektronik, Regensburg (Germany), 2010 Mar 8 - 9
Baumann,R.R.: Printed functionalities of smart objects. nano Tech 2010, Tokyo (Japan), 2010 Feb 17 - 19
Baumann,R.R.; (Vortragender:Blaudeck,T.): Support Processes for Printed Electronics. 3rd International Symposium on Laser Micromachining, Chemnitz (Germany), 2010 Oct 27 - 28
Baumann,R.R.; (Vortragender:Blaudeck,T.): Gedruckte Verpackungen für das Internet der Dinge. OE-A Forum Organische und Gedruckte Elektronik - Chancen für die Verpackungstechnik, Messe FachPack, Nürnberg (Germany), 2010 Sept 30
Baumann,R.R.; Willert,A.; Blaudeck,T.: Manufacturing of modular electronic devices employing the concept of functionality layer separations: Towards an adapted workflow for functional printing. ; Advances in Printing and Media Technology , 37 (2010) pp 327-334
Belsky,P.; Streiter,R.; Wolf,H.; Aubel,O.: Modeling of dielectric reliability in copper damascene interconnect systems under BTS conditions. Materials for Advanced Metallization (MAM 2010), Mechelen (Belgium), 2010 Mar 7-10
Belsky,P.; Streiter,R.; Wolf,H.; Schulz,S.E.; Aubel,O.; Gessner,T.: Modeling of TDDB in advanced Cu interconnect systems under BTS conditions (Talk). Advanced Metallization Conference 2010, Albany, NY (USA), 2010 Oct 5-7
Boettge,B.; Braeuer,J.; Wiemer,M.; Petzold,M.: Reaktives Bonden für spannungsarmes Fügen in der Mikrosystemtechnik. ; PLUS, 6 (2010) pp 1384-1390
Boettge,B.; Braeuer,J.; Wiemer,M.; Petzold,M.; Bagdahn,J.: Status of low temperature bonding using reactive multilayer films. 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration, The University of Tokyo, Hongo, 2010 January 19-20; Proceedings
Boettge,B.; Braeuer,J.; Wiemer,M.; Petzold,M.; Bagdahn,J.; Gessner,T.: Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology . ; Journal of Micromechanics and Microengineering, 20 (2010) pp 064018 1-8
Bonitz,J.; Hermann,S.; Kaufmann,C.; Gessner,T.: Technologie zur Integration von Kohlenstoffnanoröhren für Intertialsensoren.. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20 - 21(ISBN978-3-00-032052-1)
Braeuer,J.; Boettge,B.; Wiemer,M.; Petzold,M.; Gessner,T.: Selbst ausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen. MNI, Erfurt, 2010 Mar 3-4; Proceedings, 2 (2010) pp 14-18(ISBN978-3-8007-3216-6)
Braeuer,J.; Wiemer,M.; Gessner,T.: Reaktives Fügen löst Temperaturprobleme. ; VµE Nachrichten, 38 (2010) p 10
Ding,S.-F.; Xie,Q.; Waechtler,T.; Lu,H.-S.; Schulz,S.E.; Qu,X.-P.: Inhibition of enhanced Cu oxidation on ruthenium. 2010 International Interconnect Technology Conference (IITC), Burlingame, CA (USA), 2010 Jun 6-9; Proceedings, pp 1-3(ISBN978-1-4244-7676-3)
Dudek,R.; Doering,R.; Kreyssig,K.; Michel,B.: Theoretical Analysis on the Shear Test. EuroSimE, Bordeaux (France), 2010 Apr 26 - 28; Proceedings
Ebermann,M.; Neumann,N.; Hiller,K.; Gittler,E.; Meinig,M.; Kurth,S.: Recent advances in expanding the spectral range of MEMS Fabry-Pérot filters. ; Proc. of SPIE, Vol. 7594 (2010) pp 75940V-75940V-10
Ebermann,M.; Neumann,N.; Hoppe,S.; Hiller,K.; Gittler,E.; Meinig,M.; Kurth,S.: Miniaturisiertes Spektrometermodul für den mittleren und langwelligen Infrarotbereich mit mikromechanischem Dual-Band Fabry-Pérot Filter. 10. Fachtagung Mikrosystemtechnik, 21.-22. Oktober 2010 pp 26-31
Fischer,T.; Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials (Talk). Advanced Metallization Conference, Albany, NY (USA), 2010 Oct 5-7
Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.: NEMS/MEMS Integration for future One-chip mobile RF-systems. DFG workshop on nanoelectronics, Bad Honnef, 2010 Jan 17-19; proceedings
Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.: NEMS/MEMS and passive components integration by using novel LTCC substrate. Smart Systems Integration, Como (Italy), 2010 Mar 23-24
Gessner,T.; Vogel,M.: Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanosysteme.. ; LIFIS online (Internet-Zeitschrift des Leibniz-Instituts für interdisziplinäre Studien e.V. (LIFIS) (ISSN1864-6972)
Gessner,T.; Vogel,M.; Hiller,K.; Otto,T.; Bertz,A.; Billep,D.: Challenges of Smart System Integration.. ; ECS Transaction, 27 (2010) pp 295 - 300(ISSN1938-6737)
Gessner,T.; Vogel,M.; Kaufmann,C.; Hiller,K.; Kurth,S.; Nestler,J.; Otto,T.: Micro/nano technologies towards smart systems integration.. 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Shanghai (China), 2010 Nov 1 - 4(ISBN978-1-4244-5797-7)
Gessner,T.; Vogel,M.; Schulz,S.E.; Wiemer,M.; Hiller,K.; Kurth,S.: Mikro- und Nanotechnologien für Smart Integrated Systems.. ; Industrie Management, 6 (2010)(ISBN1434-1980, ISBN-13: 97839442183215)
Griffiths,C.A.; Bigot,S.; Brousseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer inserts tooling for prototyping of micro fluidic components in micro injection moulding. ; Int. J. Adv. Manuf. Technol., 47 (2010) p 111–123(ISSN0268-3768)
Hammerschmidt,J.; Eck,E.-M.; Sowade,E.; Jahn,S.F.; Ebert,S.; Morschhauser,A.; Goedel,W.A.; Baumann,R.: Complete Digital Fabrication of Polymeric Microsieves. NIP26: International Conference on Digital Printing Technologies and Digital Fabrication 2010, Austin, Texas, September 2010; Proceedings, 26 (2010) pp 538-540
Hedayat,C.; Wiegand,C.: Electromagnetic Compatibility: Design of Micro and Nano Systems. Chemnitzer Seminare 2010
Hermann,S.; Fiedler,H.; Waechtler,T.; Falke,M.; Ecke,R.; Schulz,S.E.; Gessner,T.: Approaches for Fabrication of Carbon Nanotube Vias. Nanoelectronic Days 2010, Aachen (Germany), 2010 Oct 4-7; Poster presentation
Hermann,S.; Loschek,S.; Haibo,Y.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen.. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, 2010 Oct 20 - 21(ISBN978-3-00-032052-1)
Hermann,S.; Pahl,B.; Ecke,R.; Schulz,S.E.; Gessner,T.: Carbon Nanotubes for Nanoscale low temperature flip chip connections.. ; Microelectronic Engineering, 87 (2010) pp 438 - 442
Hofmann,L.; Braeuer,J.; Baum,M.; Schulz,S.E.; Gessner,T.: Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration. AMC, Baltimore (USA), October 13-15, 2009; Proceeding of the Advanced Metallization Conference 2009, pp 241-251(ISBN987-1-60511-218-3)
Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations Regarding Through Silicon Via Filling for 3D Integration by Periodic Pulse Reverse Plating with and without Additives. Materials for Advanced Metallization (MAM), Mechelen (Belgium), 2010 Mar 7-10; Microelectron. Eng., (2010) p in press (DOI: 10.1016/j.mee.2010.07.004)(ISSN0167-9317)
Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Pulse Reverse Electroplating for TSV Filling in 3D Integration. Smart Systems Integration, Como (Italy), 2010 Mar 23-24; Proceedings(ISBN978-3-8007-3081-0)
Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik. ; Galvanotechnik, 08/2010 (2010) pp 1880-1884(ISBNISSN 0016-4232 B 20696)
Huang,C.; Chen,D.; Leidich,S.; Gessner,T.: Compact meta-material transmission line balun based on meander lines structure and MEMS technology. ; Microelectronic Eng., 87 (2010) pp 584-587(ISSN01679317)
Jahn,S.F.; Blaudeck,T.; Baumann,R.R.; Jakob,A.; Ecorchard,P.; Rueffer,T.; Lang,H.; Schmidt,P.: Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing Ligand. ; Chemistry of Materials, 22 (2010) pp 3067-3071(ISSN0897-4756)
Jahn,S.F.; Jakob,A.; Blaudeck,T.; Schmidt,P.; Lang,H.; Baumann,R.R.: Inkjet printing of conductive patterns with an aqueous solution of [AgO2C(CH2OCH2)3H] without any additional stabilizing ligands. ; Thin Solid Films, 518 (2010) pp 3218-3222(ISSN0040-6090)
Jakob,A.; Rueffer,T.; Ecorchard,P.; Walfort,B.; Koerbitz,K.; Fruehauf,J.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) dicarboxylates: Synthesis and their potential use as precursors for the spin-coating process in the deposition of copper.. ; Zeitschrift für Anorganische und Allgemeine Chemie, 636 (2010) pp 1931 - 1940(ISSN1521-3749)
Jakob,A.; Rueffer,T.; Schmidt,H.; Djiele,P.; Koerbitz,K.; Ecorchard,P.; Haase,T.; Kohse-Hoeinghaus,K.; Fruehauf,S.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Disilver(I) Coordination Complexes: Synthesis, Reaction Chemistry, and Their Potential Use in CVD and Spin-Coating Processes for Silver Deposition. ; Eur. J. Inorg. Chem., (2010) pp 2975-2986(ISSN1434-1948)
Jia,C.; Wiemer,M.; Reuter,D.; Hiller,K.; Gessner,T.: A Method for the Fabrication of Extra-Thin Silicon Substrates. Smart System Integration 2010, Milano, Italy, 2010 Mar 23-24
Koehler,D.; Pohle,A.; Konietzka,S.; Heinz,S.; Lange,A.; Billep,D.; Forke,R.; Horstmann,J.T.; Loebel,K.-U.; Ramsbeck,M.: Hochpräzise integrierte Sensorsignalverarbeitung zur Anregung, Kalibrierung und Auswertung von MEMS-Gyroskopen. 10. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Okt 20-21; Proceedings, pp 129-132(ISBN978-3-00-032052-1)
Kowerko,D.; Schuster,J.; Amecke,N.; Abdel-Motaleb,M.; Dobrawa,R.; Wuerthner,F.; von Borczyskowski,C.: FRET and Ligand Related NON-FRET Processes in Single Quantum Dot-Perrylene Bisimide Assemblies. ; PhysChemChemPhys, 12 (2010) pp 4112-4123
Kuechler,M.; Hofmann,L.; Hahn,R.; Bertz,A.; Gessner,T.: Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE).. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20-21(ISBN978-3-00-032052-1)
Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Zajadacz,J.; Gessner,T.: Sub-wavelength structures for infrared filtering. ; Proc. of SPIE, Vol. No. 7713 (2010) pp 771363S-1 – 771363S-11
Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Zajadazc,J.; Gessner,T.: Nanostrukturierte Breitbandreflektoren und deren Anwendung in abstimmbaren mikromechanischen Infrarot-Filtern. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz, 20.-21. Oktober 2010
Mager,T.; Reinhold,C.; Hedayat,C.: Three Dimensional Near Field Scanning Measurement Techniques for Improved RF Design.. Chemnitzer Seminar 2010
Mager,T.; Reinhold,C.; Hedayat,C.; Schubert,G.: Vorstellung eines verbesserten dreidimensionalen Nahfeld-Scanners zur automatischen Störfestigkeits- und Störabstrahlungsanalyse im Automotiv-Umfeld. EMV 2010, Düsseldorf (Germany)
Mager,T.; Reinhold,C.; Hedayat,C.; Schubert,G.: Electromagnetic Near-Field Scanning in Time and Frequency Domain for EMI Characterisation. Smart Systems Integration, Como (Italy), 2010 Mar 23 - 24; Proceedings (CD-Rom)(ISBN978-3-8007-3208-1)
Martin,J.; Piasta,D.; Hammacher,J.; Wegener,M.; Dittrich,C.; Otto,T.: Sensitive Feuchtesensoren auf der Basis von Nanokompositen.. 2. GMM-Workshop Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, Darmstadt, 2010
Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Charakterisierung des Ausschaltens von CdSe/Zns-Nanokristallen.. Öffentliches Statusseminar nanett, Chemnitz, 2010
Martin,J.; Schwittlinsky,M.; Piasta,D.; Streit,P.; Billep,D.; Otto,T.; Gessner,T.: Thermoelectric generators based on polymers and nanocomposites.. Smart System Integration (SSI), Como (Italy), 2010; Proceedings
Meinig,M.; Kurth,S.; Hiller,K.; Ebermann,M.; Gittler,E.; Gessner,T.: Entwurf und Technologie eines Dualband Fabry-Pérot-Filters für den mittleren Infrarotbereich mit zwei beweglichen Reflektoren. 10. Fachtagung Mikrosystemtechnik, Chemnitz, 21.-22. Oktober 2010 pp 32-37
Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Electronic transport properties of copper atomic wires. AMC, Baltimore, MD (USA), 2009 Oct 13-15; Proceeding of the Advanced Metallization Conference , XXV (2010) pp 127-130
Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Geometry dependent of I-V characteristics of gold atomic-sized contacts. 9th IEEE Conference on Nanotechnology, Genoa (Italy), 2009 Jul 26-30 ; Proceeding of the IEEE-Nano, pp 884-884(ISBN978-1-4244-4832-6)
Mothes,R.; Shen,Y.; Jakob,A.; Walfort,B.; Rueffer,T.; Schulz,S.E.; Waechtler,T.; Gessner,T.; Lang,H.: Phosphite Copper(I)Trifluoroacetates [((RO)3P)mCuO2CCF3](m = 1, 2, 3): Synthesis, Solid State Structures and Their Use as CVD Precursors.. ; Dalton Transactions, 39 (2010) pp 11235 - 11247
Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Lang,H.: Investigation of Formic Acid Reduction of Ruthenium-Containing Copper Oxide Layers Prepared by ALD . Baltic ALD 2010 & GerALD 2, Hamburg, 16.09.-17.09.; Talk
Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Auerswald,J.; Knapp,H.F.; Gavillet,J.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps suitable for large scale fabrication. ; Int. J. Adv. Manuf. Technol., 47, 1 (2010) pp 137-145(ISSN0268-3768)
Nestler,J.; Morschhauser,A.; Otto,T.; Koger,B; Brandenburg,A.; Wunderlich,K.; Ehrentreich-Foerster,E.; Bier,F.F.; Gessner,T.: Highly-integrated, low-cost in-vitro diagnostic platform for miniaturized assay development. MicroTAS, Netherlands, 2010; Proceedings, pp 1223-1225(ISBN978-0-9798064-3-8)
Nestler,J.; Otto,T.; Sommer,J.-P.; Michel,B.; Gessner,T.; Bier,F.F.: Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements. Smart Systems Integration, Como (Italy), 2010 Mar 23-24; Proceedings
Neumann,N.; Ebermann,M.; Gittler,E.; Meinig,M.; Kurth,S.; Hiller,K.: Uncooled IR sensors with tunable MEMS Fabry-Pérot filters for the long-wave infrared range. IEEE Sensors , Hawei, 2010
Nowack,M.; Reuter,D.; Bertz,A.; Kuechler,M.; Aurich,T.; Dittrich,C.; Gessner,T.: A Novel Three-Axis AIM Vibration Sensor for High Accuracy Condition Monitoring. IEEE Sensors 2010 Conference, Waikoloa (USA), 2010 Nov 1-4; Proceedings, pp 879-884(ISBN978-1-4244-8168-2)
Oszinda,T.; Schaller,M.; Dittmar,K.; Jinag,L.; Schulz,S.E.: How to evaluate surface free energies of dense and ultra low-k dielectrics in pattern structure.. ; ECS Transactions, 28 (2010) pp 355 - 360(ISSN1938-6737)
Oszinda,T.; Schaller,M.; Fischer,D.; Walsh,C.; Schulz,S.E.: Investigation of physical and chemical property changes of ultra low-k SiOCH in aspect of cleaning and chemical repair processes.. ; Microelectronic Engineering, 87 (2010)
Oszinda,T.; Schaller,M.; Leppack,S.; Schulz,S.E.: Restoration of plasma damaged porous ultra low-k SiOCH films: A coating process with UV activation versus a vapor phase process with thermal activation. Advanced Metallization Conference (AMC 2010), Albany, NY (USA), 2010 Oct 5 - 7; MRS Conference Proc.; Materials Research Society, pp 55 - 64(ISBN978-1-6051-1218-3, ISSN 1048-0854)
Oszinda,T.; Schaller,M.; Schulz,S.E.: Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film Using a Vapor Phase Process. ; Journal of the Electrochemical Society, 157 (2010) pp H1140 - H1147(ISSN0013-4651)
Otto,T.; Nestler,J.; Gessner,T.: Fluidischer Aktor mit verformbarer Verschlussanordnung und langer Lagerfähigkeit. ; Patentanmeldung (PCT/EP2011/070061)
Otto,T.; Nestler,J.; Gessner,T.: Mikrofluidvorrichtung und Verfahren zum Herstellen derselben. ; Patentanmeldung (PCT/EP2011/070788)
Otto,T.; Nestler,J.; Gessner,T.: Mikrofluidisches System mit Temperierung und Verfahren zur Temperierung in einem mikrofluidischen System. ; Patentanmeldung (PCT/EP2011/070664)
Otto,T.; Saupe,R.; Stock,V.; Gessner,T.: MEMS Temmperature Scanner System: Principle, Advances and Applications. SPIE Photonics West, San Francisco, 2010 Jan 23-28; Proceedings, 7594 (2010) pp 759412-1 bis 759412-6
Piasta,D.; Martin,J.; Wegener,M.; Hammacher,J.; Otto,T.; Gessner,T.: High sensitive humidity sensor based on polymers and nanocomposites.. Smart System Integration (SSI), Como (Italy), 2010; Proceedings
Rzepka,S.; Mueller,A.; Michel,B.: Virtual Prototyping Advanced by Statistic and Stochastic Methodology. EuroSimE, Bordeaux (France), 2010 Apr 26 - 28 pp 563 - 571
Schueller,M.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: LEM Based Design Optimization of SJAs. Actuator 10, Bremen (Germany), 2010 June 14-16; Proceedings, pp 983-986(ISBN978-3-933339-12-6)
Schulz,B.; Taeuber,D.; Friedriszik,F.; Graaf,H.; Schuster,J.; von Borczyskowski,C.: Optical Detection of Heterogeneous Single Molecule Diffusion in Thin Liquid Crystal Films. ; PhysChemChemPhys, 12 (2010) pp 11555-11564
Schulz,S.E.; Gessner,T.: Neue Materialien und Technologien für Nanoelektronik und Sensorik. ; VµE, 40 (2010) p 16
Schulze,K.; Jaschinsky,P.; Erben,J.; Gutsch,M.; Blaschta,F.; Freitag,M.; Schulz,S.E.; Steidel,K.; Hohle,C.; Gessner,T.; Kuecher,P.: Variable-Shaped E-Beam lithography enabling process development for future copper Damascene technology (Poster). 36th International Conference on Micro- and Nanoengineering (MNE), Genoa (Italy), 2010 Sept 19-22
Schulze,R.; Schueller,M.; Billep,D.; G.Pfeifer: Design of Piezoelectric Cantilever Actuators for Silicon Based MEMS. Actuator 10, Bremen (Germany), 2010 Jun 14-16; Proceedings, pp 378-381(ISBN3-933339-12-6)
Shirangi,M.H.; Michel,B.: Moisture Sensitivity of Plastic Packages of IC Devices. ; (ed. Fan, X. J.) Springer Series on Micro- and Optoelectronic Materials, Heidelberg, New York 2010, pp 29-69
Sommer,J.-P.; Uhlig,P.; Kulke,R.; Michel,B.: Design of Low Loss Beam Forming Networks - Supported by Numerical Simulation and Materials Characterisation. Int. Conf. on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Xian (China), 2010 Aug 16 - 19; Proceedings, A19 (2010) pp 65 - 70
Sowade,E.; Blaudeck,T.; Baumann,R.R.: Printed self-organized functional layers. NanoMA 2010 Workshop: Nano and Microstructures at Interfaces, TU Chemnitz, Center of Nanostructured Materials and Analytics, Sayda, Erzgebirge (Germany), 2010 Sept 2 - 3
Specht,H.; Kurth,S.; Billep,D.; Kaufmann,C.; Gessner,T.: Image based test methodology for laser display scanners. ; Proc. of Smart Systems Integration
Sridhar,A.: Surface modification of a PCB substrate for better adhesion of inkjet printed circuit structures. 37th iarigai International Research Conference, Montreal, 2010 Sept 12 - 15
Tuchscherer,A.; Shen,Y.; Jakob,A.; Mothes,R.; Al-Anber,M.; Walfort,B.; Rueffer,T.; Fruehauf,S.; Ecke,R.; Schulz,S.E.; Gessner,T.; Lang,H.: Lewis-base Copper(I)Formates: Synthesis, Reaction Chemistry, Structural Characterization and Their Use as Spin-Coating Precursors for Copper Deposition. ; Inorganica Chimica Acta, 365 (2010) pp 10 - 19(ISSN0020-1693)
Vogel,M.; Hiller,K.; Bertz,A.; Wiemer,M.; Gessner,T.: Smart Integrated Systems - Developments of Fraunhofer ENAS. ; Microsystems Technology in Germany 2010/Mikrosystemtechnik in Deutschland 2010, pp 18 - 19(ISSN2191-7183)
Voigt,S.; Tenholte,D.; Franke,D.; Reuter,D.; Hiller,K.; Gessner,T.; Mehner,J.: Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20 - 21(ISBN978-3-00-032052-1)
Waechtler,T.; Ding,S.-F.; Hofmann,L.; Mothes,R.; Xie,Q.; Oswald,S.; Detavernier,C.; Schulz,S.E.; Qu,X.-P.; Lang,H.; Gessner,T.: ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. Materials for Advanced Metallization (MAM), Mechelen (Belgium), 2010 Mar 7-10
Wiegand,C.; Hangmann,C.; Hedayat,C.; Hilleringmann,U.: A Resonance PLL-based Tracking System for Capacitive Sensors - MEMS/NEMS. Smart Systems Integration (SSI 2010), Como (Italy), 2010 Mar 23 - 24; Proceedings(ISBN978-3-8007-3208-1 (CD-Rom))
Wiegand,C.; Hedayat,C.: Schneller zum effizienten Entwurf. ; VµE Nachrichten - Fraunhofer Mikroelektronik, 41 (2010) p 10
Wiegand,C.; Hedayat,C.: Efficient Designs Made Faster. ; Fraunhofer VµE - Microelectronic News, 41 (2010) p 10
Wiegand,C.; Hedayat,C.; Hilleringmann,U.: Non-linear behaviour of Charge-Pump Phase-Locked Loops. Advances in Radio Science 2010
Wiemer,M.; Braeuer,J.; Wuensch,D.; Gessner,T.: Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics . Microtech 2010, Anaheim, CA (USA), 2010 Jun 21-24; Proceedings
Wiemer,M.; Braeuer,J.; Wuensch,D.; Gessner,T.: Reactive Bonding and Low Temperature Bonding of Heterogeneous Materials. ; ECS Transactions, 33 (2010) pp 307-318
Willert,A.; Siegel,F.; Hoesel,M.; Akowanou,C.; Knittel,D.; Baumann,R.R.: Hybrid R2R-machine Concept for Aligned Deposition of Functional Materials. MRS Fall/Symposium D: Challenges in Roll-to-Roll (R2R) Fabrication for Electronics and Other Functionalities, Boston, MA (USA), 2010 Nov 29 - Dec 3
Wolf,H.; Streiter,R.; Friedemann,M.; Belsky,P.; Bakaeva,O.; Letz,T.; Gessner,T.: Simulation of TaNx deposition by Reactive PVD. ; Microelectronic Eng., 87 (2010) p 1907–1913(ISSN0167-9317)
Wuensch,D.; Mueller,B; Wiemer,M.; Gessner,T.; Mischke,H: Aktivierung mittels Niederdruckplasma zur Herstellung von Si- Verbunden im Niedertemperatur-Bereich und deren Charakterisierung mittels Mikro-Chevron-Test. MNI, Darmstadt, 2010 May 10-11; Proceedings, pp 66-71(ISBN978-3-8007-3253-1)
Wuensch,D.; Wiemer,M.; Gabriel,M; Gessner,T.: Low temperature wafer bonding for microsystems using dielectric barrier discharge. ; mst news, 1/10 (2010) pp 24-25
Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Transport in carbon nanotubes: Contact models and size effects. IWEPNM 2010, Kirchberg (Austria), 2010 Mar 6-13; Phys. Status Solidi B, 247 (2010) p 3002–3005(ISSN0370-1972)
Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Electronic Transport in Carbon Nanotubes with Copper Contacts. Psi-k, Berlin (Germany), 2010 Sep 12-16; Poster presentation
Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Electronic Transport through Carbon Nanotubes with Metal Contacts. IWEPNM 2010, Kirchberg in Tirol (Austria), 2010 Mar 6-13; Poster presentation
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS. MAM 2009, Grenoble (France), 2009 Mar 9-11; Microelectronic Engineering, 87 (2010) pp 337-342(ISBN0167-9317 (ISSN))
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods. AMC, Baltimore (USA), October 13-15, 2009; Proceeding of the Advanced Metallization Conference 2009, pp 101-110(ISBN987-1-60511-218-3)
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma. Materials for Advanced Metallization MAM 2010, Mechelen (Belgium), 2010 Mar 7-10
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Etch processes for dense and porous SiCOH materials: plasma states and process results. 3rd International Workshop Plasma Etch and Strip in Microelectronics, PESM 2010, Grenoble (France), 4-5 March 2010
Zimmermann,S.; Ahner,N.; Fischer,T.; Schulz,S.E.; Gessner,T.: Talk: A combined Etch, Cleaning and k-restore Process for less damage integration of ultra low-k materials. SEMICON 2010, Dresden (Germany), October 19-21, 2010
2009
Č ermák,D.; Blaudeck,T.; Graaf,H.; Egbe.D.A,M.; Baumann,R.R.: Inkjet printing of PPE-PPV copolymers for lighting application. Proceedings of Printing Future Days 2009, Chemnitz (Germany), 2009 Nov 2-5
Č ermák,D.; Hammerschmidt,J.; Rahnfeld,C.; Jahn,S.F.; Blaudeck,T.; Egbe,D.A.M.; Willert,A.; Baumann,R.R.: Digital fabrication of functional nanostructured layers by inkjet printing. Proceedings of Large-Area, Organic and Polymer Electronics Convention 2009 (LOPE-C 09), Frankfurt/Main (Germany), June 2009; Organic Electronics Association (OE-A)(ISBN978-3-00-028063-4)
Ahner,N.; Fischer,T.; Zimmermann,S.; Schaller,M.; Prager,L.; Schulz,S.E.: UV assisted curingg of pplasma damagged porous ultralow‐k materials for a k-recovery process: influence of curing‐cycle modifications (Poster). Advanced Metallization Conference, Baltimore, Maryland (USA), 2009 Oct 13-15
Ahner,N.; Schaller,M.; Bartsch,C.; Baryschpolec,E.; Schulz,S.E.: Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions. ; Solid State Phenomena, 145-146 (2009) pp 319-322
Ahner,N.; Schulz,S.E.; Zacher,M.: Surfactants as an Additive to Wet Cleaning Solutions for Plasma Etch Residue Removal: Compatibility to a Porous CVD-SiCOH Ultra Low-k Dielectric Material . 216th ECS Meeting , Vienna, Austria, October 4 - October 9 2009; ECS Transactions, Volume 25 Issue 5 (2009) pp 87-94
Auersperg,J.; Vogel,D.; Lehr,M.U.; Grillberger,M.; Michel,B.: Crack and Damage Evaluation in Low-K BEOL Structures Under CPI Aspects. Proc. 11th Electronics Packaging Technology Conf., EPTC 2009, Singapore, 2009 Dec 9 - 11
Bauer,M.; Heidernaetsch,M.; Taeuber,D.; Schuster,J.; von Borczyskowski,C.; Radons,G.: Investigations of Static and Dynamic Heterogeneities in Ultra-Thin Liquid Films via Scaled Squared Displacements of Single Molecule Diffusion. ; Diffusion Fundamentals, 11 (2009) pp 1-2
Baum,M.: Monitoring von Human-Endoprothesen mit Mikrosensoren. 126. Kongress der deutschen Gesellschaft für Chirurgie, München (Germany), 2009 May 1; Vortrag
Baum,M.; Boese-Landgraf,J.; Gessner,T.: Mikrosensoren überwachen Endoprothesen. 10. Würzburger Medizintechnik Kongress, Würzburg (Germany), 2009 May 11-13; Proceedings, pp 83-87(ISBN978-3-937988-08-4)
Baum,M.; Boese-Landgraf,J.; Gessner,T.: Möglichkeiten zur in-vivo Zustandsbestimmung von Gelenkendoprothesen. Deutscher Kongress für Orthopädie und Unfallchirurgie, Berlin, 2009 Oct 21-24; Vortrag
Baum,M.; Braeuer,J.; Hofmann,L.; Froemel,J.; Wiemer,M.; Gessner,T.; Letsch,H.: Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem. ; Patentanmeldung (DE102009006822 & WO09941)
Baum,M.; Hofmann,L.; Wiemer,M.; Gessner,T.: Solid-Liquid-Interdiffusion Bonding für 3D-Integration und Wafer-Level-Packaging. Mikrosystemtechnik-Kongress, Berlin, 2009 Oct 12-14; Proceedings
Baumann,R.R.: Digital Fabrication Methods Based on Traditional Printing and Inkjet Technology. Printing Future Days 2009, Chemnitz (Germany), 2009 Nov 2 - 5
Baumann,R.R.: Printed Smart Objects Enter the Internet of Things. 1st Printable Electronics Symposium, Tokyo (Japan), 2009 Feb 19; Converting Technical Institute, 2009, pp 39-55
Baumann,R.R.: Verfahren zur Herstellung gedruckter Funktionalitäten. MikroSystemTechnik Kongress 2009, Berlin (Germany), 2009 Oct 12
Baumann,R.R.: Gedruckte Verpackungen für das Internet der Dinge. Systemintegration in der Mikroelektronik Messe und Kongress, Nürnberg (Germany), 2009 May 6
Baumann,R.R.: Industrielle Druckverfahren und ihre Anwendungen im Funktionsdruck. OTTI-Forum Gedruckte Elektronik, Regensburg (Germany), 2009 March 9-10
Baumann,R.R.: Introduction to functional printing. European Workshop on Organic and Large Area Electronics, Chemnitz (Germany), 2009 April 21 - 22
Baumann,R.R.: Nye produkter og inntjeningsmuligheter for grafisk bransje. New Printed Products, Annual Meeting of NHO Grafisk Association, Molde (Norway), 2009 August 14 - 16
Baumann,R.R.: Printed Smart Objects Enter the Internet of Things. International Conference on Flexible and Printed Electronics, Jeju Island/South Korea, 2009 Nov 11-13
Baumann,R.R.: Printed Smart Objects Made From Advanced Paper Substrates. Investors Day of Cham Paper Group, Cham (Switzerland), 2009 June 17
Baumann,R.R.: Printed Smart Objects. Smart Systems Integration (SSI 2009), Brussels (Belgium), 2009 March 9 - 12
Baumann,R.R.: Printing Beyond Color. TU Eindhoven/Dutch Polymer Institute, Dept. of Chemistry and Chemical Engineering SMN, Institutskolloqium Eindhoven, Eindhoven (The Netherlands), 2009 March 6
Baumann,R.R.: RF Communication of Printed Smart Objects. RFID Summit, Orlando, Florida (USA), 2009 April 27
Bertz,A.; Fendler,R.; Schuberth,R.; Werner,T.; Gessner,T.: Plasmagestütztes Hochrateätzen von Silikatgläsern mit variablem Ätzprofil. EFDS Workshop: Mikro- und Nanostrukturen an Oberflächen - Herstellung und Anwendungen, Dresden, 2009 Oct 9
Bohnké,M.; Geyer,U.; Rouault,H.; Siegel,F.; Kreutzer,A.; Hennerdal,L.-O.; Blaudeck,T.: Printing electrode materials for rechargeable lithium thin-film batteries. International Symposium on Flexible Organic Electronics (ISFOI-2), Halkidiki (Greece), July 2009
Bonitz,J.; Hermann,S.; Loschek,S.; Liu,P.; Schulz,S.E.: Selective deposition of aligned carbon nanotubes for NEMS applications. GMM-Workshop “Mikro-Nano-Integration”, Seeheim, 2009 Mar 12-13(ISBN978-3-8007-3155-8)
Braeuer,J.; Baum,M.; Wiemer,M.; Gessner,T.: Using of reactive multilayer systems for room temperature bonding of micro components. Smart Systems Integration, Brussels, 2009, Mar 10-11; Proceedings
Braeuer,J.; Baum,M.; Wiemer,M.; Gessner,T.: Reactive micro joining by using nanoscale effects . Mikro-Nano-Integration, Seeheim, 2009 Mar 12-13; Proceedings (ISBN978-3-8007-3155-8)
Braeuer,J.; Hofmann,L.; Wiemer,M.; Gessner,T.: Development and evaluation of nanoscale reactive structures for low-temperature bonding in Microsystems Technology. Mikrosystemtechnik Kongress 2009, Berlin, 2009 Oct 12-14; Proceedings(ISBN978-3-8007-3183-1)
Brandenburg,A.; Curdt,F.; Nestler,J.; Otto,T.; Wunderlich,K.; Michel,D.: Integrated point of care testing system based on low cost polymer biochips. SPIE Photonics West 2009, San Diego, 2009 Jan 24-29; Proceedings, 7169 (2009) p 716902 (11 pages)
Brandenburg,A.; Curdt,F.; Sulz,G.; Ebling,F.; Nestler,J.; Wunderlich,K.; Michel,D.: Biochip readout system for point-of-care applications. ; Sens. Act. B: Chem, Vol. 139, Issue 1 (2009) pp 245-251
Bueker,M.-J.; Hedayat,C.; Mager,T.; Hilleringmann,U.: Grundlegende Fragestellungen der drahtlosen Energieübertragung. Workshop Drahtlose Energieübertragung - Grundlagen und Praxisbeispiele, Detmold (Germany), 2009 Nov 9
Bueker,M.-J.; Reinhold,C.; Scholz,P.; Hilleringmann,U.; Mager,T.; Hedayat,C.: Efficiency and field emission improvments of wireless energy transfer systems. SAME 2009 Forum, Sophia Antipolis (France), 2009 Sept 23
Dudek,R.; Doering,R.; Bombach,C.; Michel,B.: Simulation based analysis of secondary effects on solder fatigue. ; Microelectronics Reliability, 49 (2009) pp 839-845
Ebermann,M.; Neumann,N.; Hiller,K.; Kurth,S.: Design, Operation and Performance of a Fabry-Perot-Based MWR Microspectrometer. Sensor+Test Conference 2009, Nuremberg, May 26-28 2009
Ecke,R.; Froemel,J.; Schulz,S.E.; Wiemer,M.; Gessner,T.: Process Development for Smart Systems Integration in MEMS. ; mst news, 03/09 (2009) pp 35-36
Forke,R.; Scheibner,D.; Doetzel,W.; Mehner,J.: Measurement unit for tunable low frequency vibration detection with MEMS force coupled oscillators. ; Sensors and Actuators A: Physical, 156 (2009) pp 59-65
Froemel,J.; Gessner,T.: Investigations of Bonding Mechanism with Thin Gold Layers . World Premier International Research Center AIMR Annual Workshop, Zao (Japan), 2009 Mar 1-6; Proceedings, p 124
Froemel,J.; Haubold,M.; Wiemer,M.; Gessner,T.: Thermocompresion bonding with gold interfaces. Smart System Integration 2009, Brussels (Belgium), 2009 Mar 10-11; proceedings(ISBN978-3-89838-616-6)
Gessner,T.; Leidich,S.; Nowack,M.; Froemel,J.; Hofmann,L.; Kurth,S.; Bertz,A.: Micro Devices for RF Applications. ISMOT, New Delhi (IND), 2009 Dec 16-19
Gessner,T.; Reuter,D.: Smart Systems Integration by using Micro- and Nanotechnologies. 6th International Multi-Conference on Systems, Signals and Devices, SSD 09, Djerba, Tunesia, 2009 March 23-26; Proceedings
Geyer,U.; Bohnké,M.; Siegel,F.; Kreutzer,A.; Rouault,H.; Hennerdal,L.-O.; Blaudeck,T.; Loegdlund,M.; Baumann,R.R.: Printing electrode materials for rechargeable lithium thin-film batteries. Proceedings of Large-Area, Organic and Polymer Electronics Convention 2009 (LOPE-C 09), Frankfurt/Main (Germany), June 2009; Organic Electronics Association (OE-A), p 2.4.(ISBN978-3-00-028063-4)
Griffiths,C.A.; Bigot,S.; Brousseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer inserts tooling for prototyping of micro fluidic components in micro injection moulding. ; Int. J. Adv. Manuf. Technol., in press (2009)(ISSN0268-3768)
Guttmann,M.; Kaiser,K.; Muth,S.; Moritz,M.; Schmidt,R.; Zwanzig,M.; Hofmann,L.; Schubert,I.: Neues modulares Anlagenkonzept für nasschemsiche Ätzprozesse und Wafergalvanoformung. ; Galvanotechnik, 11/2009 (2009) pp 2616-2624(ISBNISSN 0016-4232 B 20696)
Hammacher,J.; Saettler,P.; Kreyssig,K.; Martin,J.; Seiler,B.; Michel,B.: Influence of Nanocomposites on Reliability and Mechanical Properties of Moisture.. Sensors, Proc. Nanofair, Dresden (Germany), 2009 May 26 - 27
Hammerschmidt,J.; Jahn,S.F.; Wachner,D.; Goedel,W.A.; Baumann,R.R.: Digital fabrication of support structures for improved mechanical stability of fragile microsieves. Proceedings of Non-Impact Printing / Digital Fabrication 2009, Louisville, KY (USA)The Society for Imaging Science and Technology (IS&T), Springfield, VA (USA)
Hansel,T.; Grunwald,R.; Reimann,K.; Bonitz,J.; Kaufmann,C.; Griebner,U.: Deformation Measurements of High-Speed MEMS With Combined Two-Wavelength Single-Pulse Digital Holography and Single Phase Reconstruction Using Subpicosecond Pulses. ; IEEE Journal of Selected Topics in Quantum Electronics, 15, 5 (2009) pp 1351-1358(ISSN1077-260X)
Hansel,T.; Steinmeyer,G.; Grunwald,R.; Falldorf,C.; Bonitz,J.; Kaufmann,C.; Kebbel,V.; Griebner,U.: Synthesized femtosecond laser pulse source for two-wavelength contouring with simultaneously recorded digital holograms. ; Optics Express, 17 (2009) pp 2686-2695(ISSN1094-4087)
Hofmann,L.; Braeuer,J.; Baum,M.; Schulz,S.E.; Gessner,T.: Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration. Talk; 2009 Advanced Metallization Conference (AMC 2009), Baltimore, MD (USA), 2009 Oct 13-15
Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik. 12. Werkstofftechnisches Kolloquium, Chemnitz, 2009 Oct 1-2; Werkstoffe und Werkstofftechnische Anwendungen, Tagungsband, 35 (2009) pp 120-125(ISBN978-3-00-029007-7/1439-1597)
Jahn,S.F.; Engisch,L.; Baumann,R.R.; Ebert,S.; Goedel,W.A.: Polymer microsieves manufactured by inkjet technology. ; Langmuir, 25 (2009) pp 606-610(ISSN0743-7463)
Jia,C.; Baum,M.; Froemel,J.; Schubert,I.; Wiemer,M.; Gessner,T.; ArnoldSchneider; PeterFrey; HolgerRank; AchimTrautmann: An Investigation of Cu-Cu Thermal Compression Wafer Bonding. Conference on Wafer Bonding for Microsystems and Wafer Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, France, 2009 Dec 06-09
Jia,C.; Wiemer,M.; Grunert,J.; Otto,T.; Gessner,T.: A novel method for the fabrication of deep-submicron structure. Smart System Integration 2009, Bruessel, Belgien, 2009 Mar 10-12
Jia,C.; Wiemer,M.; Werner,T.; Otto,T.; Gessner,T.: Two Lithography-Based Technologies for the Fabrication of Submi-cron to Deep-Submicron Structures. GMM Conference on Micronano Integration, Seeheim, Germany, 2009 Mar 12-13(ISBN978-3-8007-3155-8, ISSN 1432-3419)
Knoll,D.; Tillack,B.; Barth,R.; Birkholz,M.; Schulz,K.; Sun,Y.M.; Wolansky,D.; Kaynak,M.; Ehwald,K.E.; Drews,J.; Scholz,R.; Korndorfer,F; Leidich,S.; Kurth,S.: BEOL Embedded RF-MEMS Switch for mm-Wave Applications . 2009 IEEE International Electron Devices Meeting, Baltimore, December 7 - 9, 2009
Kolchuzhin,V.; Forke,R.; Doetzel,W.; Mehner,J.: High Order Derivatives Technology in Advanced MEMS Modeling. Smart Systems Integration, Brussels (Belgium), 2009 Mar 10-11; Proceedings, pp 472-475(ISBN978-3-89838-616-6)
Kolchuzhin,V.; Forke,R.; Doetzel,W.; Mehner,J.; Ostertak,D.; Dragunov,V.: On the numerical capacitance evaluation of BDRIE structures. 9. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2009 Nov 5-6; Proceedings, pp 128-130(ISBN978-3-00-029135-7)
Kowerko,D.; Krause,S.; Amecke,N.; Abdel-Motaleb,M.; Schuster,J.; Dobrawa,R.; Wuerthner,F.; von Borczyskowski,C.: Identification of Different Donor-Acceptor Structures via FRET in Quantum-Dot-Perrylene Bisimide Assemblies. ; Int. J. Mol. Sci, 10 (2009) pp 5239-5256
Kowerko,D.; Schuster,J.; von Borczyskowski,C.: Restricted conformation dynamics of single functionalized perylene bisimide molecules on SiO2 surfaces and in thin polymer films . ; Molecular Physics, 107 (2009) pp 1911 - 1921
Kurth,S.; Faust,W.; Specht,H.; Meinig,M.; Fernholz,G.: Exploring microsystems - Measurement and Test in Fabrication and R&T. ; mst-news, 01/2009 (2009) pp 32-34
Leidich,S.; Braun,M.; Gessner,T.; Riemer,T.: Silicon Cylinder Spiral Coil for Nuclear Magnetic Resonance Spectroscopy of Nanoliter Samples. ; Concepts in Magnetic Resonance Part B (Magnetic Resonance Engineering), 35B(1) (2009) pp 11-22
Lin,Y.; Baum,M.; Haubold,M.; Froemel,J.; Wiemer,M.; Gessner,T.; Esashi,M.: Characterization of eutectic wafer bonding using Gold and Silicon. Smart Systems Integration 2009, Brussels (Belgium), 2009 Mar 10-11; Proceedings, pp 56-63(ISBN978-3-89838-616-6)
Lin,Y.; Baum,M.; Haubold,M.; Froemel,J.; Wiemer,M.; Gessner,T.; Esashi,M.: Development and Evaluation of AuSi Eutectic Wafer Bonding. Transducers 2009, Denver (USA), 2009 June 21-25; Proceedings, 15th International Conference on Solid-State Sensors and Microsystems (2009) pp 244-247(ISBN978-1-4244-4193-8)
Lin,Y.; Braeuer,J.; Hofmann,L.; Baum,M.; Froemel,J.; Wiemer,M.; Esashi,M.; Gessner,T.: Nanofabrication of reactive structure for low temperature bonding. IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering (NANOMED), Taiwan, 2009 Oct 18-21; Proceedings, pp 313-317(ISBN978-1-4244-5528-7)
Lin,Y.; Froemel,J.; Esashi,M.; Gessner,T.: Characterisation of Gold and Silicon Eutectic for Wafer Bonding Applications. World Premier International Research Center AIMR Annual Workshop, Zao (Japan), 2009 Mar 1-6
Liu,J.; Engquist,I.; Berggren,M.; Norberg,P.; Loegdlund,M.; Nordlinder,S.; Sawatdee,A.; Nilsson,D.; Gold,H.; Stadlober,B.; Haase,A.; Kaker,E.; Koenig,M; Klink,G.; Bock,K.: Integration of two classes of organic electronic devices into one system. Proceedings of Large-Area, Organic and Polymer Electronics Convention 2009 (LOPE-C 09), Frankfurt/Main (Germany), June 2009; Organic Electronics Association (OE-A), p 3.8.(ISBN978-3-00-028063-4)
Mager,T.; Reinhold,C.; Hedayat,C.; Gessner,T.: Near field scanner in time and frequency domain. ; mstnews, International Magazine on Smart System Technologies, 109 (2009)
Meinig,M.; Kurth,S.; Shaporin,A.; Bauer,W.; Gessner,T.: Resonant Mode Detection for Fast Determination of Structural and Material Parameters of MEMS. Sensor 2009, Nürnberg, 2009 May 26-28; Proceedings, pp 199-204(ISBN978-3-981-09934-8)
Meinig,M.; Kurth,S.; Shaporin,A.; Giessmann,S.; Gessner,T.: Time efficient test method for dimensional parameter determination based on resonant mode detection. Smart Systems Integration, Brussels (Belgium), 2009 Mar 10-11; Proceedings(ISBN978-3-89838-616-6)
Michel,B.: Testing and reliability issues in nanomechanics. Proceedings of 3rd Vienna Internat. Conf. on Nanotechnology, Vienna (Austria) 2009, pp 150-151
Michel,B.; Dudek,R.; Auersperg,J.; Winkler,T.: Micro- and nanoreliability research in the Micro Materials Center Chemnitz of Fraunhofer ENAS. ; MST News, 2/2009 (2009) pp 40 - 41
Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Theoretical study of geometry dependent I-V characteristics of copper and gold quantum point contacts. DPG, Dresden (Germany), 2009 Mar 22-27; Poster Presentation
Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Electronic transport properties of copper atomic wires. AMC, Baltimore MD (USA), 2009 Oct 13-15; Poster Presentation
Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Geometry dependent of I-V characteristics of gold atomic-sized contacts. 9th IEEE Conference on Nanotechnology, Genoa (Italy), 2009 Jul 26-30; Oral Presentation
Morschhauser,A.; Hammerschmidt,J.; Nestler,J.; Jahn,S.F.; Baumann,R.; Gessner,T.; Wachner,D.; Goedel,W.A.: Hierarchisches mikrofluidisches System. MikroSystemTechnik KONGRESS 2009, Berlin, 2009 Oct 12-14; Proceedings, pp 693-695(ISBN978-3-8007-3183-1)
Morschhauser,A.; Nestler,J.; Gessner,T.; Wachner,D.; Goedel,W.; Jahn,S.; Baumann,R.: Verfahren zur Herstellung eines mikrostrukturierten Films und mikrostrukturierter Film. ; Patentanmeldung (DE102009006064)
Mueller,M.; Knothe,M.; Wend,J.; Jahn,S.F.; Blaudeck,T.; Baumann,R.R.: UV-enhanced thermal annealing of inkjet-printed silver structures. . Proceedings of Printing Future Days 2009, Chemnitz (Germany), 2009 Nov 2 - 5
Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Auerswald,J.; Knapp,H.F.; Gavillet,J.; Gessner,T.: Polymer lab-on-chip systems with integrated electrochemical pumps suitable for large scale fabrication. ; Int. J. Adv. Technol., in press (2009)(ISSN0268-3768)
Nestler,J.; Schueller,M.; Morschhauser,A.; Otto,T.; Gessner,T.; Brandenburg,A.; Michel,D.; Bier,F.F.: Lowcost in-vitro diagnostic cartridges with integrated sensor, micropumps and reagents. Smart Systems Integration, Brussels, 2009 Mar 10-11; Proceedings(ISBN978-3-89838-616-6)
Neumann,N.; Ebermann,M.; Hiller,K.; Kurth,S.: Novel MWIR microspectrometer based on a tunable detector. MOEMS and Miniaturized Systems VIII, San Jose; Proc. of SPIE, Vol. 7208 (2009)
Nowack,M.; Reuter,D.; Bertz,A.; Gessner,T.: Integration of MEMS Inertial Sensors in Smart RFID Labels for Transport Monitoring of Sensitive Goods. Mikrosystemtechnik Kongress 2009, Berlin, 2009 Oct 12-14; Proceedings(ISBN978-3-8007-3183-1)
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Throl,O.; Graehlert,W.; Kaskel,S.; Schreck,H.; Gessner,T.: MEMS ANALYZER FOR FAST DETERMINATION OF MIXED GASES. MEMS/MOEMS Conference, San Jose, 2009; Proceedings of SPIE
Reinhold,C.: Vorstellung eines verbesserten dreidimensionalen Nahfeld-Scanners zur automatischen Störfestigkeit und Störabstrahlungsanalyse (Hybrid-Fahrzeug). 3. Dresdner RFID Symposium, Dresden (Germany), 2009 Dec 10-11
Reinhold,C.; Mager,T.; Hedayat,C.: Three dimensional near field scanning measurement techniques for improved RF design. SAME 2009 Conference, Sophia Antipolis (France), 2009 Sept 22-23
Reinhold,I.; Hendricks,C.E.; Eckhardt,R.; Kranenburg,J.M.; Perelaer,J.; Baumann,R.R.; Schubert,U.S.: Argon plasma sintering of inkjet printed silver tracks on polymer substrates. ; Journal of Materials Chemistry, 19 (2009) pp 3384-3388
Reuter,D.; Nowack,M.; Bertz,A.; Wiemer,M.; Semar,R.; Hopp,K.-F.; Dietrich,S.; Thieme,T.; Herbst,K.; Gessner,T.: Integration of Inertial MEMS Sensors in Active Smart RFID Labels for Transport Monitoring. Smart Systems Integration, Brussels, 2009 Mar 10-11; Proceedings(ISBN978-3-89838-616-6)
Reuter,D.; Nowack,M.; Rennau,M.; Bertz,A.; Wiemer,M.; Kriebel,F.; Gessner,T.: Hermetic Thin Film Encapsulation of Mechanical Transducers for Smart Label Applications. Transducers 09, Denver (USA), 2009 Jun 21-25; Tech. Digest
Rzepka,S.; Dudek,R.; Vogel,D.; Michel,B.: Virtual Prototyping in Microelectronics and Packaging. Proceedings of the 33. Internat. Conf. IMAPS/CPMT IEEE, Przczyna (Poland), 2009 Sept 21 - 24 pp 316-325
Scholz,P.; Ackermann,W.; Weiland,T.; Reinhold,C.: Antenna modeling for inductive RFID applications using the PEEC method. Compumag 2009, Florianópolis (Brazil), 2009 Nov 22-26
Schulz,S.E.; Waechtler,T.; Hofmann,L.: Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials. Invited Talk; Advanced Metallization Conference 2009, 19th Asian Session (ADMETA 2009), Tokyo (Japan), 2009 Oct 19-21
Schulze,K.; Schulz,S.E.; Koerner,H.; Gessner,T.: Airgap Integration: Fabrication by Sacrificial Etch, Thermal and Mechanical Behavior, Reliability (Talk). Materials for Advanced Metallization (MAM), Grenoble (France), 2009 Mar 8-11
Schulze,K.; Schulz,S.E.; Koerner,H.; Gessner,T.: Airgap Structures by using Sacrificial Wet Etch: Fabrication, Thermal and Mechanical Behaviour, Reliability. ; MRS Conf. Proc. AMC XXIV, Materials Research Society, Warrendale PA (2009), pp 41-52(ISBN1048-0854 / ISSN 978-1-60511-125-4)
Shaporin,A.; Streit,P.; Specht,H.; Mehner,J.: Novel test structures for characterization of microsystems parameters at wafer level. Photonics West, San Jose (US), 2009 Jan; Proc. SPIE, 7206 (2009) p 72060E
Sommer,J.-P.; Michel,B.; Noack,E.: FE Simulations and Microrange Deformation Measurements-Efficient Tools for Design Support.. 2009 IEEE MTT-S, International Microwave Symposium, Boston (USA), 2009 June 7 - 12
Sowade,E.; Hammerschmidt,J.; Polster,D.; Wagner,R.; Baumgaertel,T.; Blaudeck,T.; Graaf,H.; Cichos,F.; von Borczyskowski,C.; Baumann,R.R.: Inkjet-printing of polymer microspheres. Proceedings of Non-Impact Printing / Digital Fabrication 2009, Louisville, KY (USA), The Society for Imaging Science and Technology (IS&T), Springfield, VA (USA), 2009
Sowade,E.; Hammerschmidt,J.; Polster,D.; Wagner,R.; Baumgaertel,T.; Blaudeck,T.; Graaf,H.; Cichos,F.; von Borczyskowski,C.; Baumann,R.R.: Inkjet-printing of polymer microspheres. Annual Spring Meeting of the German Physical Society (DPG), Condensed-Matter Division, Chemical and Polymer Physics (CPP), Regensburg (Germany), March 2009
Sowade,E.; Seifert,T.; Hammerschmidt,J.; Blaudeck,T.; Baumann,R.R.: Inkjet-printing of polymer microspheres. Proceedings of Printing Future Days 2009, Chemnitz (Germany), 2009 Nov 2 - 5
Specht,H.; Kurth,S.; Billep,D.; Gessner,T.: Analysis of image quality for laser display scanner test. Photonics West, San Jose (US), 2009 Jan; Proc. SPIE, 7206 (2009) p 72060G
Taeuber,D.; Heidernaetsch,M.; Bauer,M.; Radons,G.; Schuster,J.; von Borczyskowski,C.: Single Molecule Tracking of the molecular mobility in thinning liquid films on thermally grown SiO2. ; Diffusion Fundamentals, 11 (2009) pp 1-11
Taeuber,D.; Schuster,J.; Heidernaetsch,M.; Bauer,M.; Radons,G.; von Borczyskowski,C.: Discriminination between static and dynamic heterogeneities in single dye diffusion in ultrathin liquid films. ; Diffusion Fundamentals, 11 (2009) pp 1-2
Trenkmann,I.; Taeuber,D.; Bauer,M.; Schuster,J.; von Borczyskowski,C.: Investigations of solid liquid interfaces in ultra-thin liquid films via single particle tracking of silica nanoparticles. ; Diffusion Fundamentals, 11 (2009) pp 1-12
Uddin,N.; Spang,M.; Mager,T.; Thiede,A.: Integrated active sensors for near-field scanning. International Symposium on Theoretical Electrical Engineering 2009, Luebeck (Germany) pp 398-400
Vogel,K.; Shaporin,A.; Wuensch,D.; Billep,D.: Crack propagation in micro-chevron-test samples of direct bonded wafers . 26th Danubia-Adria Symposium on Advances Experimental Mechanics, Leoben (Austria), 2009 Sep 23-26
Wachner,D.; Goedel,W.; Hammerschmidt,J.; Jahn,S.; Baumann,R.; Morschhauser,A.; Nestler,J.; Gessner,T.; Otto,T.: Mikrofluidische Einrichtung und Verfahren zur Herstellung einer mikrofluidischen Einrichtung. ; Patentanmeldung (DE102009006065)
Waechtler,T.; Gessner,T.; Schulz,S.; Lang,H.; Jakob,A.: Substrate having a coating comprising copper and method for the production thereof by means of atomic layer deposition. ; Patent Application Publication , WO 2009/071076 A1 (2009)
Waechtler,T.; Hofmann,L.; Mothes,R.; Schulze,S.; Schulz,S.E.; Gessner,T.; Lang,H.; Hietschold,M.: Copper Oxide ALD from a Cu(I) beta-Diketonate: Growth Studies and Application as Seed Layers for Electrochemical Copper Deposition. 216th ECS Meeting, Vienna (Austria), 2009 Oct 4-9
Waechtler,T.; Hofmann,L.; Schulz,S.E.: Copper Films Grown via Copper Oxide ALD: Routes and Challenges for Integration with Next-Generation Interconnect Materials. Invited Talk; 2009 Advanced Metallization Conference (AMC 2009), Baltimore, MD (USA), 2009 Oct 13-15
Waechtler,T.; Oswald,S.; Roth,N.; Jakob,A.; Lang,H.; Ecke,R.; Schulz,S.E.; Gessner,T.; Moskvinova,A.; Schulze,S.; Hietschold,M.: Copper Oxide Films Grown by Atomic Layer Deposition from Bis(tri-n-butylphosphane)copper(I)acetylacetonate on Ta, TaN, Ru, and SiO2. ; J. Electrochem. Soc., 156 (2009) pp H453-H459(ISSN0013-4651)
Waechtler,T.; Roth,N.; Mothes,R.; Schulze,S.; Schulz,S.E.; Gessner,T.; Lang,H.; Hietschold,M.: Copper Oxide ALD from a Cu(I) beta-Diketonate: Detailed Growth Studies on SiO2 and TaN . ; ECS Trans., 25 (2009) pp 277-287(ISSN1938-5862)
Waechtler,T.; Schulze,S.; Hofmann,L.; Hermann,S.; Roth,N.; Schulz,S.E.; Gessner,T.; Lang,H.; Hietschold,M.: Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru. AVS 9th International Conference on Atomic Layer Deposition (ALD 2009), Monterey, CA (USA), 2009 Jul 19-22
Wegener,M.; Greco,T.; Arlt,K.; Schuberth,R.; Morschhauser,A.; Otto,T.: Ferroelectric P(VDF-TrFE) as a large-scale piezoelectric sensor in a table-tennis racquet. Applications of Ferroelectrics, 2009. ISAF 2009. 18th IEEE International Symposium on the, Xian, Aug 23-27 pp 1-5(ISBN978-1-4244-4970-5)
Wegener,M.; Schwerdtner,R.; Schueller,M.; Morschhauser,A.: Dome-like PVDF Actuators: Preparation, Phase Transformation and Piezoelectric Properties. ; MRS Symposium Proceedings, Volume 1190: Active Polymers (2009)(ISBN978-1-60511-163-6)
Wiegand,C.; Hedayat,C.; Hilleringmann,U.: Lock detection for charge-pump phase-locked loops. SAME 2009 Conference, University Booth, Sophia Antipolis (France), 2009 Sept 22-23
Wiemer,M.; Braeuer,J.; Besser,J.; Gessner,T.: Trends in 3D Integration of MEMS and Electronics. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Grenoble / France, 2009 Dez 6-8; Proceedings, pp 107-110
Wiemer,M.; Wuensch,D.; Braeuer,J.; Eichler,M.; Hennecke,P.; Gessner,T.: Low temperature bonding of hetero-materials using ambient pressure plasma activation. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Grenoble (France), 2009 Dec 6-8
Wild,A.; Egbe,D.A.M.; Birckner,E.; Cimrova,V.; Baumann,R.R.; Grummt,U.-W.; Schubert,U.S.: Anthracene- and thiophene-containing MEH-PPE-PPVs: Synthesis and study of the effect of the aromatic ring position on the photophysical and electrochemical properties. ; Journal of Polymer Science A., 47 (2009) pp 2243-2261
Willert,A.: Digitaldruckprozesse zur Funktionalisierung von Textilien: Erste Ansätze und Visionen. ; Textilveredelung, 44 (2009) pp 12-15
Willert,A.; Baumann,R.R.: Printing Technologies for functional layer and device manufacturing. Proceedings of the 9th Seminar in Graphic Arts, Pardubice, 2009 Sept 23-24 pp 75-80
Willert,A.; Blaudeck,T.; Baumann,R.R.: Digital microfabrication based on digital and traditional printing technologies. Hannover Messe 2009, Forum "Innovations for Industry", Session "Printed Intelligence and Printed Electronics from Europe"
Willert,A.; Blaudeck,T.; Baumann,R.R.: Prospects and challenges of functional printing - functional layers and devices manufactured by printing technologies. (i) German-Thai Symposium on Nanoscience and Nanotechnology, Sept 21-22, 2009, Chiang Mai/Thailand, abstract page 5. (ii) NECTEC Annual Conference and Exhibition 2009, Sept 23-25, 2009, Bangkok/Thailand
Willert,A.; Geyer,U.; Kreutzer,A.; Baumann,R.R.: Druckverfahren zur Herstellung elektrochemischer Energiespeicher. MikroSystemTechnik Kongress 2009, Berlin (Germany), 2009 Oct 12
Willert,A.; Geyer,U.; Kreutzer,A.; Baumann,R.R.; (presenter:Blaudeck,T.): Drucktechnische Herstellung einfacher Energiesysteme. 3rd Materialica Surface Congress, Session Innovative Surfaces: Added value, Sustainability, Functionality, Munich (Germany), 2009 Oct 15th
Willert,A.; Kreutzer,A.; Geyer,U.; Baumann,R.R.: Lab-manufacturing of batteries for smart systems based on printing technologies. Smart Systems Integration 2009 - 3rd Europen Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICS and Electronic Components, Brussels (Belgium), - Heidelberg, 2009 March 10 - 11; AKA Verlag, pp 556-559
Wittig,T.; Mager,T.; Reinhold,C.: Combining the strenght of EM simulation and measurement during design and operation of a high precision near-field scanner. RFMTC09 (Conference aaranged by teh Center for RF Measurement Technology at the University of Gävle), Gävle (Sweden), 2009 Oct 6-7
Wunderle,B.; Michel,B.: Reliability Concepts for Microsystem Integration. Proc. European Conf. on Smart Systems Integration, Brussels (Belgium), 2009 March 10-11; pp. 214-216
Zhong,Zh.; Mohammadzadeh,S.; Cao,Y.; Qiu,Zh.; Liu,R.; Streiter,R.; Gessner,T.: Electrical resistivity calculations for copper nanointerconnect. MAM, Grenoble (France), 2009 Mar 9-11; Poster Presentation
Zichner,R.; Baumann,R.R.: Customised printed RFID antennas for various environments. Proceedings of Large-Area, Organic and Polymer Electronics Convention 2009 (LOPE-C 09), Frankfurt/Main (Germany), June 2009; Organic Electronics Association (OE-A), p 3.11.(ISBN978-3-00-028063-4)
Zichner,R.; Goetze,J.; Mueller,E.; Baumann,R.R.: Low-cost RFID for industrial applications. 14th International Symposium on Logistics (ISL-14), Istanbul (Turkey), July 2009
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS. Materials for Advanced Metallization MAM 2009, Grenoble (France), 2009 Mar 9-11
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma. Materials for Advanced Metallization MAM 2010, Mechelen (Belgium), 2010 Mar 7-10
Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Talk: Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods. AMC 2009, Baltimore (USA), October 13-15, 2009; Advanced Metallization Conference
Zimmermann,S.; Blaschta,F.; Schaller,M.; Ruelke,H; Schulz,S.E.; Gessner,T.: Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as in situ diagnostic methods. AMC, San Diego (USA); Proceedings of the Advanced Metallization Coneference 2008, pp 387-392(ISBN978-1-60511-125-4)
Zong,Zh.; Mohammadzadeh,S.; Cao,Y.; Qiu,Zh.; Liu,R.; Streiter,R.; Gessner,T.: Electrical resistivity calculations for copper nanointerconnect. ; Microelectronic Eng., 87 (2009) pp 402-405
2008
Ahner,N.; Schaller,M.; Bartsch,C.; Baryschpolec,E.; Schulz,S.E.: Surface energy and wetting behaviour of plasma etched porous SiCOH surfaces and plasma etch residue cleaning solutions. 9th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Bruges (Belgium), 2008 Sep 21-24; Proceedings, pp 119-120
Ahner,N.; Schulz,S.E.; Blaschta,F.; Rennau,M.: Optical, electrical and structural properties of spin-on MSQ low-k dielectrics over a wide temperature range. Materials for Advanced Metallization - MAM, Dresden (Germany), 2008 Mar 2-5; Microelectronic Engineering, 85 (2008) pp 2111-2113(ISSN0167-9317)
Ahner,N.; Schulz,S.E.; Prager,L.; Schaller,M.: UV assisted curing of plasma damaged porous ultralow-k material after a k-restore process: influence of UV-wavelength and curing ambient. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25
Baum,M.; Otto,T.; Gessner,T.; Keiper,B.; Haenel,J.: Mikrofluidische Schnittstellen durch Laserstrukturierung. ; Mikroproduktion, 01/2008 (2008) pp 24-28(ISBNISSN 1614-4538)
Baum,M.; Rota,A.; Salk,N.; Otto,T.; Gessner,T.: Micro machining technologies for non silicon materials. Smart Systems Integration 2008, Barcelona (Spain), 2008 April 9-10 pp 395-398(ISBN978-3-8007-3081-0)
Forke,R.; Scheibner,D.; Doetzel,W.; Mehner,J.: Tunable Frequency Selective Vibration Detection with MEMS Force Coupled Oscillators. Eurosensors XXII, Dresden (Germany), 2008 Sep 7-10; Proceedings, pp 1573-1576(ISBN978-3-00-025217-4)
Forke,R.; Scheibner,D.; Hiller,K.; Gessner,T.; Doetzel,W.; Mehner,J.: Fabrication and Characterization of a Force Coupled Sensor-Actuator System for Adjustable Resonant Low Frequency Vibration Detection. ; Sensors and Actuators A: Physical, 145-146 (2008) pp 245-256
Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Electrostatic force coupling of MEMS oscillators for spectral vibration measurements. ; Sensors and Actuators A: Physical, 142, 1 (2008) pp 276-283
Froemel,J.; Sato,Y.: Functional Element Package and Fabrication Method Therefor. ; Patentschrift WO002008123165A1, JP002008263166AA
Froemel,J.; Voigt,S.; Kurth,S.; Leidich,S.; Bertz,A.; Kaufmann,C.; Gessner,T.: Micromechanical Switch Device with Mechanical Power Amplification. ; Patentschrift WO002008110389A1, DE102007013102A1
Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Gelapierre,G.; Hiller,K.; Nestler,J.; Gessner,T.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Ross,S.; Bigot,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.: Nanostructured polymer thin films: Application to biosensors. ; Materials Science Forum, 570 (2008) pp 10-17(ISSN0255-5476)
Gessner,T.; Schulze,K.; Schulz,S.E.: Thermal behaviour of BEOL systems: Comparison of SiO2, low-k and airgap Integration (Invited Talk). 10th International Workshop on Stress-Induced Phenomena in Metallization , Austin TX (USA), 2008 Nov 5-7
Griffiths,C.; Tosello,G.; Nestler,J.; Sha,B.; Hoyle,R.: Micro Engineering: Experiments conducted on the use of polymeric materials in micro injection moulding. 1st European Conference on Medical Polymers, Belfast (UK), 2008 Sep 3-5; Proceedings, pp 171-178(ISBN978-0-853899433)
Haenel,J.; Keiper,B.; Baum,M.: Lasermikrostrukturierung von dünnen Polymersubstraten. ; Inno - Fachmagazin für Mikro- und Nanotechnik und neue Materialien, Nr. 39, 13. Jahrgang (2008) p 7
Haenel,J.; Keiper,B.; Bleul,K.; Kaufmann,C.; Bonitz,J.: Laser Trimming of Micro Mirror Devices. ; Laser Technik Journal, 5 (2008) pp 36-39(ISSN1613-7728)
Hermann,S.; Ecke,R.; Schulz,S.E.; Gessner,T.: Controlling the formation of nanoparticles for definite growth of carbon nanotubes for interconnect applications . MAM 2008, Dresden (Germany), 2008 Mar 8-11; Microelectronic Engineering, Volume 85, Issue 10 (2008) pp 1979-1983
Hermann,S.; Schulz,S.E.; Gessner,T.: Growth of Multi-Walled Carbon Nanotubes on different Support/Catalyst Systems for Interconnect Applications. Ninth International Conference on the Science and Application of Nanotubes - NT08, Montpellier (France), 2008 Jun 29-Jul 4
Herrmann,M.; Richter,F.; Schulz,S.E.: Study of Nano-mechanical Properties for Thin Porous Films through Instrumented Indentation: SiO2 Low Dielectric Constant Films as an Example. Materials for Advanced Metallization - MAM, Dresden (Germany), 2008 Mar 2-5; Microelectronic Engineering, 85 (2008) pp 2172-2174(ISSN0167-9317)
Hofmann,L.; Kuechler,M.; Gumprecht,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias by copper electro depostition. ; Proceedings, Advanced Metallization Conference 2007, Mater. Res. Soc. Conf. Proc. AMC XXIV (2008) pp 623-630(ISBN978-1-55899-992-3 / ISSN 1048-0854)
Jakob,A.; Shen,Y.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Riedel,R.; Fasel,C.; Lang,H.: Copper(I) Carboxylates of Type [(nBu3P)mCuO2CR] (m = 1, 2, 3) -- Synthesis, Properties, and their Use as CVD Precursors. ; Z. Anorg. Allg. Chem., 634 (2008) pp 2226-2234(ISSN0044-2313)
Jia,C.; Froemel,J.; Wiemer,M.: Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen. ; Laser Magazin, 06/2008 (2008) pp 50-51
Jia,C.; Wiemer,M.; Hiller,K.; Otto,T.; Gessner,T.: Fabrication of a Low-Frequency Ultrasonic Transducer. Smart Systems Integration 2008, Barcelona (ES), April; Proceedings, pp 443-446(ISBN978-3-8007-3081-0)
Kurth,S.; A.Shaporin; Gessner,T.: Characterization of mechanical shock by impulse specific peak deflection (ISPD). ; Micromaterials and Nanomaterials, 08/2008, (2008) pp 54-57(ISSN1619-2486)
Kurth,S.; Shaporin,A.; Hiller,K.; Kaufmann,C.; Gessner,T.: Reliability of MEMS Devices in Shock and Vibration Overload Situation. ; Proc. of SPIE Vol. 6884 (2008)
Leidich,S.; Gessner,T.; Riemer,T.: In-Plane-Resonator for NMR Spectroscopy of nano Liter Samples. Experimental Nuclear Magnetic Resonance Conference, Pacific Grove (USA), 2008 Mar 9-14; Proceedings
Leidich,S.; Kurth,S.; Gessner,T.: Continuously Tunable RF-MEMS Varactor for High Power Applications. IEEE MTT-S International Microwave Symposium, Atlanta (USA), 2008 Jun 15-20; Proceedings, pp 1267-1270
Leidich,S.; Riemer,T.; Braun,M.; Kurth,S.; Gessner,T.: Complex Miniaturized Analysis System for Nuclear Magnetic Resonance Spectroscopy of Nano Liter Amounts of Biological Sample Material. Smart Systems Integration, Barcelona (Spain), 2008 Apr 9-10; Proceedings, pp 466-469(ISBN978-3-8007-3081-0)
Martin,J.; Cichos,F.; Huisken,F.; von Borczyskowski,C.: Electron-Phonon Coupling and Localization of Excitons in Single Silicon Nanocrystals. ; Nanoletters, 8 (2) (2008) pp 656-660
Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Theoretical study of electronic transfer through gold and copper quantum point contacts. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25
Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Electronic transport properties in copper nanowire. ; Microelectronic Eng., 85 (2008) pp 1992-1994
Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Theoretical study of electron transfer through copper and gold nanowires. Nanoelectronics Day, Aachen (Germany), 2008 May 13-16; Poster Presentation
Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Quantum conductance of copper nanowires. DPG, Berlin (Germany), 2008 Feb 25-29; Poster Presentation
Mohammadzadeh,S.; Pouladsaz,D.; Streiter,R.; Gessner,T.: Electronic transport properties in copper nanowire. MAM, Dresden (Germany), 2008 Mar 2-5; Poster Presentation
Morschhauser,A.; Nestler,J.; Baum,M.; Schueller,M.; Jaenig,O.; Otto,T.; Gessner,T.: Fabrication of Magnetic Polymer Membranes with microfluidic functionality. Actuator 2008, Bremen (GERMANY), 2008 Jun 9-11; Proceedings, pp 807-810(ISBN3-933339-10-3)
Nestler,J.; Enderlein,T.; Hiller,K.; Otto,T.; Gessner,T.; Auerswald,J.; Knapp,H.F.; Griffiths,C.; Bigot,S.: Microfluidic cartridge with integrated pumps and liquid position feedback designed for running protein assays. uFlu2008, 1st European Conference on Microfluidics, Bologna, 2008 Dec 10-12; Proceedings
Nestler,J.; Hiller,K.; Gessner,T.; Gavillet,J.; Auerswald,J.; Knapp,H.F.; Griffiths,C.; Bigot,S.; Beckers,M.-C.: An all-polymer microfluidic system for protein sensing applications with integrated low-cost pumps, surface modification and sealing. Smart Systems Integration 2008, Barcelona (ES), 2008 Apr 9-10; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2008), pp 291-298(ISBN978-3-8007-3081-0)
Nestler,J.; Hiller,K.; Morschhauser,A.; Bigot,S.; Griffiths,C.; Auerswald,J.; Gavilllet,J.; Nonglaton,G.; Otto,T.; Gessner,T.: Low-cost, fully integrated liquid handling platform for protein assays. uTAS2008 - 12th Internationl Conference on Miniaturized Systems for Chemistry and Life Sciences, San Diego (USA), 2008 Oct 12-16; Proceedings, pp 411-413(ISBN978-0-9798064-1-4)
Nestler,J.; Hiller,K.; Morschhauser,A.; Schueller,M.; Otto,T.; Gessner,T.: Low-cost micro valves based on electrolysis inside hydrogels. Actuator 2008, Bremen (GERMANY), 2008 Jun 9-11; Proceedings, pp 214-217(ISBN3-933339-10-3)
Nestler,J.; Hiller,K.; Otto,T.; Gessner,T.: Micro Actuators based on Structured Water. ; MST-News (international magazine on smart systems integration), June 2008 (2008) pp 18-21
Nestler,J.; Schueller,M.; Morschhauser,A.; Baum,M.; Otto,T.; Gessner,T.: Mikropumpe und Verfahren zum Pumpen eines Fluids. ; Patentanmeldung (DE102008004147)
Nestler,J.; Schueller,M.; Morschhauser,A.; Otto,T.; Gessner,T.: Vorrichtung und Verfahren zum Hin- und Herbewegen einer Flüssigkeit über eine vorbestimmte Fläche. ; Patentschrift (DE102008004139)
Neumann,N.; Kurth,S.; Hiller,K.: Tunable infrared detector with integrated micromachined Fabry-Perot filter. ; J. Micro/Nanolith. MEMS MOEMS , 7(2), 021004 (Apr-Jun 2008) (2008)
Norman,J.A.T.; Perez,M.; Schulz,S.E.; Waechtler,T.: New precursors for CVD copper metallization. Materials for Advanced Metallization - MAM, Dresden (Germany), 2008 Mar 2-5; Microelectron. Eng., 85 (2008) pp 2159-2163(ISSN0167-9317)
Otto,T.; Nestler,J.; Morschhauser,A.; Schueller,M.; Gessner,T.; Krissler,J.; Ebling,F.; Wegener,M.; Grzesiak,A.; Burgard,M.; Brandenburg,A.; Sulz,G.; Nebling,E.; Hintsche,R.; Wirth,I.: Highly integrated polymer-based technology platform for in-vitro diagnostics. Smart Systems Integration 2008, Barcelona (ES), 2008 Apr 9-10; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2008), pp 504-507(ISBN978-3-8007-3081-0)
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Wiesner,K.; Lampe,U.; Fleischer,M.; Gessner,T.: Dual detector optical MEMS spectrum analyzer: advances, applications and prospects. MEMS/MOEMS Conference, San Jose, 2008; Proceedings of SPIE, 6882 (2008)
Otto,T.; Saupe,R.; Weiss,A.; Throl,O.; Stock,V.; Gessner,T.: Fuel Gas Determination Using a MEMS Gas Analyser. Actuator 2008, Bremen, 9-11 June 2008 pp 782-785(ISBN3-933339-10-3)
Reuter,D.; Bertz,A.; Nowack,M.; Gessner,T.: Thin film encapsulation technology for harms using sacrificial CF-polymer. ; Sensors and Actuators A: Physical, 145-146 (2008) pp 316-322
Roth,N.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Silver, Copper and Ruthenium Precursors for ALD and CVD – An Overview. GerALD 2008 -- German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 2008 Sep 22-23
Rudra,S.; Waechtler,T.; Friedrich,M.; Louis,S.J.; Himcinschi,C.; Zimmermann,S.; Schulz,S.E.; Silaghi,S.; Cobet,C.; Esser,N.; Gessner,T.; Zahn,D.R.T.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. ; phys. stat. sol. (a), 205 (2008) pp 922-926(ISSN0031-8965)
Saupe,R.; Otto,T.; Gruska,B.; Weiss,A.; Stock,V.; Gessner,T.: MEMS-based spectroscopic ellipsometry. Smart Systems Integration 2008, Barcelona, 9-10 April 2008 pp 277-284(ISBN978-3-8007-3081-4)
Schueller,M.; Nestler,J.; Morschhauser,A.; Otto,T.; Gessner,T.: Low cost valveless magnetic micropumps suitable for array applications. Actuator 2008, Bremen (GERMANY), 2008 Jun 9-11; Proceedings, pp 811-813(ISBN3-933339-10-3)
Schulze,K.; Schulz,S.E.; Koerner,H.; Gessner,T.: Airgap structures by using sacrificial wet etch: Fabrication, thermal and mechanical behavior, reliability. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25
Semar,R.; Bertz,A.: Active Smart ID-Label für die Transportüberwachung . Clustermeeting RFID: Smart Label in der Logistik, Berlin, 5./6. November
Shaporin,A.; Forke,R.; Dienel,M.; Naumann,M.; Scheibner,D.; Doetzel,W.; Mehner,J.: Technology Dependent Design and Characterization of Silicon Vibration Sensors with Linear Tunable Band Selectivity. Eurosensors XXII, Dresden (Germany), 2008 Sep 7-10; Proceedings, pp 605-608(ISBN978-3-00-025217-4)
Shaporin,A.; Forke,R.; Schmiedel,R.; Doetzel,W.: Test-Structures for Wafer Level Microsystems Characterization. Smart Systems Integration, Barcelona (Spain), 2008 Apr 9-11; Proceedings, pp 528-531(ISBN978-3-8007-3081-0)
Tenholte,Dirk; Kurth,S.; Hiller,K.; Kaufmann,C.; Gessner,T.; Doetzel,W.; Mehner,J.: A MEMS friction vacuum gauge suitable for high temperature environment. ; Sensors and Actuators A: Physical, Volume 142, (2008) (2008) pp 166-172
Waechtler,T.; Oswald,S.; Pohlers,A.; Schulze,S.; Schulz,S.E.; Gessner,T.: Copper and Copper Oxide Composite Films Deposited by ALD on Tantalum-Based Diffusion Barriers. ; Proceedings, Advanced Metallization Conference 2007, Mater. Res. Soc. Conf. Proc. AMC XXIII (2008) pp 23-29(ISBN978-1-55899-992-3 / ISSN 1048-0854)
Waechtler,T.; Oswald,S.; Roth,N.; Lang,H.; Ecke,R.; Schulz,S.E.; Gessner,T.: Atomic Layer Deposition of Ultra-Thin Copper and Copper Oxide Films for ULSI Metallization Purposes. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25
Waechtler,T.; Oswald,S.; Roth,N.; Lang,H.; Schulz,S.E.; Gessner,T.: ALD of Copper and Copper Oxide Thin Films for Applications in Metallization Systems of ULSI Devices. 8th International Conference on Atomic Layer Deposition (ALD 2008), Bruges (Belgium), 2008 Jun 29 - Jul 2
Waechtler,T.; Roth,N.; Oswald,S.; Lang,H.; Schulz,S.E.; Gessner,T.: Atomic layer deposition of copper and copper oxide thin films for applications in microelectronic metallization systems. GerALD 2008 -- German Workshop on Atomic Layer Deposition, Halle (Saale) (Germany), Max Planck Institute of Microstructure Physics, 2008 Sep 22-23
Waechtler,T.; Schulz,S.E.: Copper Oxide and Copper Thin Films Grown by ALD for Seed Layer Applications (Invited Talk). Twenty Fifth International VLSI Multilevel Interconnection Conference (VMIC), Fremont, California (USA), 2008 Oct 28-30; Proceedings, p 365
Wiemer,M.; Froemel,J.; Haubold,M.; Jia,C.; Wuensch,D.; Gessner,T.: Developments Trends in the Field of Wafer Bonding Technologies. 214th Meeting of the Electrochemical Society, Honolulu, Hawai, 2008 October 12-17; ECS Transactions, Volume 16 Issue 8 (2008)
Zenkevich,E.I.; Martin,J.; von Borczyskowski,C.; Ageeva,T.; Titov,V.: Laser confocal spatially resolved fluorescence spectroscopy of porphyrin distribution on plasma deposited polymer film. VII International Conference on Laser Physics and Optical Technolgies, Minsk, National Academy of Sciences of Belarus, 2008; Proceedings, pp 220-223
Zenkevich,E.I.; Martin,J.; von Borczyskowski,C.; Ageeva,T.A.; Titov,V.A.; Knyukshto,V.N.: Laser Confocal and Spatially-Resolved Fluorescence Spectroscopy of Porphyrin Distribution on Plasma Deposited Polymer Films. ; Macroheterocycles, 1 (1) (2008) pp 59-67
Zimmermann,S.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Investigation of etch processes of dense and porous low-k dielectrics using OES and QMS as insitu diagnostic methods. Advanced Metallization Conference - AMC 2008, San Diego, CA (USA), 2008 Sep 23-25
2007
Ahner,N.; Schulz,S.E.; Blaschta,F.; Rennau,M.: Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics. Materials for Advanced Metallization - MAM, Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84 (2007) pp 2606-2609(ISSN0167-9317)
Auerswald,J.; Niedermann,P.; Dias,F.; Keppner,H.; Bigot,S.; Beckers,M.-C.; Nestler,J.; Hiller,K.; Gessner,T.; Knapp,H.F.: Bonding of glass chip based SPR sensors to thermoplastic microfluidic scaffolds. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 153-160(ISBN978-3-8007-3009-4)
Bagdahn,J.; Bernasch,M.; Fischer,C.; Wiemer,M.: Comparison of the mechanical properties of low temperature bonded test samples. Semiconductor Wafer Bonding 9: Science, technology and application, Cancun, 2006 Okt pp 269-278(ISBN1-56677-506-X)
Baum,M.; Gessner,T.: Siliziumätzen schafft Sensibilität. ; Mikroproduktion, 1/2007 (2007) p 16(ISBNISSN 1614-4538)
Baum,M.; Gessner,T.: Das intelligente Produkt gewinnt. ; Mikroproduktion, 2/2007 (2007) pp 42-43(ISBNISSN 1614-4538)
Baum,M.; Letsch,H.; Shaporin,A.; Otto,T.; Gessner,T.: Development and Characterization of Cu to Cu bonding technology. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 427-429(ISBN978-3-8007-3009-4)
Baum,M.; Mann,M.; Ebling,F.; Keiper,B.; Haenel,J.; Otto,T.; Gessner,T.: Mikrostrukturierung von Kunststoffen durch Heißprägen und Laserablation. MST-Kongress 2007, Dresden (Deutschland), 2007 Okt. 15-17; Proceedings, VDE VERLAG GMBH, Berlin-Offenbach (2007), pp 623-626(ISBN978-3-8007-3061-2)
Baum,M.; Schaufuß,J.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Smart Hip Joint Implants. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 273-279(ISBN978-3-8007-3009-4)
Bertz,A.; Fendler,R.; Schuberth,R.; Hentsch,W.; Gessner,T.: A New Method for High-Rate Deep Dry Etching of Silicate Glass with Variable Etch Profile. Transducers07, Lyon (France), 2007 June 10-14; Digest of Technical Papers, pp 81-84(ISBN1-4244-0841-5)
Bleul,K.; Bonitz,J.; Haenel,J.; Kaufmann,C.; Keiper,B.; Mehner,J.; Petsch,T.: Laser Trimming of MEMS. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 581-583(ISBN978-3-8007-3009-4)
Bonitz,J.; Kaufmann,C.; Gessner,T.; Bundesmann,C.; Eichentopf,I.-M.; Maendl,S.; Neumann,H.: Hochreflektiver mikromechanischer Scanner für Materialbearbeitung und medizinische Anwendungen. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 513-516(ISBN978-3-8007-3061-2)
Ecke,R.; Rennau,M.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Influence of barrier crystallization on CV characteristics of MIS structures. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 123-128(ISBN1-55899-865-9 / ISSN 1048-0854)
Fischer,T.; Toepper,M.; Juergensen,N.; Ehrmann,O.; Wiemer,M.; Reichl,H.: Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresist. Smart System Integration, Paris, 2007 Mar 27-28 pp 473-475(ISBN978-3-8007-3009-4)
Forke,R.; Scheibner,D.; Hiller,K.; Gessner,T.; Doetzel,W.; Mehner,J.: Spektrale Vibrationsmessung mit mikromechanischen kraftgekoppelten Silizium-Schwingern. 8. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2007 Nov 14-15; Proceedings, pp 67-72(ISBN978-3-00-022168-2)
Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Adjustable Force Coupled Sensor-Actuator System for Low Frequency Resonant Vibration Detection. Transducers 07 - 14th International Conference on Solid-State Sensors, Actuators and Microsystems, Lyon (France), 2007 Jun 10-14; Proceedings, pp 1725-1728(ISBN1-4244-0841-5)
Froemel,J.; Otto,T.; Nestler,J.; Gessner,T.: Method and Device for molding Structures. ; Patentschrift WO002007025519A3
Froemel,J.; Sato,Y.; Ohtaka,K; Gessner,T.: Development of wafer level packaging for MEMS micro mirrors. Smart System Integration, Paris, 27-28. M?rz 2007(ISBN978-3-8007-3009-4)
Froemel,J.; Wiemer,M.; Gessner,T.: AVT als Basis erfolgreicher MEMS-Kommerzialisierung. ; Mikroproduktion, 1/2007 (2007) pp 10-14(ISSN1614-4538)
Froemel,J.; Zimmermann,S.; Wiemer,M.; Gessner,T.: Fabrication of SOI substrates with buried silicide layers for BICMOS-applications. Nano-Hetero System Integration, Sendai, 30.07.2007
Frühauf,S.; Gessner,T.; Haase,T.; Jakob,A.; Kohse-Hoeinghaus,K.; Lang,H.; Schulz,S.E.; Wächtler,T.: Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 531-533(ISBN978-3-8007-3009-4)
Gottfried,K.; Schubert,I.; Schulze,K.: CMP an Airgap basierten Interconnectsystemen. CMP Nutzertreffen, Duisburg, Apr 20
Gottfried,K.; Schubert,I.; Schulze,K.; Schulz,S.E.; Gessner,T.: CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices. ICPT - International Conference on Planarization/CMP Technology, Dresden (Germany), 2007, Oct 25-27 pp 297-302(ISBN9783800730650)
Griffiths,C.A.; Bigot,S.; Brusseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer insert tooling for prototyping of micro fluidic components in micro injection moulding. 4M2007 - International Conference on Multi-Material Micro Manufacture, Borovets (Bulgaria), 2007 Oct 3-5; Proceedings, pp 305-308(ISBN978-1904445-53-1)
Hiller,K.; Nestler,J.; Gessner,T.; Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Delapierre,G.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Stanley,R.; Bigot,S.; Dimov,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.; Victor-Pujebet,E.: Integration aspects of a polymer based SPR biosensor with active micro optical and micro fluidic elements. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 295-302(ISBN978-3-8007-3009-4)
Hofmann,L.; Kuechler,M.; Gumprecht,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias by copper electro depostition (Talk). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11
Iacopi,F.; Beyer,G.; Travaly,Y.; Waldfried,C.; Gage,D.M.; Dauskardt,R.H.; Houthoofd,K.; Jacobs,P.; Adriaensens,P.; Schulze,K.; Schulz,S.E.; List,S.; Carlotti,G.: Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure. ; Acta Materialia, 55(4) (2007) pp 1407-1414
Jia,C.; Hiller,K.; Wiemer,M.; Otto,T.; Gessner,T.: Low-Temperature Ti-Si bonding and its application in micro-device fabrication. Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, Halle, 09.-11.12.2007
Jia,C.; Wiemer,M.; Kurth,S.; Otto,T.; Gessner,T.: Design and fabrication of a micromechanical vertical resonator. Smart System Integration, Paris, 2007 March 27-28 pp 497-499(ISBN978-3-8007-3009-4)
Kolchuzhin,V.; Mehner,J.; Geßner,T.; Doetzel,W.: Application of Higher Order Derivatives Method to Parametric Simulation of MEMS. EuroSimE, London (England), 2007 Apr 16-18; Proceedings, pp 588-593(ISBN1-4244-1106-8)
Kurth,S.; Froemel,J.; Voigt,S.; Leidich,S.; Nestler,J.; Shaporin,A.; Doetzel,W.; Gessner,T.: Switch Arrangement with a Plurality of Switches arranged in the Form of a Matrix and Method for switching Switches arranged in the Form of a Matrix . ; Patentschrift WO002007104528A1, DE102006029024B3
Leidich,S.; Hofmann,L.; Riemer,T.; Kurth,S.; Gessner,T.: Integrated Micro Resonators for Nuclear Magnetic Resonance Spectroscopy. Smart Systems Integration, Paris, 2007 Mar 27-28(ISBN 978-3-8007-3009-4)
Leidich,S.; Hofmann,L.; Riemer,T.; Kurth,S.; Schubert,I.; Kaufmann,C.; Gessner,T.: Mikrospulen und RF-MEMS Varaktoren für die kernmagnetische Resonanzspektroskopie – Applikationen und Technologie. 8. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2007 Nov 14-15(ISBN978-3-00-022168-2)
Leidich,S.; Kurth,S.; Gessner,T.: Continuously Tunable RF-MEMS Varactor for High Power Applications. ISMOT, Rom, 2007 Dez 17-21
Martin,J.; Otto,T.; Gessner,T.: Modeling of Mass Printed Organic Field Effect Transistors. Smart Systems Integration 2007, Paris (France), 2007 Mar 27-28; Proceedings, pp 549-551(ISBN978-3-8007-3009-4)
Morschhauser,A.; Nestler,J.; Voigt,S.; Schueller,M.; Otto,T.; Gessner,T.: Permanentmagnetische Membranen für mikrofluidische Aktorik. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 813-815(ISBN978-3-8007-3061-2)
Nestler,J.; Morschhauser,A.; Hiller,K.; Auerswald,J.; Knapp,H.F.; Otto,T.; Gessner,T.: Fully integrated polymer based microfluidic pumps and valves in Lab-on-Chip systems for Point-of-Care use. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 565-568(ISBN978-3-8007-3009-4)
Nestler,J.; Morschhauser,A.; Hiller,K.; Bigot,S.; Auerswald,J.; Gavillet,J.; Otto,T.; Gessner,T.: Electrochemical microfluidic pumps based on super absorbing polymers. uTAS2007 - 11th Internationl Conference on Miniaturized Systems for Chemistry and Life Sciences, Paris (France), 2007 Oct 7-11; Proceedings, pp 1504-1506(ISBN978-09798064-0-7)
Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps. 4M2007 - International Conference on Multi-Material Micro Manufacture, Borovets (Bulgaria), 2007 Oct 3-5; Proceedings, pp 319-322(ISBN978-1904445-53-1)
Nowack,M.; Reuter,D.; Rennau,M.; Bertz,A.; Gessner,T.: Wafer-Level Active Testing of Capacitive Inertial Sensors. MicroNanoReliability, Berlin (Germany), 2007 Sep 2-5; Micromaterials and Nanomaterials, p 175(ISSN1619-2486)
Otto,T.; Martin,J.; Gessner,T.: Nanotechnology for polymerbased sensor and actuator arrays. 5th Leibniz Conference of Advanced Science: NanoScience 2007, Lichtenwalde (Deutschland), 2007 Oct 18-20; Proceedings, pp 64-69
Otto,T.; Morschhauser,A.; Nestler,J.; Voigt,S.; Gessner,T.: Verfahren und Vorrichtung zur Lokalisierung von Partikeln in Matrixwerkstoffen. ; Patentschrift (DE102007051977)
Otto,T.; Nestler,J.; Baum,M.; Schroeder,H.; Ebling,F.; Bruch,R.; Gessner,T.: Integrated polymer multimode waveguides for microfluidic sensing applications. Nanosensors, Microsensors, and Biosensors and Systems 2007, San Diego, USA, 18-22 March 2007; Proc. SPIE, 6528 (2007) pp U224-U231(ISBN978-0-8194-6649-5)
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Fritzsch,U.; Gessner,T.: MEMS-based NIR-Spectrometers: The next generation of analytical instruments. The 7th International Conference on ASIC, Guillin, 2007 Oct 26-29
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Forensische Untersuchungen mittels MEMS-Spektrometern. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17 pp 493-496(ISBN978-3-8007-3061-2)
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Mikrospiegelspektrometer für den Nahinfraroten Spektralbereich – Applikationen & Trends. 8. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2007 Nov 14-15 pp 144-147(ISBNISBN 978-3-00-022168-2)
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Miniaturisierung in der instrumentellen Analytik dank Mikrospiegeln. ; apv news, 2/07 (2007) pp 14-15
Reuter,D.; Bertz,A.; Gessner,T.: Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 597-599(ISBN978-3-8007-3009-4)
Reuter,D.; Bertz,A.; Werner,T.; Nowack,M.; Gessner,T.: Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer. Transducers07, Lyon (F), 2007 Jun 11-14; Tech. Digest
Roth,N.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) complexes as CVD precursors. ; Surf. Coat. Technol., 201 (22-23) (2007) pp 9089-9094(ISSN0257-8972)
Rudra,S.; Friedrich,M.; Louis,S.; Gordan,O.; Waechtler,T.; Zahn,D.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. 71st Annual Meeting of the Deutsche Physikalische Gesellschaft and DPG Spring Meeting of the Division Condensed Matter, Regensburg (Germany), 2007 Mar 26-30
Rudra,S.; Friedrich,M.; Louis,S.J.; Waechtler,T.; Himcinschi,C.; Zahn,D.R.T.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. 4th International Conference on Spectroscopic Ellipsometry, Stockholm (Sweden), 2007 Jun 11-15
Saupe,R.; Otto,T.; Weiss,A.; Stock,V.; Gessner,T.: Packaging aspects of MEMS-based optical systems. Smart Systems Integration, Paris, 2007 Mar 27-28 pp 605-607(ISBN978-3-8007-3009-4)
Schuberth,R.; Otto,T.; Schwerdtner,R.; Bach,D.; Wegener,M.; Gessner,T.: Demonstration des Einsatzes flächiger low-cost-Sensoren am Beispiel eines trainingsunterstützenden Tischtennisschlägers. Mikrosystemtechnik-Kongress MST 2007, Dresden (Germany); Proceedings, pp 1087-1090
Schulz,S.E.; Ahner,N.: Deposition and properties of porous ultra-low-k dielectric films (Invited Talk). 8th Seminar Porous Glasses - Special Glasses, Wroclaw, 2007 Sept 4-8
Schulze,K.; Schulz,S.E.; Gessner,T.: Impact of Dielectric Material and Metal Arrangement on Thermal Behaviour of Interconnect Systems. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 445-451(ISBN1-55899-865-9 / ISSN 1048-0854)
Schulze,K.; Schulz,S.E.; Gessner,T.: Thermal Behavior of Interconnect Systems: A Comparison of low-k, Airgap and SiO2 Integration (Talk). MicroNanoReliability, Berlin, 2007 Sept 2-5
Schulze,K.; Schulz,S.E.; Gessner,T.: Electrical characterization of Airgap structures: Impact of film thickness and film permittivity on effective dielectric constant (Talk). European Congress on Advanced Materials and Processes EUROMAT, Nuernberg, 2007 Sept 10-13
Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11
Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation. Materials for Advanced Metallization (MAM), Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84/11 (2007) pp 2587-2594
Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.: Reproduciple reliable AuSi eutectic wafer bond process with high yield. IMECE2007, Seattle (USA), 2007 Nov 11-15
Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.: Improvement of solid Au-Si eutectic bond process. Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, 09.-11.12.2007
Schwerdtner,R.; Otto,T.; Schuberth,R.; Bach,D.; Wegener,M.; Danz,R.; Gessner,T.: Flexible taktile Sensorarrays auf Basis verschiedener piezoelektrischer Funktionspolymere. Mikrosystemtechnik-Kongress MST 2007, Dresden(Germany), 2007 Oct 15-17; Proceedings, pp 155-158
Shaporin,A.; Forke,R.; Doetzel,W.; Mehner,J.: MEMS Characterization Technique Based on Special Designed Test-Structures. Mikrosystemtechnik Kongress, Dresden, 2007 Okt 15-17; Proceedings, pp 873-876(ISBN978-3-8007-3061-2)
Shaporin,A.; Hanf,M.; Forke,R.; Mehner,J.; Gessner,T.; Doetzel,W.: Test-Structure based MEMS Characterization Technique. Smart Systems Integration 2007, Paris (France), 2007 Mar 27-28; Proceedings, pp 625-627(ISBN978-3-8007-3009-4)
Thieme,T.; Bertz,A.; Gessner,T.; Dittrich,C.: Neue Technologie in der Herstellung – neue Chance am Markt. Mikrosystemtechnik-Kongress, Dresden (Germany), 2007 Oct 15-17; Proceedings, pp 135-138(ISBN978-3-8007-3061-2)
Voigt,S.; Morschhauser,A.: PDMS-Membran mit partiell verteilten Magnetpartikeln für Schalteranwendungen. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 809-812(ISBN978-3-8007-3061-2)
von Borczyskowski,C.; Cichos,F.; Martin,J.; Schuster,J.; Issac,A.; Brabandt,J.: Common luminescence intensity fluctuations of single particle and single molecules in non-conducing matrices. ; The European Physical Journal - Special Topics, 144 (1) (2007) pp 13-25
Waechtler,T.; Jakob,A.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Copper thin films grown via ALD of copper oxide. European Congress on Advanced Materials and Processes - EUROMAT, Nuremberg (Germany), 2007 Sep 10-13
Waechtler,T.; Oswald,S.; Pohlers,A.; Schulze,S.; Schulz,S.E.; Gessner,T.: Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11
Waechtler,T.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Composite films of copper and copper oxide deposited by ALD . AVS 7th International Conference on Atomic Layer Deposition - ALD 2007, San Diego, California (USA), 2007 Jun 24-27
Waechtler,T.; Schulz,S.E.; Oswald,S.; Gessner,T.: Atomic Layer Deposition of Copper and Copper Oxide for Applications in Microelectronic Metallization Systems. NanoScience 2007 - 5th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 2007 Oct 18-20; Micromaterials and Nanomaterials, Iss. 07/2007 (2007) pp 26-27(ISSN1619-2486)
Wieland,R.; Ecke,R.; Klumpp,A.; Merkel,R.; Schulz,S.E.; Ramm,P.: 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology. Smart Systems Integration 2007, Paris (F), Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 649-651(ISBN978-3-8007-3009-4)
Wiemer,M.; Bagdahn,J.; Beckert,E.; Eichler,M.; Hollaender,A.; Vogel,D.: Bonding and reliability for 3D mechanical, optical and fluidic systems. Smart System Integration, Paris, 2007 March 27-28 p 399(ISBN978-3-8007-3009-4)
Wiemer,M.; Froemel,J.; Bagdahn,J.; Knechtel,R.: Waferbond technologies and quality assesment. Micromaterials and Nanomaterial, Berlin, 2007 Sept. 2-5 p 264(ISSN1619-2486)
Wiemer,M.; Froemel,J.; Hiller,K.; Reuter,D.; Jia,C.: Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele. Technologien und Werkstoffe der Mikro- und Nanosystemtechnik, Karlsruhe, 07.-08. Mai 2007; GMM-Fachbericht , 53 (2007) pp 17-24
Wiemer,M.; Jia,C.; Froemel,J.: Herstellungstechnologie und Testverfahren von Fügeverbindungen der Sensorebenen. ZVEI: Qualifizierungsmethoden für Drucksensor-Anwendungen, Nürnberg, 2007 May 24
Zimmermann,S.; Q.T.Zhao; H.Hoehnemann; Wiemer,M.; Kaufmann,C.; S.Mantl; V.Dudek; Gessner,T.: Roughness improvement of the CoSi2/Si-interface for an application as buried silicide. Material for Advanced Metallization MAM 2007, Bruges (Belgium), March 4-7
2006
Baum,M.; Hientzsch,M.; Schaufuss,J.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Gelenkprothese und Verfahren zum Messen einer Abnutzung in dieser Gelenkprothese. ; Patentanmeldung & Offenlegungsschrift (DE102006051173 A1)
Bonitz,J.; Kaufmann,C.; Mehner,J.; Bleul,K.; Keiper,B.; Haenel,J.: Laser Trimming of Silicon Micro Mirror Devices. International Symposium on Laser-Micromachinig, Chemnitz, 2006 Sept 13-14
Ecke,R.; Rennau,M.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Influence of barrier crystallization on CV characteristics of MIS structures (poster). Advanced Metallization Conference (AMC), San Diego (USA), 2006 Oct 17-19
Forke,R.; Scheibner,D.; Mehner,J.; Geßner,T.; Doetzel,W.: Micromachined Force Coupled Sensor–Actuator System for Frequency Selective Vibration Monitoring. Actuator, Bremen, 2006 Jun 14-16; Proceedings, pp 928-931(ISBN3-933339-08-1)
Forke,R.; Scheibner,D.; Mehner,J.; Geßner,T.; Doetzel,W.: Electrostatic Force Coupling of MEMS Oscillators for Spectral Vibration Measurements. Eurosensors XX, Göteborg (Sweden), 2006 Sept 17-20; Proceedings (digital), pp M2B-O2(ISBN91-631-9281-0)
Froemel,J.; Gessner,T.: Advanced packaging is the breakthrough technology of MEMS commercialisation. The 12th International Nanotech Symposium, Tokyo, 2006 Nov 8-10
Froemel,J.; Schwerdtner,R.; Wiemer,M.; Gessner,T.: Development of AuSi eutectic wafer bond processes with high yield. 2nd WORKSHOP ON WAFER BONDING FOR MEMS TECHNOLOGIES, Halle (Germany), 2006 Apr 9-11
Frömel,J.; Billep,D.; Geßner,T.; Wiemer,M.: Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. ; Microsystem Technologies, 12 (2006) pp 481-483(ISSN0946-7076)
Frühauf,S.; Schulz,S.E.; Gessner,T.: Mesoporous SiO2 as low-k dielectric for integration in Cu/low-k interconnect systems. ; Vacuums Best, (2006) pp 31-36
Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Gelapierre,G.; Hiller,K.; Nestler,J.; Gessner,T.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Ross,S.; Bigot,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.: Nanostructured polymer thin films : Application to biosensors. Nanomat 2006, Rio de Janeiro (Brazil), 2006 Jun 5-8 ; Proceedings
Geßner,T.; Baum,M.; Hiller,K.; Mehner,J.; Wiemer,M.; Otto,T.; Saupe,R.; Nestler,J.: Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanotechnologien. VDE Kongress 2006, Aachen (Germany), 2006 Oct 23-25; Proceedings, Band 1 (2006) pp 495-500(ISBN3-8007-2979-2)
Geßner,T.; Bonitz,J.; Kaufmann,C.; Kurth,S.; Specht,H.: MEMS based Micro Scanners: Components, Technologies and Applications. Actuator 2006, 10th International Conference on New Actuators, Bremen (Germany), 2006 June 14-16; Proceedings, pp 193-198
Gottfried,K.; Schubert,I.: Ultra low-k integration – a challenge for CMP. CMP Nutzertreffen (CMP user meeting), Chemnitz, 2006 Oct 27
Gottfried,K.; Schubert,I.: Ultra low-k integration – a challenge for CMP. Cabot Microelectronics CMP Meeting, Dresden, 2006 Jun 21
Gottfried,K.; Schubert,I.: CMP processes for copper / porous low-k based damascene architectures. CMP User Meeting, München, 2006 Apr 7
Gottfried,K.; Schubert,I.; Schulz,S.E.; Geßner,T.: Cu/barrier CMP on porous low-k based interconnect schemes. MAM, Grenoble (France), 2006 Mar 6-8; Microelectronic Engineering, 83 (2006) p 2218–2224
Jia,C.; Wiemer,M.; Froemel,J.; Otto,T.; Gessner,T.: Low temperature adhesive bonding by using SU-8 photoresist. The 2nd International Workshop on Wafer Bonding for MEMS Technologies, Halle(Saale), Germany, April; Proceedings, pp 43-44
Jia,C.; Wiemer,M.; Gessner,T.: Direct Bonding with On-wafer Metal Interconnections. ; J. Microsyst. Technol., 12 (2006) pp 391-396
Jia,C.; Wiemer,M.; Otto,T.; Gessner,T.: Silicon Micromachined Membrane Actuator for Ultrasound Generation. The 10th International Conference on New Actuator (ACTUATOR06), Bremen, June; Proceedings, pp 227-230(ISBN3-933339-08-1)
Jia,C; Wiemer,M.; Grunert,J.; Otto,T.; Gessner,T: Micro-machined Capacitive Ultrasonic Transducer Array with Better Than One-percent Cell Uniformity. The 5th International Workshop on Micromachined Ultrasound Transducers, Munich, May
Knechtel,R.; Wiemer,M.; Frömel,J.:; Microsystem Technologies, 12 (2006) pp 468-472(ISSN0946-7076)
Kolchuzhin,V.; Mehner,J.; Gessner,T.; Doetzel,W.: Parametric Finite Element Analysis for Reduced Order Modeling of MEMS. EuroSimE 2006 - 7th International conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, Como (Italy), 2006 Apr 23-26; Proceedings, pp 220-225(ISBN1-4244-0275-1)
Kolchuzhin,V.; Mehner,J.; Gessner,T.; Doetzel,W.: Parametric Simulation of MEMS Based on Automatic Differentiation of Finite Element Codes. Nanotech 2006 - NSTI Nanotechnology Conference and Trade Show , Boston (USA), 2006 May 7-11; Technical Proceedings, 3 (2006) pp 507-510(ISBN0-9767985-8-1)
Leidich,S.; Geßner,T.: Using Circuit and Electromagnetic Simulation Software in RF-MEMS Design Process. 3. AWR User Group Meeting, Munich, 2006 Oct 4-5
Leidich,S.; Voigt,S.; Kurth,S.; Geßner,T.: Microwave Phase Shifter with Electromagnetic Signal Coupling in Silicon Bulk Technology. ; Int. J. Microwave and Optical Techn., 1 (2006) pp 1-9(ISSN1553-0396)
Nestler,J.; Hiller,K.; Gessner,T.; Buergi,L; Soechtig,J.; Ross,S.; Voirin,G.; Bigot,S.; Gavillet,J.; Getin,S.; Fillon,B.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.: A new technology platform for fully integrated polymer based micro optical fluidic systems . 4M2006 - Second International Conference on Multi-Material Micro Manufacture, Grenoble (France), 2006 Sep 20-22; Proceedings, pp 35-38(ISBN0-080-45263-9)
Nestler,J.; Hiller,K.; Otto,T.; Gessner,T.: Microfluidic bubble actuators based on hydrogels. uTAS2006 - 10th International Conference on Miniaturized Systems for Chemistry and Life Sciences, Tokyo, 2006 Nov 05-09; Proceedings, pp 657-659(ISBN4-9903269-0-3-C3043)
Nestler,J.; Hiller,K.; Otto,T.; Gessner,T.: Mikrofluidischer Aktor, Aktorverfahren und Verfahren zum Herstellen eines Mikroaktors. ; Patentanmeldung (DE102006017482A1, EP1844936A1)
Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Bruch,R.; Gessner,T.: Principle and Applications of a new MOEMS-Spectrometer. MEMS/MOEMS Conference, San Jose, 2006; Proceedings of SPIE, 6114 (2006) pp 77-86
Reuter,D.; Bertz,A.; Billep,D.; Scheibner,D.; Doetzel,W.; Geßner,T.: In-process gap reduction of capacitive transducers. ; Sensors and Actuators A, 126 (2006) pp 211-217(ISSN0924-4247)
Schulz,S.E.; Gessner,T.: Achieving ultra low dielectric constant for nanoelectronics interconnect systems, Invited talk . FORNEL Workshop, Wuerzburg, 2006 Mar 15
Schulz,S.E.; Schulze,K.: Achieving ultra low k dielectric constant for nanoelectronics interconnect systems, Invited talk. 2006 8th International Conference on Solid-State and Integrated Circuit Technology, ICSICT-2006, Shanghai (China), 2006 Oct 23-26; pp 298-301(ISBNPrint version: 1-4244-0160-7; CD-ROM version: 1-4244-0161-5)
Schulze,K.; Schulz,S.E.; Gessner,T.: Impact of Dielectric Material and Metal Arrangement on Thermal Behaviour of Interconnect Systems (Talk). Advanced Metallization Conference (AMC), San Diego (USA), 2006 Oct 17-19
Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of air gap structures produced by wet etch of sacrificial dielectrics: Extraction of keff for different technology nodes and film permittivity. Materials for Advanced Metallization (MAM), Grenoble (France), 2006 Mar 4-6; Microelectronic Engineering, Volume 83, Issues 11-12 (2006) pp 2324-2328(ISSN0167-9317)
Schulze,K.; Schulz,S.E.; Rennau,M.; Gessner,T.: Formation of Air Gap structures via wet etch removal of sacrificial dielectrics. Advanced Metallization Conference 2005, Colorado Springs CO, U.S.A., 2005 Sept 27-29; MRS Conf. Proc. AMC XXI, Material Research Society, Warrendale PA (2006), pp 309-316(ISBN1-55899-865-9 / ISSN 1048-0854)
Schulze,K.; Schulz,S.E.; Rennau,M.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics (Talk). IEEE EDS Workshop on Advanced Electron Devices, Duisburg (Germany), 2006 June 13-14
Voigt,S.; Leidich,S.; Kurth,S.; Geßner,T.; Doetzel,W.: 24 GHz RF-MEMS Phase Shifter with Non-Galvanic Electromagnetic Coupling Fabricated in Silicon-Bulk Technology. ; Journal of Physics: Conference Series, 34 (2006) pp 228-234(ISSN1742-6588)
Waechtler,T.; Gruska,B.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry. Talk given at the 4th Workshop on Ellipsometry, Berlin (Germany), 2006 Feb 20-22(ISBN978-3-00-018751-3)
Waechtler,T.; Gruska,B.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Characterization of Sputtered Ta and TaN Films by Spectroscopic Ellipsometry. Talk given at the 8th International Conference on Solid-State and Integrated Circuit Technology, ICSICT-2006, Shanghai (China), 2006 Oct 23-26; Proceedings, pp 2184-2186(ISBNPrint version: 1-4244-0160-7; CD-ROM version: 1-4244-0161-5)
Waechtler,T.; Shen,Y.Z.; Jakob,A.; Ecke,R.; Schulz,S.E.; Wittenbecher,L.; Sterzel,H.-J.; Tiefensee,K.; Oswald,S.; Schulze,S.; Lang,H.; Hietschold,M.; Gessner,T.: Evaluation of Phosphite and Phosphane Stabilized Copper(I) Trifluoroacetates as Precursors for the Metal-Organic Chemical Vapor Deposition of Copper. Poster presented at the Materials for Advanced Metallization Conference - MAM 2006, Grenoble (France), 2006 Mar 6-8
Zimmermann,S.; Zhao,Q.T.; Hoehnemann,H.; Wiemer,M.; Kaufmann,C.; Mantl,S.; Dudek,V.; Gessner,T.: Different approaches to integrate patterned buried CoSi2 layers in SOI substrates. Materials for Advanced Metallization (MAM), Grenoble (France), 2006 March 4-6; Microelectronic Engineereing, Volume 83, Issues 11-12 (2006) pp 2112-2116(ISSN0167-9317)
2005
Baum,M.; Hientzsch,M.; Boese-Landgraf,J.; Otto,T.; Geßner,T.: Verschleißmonitoring bei Hüftgelenkendoprothesen durch integrierte Mikrosensorik. Mikrosystemtechnik Kongress 2005, 2005 Oct 10-12; Proceedings, pp 633-636(ISBN3-8007-2926-1)
Baum,M.; Nestler,J.; Rost,D.; Weissmantel,S.; Otto,T.; Reisse,G.; Geßner,T.: Improved Silicon Master Tools for Hot Embossing. Micro System Technologies 2005, Munich (Germany), 2005 Oct 5-6; Proceedings, pp 76-82(ISBN3-7723-7040-3)
Belsky,P.; Streiter,R.; Wolf,H.; Gessner,T.: Application of Molecular Dynamics to the Simulation of IPVD. Advanced Metallization Conference 2004, San Diego CA, U.S.A., 2004 Oct 19-21; MRS Conf. Proc. AMC XX, Material Research Society, Warrendale PA (2005), pp 787-792(ISBN1-55899-814-4 / ISSN 1048-0854)
Bertz,A.; Lohmann,C.; Reuter,D.; Geßner,T.: Efficient and Flexible High Aspect Ratio Micromachining for the Fabrication of low-g-Sensors (invited). Microcar 2005, Leipzig, June 22; Micromaterials and Nanomaterials, Volume of Abstracts, 04 2005 (2005) p 79(ISSN1619-2486)
Billep,D.; Hiller,K.; Frömel,J.; Tenholte,D.; Reuter,D.; Dötzel,W.; Geßner,T.: Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement . SPIE Symposium on Microtechnologies for the New Millennium 2005, Sevilla (Spain), 2005 May 09-11; Procceedings
Blaschta,F.; Schulz,S.E.; Gessner,T.: Impact of reducing resist stripping processes at elevated temperature on ULK and HM materials. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 427-433(ISSN0167-9317)
Blaschta,F.; Schulz,S.E.; Gessner,T.: H2-Strip Processes on Low-k Materials, Talk. European Congress on Advanced Materials and Processes EUROMAT, Prague, Czech Republic, 2005 Sep 5-8
Bonitz,J.; Ecke,R.; Schulz,S.E.; Gessner,T.: Different SiH4 Treatments of CVD TiN Barrier Layers . Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 618-622(ISSN0167-9317)
Ebest,G.; Mrwa,A.; Erler,K.; Rindelhardt,U.: Light trapping and optical losses in solar cells with RIE textured surfaces. 20th PVSEC, Barcelona (Spain), 2005 Jun 6-10
Ecke,R.; Schulz,S.E.; Hecker,M.; Engelmann,H.-J.; Gessner,T.: W(Si)N Diffusion Barriers for Cu Metallization deposited by PECVD. Advanced Metallization Conference 2004, San Diego CA, U.S.A., 2004 Oct 19-21; MRS Conf. Proc. AMC XX, Material Research Society, Warrendale PA (2005), pp 793-799(ISBN1-55899-814-4 / ISSN 1048-0854)
Forke,R.; Mehner,J.; Doetzel,W.; Geßner,T.: Mikromechanisches gekoppeltes Schwingsystem für frequenzselektive Vibrationsmessungen. 7. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2005 Oct 26-27; Proceedings, pp 143-148(ISBN3-00-016889-3)
Frömel,J.; Wiemer,M.; Bagdahn,J.: Mechanische Zuverlässigkeit der Verkapselung von MEMS. Microcar 2005, Leipzig, 22.06.2005
Frömel,J.; Wiemer,M.; Geßner,T.: Packaging of MEMS structures in SCREAM technology using anodic bonding. Micro System Technologies 2005, München , 2005 October 5-6; Proceedings , pp 99-104(ISBN3-7723-7040-3)
Frühauf,S.; Himcinschi,C.; Rennau,M.; Schulze,K.; Schulz,S.E.; Friedrich,M.; Gessner,T.; Zahn,D.R.T.; Le,Q.T.; Caluwaerts,R.: Scaling down thickness of ULK materials for 65nm node and below and its effect on electrical performance. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 405-410(ISSN0167-9317)
Geßner,T.; Frömel,J.; Jung,E.; Reichl,H.: MEMS and MOEMS Packaging. 2nd Mechatronics and Microsystems Symposium DCMM, Delft (Netherlands), 2005 September 7-8
Gessner,T.; Schulz,S.E.; Schulze,K.; Ecke,R.; Frühauf,S.; Streiter,R.: Challenges of Advanced Interconnect Systems: Cu diffusion barrier, porous low k dielectrics and thermal issues, Invited Talk. ICMAT 2005, Singapore, 2005 June
Hata,S.; Froemel,J.; Gessner,T.: The improvement of the bonding strength of low temperature anodic bonding. Japan Institute of Electronics Packaging: Packaging Workshop, Tokyo, 2005 Mar 16-18
Hiller,K.; Küchler,M.; Billep,D.; Schroeter,B.; Dienel,M.; Scheibner,D.; Gessner,T.: Bonding and Deep RIE - a powerful combination for high aspect ratio sensors and actuators. SPIE Photonics West, Conf. MF01 Microfabrication, Santa Clara, January 2005; Proceedings , pp paper MF01 5715-8
Jakob,A.; Schmidt,H.; Walfort,B.; Rheinwald,G.; Frühauf,S.; Schulz,S.; Geßner,T.; Lang,H.: Tri-n-Butyl-Phosphan-Silber(I)-Komplexe mit Carboxylat-, Troponolat- bzw. N-Hydroxyphthalimid-Teilstrukturen; Synthese und Verwendung als Spin-On-Precursoren. ; Zeitschrift für anorganische und allgemeine Chemie, 631 (6-7) (2005) pp 1079-1086(ISSN0044-2313)
Jia,Chenping; Nestler,J.; Otto,T.; Geßner,T.: FEM simulation and its application in MEMS design. 17. International Wissenschaftliche Konferenz Mittweida, Mittweida (Germany), Nov. 3-4; Proceedings(ISSN1437-7624)
Jia,Chenping; Wiemer,M.; Müller,R.; Otto,T.; Geßner,T.: Fabrication of embedded micro-channels by intended under-etching and trench filling. Micro System Technologies 2005, Munich (Germany), Oct. 5-6; Proceedings, pp 71-75(ISBN3-7723-7040-3)
Jia,Chenping; Wiemer,M.; Zichner,N.; Otto,T.; Geßner,T.: Fabrication and characterisation of a bulk micro-machined ultrasonic transducer. 2005 IEEE Ultrasonic Symposium, Rotterdam (Netherlands), Sep. 19-21; Proceedings
Koerner,H.; Bueyuektas,K.; Eisener,B.; Liebmann,R.; Schulz,S.E.; Seidel,U.; Gessner,T.: Impact of Ultra Low k dielectrics on RF-Performance of Inductors. Advanced Metallization Conference 2004, San Diego CA, U.S.A., 2004 Oct 19-21; MRS Conf. Proc. AMC XX, Material Research Society, Warrendale PA (2005), pp 143-149(ISBN1-55899-814-4 / ISSN 1048-0854)
Kolchuzhin,V.; Mehner,J.; Doetzel,W. : Geometrically Parameterized Finite Element Model of a Silicon Strain Gauge. 7. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2005 Oct 26-27 pp 190-195(ISBN3-00-016889-3)
Lohmann,C.; Bertz,A.; Reuter,D.; Küchler,M.; Geßner,T.: Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie. Mikrosystemtechnik Kongress, Freiburg, 2005 Oct 10-13 p 539–542(ISBN978–3–8007–2926–5)
Lohmann,C.; Bertz,A.; Reuter,D.; Küchler,M.; Geßner,T.: Validierung der AIM–Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen. 7. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2005 Oct 26-27(ISBN3-00-016889-3)
Martin,J.; Cichos,F.; von Borczyskowski,C.: Confocal microscopy of electrostatic properties of Si-quantum dots and silica surfaces by charge sensitive dye molecules. ; Opt. Spectr., 99 (2005) pp 281-288
Mehner, J. E.; Shaporin, A.; Kolchuzhin, V.; Doetzel, W.; Gessner, T.: Novel Modeling Techniques of MEMS Sensors and Actuators for Electronic and System Design in Automotive Applications. 2. Fachkongress Microcar 2005 Mikrowerkstoffe, Nanowerkstoffe fur den Automobilbau, Leipzig, 2005 Jun 22
Mehner,J.; Kolchuzhin,V.; Schaporin,A.; Doetzel,W.; Geßner,T.: Finite Element Based Reduced Order Modeling for Micro Electro Mechanical Systems (MEMS). Mikrosystemtechnik Kongress 2005, Freiburg, 2005 Oct. 10-13 pp 657-660(ISBN978-3-8007-2926-5)
Mehner,J.; Schaporin,A.; Kolchuzhin,V.; Doetzel,W.; Geßner,T.: Parametric Model Extraction for MEMS based on Variational Finite Element Techniques. Transducers05, Seoul (Korea), 2005 June 5-9; Tech. Digest, pp 776-780
Mehner,J.; Schaporin,A.; Kolchuzhin,V.; Doetzel,W.; Geßner,T.: Variational Finite Element Technologies for Parametric Model Extraction for MEMS. Micro System Technologies 2005, Munich (Germany), 2005 Oct. 5-6; Proceedings, pp 516-523(ISBN3-7723-7040-3)
Otto,T.; Saupe,R.; Stock,V.; Bruch,R.; Gruska,B.; Geßner,T.: A novel dual-detector micro spectrometer. SPIE Photonics West: MOEMS and Miniaturized Systems V, San Jose; Proceedings of SPIE , 5719 (2005) pp 76-82
Puschmann,R.; Schwarzer,N.; Richter,F.; Frühauf,S.; Schulz,S.E.: A usable concept for the indentation of thin porous films. ; Z. Metallkd., 96/11 (2005) pp 1272-1277(ISSN0044-3093)
Reuter,D.; Bertz,A.; Billep,D.; Scheibner,D.; Buschnakowski,S.; Doetzel,W.; Gessner,T.: In-Process Gap Reduction of Capacitive Transducers. Transducers05, Seoul (Korea), 2005 Jun 5-9; Tech. Digest, pp 1358-1361
Scheibner,D.; Mehner,J.; Reuter,D.; Gessner,T.; Doetzel,W.: A spectral vibration detection system based on tunable micromechanical resonators. ; Sensors and Actuators A, 123-124 (2005) pp 63-72
Schlegel,M.; Bennini,F.; Mehner,J.; Herrmann,G.; Mueller,D.; Dötzel,W.: Analyzing and Simulation of MEMS in VHDL-AMS Based on Reduced Order FE-Models. ; accepted for IEEE Sensors Journal(ISSN1530-437X)
Schmidt,H.; Jakob,A.; Haase,T.; Kohse-Hoeinghaus,K.; Schulz,S.E.; Wächtler,T.; Gessner,T.; Lang,H.: nBu3P-Silber(I)-β-Diketonate: Synthese, Gasphasenuntersuchungen und Verwendung als CVD-Precursoren. ; Zeitschrift für Anorganische und Allgemeine Chemie, 631 (13-14) (2005) pp 2786-2791(ISSN0044-2313)
Schneider,D.; Frühauf,S.; Schulz,S.E.; Gessner,T.: The current limits of the laser-acoustic test method to characterize low-k films. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 393-398.(ISSN0167-9317)
Schulze,K.; Schuldt,U.; Kahle,O.; Schulz,S.E.; Uhlig,M.; Uhlig,C.; Dreyer,C.; Bauer,M.; Gessner,T.: Novel low-k polycyanurates for integrated circuit (IC) metallization. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 356-361(ISSN0167-9317)
Schulze,K.; Schuldt,U.; Kahle,O.; Schulz,S.E.; Uhlig,M.; Uhlig,C.; Dreyer,C.; Bauer,M.; Gessner,T.: Polycyanurates – A Low-k Material Approach. European Congress on Advanced Materials and Processes EUROMAT, Prague, Czech Republic, 2005 Sep 05-08
Schulze,K.; Schulz,S.E.; Rennau,M.; Gessner,T.: Formation of Air Gap structures via wet etch removal of sacrificial dielectrics (Talk). Advanced Metallization Conference (AMC) 2005, Colorado Springs CO (USA), 2005 Sep 27-29
Shen,Y.; Jakob,A.; Djiele,P.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane- and Phosphite-Silver(I)-a-Hydroxy-Carboxylates and -Glycinates: Synthesis and their Use as CVD Precursors . ; J. Organomet. Chem.
Shen,Y.; Rueffer,T.; Schulz,S.E.; Gessner,T.; Wittenbecher,L.; Sterzel,H.-J.; Lang,H.: Me3SiC≡C-CMe=CH2 copper(I) β-diketonates: Synthesis, solid state structure, and low-temperature chemical vapour deposition. ; Journal of Organometallic Chemistry, 690 (17) (2005) pp 3878-3885(ISSN0022-328X)
Streiter,R.: Thermal issues of low-k, ULK and airgaps (Invited talk). Advanced Metallization Conference (AMC) 2005, Colorado Springs CO (USA), 2005 Sep 27-29
Voigt,S.; Leidich,S.; Kurth,S.; Geßner,T.; Doetzel,W.: Koplanare elektromagnetische Koppler zur Signalkontaktierung von RF-MEMS Bauelementen bei Mikrowellenfrequenzen. Mikrosystemtechnik Kongress, Freiburg, 2005 Oct 10-12; Proceedings, pp 397-400(ISBN978–3–8007–2926–5)
Wolf,H.; Streiter,R.; Rzehak,R.; Meyer,F.; Springer,G.: Empirical Modeling of Oxide CMP at Chip Scale. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 686-694(ISSN0167-9317)
Zeun,H.; Heinz,S.; Ebest,G.: Nonlinear Behaviour of High-ohmic Polysilicon Resistors in Integrated Circuits. Conference Applied Electronics, Pilsen (Tschechien), 2005 Sep 7-8; Proceedings, pp 361-364(ISBN80-7043-369-8)
Zimmermann,S.; Zhao,Q.T.; Trui,B.; Wiemer,M.; Kaufmann,C.; Mantl,S.; Dudek,V.; Gessner,T.: Fabrication and characterization of buried silide layers on SOI substrates for BICMOS-applications. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 454-459(ISSN0167-9317)
2004
Amro,R.; Lutz,J.; Lindemann,A.: Evaluation of a DCB based Transfer Molded Component for Application with High Temperature Swings. PCIM Europe 2004, Nuremberg (Germany)
Amro,R.; Lutz,J.; Lindemann,A.: Power Cycling with High Temperature Swing of Discrete Components based on Different Technologies. 35th IEEE Power Electronics Specialists Conference, Aachen; Proceedings, pp 2593 - 2598
Baum,M.: Optical devices and biomedical application. A*Star IZM Workshop, Singapore, 2004 Nov 8
Belsky,P.; Streiter,R.; Wolf,H.; Geßner,T.: Application of Molecular Dynamics to the Simulation of IPVD. AMC, San Diego (USA), 2004 Oct 19-21
Blaschta,F.; Schulze,K.; Schulz,S.; Geßner,T.: SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes. ; Microelectronic Eng., 76 (2004) pp 8-15
Bonitz,J.; Schulz,S.E.; Geßner,T.: Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials. ; Microelectronic Engineering, 76 (2004) pp 82-88
Cichos,F.; Martin,J.; von Borczyskowski,C.: Emission intermittency in silicon nanocrystals. ; Phys. Rev. B, 70 (2004) p 115314
Cichos,F.; Martin,J.; von Borczyskowski,C.: Characterizing the Non-stationary Blinking of Silicon Nanocrystals. ; J. Lumin., 107(1-4) (2004) pp 160-165
Diefenbach,K.-H.; Erler,K.; Mrwa,A.; Denissov,S.; Ebest,G.; Rindelhardt,U.: Emitter Formation at RIE textured Surfaces. PVSEC, Paris, 2004 June 7-11
Ecke,R.; Schulz,S.E.; Hecker,M.; Engelmann,H.-J.; Geßner,T.: W(Si)N Diffusion Barriers for Cu Metallization deposited by PECVD. Advanced Metallization Conference AMC 2004, San Diego, USA, 2004 Oct 19-21
Frömel,J.; Billep,D.; Wiemer,M.: Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. Workshop on Wafer Bonding for MEMS Technologies, Halle, 11,12 Oktober 2004
Frühauf,J.: Ätzmasken- Entwurf und Simulation des kristallorientierungsabhängigen Silizium- Ätzens. ; Tagungsband 10. GMM- Workshop Methoden und Werkzeuge zum Entwurf von Mikrosystemen, pp 19-23
Frühauf,J.; Gärtner,E.; Brand,U.; Döring,L.: Silicon springs for the calibration of the force of hardness testing instruments and tactile profilometers. ; Proceedings of the EUSPEN, p 362
Frühauf,J.; Krönert,S.: Linear Silicon Gratings with Different Profiles: Trapezodial, Triangular, Rectangular, Arched. Proc.. International Colloquium on Surfaces, Chemnitz (Germany), 2004 February 2-3
Frühauf,J.; Krönert,S.; Brand,U.; Krüger-Sehm,R.: Reachable precision of silicon dimensional standards. ; Proceedings of the EUSPEN , p 217
Frühauf,S.; Schulz,S.E.; Geßner,T.: Integrationspotential mesoporöser SiO2-Schichten als ultra-low-k Dielektrikum. ; Vakuum in Forschung und Praxis, 16 (2004) pp 194-198(ISSN0947-076X)
Geiger,W.; Breng,U.; Deppe-Reibold,O.; Fuchs,W.; Gutmann,W.; Hafen,M.; Handrich,E.; Huber,M.; Kunz,J.; Leinfelder,P.; Newzella,A.; Ohmberger,R.; Ruf,M.; Schröder,W.; Spahlinger,G.; Rasch,A.; Hiller,K.; Billep,D.: Test Results of the Micromechanical Coriolis Rate Sensor µCORS II. DGON 2004 Symposium Gyro Technology, Stuttgart
Geßner,T.: Microelectronics and MEMS: Overview about FhG-IZM and the Fraunhofer Organization. Fraunhofer (IZM) - SERC a-star MEMS Workshop, IME Singapore, 2004 Nov 8
Geßner,T.: Advanced Silicon Micromachining Technologies. MEMS Workshop, Industrial Technology Research Institute ITRI, Taiwan, 2004 Mar 1
Geßner,T.: MEMS Metallization. Invited Talk, MRS Spring Meeting 2004, San Francisco (USA), 2004 Apr 12-16
Geßner,T.: Microsystems Technologies. Leipziger Messe Z 2004, Leipzig
Geßner,T.: Copper Metallization systems and low k dielectrics. Joint Workshop on Materials for Advanced Interconnects, Fudan University Shanghai (China), 2004 Jul 13-14
Geßner,T.: Mikroelektronik- und Mikrosystemtechnik-Forschung am Zentrum für Mikrotechnologien der Technischen Universitaet Chemnitz in Kooperation mit dem Fraunhofer IZM. Kolloquium am ZMN Ilmenau, Ilmenau (Germany), 2004 Jul 30
Geßner,T.: Microelectronics and MEMS: Challenges for the Technology Transfer into the Industry within the Fraunhofer Organization. MINAPIM, Manaus, Amazonas (Brazil), 2004 Sep 15-18
Geßner,T.: Technology Approaches for Inertial Sensors. Invited Talk, ISINTIT 2004, Nanjing (China), 2004 Oct 15-16
Geßner,T.: Mikrosysteme im Automobil. Chemnitzer Automobiltagung, TU Chemnitz, Chemnitz (Germany), 21 Oct 2004
Geßner,T.: The Scientific System in Germany – Universities, Max-Planck-Institutes, Fraunhofer Organization, Leibniz-Foundation and Helmholtz-Foundation. Workshop at Chongqing University, Chongqing (China), 2004 Oct 12
Geßner,T.: Systems Integration – A Challenge for Micro- and Nanotechnologies. Kolloquium caesarianum, Stiftung caesar, Bonn (Germany), 2004 Oct 26
Geßner,T.: Challenges and trends for advanced interconnect systems – contribution and experiences of TU Chemnitz / ZfM and FhG-IZM Chemnitz. AMD-Silicon Saxony, Dresden (Germany), 2004 Nov 3
Geßner,T.; Bertz,A.; Lohmann,C.; Wiemer,M.; Kurth,S.; Hiller,K.: Advanced Silicon Micromachining. Suss MEMS Seminar, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Shanghai (China), 2004 Nov 12
Geßner,T.; Hiller,K.; Bertz,A.: MEMS for automotive applications. Nanofair 2004, 2004; VDI-Berichte 1839, pp 77-82
Geßner,T.; Hiller,K.; Hübler,A.; Kurth,S.: Micro Scanners for Spectrum Analysis Systems. Invited Talk, Actuator 2004, Bremen (Germany), 14 Jun 2004
Geßner,T.; Schulz,S.E.: Selected Challenges for Advanced Interconnect Systems. Invited Talk, E-MRS 2004, Strasbourg (France), 2004 May 24-28
Hammer,K.; Heinz,S.; Zeun,H.; Ebest,G.: Using of High-end Design Tools in Education. Proceedings Conference Applied Electronics 2004, Pilsen (Tschechien), 2004 Sep 8-9 pp 64-67(ISBN80-7043-274-8)
Hanf,M.,Dötzel,W.: Characterization of charges in MEMS devices. Actuator 2004, Bremen (Germany); Proceedings, pp 498-501
Hanf,M.; Dötzel,W.: Micromechanical electrostatic field sensor for the detection of surface charges. EUROSENSORS XVII, Guimaraes (Portugal), 2004; Sensors and Actuators, 115, 2-3 (2004) pp 280-285(ISSN0924-4247)
Hanf,M.; Kurth,S.; Billep,D.; Hahn,R.; Faust,W.; Heinz,S.; Dötzel,W.; Geßner,T.: A Dynamically Driven Micro Mirror Array as Light Modulator in a Hadamard Transform Spectrometer (HTS). Eurosensors XVIII, Roma (Italy), 2004 Sep
Hanf,M.; Markert,J.; Dötzel,W.: Measurement and evaluation of surface of micro mechanical mirror structures. XI. Internationales Colloquium on Surfaces, Chemnitz (Germany), 2004 Feb 2-3
Herrmann,G.; Dost,G.: Entwurf und Technologie von Mikroprozessoren .
Herrmann,G.; Müller,D.: ASIC – Entwurf und Test.
Himcinschi,C.; Friedrich,M.; Frühauf,S.; Schulz,S.E.; Geßner,T.; Zahn,D.R.T.: Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy. ; Thin Solid Films, 455-456 (2004) pp 433-437
Jerinic,V.; Müller,D.: Safe integration of parameterized IP . ; Integration, the VLSI journal, 37 (2004) pp 193-221
Jia,Ch.; Wiemer,M.; Geßner,T.: Low temperature direct bonding with on wafer metal interconnections. workshop on wafer bonding for MEMS technologies, Halle (Germany), 2004 October 10-12
Knechtel,R.; Frömel,J.; Wiemer,M.: Wafer level Incapsulation of microsystems using glass frit bonding. Workshop on Waferbonding for MEMS Technologies, Halle, 10-12 Oktober 2004
Knechtel,R.; Wiemer,M.; Knaup,M.; Bagdahn,J.: An non-destructive test structure for bond strength evaluation in silicon-glass bonds. workshop on wafer bonding for MEMS technologies, Halle (Germany), 2004 October 10-12
Körner,H.; Bueyuektas,K.; Eisener,B.; Liebmann,R.; Schulz,S.E.; Seidel,U.; Geßner,T.: Impact of Ultra Low k dielectrics on RF-Performance of Inductors. Advanced Metallization Conference AMC 2004, San Diego, USA, 2004 Oct 19-21
Kretzschmar,C.; Bitterlich,T.; Müller,D.: A High-Level DSM Bus Model for Accurate Exploration of Transmission Behaviour and Power Estimation of Global System Buses. Integrated Circuit and System Design, Power and Timing Modeling, Optimization and Simulation, 14th International Workshop, PATMOS, , Santorini (Greece), 2004 Sep 15-17
Kretzschmar,C.; Nieuwland,A.K.; Müller,D.: Why Transition Coding for Power Minimization of on-Chip Buses does not work. Design Automation and Test in Europe (DATE), Paris (France), 2004 Feb 16-20
Kretzschmar,C.; Scheithauer,M.; Müller,D.: Adaptive Bus Encoding Schemes for Power-efficient Data Transfer in DSM Environments. IFIP Working Conference on Distributed and Parallel Embedded Systems (DIPES), Toulouse (France), 2004 Aug 23-26
Kretzschmar,C.; Siegmund,R.; Müller,D.: Adaptive Bus Line Grouping for Power Efficient Data Transfer over Wide System Buses. GI/ITG/GMM Workshop: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, Kaiserslautern (Germany), 2004 Feb 23-25
Krüger-Sehm,R.; Hässler-Grohne,W.; Frühauf,J.: Traceable calibration standard for the lateral axis of contact stylus instruments. ; Wear, 257 Nr. 12 (2004) pp 1241-1245
Kurth,S.: Meßtechnische Parameterbestimmung an MEMS-Baulementen. Materialsweek 2004, Munich (Germany), 2004 Sep 21-23
Kurth,S.: Test, Charakterisierung und Zuverlässigkeit mikromechanischer Komponenten. MEMUNITY Workshop, Waldbronn (Germany), 2004 Mar
Leidich,S.; Voigt,S; Kurth,S; Rawat,B.; Geßner,T.: Microwave Phase Shifter in Bulk Micro Mechanic Technology. International Conference of Applied Electronics, Plzen (Czech Republic), 2004
Lohmann,C.; Gottfried,K.; Bertz,A.; Reuter,D.; Hiller,K.; Kuhn,M.; Geßner,T.: MEMS Metallization. ; Materials, Technology and Reliabilitity for Advanced Interconnects and Low-k Dielectrics – 2004 (Eds. R.J Carter, C.S. Hau-Riege, G.M. Kloster, T.-M. Lu, S.E. Schulz), MRS Symp. Proc. 812 (2004) pp 233-242(ISBN1-55899-762-8)
Markert,E.; Schlegel,M.; Herrmann,G.; Müller,D.: Beschreibung von mechatronischen Systemen mit SystemC-AMS. 10. GMM-Workshop "Methoden und Werkzeuge für den Entwurf von Mikrosystemen", Cottbus (Germany), 2004 Oct 20-22; Proceedings, p 59ff
Martin,J.; Cichos,F.; Chan,I.Y.; Huisken,F.; von Borczyskowski,C.: Photoinduced Processes in Silicon Nanoparticles. ; Israel Journal of Chemistry, 44 (4) (2004) pp 341-351
Martin,J.; Cichos,F.; von Borczyskowski,C.: Spectroscopy of Single Silicon Nanoparticles. ; J. Lumin., 108 (2004) pp 347-350
Mehner,J.: MEMS design, simulation and modelling. A*Star IZM Workshop, Singapore, 2004 Nov 8
Mehner,J.; Dötzel,W.; Geßner,T.: Advanced Technologies for Microsystems Design. ; Anniversary book for Prof. Dr. H. Reichl´s 60th birthday, ed. B.Michel & R.Aschenbrenner, 2004, pp 241-245
Müller,A.-D.; Müller,F.; Mehner,J.; Geßner,T.; Hietschold,M.: Sensor-actuator arrays for dynamic Atomic Force Microscopy and their application in temporary MESFET devices. Actuator 2004, Bremen (Germany), 2004
Müller,F.; Long,T.D.; Müller,A.-D.; Geßner,T.; Hietschold,M.: Resonance shifts in capacitively controlled actuator arrays. Actuators 2004, Bremen (Germany), 2004
Nestler,J.; Baum,M.; Otto,T.; Geßner,T.: Potentials for Microsystems in Biotechnology and Healthcare. 6th International Scientific Conference SATERRA, Mittweida (Germany), 2004 Nov 11-13; Scientific Reports of the Hochschule Mittweida, 6'2004 (2004) pp 1-4(ISSN1437-7624)
Otto,T.; Nestler,J.; Baum,M.; Gessner,T.: Mikrofluidische Vorrichtung für die optische Analyse. ; Patentschrift (DE 102004015906B4)
Otto,T.; Saupe,R.; Kaufmann,C.; Geßner,T.: Infrared Micro Mirror Spektrometer for Gas Analysis. Actuator 2004, 9th International Conference on New Actuators, Bremen (Germany), 2004 June 14-16; Proceedings, pp 254-257
Otto,T.; Saupe,R.; Stock,V.; Fritzsch,U.; Bruch,R.; Geßner,T.: Packaging and Characterization of Miniaturized Spectral Sensing Devices. SPIE Photonics West: MOEMS and Miniaturized Systems IV, San Jose (USA), 2004 Jan 27-28; Proc. of SPIE, 5346 (2004) pp 134-140
Puschmann,R.; Schwarzer,N.; Frühauf,S.; Richter,F.; Schulz,S.E.; Geßner,T.: Neues Konzept für den Eindruckversuch an porösen Schichten. DPG Frühjahrstagung 2004, 2004 Mar
Puschmann,R.; Schwarzer,N.; Richter,F.; Frühauf,S.; Schulz,S.E.: A usable concept for the indentation of thin porous films. NanoMech Workshop, Hückelhoven, 2004 Sep
Reuter,D.; Bertz,A.; Schwenzer,G.; Geßner,T.: Selective adhesive bonding with SU-8 for zero-level-packaging. SPIE Int. Symposium Smart Materials, Nano- and Micro-Smart Systems, Sidney (Australia), 2004 Dec 12-15
Saupe,R.; Otto,T.; Mehner,J.; Kurth,S.; Kaufmann,C.; Geßner,T.: Electrostatic Driven Scanning Micro Mirrors Applied in Spectral Sensing Devices. ; VDI/VDE/IT mstnews, 03/2004 (2004) pp 40-42
Scheibner,D.; Mehner,J.; Reuter,D.; Kotarsky,U.; Geßner,T.; Dötzel,W.: Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements. ; Sensors and Actuators A, 111 (2004) pp 93-99
Schlegel,M.; Bennini,F.; Mehner,J.; Herrmann,G.; Müller,D.; Dötzel,W.: Analyzing and Simulation of MEMS in VHDL-AMS Based on Reduced Order FE-Models. ; IEEE Sensores Journal
Schlegel,M.; Herrmann,G.; Müller,D.: Eine neue Hardware-Komponente zur Fuzzy-Pattern- Klassifikation . Dresdener Arbeitstagung Schaltungs- und Systementwurf DASS'04, Dresden (Germany), 2004 Apr 19-20; Proceedings, pp 21-26
Schlegel,M.; Herrmann,G.; Müller,D.: Erweiterte Kostenmodellierung mit VHDL/VHDL- AMS. GI/ITG/GMM-Workshop:Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, 2004 Feb 24-25; Berichte aus der Informatik (Shaker Verlag, Aachen), pp 147-155
Schröter,B.; Mehner,J.; Hiller,K.; Geßner,T.; Dötzel,W.: A Novel Microactuator Based on the Working Principle of a Step-by-Step Switchgear. Actuator 04 , Bremen (Germany); Proceedings, pp 242-245
Schulz,S.E.: CVD Thin Films for Barrier, Hard Mask, Etch and CMP Stop Application, Short Course Lecture. Advanced Metallization Conference AMC 2004, San Diego (USA), 2004 Oct 18
Schulz,S.E.; Blaschta,F.; Eisener,B.; Frühauf,S.; Schulze,K.; Seidel,U.; Körner,H.; Geßner,T.: SiO2 Aerogel ULK Integration into Copper Damascene Interconnects for RF Devices. ; Advanced Metallization Conference (AMC 2003), Conf. Proc. AMC XIX, MRS Warrendale PA (2004) pp 97-105(ISBN1-55899-757-1)
Schulz,S.E.; Ecke,R.: Advanced CVD Technology for Diffusion Barrier and Cu Deposition, Invited talk. 3rd International Semiconductor Technology Conference (ISTC 2004), Shanghai, China, 2004 Sep 15-17
Schulze,K.; Schulz,S.E.; Fruehauf,S.; Koerner,H.; Seidel,U.; Schneider,D.; Gessner,T.: Improvement of mechanical integrity of ultra low-k dielectric stack and CMP compatibility. Materials for Advanced Metallization (MAM), Brussels (Belgium), 2004 Mar 7-10; Microelectronic Eng., 76 (2004) pp 38-45
Schulze,K.; Schulz,S.E.; Frühauf,S.; Geßner,T.: Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility. ; Microelectronic Engineering, 76 (2004) pp 38-45
Shaporin,A.; Kolchuzhin,V.; Mehner,J.; Dötzel,W.: Parametric Variational Finite Element Method for MEMS Electrostatic Problems. 10. GMM Cottbus, Cottbus (Germany); Proceedings, pp 39-46(ISSN0947-1413)
Shen,Y.Z.; Leschke,M.; Schulz,S.E.; Ecke,R.; Geßner,T.; Lang,H.: Synthesis of tri-n-butylphosphine copper(I) beta-diketonates and their use in chemical vapour deposition of copper. ; CHINESE JOURNAL OF INORGANIC CHEMISTRY, 20 (11) (2004) pp 1257-1264(ISSN1001-4861)
Siemieniec,R.; Niedernostheide,F.-J.; Schulze,H.-J.; Suedkamp,W.; Kellner-Werdehausen,U.; Lutz,J.: Irradiation induced deep levels in Silicon. Electrochemical Society, Honolulu, Hawaii (USA), 2004 Oct; Proceedings, 05 (2004) pp 369-384
Wiemer,M.: Wafer bonding and MEMS packaging technologies. A*Star IZM Workshop, Singapore, 2004 Nov 8
Wiemer,M.; Frömel,J.; Jia,Ch.; Geßner,T.: Bonding, contacting and sealing of MEMS structures on wafer level. ; Sensors and Materials
Zeun,H.; Uhle,J.; Heinz,S.; Ebest,G.: Hochohmige Polysilizium-Widerstände in integrierten Hochvolt-Schaltungen. 10. GMM-Workshop "Methoden und Werkzeuge zum Entwurf von Mikrosystemen", Cottbus, 2004 Okt 20-22 pp 227-230(ISSN0947-1413)
Zimmermann,S.; Ecke,R.; Rennau,M.; Schulz,S.E.; Hecker,M.; Voss,A.; Engelmann,H.-J.; Mattern,N.; Zschech,E.; Geßner,T.: Characterisation of a PECVD WNx Barrier Layer Against Copper Diffusion. ; Advanced Metallization Conference (AMC 2003), Conf. Proc. AMC XIX, MRS Warrendale PA (2004) pp 397-402(ISBN1-55899-757-1)
2003
Bagdahn,J.; Knoll,H.; Petzold,M.; Wiemer,M.; Frömel,J.: Debonding of directly wafer-bonded silicon after high temperature process steps. The Electrochemical Society - 203rd meeting, Paris (France), 2003 Apr 27 - May 2
Bennini,F.; Mehner,J.; Dötzel,W.: System Level Simulations of MEMS Based on Reduced Order Finite Element Models. ; International Journal of Computational Engineering Science, Vol. 2, Nr. 2 (2003) pp 385-388
Bonitz,J.; Schulz,S.E.; Geßner,T.: CVD TiN layers as diffusion barrier films on porous SiO2 aerogel. ; Microelectronic Eng., 70 (2003) pp 330-336
Buschnakowski,S.; Bertz,A.; Bräuer,W.; Heinz,S.; Schuberth,R.; Ebest,G.; Geßner,T.: Development and Characterization of a High Aspect Ratio Vertical FET Sensor for Motion Detection. The 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 03, Boston (USA), 2003 Jun 8-12
Buschnakowski,S.; Heinz,S.; Zeun,H.; Korndörfer,F.; Ebest,G.: Integrierter Zweiphasen-Lock-In-Verstärker zur kapazitiven Signaldetektion mikromechanischer Vibrationssensoren. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Oct 1-2; Proc., pp 343-348(ISBN3-85133-030-7)
Delan,A.; Rennau,M.; Schulz,S.E.; Geßner,T.: Thermal Conductivity of ultra low-k dielectrics. MAM, La Londe Les Maures (France), 2003 Mar 9-12; Microelectronic Eng., 70 (2003) pp 280-284
Döring,L.; Brand,U.; Peiner,E.; Frühauf,J.; Gärtner,E.: Development of micro force setting standards for stylus instruments. ; Proceedings of the EUSPEN, Aachen, p 407
Ecke,R.; Hecker,M.; Schulz,S.E.; Engelmann,H.-J.; Geßner,T.; Mattern,N.; Zschech,E.: Properties of as-deposited and annealed PECVD Tungsten Nitride films. European Congress on Advanced Materials and Processes EUROMAT 2003, Lusanne (Switzerland), 2003 Sept. 1-5
Ecke,R.; Schulz,S.E.; Geßner,T.; Riedel,S.; Lipp,E.; Eizenberg,M.: Deposition and treatment of titanium based barrier layers by MOCVD. ; Proc. Chemical Vapor Deposition XVI and EUROCVD 14, 2003-08 (2003) pp 1224-1230
Ecke,R.; Schulz,S.E.; Hecker,M.; Mattern,N.; Geßner,T.: Influence of SiH4 on the WNx-PECVD process. MAM, La Londe Les Maures (France), 2003 Mar 9-12; Microelectronic Eng., 70 (2003) pp 346-351
Emelianov,V.; Ganesan,G.; Puzic,A.; Schulz,S.E.; Eizenberg,M.; Habermeier,H.U.; Stoll,H.: Investigation of Electromigration in Copper Interconnects by Noise Measurements. SPIE Fluctuations and Noise, Santa Fe, New Mexico (USA), 2003 Jun 1?4; Proceedings SPIE, 5112 (2003) pp 271-281
Flaspöhler,M.; Buschnakowski,S.; Kuhn,M.; Kaufmann,C.; Frühauf,J.; Geßner,T.; Ebest,G.; Hübler,A.: Multispectral Image Capturing System Based on a Micro Mirror Device with a Diffraction Grating. PICS Conference - The Digital Photography Conference, Rochester, NY (USA); Proceedings , 6 (2003) pp 183-187(ISBN0-89208-245-3)
Frühauf,J.:: Silicon as a suitable material in precision engineering. ; Proceedings of the EUSPEN , p 39
Frühauf,J.; Krönert,S.; Krüger-Sehm,R.: Precision of etched bulk silicon structures with dimensions up to the mm-range. ; Proceedings of the EUSPEN, p 2
Frühauf,S.; Streiter,I.; Puschmann,R.; Schulz,S.E.; Himcinschi,C.; Flannery,C.M.; Geßner,T.; Zahn,D.R.T.: Modified silica aerogel as a low-k dielectric with improved mechanical properties. ULSI XVIII, 2003; Proceedings, pp 507-512
Frühauf,S.; Streiter,I.; Rennau,M.; Puschmann,R.; Schulz,S.E.; Geßner,T.; Chudoba,T.; Richter,F.,Flannery,C.; Matusche,J.; Schmidt.U.: Electrical and Mechanical characterization of porous silicon dioxide as an ultra low k dielectric. Proceedings of Materialsweek, Munich (Germany), 2003 Sept. 30th- Oct. 2nd
Gärtner,E.; Frühauf,J.; Jänsch,E.; Reuter,D.: Flexural solid hinges etched from silicon. ; EUSPEN, p 43
Gärtner,E.; Frühauf,J.; Krönert,S.; Jänsch,E.: Festkörpergelenkführungen aus Si mit bis zu 5 mm Hub. 6. Chemnitzer Fachtagung Mikromechanik und Mikroelektronik 2003; Proceedings , p 118
Geiger,W.; Breng,U.; Leinfelder,P.; Gutmann,W.; Ohmberger,R.; Kunz,J.; Ruf,M.; Huber,M.; Ryrko,B.; Hafen,M.; Spahlinger,G.; Schröder,W.; Handrich,E.; Hiller,K.; Billep,D.: The micromechanical Coriolis Rate Sensor µCORS II. Symposium Gyro Technology, Stuttgart (Germany), 2003
Geßner,T.: Microelectronics and Microsystems Research within the Center for Microtechnologies and the Fraunhofer IZM Branchlab Chemnitz. 6. Deutsch- Vietnamisches Seminar Chemnitz, 2003 May 25-30
Geßner,T.: Micro- and Nanotechnologies – Challenges for Microelectronics and MEMS. Portland Area Semiconductor Seminar Series, University of Portland, Oregon, USA,, 2003 October
Geßner,T.: Selected Challenges of Advanced Interconnect Systems. University of Albany- SUNY, Albany, New York (USA), 2003 October
Geßner,T.: MEMS and Microsystems Technologies. Summer School on Precision Assembly, Eindhoven (Netherlands), 2003 July
Geßner,T.: Werkstoff- und Technologieaspekte der Silizium-Mikromechanik für Anwendungen in der Automobilindustrie. Fachkongress MicroCar 2003, Leipzig, 2003 June 26
Geßner,T.: MEMS devices fabricated by using advanced Si-micromachining. Joint Workshop FhG-IZM/ The University of Tokyo, Tokyo (Japan), 2003 February 20
Geßner,T.: Microsystems Technologies.
Geßner,T.; Bertz,A.; Lohmann,C.; Kurth,S.; Hiller,K.: Advanced Silicon Micromachining. ; International Journal of Computational Engineering Science, 4, Nr.2 (2003) pp 151-156
Gottfried,K.; Kaufmann,C.; Hoffmann,R.; Wiemer,M.; Geßner,T.: Temperaturstabile Metallisierungs – und Anschlusssysteme für Sensoranwendungen im Kraftfahrzeug. Fachkongreß MicroCar 2003, Leipzig (Germany), 2003 June 26
Hanf,M.; Dötzel,W.: Micromechanical electrostatic field sensor for the detection of surface charges. Proc. of the EUROSENSORS XVII, Guimaraes (Portugal) , 2003; Proceedings, pp 374-375
Hanf,M.; Kurth,S.; Billep,D.; Hahn,R.; Faust,W.; Heinz,S.; Dötzel,W.; Geßner,T.: Application of micro mirror arrays for Hadamard transform optics. 9th Int. Symp. on Microwave and Optical Technology (ISMOT2003),, Ostrava (Czech Republic), 2003
Hecker,M.; Hübner,R.; Mattern,N.; Voss,A.; Acker,J.; Ecke,R.; Schulz,S.E.; Geßner,T.; Wenzel,C.; Bartha,J.; Engelmann,H.-J.; Zschech,E.: Effect of thermal stressing on the microstructure of tungsten and tantalum based diffusion barrier layers. European Congress on Advanced Materials and Processes EUROMAT 2003, Lausanne (Switzerland), 2003 Sept. 1-5
Heinz,S.; Buschnakowski,S.; Bertz,A.; Bräuer,W.; Korndörfer,F.; Schuberth,R.; Zeun,H.; Ebest,G.; Geßner,T.: Vertikaler Feldeffekttransistor mit beweglicher Gate-Vertikaler Feldeffekttransistor mit beweglicher Gate-Elektrode für die Bewegungsdetektion. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Okt 1-2 pp 487-492(ISBN3-85133-030-7)
Heinz,S.; Buschnakowski,S.; Bertz,A.; Bräuer,W.; Schuberth,R.; Ebest,G.; Geßner,T.: Vertikaler Feldeffekttransistor mit beweglicher Gate-Elektrode für die Bewegungsdetektion. 6. Chemnitzer Fachtagung Mikromechanik und Mikroelektronik, Chemnitz (Germany), 2003 Oct. 29-30
Heinz,S.; Buschnakowski,S.; Bertz,A.; Bräuer,W.; Schuberth,R.; Ebest,G.; Geßner,T.: A High Aspect Ratio Vertical FET Sensor for Motion Detection. MICRO SYSTEM Technologies 2003, Posterpräsentation, Munich (Germany), 2003 Oct. 7-8
Heinz,S.; Buschnakowski,S.; Korndörfer,F.; Zeun,H.; Hiller,K.; Hahn,R.; Ebest,G.: Integrierter 48-kanaliger Hochvolt-Schalter zur Ansteuerung mikromechanischer Schwenkspiegel. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Okt 1-2 pp 493-498(ISBN3-85133-030-7)
Hiller,K.; Hahn,R.; Kaufmann,C.; Hanf,M.; Heinz,S.; Geßner,T.; Dötzel,W.; Ebest,G.: Technologieentwicklung für ein Mikrospiegelarray mit integrierter Elektronik. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct. 29.30; Proceedings, pp 54-59
Hiller,K.; Kurth,S.; Neumann,N.; Hahn,R.; Kaufmann,C.; Hanf,M.; Heinz,S.; Geßner,T.; Dötzel,W.; Ebest,G.: Application of low temperature direct bonding in optical devices and integrated systems. Proceedings of MICRO SYTEM Technologies 2003; Proceedings , pp 102-109
Himcinschi,C.; Friedrich,M.; Frühauf,S.; Schulz,S.E.; Geßner,T.; Zahn,D.R.T.: Contributions to static dielectric constants of low-k xerogels films derived from VASE and IR spectroscopies. International Conference on Spectroscopic Ellipsometry, Vienna (Austria), 2003 July 6 - 11
Huisken,F.; Amans,D.; Ledoux,G.; Hofmeister,H.; Cichos,F.; Martin,J.: Nanostructuration with visible-light-emitting silicon nanocrystals. ; New Journal of Physics, 5 (2003) pp 10.1-10.10
Koenig,D.; Zahn,D.R.T.; Ebest,G.: Field Effect of Fixed Negative Charges on Oxidized Silicon Induced by AlF3 Layers with Fluorine Deficiency. 9th International Conference on the Formation of Semiconductor Interfaces (ICFSI-9), Madrid (Spain), 2003 September 15-19
Koenig,D.; Zahn,D.R.T.; Reich,R,; Gottfried,K.; Ebest,G.: P inversion layer solar cells as test for the I-S structure: results and prospects. 3rd World Conference on PV Solar Energy Conversion, Osaka (Japan), 2003 may 11-18
Korndörfer,F.; Kuschel,B.; Heinz,S.; Zeun,H.; Buschnakowski,S.; Ebest,G.: Charakteristierung von Bauelementen unter dem Aspekt der Selbsterwärmung. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Okt 1-2 pp 419-424(ISBN3-85133-030-7)
Kotarsky,U.; Manthey,W.; Dietzsch,M.; Bertz,A.: „Hochauflösender mikromechanischer Sensor zur Erfassung von Oberflächenprofilen mit großem Eigenzustellbereich. 6.Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct 29-30
Krüger-Sehm,R.; Hässler-Grohne,W.; Frühauf,J.: Traceable calibration standard for the lateral axis of contact stylus instruments. Conference on Metrology and Properties of Engineering Surfaces, Halmstad, 2003 Sept
Küchler,M.; Otto,T.; Geßner,T.; Ebling,F.; Schröder,H.: Hot embossing for MEMS using silicon Tools. ICMAT 2003, Singapore, 2003; International Journal of Computational Engineering Science, 4 No.3 (2003) pp 609-612
Kuhn,M.; Flaspöhler,M.; Krönert,S.; Kaufmann,C.; Geßner,T.; Hübler,A.; Frühauf,J.: Herstellung und Charakterisierung von mikromechanischen Scannern mit intergrierten Beugungsgittern. 6. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, 2003, Chemnitz (Germany), 2003
Kuhn,M.; Flaspöhler,M.; Krönert,S.; Kaufmann,C.; Geßner,T.; Hübler,A.; Frühauf,J.: Microactuators with Diffraction Grating. Micro Systems Technologies 2003, Postersession, Munich (Germany), 2003 Oct 7-8
Kurth,S.: Zuverlässigkeit und Test von MOEMS Komponenten. Workshop „MEMS / Sensors - from Component Manufactoring to Packaged Functional Components", FhG IZM Branchlab Chemnitz, 2003 Sept 16
Kurth,S.,; Hiller,K.; Dötzel,W.; Geßner,T.; Neumann,N.; Heinze,M.: Tunable infrared filter based on Fabry-Perot-Interferometer. Proc. of Micro System Technologies 2003, Munich (Germany), 2003 Oct 7-8
Kurth,S.,; Hiller,K.; Neumann,N.; Heinze,M.; Dötzel,W.; Geßner,T.: An electrically tunable infrared filter on base of Fabry-Perot-Interferometer. 9th International Symposium on Microwave and Optical Technology, ISMOT, Ostrava (Czech Republic), 2003 August 11-15
Kurth,S.,; Hiller,K.; Neumann,N.; Heinze,M.; Dötzel,W.; Geßner,T.: A tunable Fabry-Perot-Interferometer for 3 – 4.5 µm wavelength with bulk micromachined reflector carrier. SPIE Conference Photonics West, 2003 January; Proceedings, 4983 (2003) pp 215-226
Lang,H.; Leschke,M.; Melter,M.; Walfort,B.; Koehler,K.; Schulz,S.E.; Geßner,T.: Ein- und zweikernige Kupfer(I)- und Silber(I)-Phosphan-Komplexe mit b-Diketonato-Teilstrukturen . ; Z. anorg. allg. Chemie, 629 (2003) p 2371 – 2380
Lohmann,C.; Bertz,A.; Küchler,M.; Geßner,T.: Mechanical reliability of MEMS fabricatedby a special technology using standard silicon wafers. SPIE Conference 4980, San Jose (USA), January 2003
Löschner,U.; Exner,H.; Gärtner,E.; Fruehauf,J.: Laser bending of silicon. SPIE Conference Photonics West, San Jose (California), 2003; Proceedings, 4977 (2003) pp 86-93
Manfra,M.J.; Weimann,N.G.; Mitrofanov,O.; Waechtler,T.; Tennant,D.M.: High Power GaN/AlGaN/GaN HEMTs operating at 2 to 25 GHz grown by plasma-assisted MBE. ; physica status solidi (a), 200 (1) (2003) pp 175-178(ISSN0031-8965)
Mehner,J.; Dötzel,W.; Schauwecker,B.; Ostergard,D.: Reduced Order of Fluid Structural Interactions in MEMS Based on Modal Projection Techniques. 12. Intern. Conf. on Solid State Sensors, Actuators and Microsystems, Boston, 2003; Proceedings, pp 1840-1843
Mehner,J.; Schaporin,A.; Dötzel,W.: Simulation for MEMS – Packaging. Mems Packaging Workshop 2003, Chemnitz (Germany), 2003
Mrwa,A.; Erler,K.; Diefenbach,K.H.; Denissov,S.; Ebest,G.: Ortsaufgelöste Messung der Minoritätsladungsträgerlebensdauer bei Siliziumsolarzellen mittels MWPCD. Freiberger Siliziumtage 2003; Freiberger Forschungshefte, B 327 (2003) pp 91-107
Müller,A.-D.; Müller,F.; Mehner,J.; Wibbeler,J.; Geßner,T.; Hietschold,M.: Electrostatic double-cantilever device for dynamic noncontact-mode Atomic Force Microscopy. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct 29-30
Neumann,N.; Heinze,M.; Stegbauer,H.-J.; Hiller,K.; Kurth,S.: mikromechanisches, durchstimmbares Fabry-Perot-Filter für die nichtdispersive Gasanalytik im Spektralbereich (3…5) µm. 6. Dresdner Sensor-Symposium 2003
Otto,T.; Saupe,R.; Geßner,T.: Novel Possibilities in Physical Analytics Employing Miniaturized Devices. Proc. of the MST 2003,, München (Germany); Proceedings, pp 565-567
Reuter,D.; Frömel,J.; Schwenzer,G.; Bertz,A.; Geßner,T.: Selektives Niedertemperaturbonden mit SU-8 fuer Wafer-Level-Verkappung von mikromechanischen Strukturen. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2003 Oct 29-30
Reuter,D.; Frömel,J.; Schwenzer,G.; Bertz,A.; Geßner,T.: Selektives Niedertemperaturbonden mit SU-8 fuer Wafer-Level-Verkappung von mikromechanischen Strukturen. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2003 Oct 29-30
Rinderknecht,J.; Prinz,H.; Kammler,T.; Schell,N.; Zschech,E.; Wetzig,K.; Geßner,T.: In situ high temperature synchrotron-radiation diffraction studies of silicidation processes in nanoscale Ni layers. MAM 2003, La Londe Les Maures (France), 2003 Mar 9-12; Proceedings, Microelectronic Engn., 70 (2003) pp 226-232
Saupe,R.: Entwicklung eines auf MOEMS basierten Spektrometers. MEMS /Sensors - from Component Manufactoring to Packaged Functional Components, Fhg IZM Branchlab Chemnitz (Germany), 2003 Sept 16
Saupe,R.; Otto,T.; Stock,V.; Fritsch,U.; Geßner,T.: Packaging and Characterization of Micro-Opto-Electro-Mechanical Systems. ISMOT (International Symposium on Microwave and Optical Technology), Ostrava (Czech Republic); Proceedings
Scheibner,D.; Mehner,J.; Braemer,B.; Geßner,T.; Dötzel,W.: Wide Range Tunable Resonators for Vibration Measurements. Microelectronic Engineering 67-68, 2003; Proceedings, pp 542-549
Scheibner,D.; Mehner,J.; Reuter,D.; Geßner,T.; Dötzel,W.: Tunable Resonators with Electrostatic Self Test Functionality for Frequency Selective Vibration Measurements. MEMS 2003, Kyoto (Japan); Proceedings, pp 526-529
Scheibner,D.; Mehner,J.; Reuter,D.; Kotarsky,U.; Geßner,T.; Dötzel,W.: CHARACTERIZATION AND SELF TEST OF ELECTROSTATICALLY TUNABLE RESONATORS FOR FREQUENCY SELECTIVE VIBRATION MEASUREMENTS. Sensors and Actuators 2003
Scheibner,D.; Wibbeler,J.; Mehner,J.; Braemer,B.; Geßner,T.; Dötzel,W.: A Frequency Selective Silicon Vibration Sensor with Direct Electrostatic Stiffness Modulation. Analog Integrated Circuits and Signal Processing,, 2003; Proceedings, pp 35-43
Schulz,S.E.; Aubel,O.; Baumann,J.; Hasse,W.; Geßner,T.: Copper Alloys for Improved Interconnect Properties. (Advanced Metallization Conference), Montreal (Canada), 2003 Oct 21-23
Schulz,S.E.; Blaschta,F.; Eisener,B.; Fruehauf,S.; Schulze,K.; Seidel,U.; Koerner,H.; Gessner,T.: SiO2-Aerogel ULK Integration into Copper Damascene Interconnects for RF Devices. AMC (Advanced Metallization Conference), Montreal (Canada), 2003 Oct 21-23
Schulz,S.E.; Schulze,K.; Matusche,J.; Schmidt,U.; Gessner,T.: Effect of PECVD SiC and SiCN cap layer deposition on mesoporous silica ultra low k dielectric films. 14th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, Munich (Germany), 2003 Mar 31- April 1
Sternberger,A.; Hiller,K.; Geßner,T.; Dötzel,W.; Kurth,S.; Neumann,N.; Heinze,M.: Closed loop controll of a tunable infrared filter. Int. Conf. on Applied Electronics 2003, Pilsen (Czech Republic), 2003 Sept 10-11; Proceedings , pp 197-200
Uhlig,M.; Bertz,A.; Brocke,H.; Dobler,M.; Flannery,C.; Jnawali,G.; Zeidler,D.; Geßner,T.: Integration of Plasma Deposited CF Polymer in a Copper / Low k Damascene Architecture”,. ULSI XVIII; Materials Research Society, Warrendale , pp 629-635
Uhlig,M.; Bertz,A.; Erben,J.-W.; Schulz,S.E.; Geßner,T.; Zeidler,D.; Wenzel,C.; Bartha,J.: Experimental results on the integration of copper and CVD ultra low k material. MAM 2003, La Londe Les Maures (France), 2003 Mar 9-12; Proceedings, Microelectronic Eng., 70 (2003) pp 314-319
Waechtler,T.; Manfra,M.J.; Weimann,N.G.; Mitrofanov,O.: High Power GaN/AlGaN/GaN HEMTs Grown by Plasma-Assisted MBE Operating at 2 to 25 GHz. 61st Device Research Conference (DRC), Salt Lake City, Utah (USA), 2003 Jun 22-25
Weimann,N.G.; Manfra,M.J.; Waechtler,T.: Unpassivated AlGaN-GaN HEMTs With Minimal RF Dispersion Grown by Plasma-Assisted MBE on Semi-Insulating 6H-SiC Substrates. ; IEEE Electron Device Letters, 24 (2) (2003) pp 57-59(ISSN0741-3106)
Wenger,Ch.; Hübner,R.; Wenzel,Ch.; Reinicke,M.; Hecker,M.; Mattern,N.; Wetzig,K.; Baumann,J.; Schulz,S.; Bartha,J.W.; Engelmann,H.-J.; Zschech,E.: Stability of graded Ta-TaN-Ta and single layer TaSiN diffusion barriers for copper interconnect systems. ULSI XVIII; Materials Research Society, Warrendale (2003),, pp 847-851
Wiemer,M.: Wafer bond techniques for MEMS applications. MEMS , Yokohama (Japan), 2003 June 30
Wiemer,M.; Frömel,J.; Geßner,T.: Trends der Technologieentwicklung im Bereich Waferbonden. 6. Chemnitzer Fachtagung Mikromechanik & Mikroelelektronik, Lichtenwalde/Chemnitz, 29/30.10.2003; Tagungsband, p 178
Wiemer,M.; Frömel,J.; Geßner,T.; Nowak,B.; Suedkamp,W.; Peschka,A.; Bagdahn,J.; Petzold,M.: Bewertung von Niedertemperaturbondverfahren für Drucksensoren in der Automobiltechnik. MicroCar 2003, Leipzig, 2003 Jun 26
Wiemer,M.; Frömel,J.; Jia,C.; Geßner,T.: Bonding and contacting of MEMS-structures on wafer level. The Electrochemical Society - 203 rd meeting, Paris, 2003 May 2; Proceedings
Wiemer,M.; Frömel,J.; Jia,C.; Geßner,T.: Bonding and contacting of MEMS-structures on wafer level. The Electrochemical Society - 203 rd meeting, Paris (France), 2003 April 27- May 2
Windhorn,K.; Meixner,L; Drost,S.; Schröder,H.; Kilgus,E.; Scheel,W.; Ebling,F; Otto,T.; Küchler,M.; Nestler,J.; Geßner,T.: Polymer BioMEMs with integrated optical and fluidic functionality. Micro System Technologies, Munich (Germany), 2003 Oct 7-8; Proceedings, pp 416-423
Zeun,H.; Heinz,S.; Buschnakowski,S.; Korndörfer,F.; Schreiter,M.; Ebest,G.: High-ohmic poly-Si in high-voltage circuits. Proceedings Conference Applied Electronics 2003, Pilsen (Tschechien), 2003 Sep 10-11 pp 244-247(ISBN80-7082-951-6)
Zeun,H.; Korndörfer,F.; Heinz,S.; Buschnakowski,S.; Ebest,G.: Summation phasenverschobener Signale. Informationstagung Mikroelektronik 2003, Wien (Österreich), 2003 Okt 1-2 pp 529-533(ISBN3-85133-030-7)
Zhou,J.; Baum,M.; Schmiedel,R.; Huang,Y.; Ruan,G.; Geßner,T.: Harmonic Analysis of Microbeams with PZT on-Chip Actuating and Sensing. EMF, Cambridge (UK), 2003 Aug 3-8; Journal of Conference, Abstracts, 8 (2003) p 376(ISSN1362-0886)
Zimmermann,S.; Baumann,J.; Kaufmann,C.; Geßner,T.: Thermal stability of thin Ta and TaNx films as diffusion barriers for copper metallization. ULSI XVIII, 2003; Materials Research Society, Warrendale (2003), pp 859-864
Zimmermann,S.; Ecke,R.; Rennau,M.; Schulz,S.E.; Hecker,M.; Voss,A.; Engelmann,H.-J.; Acker,J.; Mattern,N.; Zschech,E.; Geßner,T.: Characterisation of a PECVD WNx Barrier Layer Against Copper Diffusion. AMC (Advanced Metallization Conference), Montreal (Canada), 2003 Oct 21-23
2002
Bertz,A.; Küchler,M.; Knoefler,R.; Geßner,T.: A novel high aspect ratio technology for mems fabrication using standard silicon wafers. ; Sensors & Actuators: A. Physical, 97, Issue 1 (2002) p 691(ISSN0924-4247)
Billep,D.: Mikromechanische Inertialsensoren. VDE Kongress 2002, Dresden, 2002 Oct 21-23
Bohuslavová,A.; Schulz,S.E.; Gessner,T.: Effect of PECVD SiO2 AND Si3N4 Hard Mask Deposition on Mesoporous Silica Ultralow k Dielectric Films. Talk presented at Materials for Advanced Metallization – MAM 2002; Book of Abstracts, p 65/66
Bruch,R.; Deshpande,K.; Merabet,H.; Picton,E.; Kondagari,S.; Otto,T.; Saupe,R.: Vibrational Spectroscopy: A New Tool in Biomedical Diagnostics. ; Wissenschaftliche Wissenschaftliche Berichte, IWKM 2002
Bruch,R.; Deshpande,K.; Merabet,H.; Picton,E.; Kondagari,S.; Otto,T.; Saupe,R.: Vibrational Spectroscopy: A New Tool in Biomedical Diagnostics. ; Wissenschaftliche Wissenschaftliche Berichte, IWKM 2002
Bruch,R.; Deshpande,K.; Merabet,H.; Picton,E.; Kondagari,S.; Otto,T.; Saupe,R.: Vibrational Spectroscopy: A New Tool in Biomedical Diagnostics. ; Wissenschaftliche Wissenschaftliche Berichte, IWKM 2002
Doetzel,W.; Schroeter,B.; Fruehauf,J.; Mehner,J.; Gessner,T.: Movable Micromechanical Joints for Use in Micromechatronics. Proc. APEIE,. pp 4-8(ISBNMovable Micromechanical 0-7803-7361-8)
Ecke,R.; Schulz,S.; GessnerT.; Wenger,C.; Wenzel,C; Bartha,J.; Hecker,M.; Huebner,R; MatternN.; Wetzig,K.; Engelmann,H.J.; Zesch,E: Ultrathin Diffusion Barriers for high-integrated Cu-Metallization. Tagung NanoDe 2002, Bonn, 2002 MAR 6-7
Ecke,R.; Schulz,S.; Hecker,M.; Engelmann,H.-J.; Gessner,T.: Development of PECVD WNx ultrathin film as barrier layer for copper metallization. ; Materials Week 2002 MaterialsWeek 2002,
Ecke,R.; Schulz,S.; Hecker,M.; Gessner,T.: Development of PECVD WNx ultrathin film as barrier layer for copper metallization. ; Microelectronic Engineering 64 (2002), p 261
Erler,K.; Mrwa,A.; Diefenbach,K.H.; Ebest,G.; Werner,T.; Schwarz,T.: Application of cost effective solar cell processing steps on RIE textured silicon surfaces. PV in Europe - From PV Technology to Energy Solutions Conference, Rome, 2002 Oct 07-11
Flaspoehler,M.; Kuhn,M.; Kaufmann,C.; Guessous,F.; Fruehauf,J.; Gessner,T.; Huebler,A: Image capturing method using a microactuator with diffraction grating. 8th International Conference on New Actuators, Bremen, 2002 Jun 10-12; Actuator 2002, pp 325-328
Fruehauf,J.; Trumpold,H.: Silicon Standards for Assessment and Calibration of Stylus Probes. ; Annals of the CIRP, 51/1/2002 (2002) pp 475-478
Fruehauf,S.; Streiter,I.; Puschmann,R.; Schulz,S.E.; Himcinschi,C.C.; Flannery,C.M.; Gessner,T.; Zahn,D.R.T.: Modified silica xerogel as a low- dielectric with improved mechanical properties. Advanced Metallization Conference (AMC), San Diego, 2002 OCT 1-3
Fruehauf,S.; Streiter,I.; Rennau,M.; Puschmann,R.; Schulz,S.E.; Gessner,T.; Chudoba,T.; Richter,F.,Flannery,C; Matusche,J; Schmidt.U.: Electrical and Mechanical characterization of porous silicon dioxide as an ultra low k dielectric. ; Materialsweek
Fruehauf,S.; Streiter,I.; Schulz,S.E.; Brendler,E; Himcinschi,C.; Friedrich,M.; Gessner,T.; Zahn,D.R.T.: Hydrophobisation process for porous low k dielectric silica layers. Conf. Proc. ULSI XVII, Warrendale; Materials Research Society, pp 287-294
Fruehauf,S.; Streiter,I.; Schulz,S.E.; Gessner,T.: SiO2-Xerogel-Dünnschichten als Isolatormaterial mit kleiner Dielektrizitätskonstante. Beitrag zum Abschlusskolloquium des DFG-Graduiertenkollegs “Werkstoffphysikalische Modellierung, Freiberg, 2002 JUN
Fruehauf,S.; Streiter,I.; Schulz,S.E.; Gessner,T.; Matusche,J.; Schmidt,U.; Schuhbauer,A: Low-k Materials: Nanoporous SiO2-Layers with an ultra low dielectric constant. Poster presented at NanoDE 2002, Bonn, 2002 MAR
Gessner,T.: Transfer of Technology in the Semiconductor Industry: Science-Industry in Saxony. Forum in Tokio zur Präsentation des Forschungs- und Industriepotentials aus dem Freistaat Sachsen, Tokio, 2002 FEB 14
Gessner,T.: Low temperature wafer bonding and AIM technology. Universitätskolloquium, NTU Singapore, 2002 FEB 18
Gessner,T.: Microsystems/MEMS devices fabricated by using silicon micromachining. öffentliches Universitätskolloquium, University of Nevada, Reno, 2002 APR 12
Gessner,T.: Von der Mikro- zur Nanoelektronik - eine besondere Herausforderung für das Metallisierungssystem. Tagung NanoDe 2002, Bonn, 2002 Mar 06-07
Gessner,T.: Microsystem Research at the Chemnitz University of Technology. Universitätskolloquium, FUDAN University Shanghai, 2002 Jun
Gessner,T.: MEMS and Microsystem Technologies. Süss MicroTec Workshop “Trends in MEMS and Process Technology”, Peking, 2002 OCT 25; Plenary lecture
Gessner,T.: Von der Mikro- zur Nanotechnologie - eine besondere Herausforderung für die Systemintegration. Silicon Saxony Kolloquium, Dresden, 2002 Nov
Gessner,T.; Schulz,S: Copper and Low-k Technology for On-Chip Metallization. ; Flip-Chip & Chip Scale Europe 2002
Hanf,M.; Bennini,F.; Fruehauf,J.; Gaertner,E; Doetzel,W.: Realization of Electrostatically Driven Actuators Using Curved Electrodes Fabricated Using Silicon Bulk Micromachining Techniques. 8th International Conference on New Actuators, Bremen, 2002 Jun; ACTUATOR 2002, pp 329-332
Hanf,M.; Kurth,S.; Faust,W.; Billep,D; Hahn,R.; Heinz,S.; Doetzel,W.; Gessner,T.: Realization of a Hadamard transform optic using a micromirror array for light modulation. OPTO 2002, Erfurt pp 63-66
Hecker,M.; Huebner,R.; Ecke,R.; Schulz,S.; Engelmann,H.-J.; Stegmann,H.; Hoffmann,V.; Mattern,N.; Gessner,T.; Zschech,E.: Effect of annealing on the microstructure of ultrathin tungsten nitride diffusion barriers for copper metallization. ; Microelectronic Engineering 64 (2002), p 269
Himcinschi,C.; Friedrich,M.; Fruehauf,S.; Streiter,I.; Schulz,S.E.; Gessner,T.; Baklanov,M.R.; Mogilnikov,K.P.; Zahn,D.R.T.: Ellipsometric study of the change in the porosity of silica xerogels after chemical modification of the surface with hexamethyldisilazane. ; Anal Bioanal Chem 374 (2002), pp 654-657
Hoffmann,R.; Gottfried,K.; Vogel,M.; Streit,A.; Dieckmann,F.; Dietel,U.: Bestimmung der Konzentration von limitierten gasförmigen Schadstoffkomponenten im Abgas von Verbrennungsmotoren durch Vollstrommessung mit Titanoxidgassensoren. ; MTZ Motortechnische Zeitschrift , 5/2002 (2002) p 400 ff(ISSN0024-8525)
Hoffmann,R.; GottfriedK.; KaufmannC.; Gessner,T.; Vogel,M.; Dietel,U.: Testing of a Gas Sensor for High Temperature Application. Ed. Werkstoffwoche-Partnerschaft GbR, Frankfurt; MATERIALS WEEK 2001(ISBN3-88355-302-6)
Jaensch,E.; Gaertner,E.; Fruehauf,J.: Biegebruchfestigkeiten von geätzten und verformten Silicium-Mikrostrukturen. ; Freiberger Forschungshefte B321 Werkstofftechnologie (2002) „Kristallisation und Technik“, pp 238-253(ISBN3-86012-173-1)
Jung,E,; Wiemer,M.; Grosser,V.; Bock,K.; Wolf,J.: Packaging for MEMS devices - stumbling block or enabling solution?. ; DTIP 2002
Koenig,D.; Ebest,G.: Novel external drift field source by localization of electrons for improvement of solar cells. Solar EnergyMaterials and Solar Cells 75, 335
Koenig,D.; Ebest,G.: New contact frame design for minimizing losses due to edge recombination and grid-induced shading. Solar Energy Materials and Solar Cells 75, 381
Koenig,D.; Scholz,R.; Gemming,S.; Thurzo,I.; Kampen,T.U.; Zahn,D.R.T.; Ebest,G: Evidence for high negative charge densities in AlF3 coatings on oxidized silicon: a promising source for large drift fields. ; Physica E 14, p 259
Korndoerfer,F.; Heinz,S.; Zeun,H.; Ebest,G.: Specifics of high voltage technologies - Characterization and modeling of HV-DMOS transistors. ; Proceedings Conference Applied Electronics 2002, pp 114-117(ISBN80-7082-881-1)
Korndoerfer,F.; Heinz,S.; Zeun,H.; Ebest,G.: Specifics of high voltage technologies - Characterization and modeling of HV-DMOS transistors. ; Proceedings Conference Applied Electronics 2002, pp 114-117(ISBN80-7082-881-1)
Korndörfer,F.; Heinz,S.; Zeun,H.; Ebest,G.: Specifics of high voltage technologies - Characterization and modeling of HV-DMOS transistors. Proceedings Conference Applied Electronics 2002, Pilsen (Tschechien), 2002 Sep 11-12 pp 114-117(ISBN80-7082-881-1)
Kuhn,M.; Flaspoehler,M.; Kroenert,S.; Gessner,T.; Huebler,A.; Fruehauf,J.: Optische Gitter auf Mikroaktuatoren - Herstellung und Einsatz. ; Scientific Reports: Journal of the University of Applied Sciences Mittweida, 10 (2002) pp 167-172(ISSN1437-7624)
Ledoux,G.; Amans,D.; Gong,J.; Huisken,F.; Cichos,F.; Martin,J.: Nanostructured Films Composed of Silicon Nanoparticles. ; Materials Science and Engineering C, 19 (2002) pp 215-218
Lohmann,Ch.; Bertz,A.; Kuechler,M.; Reuter,D.; Gessner,T.: Eine neue HIGH– ASPECT–RATIO–Technologie für die MEMS-Integration. 15. International Scientific Conference Mittweida, 2002 NOV 07-09 pp 156-161(ISSN1437-7624)
Mehner,J.; Bennini,F.; Doetzel,W.: Methods and Tools to Design Microsystems. First International Symposium on Mechatronics (ISOM 2002), Chemnitz, 2002 Feb pp 473-482(ISBN3-00-007504)
Mrwa,A.; Erler,K.; Diefenbach,K.H.; Ebest,G.: Rapid and classic thermal processing of block cast multicrystalline and edge defined film-fed growth EFG silicon. PV in Europe - From PV Technology to Energy Solutions Conference, Rome, 2002 OCT 07-11
Mrwa,A.; Erler,K.; Ebest,G.; Steckemetz,S.; Hezel,R.: RT Annealed Spin-on Glass Process for Screen Printed Multicrystalline Silicon Solar Cells. World Renewable Energy Congress VII, Cologne
Murray,C.; Flannery,C.; Streiter,I.; Schulz,S.E.; Baklanov,M.R.; Mogilnikov,K.P.; Himcinschi,C.; Friedrich,M.; Zahn,D.R.T.; Gessner,T.: Comparison of Techniques to Characterise the Density, Porosity and Elastic Modulus of Porous Low-k SiO2 Xerogel Films. Microelectronics Engineering 60 pp 133-141
Otto,T.; Saupe,R.; Gessner,T.: Development of a Microspectrometer for the Infrared Range. IRMMW 2002, San Diego, 2002 SEP 22-26 pp 31-32(ISBNCatalog Number 02EX561)
Otto,T.; Saupe,R.Mueller,A.,Gessner,T.: Infrarotspektroskopie unter Einsatz mikrosystemtechnischer Komponenten. 15. Internationale Wissenschaftliche Konferenz Mittweida; Wissenschaftliche Berichte, IWKM 2002, 10 (2002) pp 180-184
Petzold,M.; Katzer,D.; Wiemer,M.; Bagdahn,J.: Strength and long-term reliability testing of wafer-bonded MEMS. ; DTIP 2002
Saupe,R.; Otto,T.; Gessner,T.: Design and Packaging of Ultracompact Infrared Spectrometers Using Micromechanical Components. International Conference Infrared Sensors and Systems; IRS² Proceedings 2002, pp 237-242
Schauwecker,B.; Arnold,M.; Radehaus,C.; Przyrembel,G; Kuhlow,B.: Optical waveguide components with high refractive index difference in silicon-oxynitride for application in integrated optoelectronics. ; Optical Engineering, 41 (2002) pp 237 - 243
Scheibner,D.; Mehner,J.; Braemer,B.; Doetzel,W.; Gessner,T.: Wide Range Tunable Resonators for Vibration Measurements. ; MNE 2002
Scheibner,D.; Wibbeler,J.; Mehner,J.; Braemer,B.; Doetzel,W.; Gessner,T.: Frequency- Selective Silicon Vibration Sensor with Direct Electrostatic Stiffness Modulation. ; DTIP 2002, pp 325-332(ISBN0-8194-4518-5)
Scheibner,D.; Wibbeler,J.; Mehner,J.; Braemer,B.; Doetzel,W.; Gessner,T.: Frequency Selective Sensor Arrays for Vibration Measurement. ; IEEE Sensors 2002(ISBN0-7803-7455-X)
Scheibner,D.; Wibbeler,J.; Mehner,J.; Doetzel,W.; Gessner,T.: Silicon vibration sensor arrays with electrically tunable band selectivity. ; Microsystem Technologies 8 , 4-5 (2002) pp 314-317(ISBNDOI 10.1007/s00542-002-0100-2)
Schroeter,B.; Fruehauf,J.; Mehner,J.; Doetzel,W.; Gessner,T.: Flexible Gelenke in der Mikromechanik. First International Symposium on Mechatronics (ISOM 2002), Chemnitz, 2002 FEB pp 530-535(ISBN3-00-007504-6)
Schroeter,B.; Fruehauf,J.; Mehner,J.; Gessner,T.; Doetzel,W.: Feinwerktechnische Wirkprinzipien in der Mikrosystemtechnik. Proc. 47. Int. Wiss. Kolloquium.(ISSN1619-4098)
Schulze,K.; Billep,D.: Bewegungs- und Lagemesssystem für CAD-Anwendungen. 15. Internationale Wissenschaftliche Konferenz Mittweida, Mittweida, 2002 Nov 9-11; Proceedings(ISSN1437-7624)
Streiter,R.; Wolf,H.; Belsky,P.; Tirschler,W.; Giegengack,H.; Urbansky,N.; Gessner,T: Influence of target texture on the deposition of titanium films by long throw sputtering. Advanced Metallization Conference 2002 (AMC 2002), San Diego, 2002 OCT 01-03
Streiter,R.; Wolf,H.; Zhu,Z.; Xiao,X.; Gessner,T.: Thermal and Electrical Simulation of Deep Submicron Interconnection Systems. Proc. Advanced Metallization Conference 2001 (AMC 2001), Montreal, Canada, 2002 OCT 09-11; Materials Research Society, Warrendale, pp 379-386
Thurzo,I.; Kampen,T.U.; Zahn,D.R.T.; Koenig,D.: Electron capture kinetics at AlF3/SiO2 interfaces. Oral session ThA15.15, ICSFS-11, Marseille, 2002 JUL 08-12
Uhlig,M.; Bertz,A.; Brocke,H.; Dobler,M.; Flannery,C.; Jnawali,G.; Zeidler,D.; Gessner,T: Integration of Plasma Deposited CF Polymer in a Copper / Low k Damascene Architecture. Proc. Advanced Metallization Conference (AMC 2002), San Diego, 2002 OCT 03-01; Materials Research Society
Uhlig,M.; Zacher,M.; Bertz,A.; Werner,T.; Gessner,T.: Organische Low-k- Materialien für die Mikroelektronik. 3.Woerlitzer Workshop Funktionelle Schichten „Organische Schichten für Elektronik und Optoelektronik“, Wörlitz, 2002 MAR 14/15
Wiemer,M.; Froemel,J.; Gessner,T.: Applikationsfelder für Waferbondverfahren in der Mikromechanik und Mikroelektronik. ; Festschrift für Prof. Meusel – TU Dresden
Wiemer,M.; Gessner,T.: MEMS-Packaging. ; News Letter Süss Microtec
Wiemer,M.; Gessner,T.: Assembly and Bonding Technologies for Wafer Level Integration. ; VTE Heft 06
Wolf,H.; Streiter,R.; Tirschler,W.; Giegengack,H.; Urbansky,N.; Gessner,T.: Investigation of long throw PVD of titanium films from polycrystalline targets with texture. ; Microelectron. Eng. 63/4, pp 329-345
Zimmermann,S.; Baumann,J.; Kaufmann,C.; Gessner,T.: Thermal stability of thin Ta and TaNx films as diffusion barriers for copper metallization. Advanced Metallization Conference (AMC), San Diego, 2002 OCT 03-01
2001
Bagdahn,J.; Katzer,D.; Petzold,M.; Wiemer,M.; Alexe,M.; DragoiV.; Goesele,U.: Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation. MRS 2001, Spring Meeting, San Francisco
Bagdahn,J.; Katzer,D.; Petzold,M.; Wiemer,M.; Alexe,M.; Goesele,U.: A new approach for handling and transferring of thin semiconductor materials. Micro System Technologies 2001, Düsseldorf, 2001 MAR 27-29
Bennini,F.; Mehner,J.; Doetzel,W.: Computational Methods for Reduced Order Modeling of Coupled Domain Simulations. 11. International Conference on Solid- State Sensors and Actuators (Transducers 01), München pp 260-263
Bennini,F.; Mehner,J.; Doetzel,W.: A Modal Decomposition Technique for Fast Harmonic and Transient Simulations of MEMS. International MEMS Workshop 2001 (IMEMS 2001), Singapore pp 477-484
Bennini,F.; Mehner,J.; Doetzel,W.: Reduktion nichtlinearer Modelle für Komponentenund Systemsimulation. 5. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, 2001
Bertz,A.,Symanzik,H.; Steiniger,C.; Hoeffer,A.; Griesbach,K.; Stegemann,K.; Ebest,G; Gessner,T: A single-crystal Si-resonator with on-chip readout amplifier in standard CMOS. ; Sensors & Actuators A, 93 (2001), pp 163-172
Bertz,A.; Kuechler,M.; Knoefler,R.; Gessner,T.: A Novel High Aspect Ratio Technology for MEMS Fabrication Using Standard Silicon Wafers. ; Digest of Technical Papers, Transducers ´01/ Eurosensors XV, p 1128
Buschnakowski,S.; Ebest,G.; Heinz,S.; Schlegel,C.: Integrated high voltage amplifiers to drive capacitive microactuators. MICRO SYSTEM Technologies 2001, Düsseldorf, 2001 MAR 27-29(ISBN3-8007-2601-7)
Chen,Z.; Richter,K.; Riedel,S.; Schulz,S.E.; Gessner,T.: Copper alloy formation and film properties after annealing of Al/Cu stacks in different ambients. European Workshop for Advanced Metallization, Sigtuna, Schweden, 2001 MAR 05-07
Duan,X.; Schulz,S.E.; Ecke,R.; Gessner,T.: The nucleation of copper films deposited by MOCVD using different precursor blends and substrate materials. 11.Tagung Festkörperanalytik 2001, Chemnitz, 2001 JUN 25-28
Duan,X.; Schulz,S.E.; Ecke,R.; Gessner,T.: The nucleation of copper films deposited by MOCVD using different precursor blends and substrate materials. 11.Tagung Festkörperanalytik 2001, Chemnitz, 2001 JUN 25-28
Ebest,G.; Erler,K.; Mrwa,A.; Ball,M.: Großflächige multikristalline Silizium- Solarzellen mit hohen Wirkungsgraden. Abschlussbericht zum BMWi-Forschungsprojekt(ISBNFKZ 0329803)
Ecke,R.; Richter,K.; SchulzS.E.; GessnerT.: Charakterisierung von CVD-WNx- Schichten als Barriere gegen Kupferdiffusion. 11. Tagung Festkörperanalytik 2001, Chemnitz, 2001 JUN 25-28
Erler,K.; Ball,M.; Mrwa,A.; Werner,T.; Henker,M.; Ebest,G.: Preparation of RIE textured silicon surfaces and application to typical solar cells processing. 17th European Photovoltaic Solar Energy Conference, München
Flannery,C.M.; Murray,C.; Streiter,I.; Schulz,S.E.: Characterisation of porosity and stiffness of aerogel films by wideband ultrasonic surface waves. MRS Spring Meeting
Fruehauf,J.; Kroenert,S.; Brand,U.: Tiefen- und Längennormale aus Silizium. Technisches Messen 7-8 pp 326-332
Fruehauf,S.; Streiter,I.; Schulz,S.E.; Brendler,E.; Himcinschi,C.; Friedrich,M.; Gessner,T.; Zahn,D.R.T.: Hydrophobization process for porous low k dielectric silica layers. Advanced Metallization Conference in 2001, Montreal, 2001 OCT 09-11
Gaertner,E.; Fruehauf,J.; Hannemann,B.; Jaensch,E.: Mounting of Si-Chips with Plastically Bent Cantilevers. Transducers´01 Eurosensors XV,The 11th International Conference on Solid State Sensors and Actuators, München, 2001 JUn 10-14; Digest of technical papers, 1 (2001) pp 206-209
Gaertner,E.; Fruehauf,J.; Jaensch,E.: Entwurf eines Si-Positioniersystems. 5. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2001 OCT 23/24 pp Tagungsband 109- 114
Gaertner,E.; Fruehauf,J.; Loeschner,U.; Exner,H.: Laser Bending of Etched Silicon Microstructures. ; Microsystem Technologies 7, pp 23-26
Gessner,T.; Bohuslavová,A.; Schulz,S.E.: Nanoporous Dielectric Materials for Advanced CMOS. Sixth International Conference on Solid- State and Integrated-Circuit Technology ICSICT 2001, Shanghai, 2001 OCT 22-25
Gessner,T.; Kurth,S.; Kaufmann,C.; Markert,J.; Doetzel,W.: Micromirrors and micromirror arrays for scanning applications. ; Proc. SPIE 4178, pp 338-347
Gessner,T.; Kurth,S.; Kaufmann,C.; Markert,J.; Doetzel,W.; EhrlichA.: Laser scan systems based on micro mirror units. 8th International Symposium on Microwave and Optical Technology (ISMOT-01), Montreal, 2001 Jun 20-24
Gessner,T.; Schulz,S.E.: Neue Dünnschichtmaterialien für die fortgeschrittenene Mikroelektronik. DPG Frühjahrstagung, Hamburg, 2001 MAR 26-30
Gessner,T.; Seckel,W.; Herrmann,G.; Streiter,R.: Grundlagenforschung mit Anwendungsbezug auf dem Gebiet der Mikrosystemtechnik an der TU Chemnitz. ; it+ti, pp 282-283
Hanf,M.; Kurth,S.; Faust,W.; Hahn,R.; Heinz,S.; Doetzel,W.,; Gessner,T.: Einsatz von Mikrospiegel- Arrays zur Lichtmodulation in einem Hadamard- Transformations- Spektrometer. 5. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik
Hanf,M.; Kurth,S.; Faust,W.; Hahn,R.; Heinz,S.; Doetzel,W.; Gessner,T.: Einsatz von Mikrospiegel-Arrays zur Lichtmodulation in einem Hadamard-Transformations- Spektrometer. 5. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2001 OCT pp 30-34
Heinz,S.; Ebest,G.: Integrierte Hochvoltverstärkerschaltungen zur Ansteuerung mikromechanischer Aktorarrays. Informationstagung Mikroelektronik 2001, Wien, 2001 OCT 10/11
Heinz,S.; Symanzik,H.-G.; Ebest,G.: Integrierte Hochvoltverstärker für Arrayapplikationen. 5. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2001 OCT 23/24
Heinz,S.; Symanzik,H.-G.; Ebest,G.; alphamicroelectronicsGmbH: Monolithisch integrierter Hochspannungsverstärker.
Hietschold,M.; Mueller,F.; Mueller,A.-D.; Reuter,M.; Wibbeler,J.; Loebner,B.: The miniaturized multiple-tip scanning probe – A useful tool for experiments in nanotechnology. ; Proc. SCANNING 2001
Hiller,K.; Kurth,S.; Zichner,N.; Gessner,T; Doetzel,W.; Iwert,T.; Fritsch,H,Biehl: Ein mikromechanischer Vakuumsensor nach dem Reibungsprinzip. 5. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2001 OCT pp 79-86
Hiller,K.; Kurth,S.; Zichner,N.; Gessner,T; Doetzel,W.; Iwert,T.; Fritsch,H,Biehl,S.: Bulk micromachined and wafer bonded resonators for vacuum pressure measurement. Micro System Technologies MST 2001, Düsseldorf pp 285-290
Hiller,K.; Kurth,S.; Zichner,N.; Mehner,J.; Kaufmann,C.; Iwert,T.; Biehl,S.; Doetzel,W.; Gessner,T.: Ein mikromechanischer Vakuumsensor nach dem Reibungsprinzip. 5. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik
Himcinschi,C.; Friedrich,M.; Murray,C.; Streiter,I.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.: Influence of Hexamethyldisilazane treatment on the properties of silica xerogels films derived by vibrational spectroscopy. First International Conference of Advanced Vibrational Spectroscopy (ICAVS-1), Turku, Finnland, 2001 AUG
Himcinschi,C.; Friedrich,M.; Murray,C.; Streiter,I.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.: Characterization of silica xerogel films by variable-angle spectroscopic ellipsometry and infrared spectroscopy. ; Semicond. Sci. Technol. 16 (2001), pp 806-811
Himcinschi,C.; Friedrich,M.; Zahn,D.R.T.; Murray,C.; Streiter,I.; Schulz,S.E.; Gessner,T: Optical characterisation of silica xerogels. DPG Frühjahrstagung, Hamburg, 2001 MAR 26-30
Himcinschi,C.; Milekhin,A.; Friedrich,M.; Hiller,K.; Wiemer,M.; Gessner,T.; Schulze,S.; Zahn,D.R.T.: Silicon oxide in Si-Si bonded wafers. ; Applied Surface Science, pp 175-176; 715-720
Koenig,D.; Ebest,D.: New contact frame design for minimizing losses due to edge recombination and grid-induced shading. 12th International PVSEC Cheju Islands, Korea
Koenig,D.; Ebest,D.: Novel external field source by localization of electrons for improving field effect solar cells. 17th European Photovoltaic Solar Energy Conference, München
Koenig,D.; Ebest,D.: Hole collecting contacts by Pt with PtSi formation. 17th European Photovoltaic Solar Energy Conference, München
Koenig,D.; Ebest,G.: Negative Festladungen als externe Driftfeldquellen: Neue Möglichkeiten zur Verbesserung von Silizium-Solarzellen. Workshop Photovoltaik, Rudisleben, 2001 MAR 29/30
Koenig,D.; Rennau,M.; Henker,M.; Ebest,G.: Evidence of a high density of fixed negative charges in an IS structure. ; Thin Solid films 385, 1-2 (2001) pp 126-131
Koenig,D.; Scholz,R.; Gemming,S.; Thurzo,I.; Kampen,T.; Zahn,D.R.T.; Ebest,G.: Evidence for high negative charge densities in ALF3 coatings of silicon-based solar cells. International Workshop on Nanostructures in Photovoltaics, Dresden
Korndoerfer,F.; Heinz,S.; Ebest,G.: Parameterextraktion und Modellierung eines Vertikalen DMOS-Transistors in SOI-Technologie. Informationstagung Mikroelektronik, Wien, 2001 Oct 10/11
Kuechler,M.; Hiller,K.; Hahn,R.; Bertz,A.; Gessner,T.: Einsatzerfahrungen mit einer Multiplex-Ätzanlage für tiefes Siliziumätzen. Chemnitzer Fachtagung, Chemnitz; Tagungsband 5, p 159
Kurth,S.; Hiller,K.; Zichner,N.; Mehner,J.; Iwert,T.; Biehl,S.; Doetzel,W.; Gessner,T: A micromachined pressure gauge for the vacuum range based on damping of a resonator. ; Proc. of SPIE, 4559-15 (2001) pp 103-111
Kurth,S.; Hiller,K.; Zichner,N.; Mehner,J.; Kaufmann,C.; Iwert,T.; Biehl,S.; Doetzel,W.; GessnerT.: A new vacuum friction gauge based on a Si tuning fork. The 11th International Conference on Solid-State Sensors and Actuators, Transducers 2001, München, 2001 JUN 10-14; Dig. of Techn. Papers, 1 (2001) pp 502-505
Leschke,M.; Richter,K.; Riedel,S.; Schulz,S.E.; Gessner,T.; Lang,H.: Metallorganische Precursoren für Metallisierungssysteme in der Mikroelektronik. Förderung des SMWK (Project No. 7533-70-0380-98/1), Chemnitz, 2001 JAN
Loehr,K.; Mehner,J.; Doetzel,W.: Simulation viskoser Dämpfung in Mikrosystemen unter Verwendung von Analogiebeziehungen. 5. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik
Martin,J.; Bischoff,L.; Wannemacher,R.: Microscopy of Ion-Beam Generated Fluorescent Color Center Patterns in LiF. ; Opt. Commun., 188 (2001) pp 119-128
Martin,J.; Kiesow,A.; Heilmann,A.; Wannemacher,R.: Laser Microstructuring and Scanning Microscopy of Plasmapolymer-Silver Composite Layers. ; Applied Optics-OT, 40 (31) (2001) pp 5726-5730
Mehner,J.; Scheibner,D.; Wibbeler,J.: Silicon Vibration Sensor Arrays with Electrically Tunable Band Selectivity. ; MST, pp 267-272
Mrwa,A.; Ebest,G.; Rennau,M.; Beyer,A.: Fabrication of MINP solar cells: Comparison between conventional and rapid thermal process. 17th European Photovoltaic Solar Energy Conference, München
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.: Multikristalline Silizium-Solarzellen. Workshop Photovoltaik, Rudisleben, 2001 MAR 29/30
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.; Steckemetz,S.; Metz,A.; Hezel,R.: Rapid thermal annealed spin-on glass process for screen printed multicrystalline silicon solar cells. 17th European Photovoltaic Solar Energy Conference, München
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.; Steckemetz,S.; Metz,A.; Hezel,R.: Rapid thermal annealed spin-on glass process for screen printed multicrystalline silicon solar cells. 17th European Photovoltaic Solar Energy Conference, München
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.; Steckemetz,S.; Metz,A.; Hezel,R.: Rapid thermal annealed spin-on glass process for screen printed multicrystalline silicon solar cells. 17th European Photovoltaic Solar Energy Conference, München
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.; Steckemetz,S.; Metz,A.; Hezel,R.: Rapid thermal annealed spin-on glass process for screen printed multicrystalline silicon solar cells. 17th European Photovoltaic Solar Energy Conference, München
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.; Steckemetz,S.; Metz,A.; Hezel,R.: Rapid thermal annealed spin-on glass process for screen printed multicrystalline silicon solar cells. 17th European Photovoltaic Solar Energy Conference, München
Murray,C.; Flannery,C; Streiter,I.; Schulz,S.E.; Baklanov,M.R.; Mogilnikov,K.P.; Himcinschi,C.; Friedrich,M.; Zahn,D.R.T.; Zahn,D.R.T.; Gessner,T.: Comparison of techniques to characterise the density, porosity and elastic modulus of porous low-k SiO2 xerogel films. European Workshop for Advanced Metallization, Sigtuna, Schweden, 2001 MAR 05-07
Ramm,P.; Bonfert,D.; Ecke,R.; Iberl,F.; Klumpp,A.; Riedel,S.; Schulz,S.E.; Wieland,R.; Zacher,M.; Gessner,T.: Interchip Via Technology by Using Copper for Vertical System Integration. Advanced Metallization Conference in 2001, Montreal, 2001 OCT 09-11
Richter,K.; Riedel,S.; Schulz,S.E.; Gessner,T.: WNx Film Deposition by PECVD Using WF6/ N2/ H2 Gas Mixture. MRS Conference Proceedings ULSI XVI, MRS Warrendale, PA pp 301-306
Riedel,S.; Ecke,R.; Schulz,S.E.; Gessner,T.; Wieland,R.; Leutenecker,R.; Klumpp,A.; Ramm,P.: Copper metallization scheme for vertical chip integration. European Workshop for Advanced Metallization, Sigtuna, Schweden, 2001 Mar 05-07
Riedel,S.; Schulz,S.E.; Baumann,J.; Rennau,M.; Gessner,T.: Influence of Different Treatment Techniques on the Barrier Properties of MOCVD TiN Against Copper Diffusion. ; Microelectronic Engineering 55, pp 213-218
Scheibner,D.; Mehner,J.; Braemer,B.; Gessner,T.; Doetzel,W.: Abstimmbare Siliziumsensoren zur Vibrationsanalyse mit elektro-magnetischer Selbsttest- Funktionalität. 5. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik
Schlegel,C.; Heinz,S.; Ebest,G.: Integrierte Front End - Schaltungen für ein piezoelektrisches Mikrowandler - Phased Array. Fachtagung Informationstechnik, Magdeburg, 2001 MAR 21/22(ISBN3-930385-29-5)
Schmid,G.; Liu,Y.; Schumann,M.; Raschke,T.; Radehaus,C.: Quasi One- Dimensional Arrangements of Au55(PPh3)12Cl6 Clusters and Their Electrical Properties at Room Temperature. ; Nanoletters, 1(8) (2001) pp 405-407
Schneider,G.; Hamback,D.; Kaulich,B.; Hoffmann,N.; Hasse,W.; Schulz,S.E.: Non-destructive high resolution in-situ studies of the electromigration in passivated Cu interconnects and integrated circuit conductors by x-ray micrsocopy. MRS Conference Proceedings ULSI XVI, MRS Warrendale, PA pp 431-437
Schulz,S.E.: Copper CVD: Potentials and Challenges. 12th Annual Dielectrics and Metallization Symposium, San Diego, 2001 MAY 20-22; Invited Talk presented at Schumacher Forum for Future Trends
Schulz,S.E.; Koerner,H.; Helneder,H.; Schwerd,M.; Wendt,H.; Murray,C.; Streiter,I.; Gessner,T.: Properties of Ta and TaN barriers and sputtered Cu seed layers on capped and non-capped porous silicon oxide. MRS Conference Proceedings ULSI XVI, MRS Warrendale, PA pp 321-328
Schulz,S.E.; Koerner,H.; Murray,C.; Streiter,I.; Gessner,T.: Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide. ; Microelectronic Engineering 55, pp 445-52
Schulz,S.E.; Markert,M.; Rennau,M.; Riedel,S.; Streiter,R.; Uhlig,M.; Weiss,U.; Gessner,T.:Verbundprojekt „Fortschrittliche Kupfer- Metallisierungssysteme“ (FOKUM, FKZ 01M2972A des BMBF), Teilvorhaben: Prozess- und Verfahrensentwicklung für die Höchstintegration, Chemnitz, 2001 MAR
Schulz,S.E.; Schwenzer,G.; Zacher,M.; Uhlig,M.; Gessner,T.: 1. Zwischenbericht zum Verbundprojekt “Verbesserung der Performance von ICs durch Integration von Kupfer und low-k Dielektrika – PERFECT”, Teilvorhaben der TU Chemnitz: “Integration von Kupfer und low-k Dielektrika in Metallisierungssysteme” (Förderkennzeichen 01 M 3105 E des BMBF).
Schumann,M.; Liu,Y.; Raschke,T.; Radehaus,C.; Schmid,G.: Fabrication of room temperature single electron tunnelling transistors by Au55 Clusters, GVS4. pp 175-178
Schumann,M.; Liu,Y.; Torma,V.; Raschke,T.; Radehaus,C.; Schmid,G.: Nanostructures for the characterization of nanoclusters & molecules. Conference of Advanced Science, Augustusburg, 2001 SEP 05-07; Molecular Nanotechnology 2001
Schwalbe,G.; Baumann,J.; Kaufmann,C.; Gessner,T.; Koenigsmann,H.; Bartzsch,A.; Gilman,P.: Comparitive study of Cu and CuAl0.3wt% films. ; Microelectronic Engineering 55, pp 341-348
Seliger,B.; Radehaus,C.; Radehaus,P.: Pestizitsensoren auf der Basis immunochemischer Reaktionen. SATTERA 2001, Hochschule Mittweida (FH), Mittweida, 2001 Nov 08-10
Steiniger,C.; Bertz,A.; Gessner,T.: Monolithic integration of vibration sensors in near surface bulk silicon micromachining with microelectronics. Proceedings of the Micro System Technology 2001, Düsseldorf p 333
Streiter,R.; Wolf,H.; Zhu,Z.; Xiao,X.; Gessner,T.: Thermal and Electrical Simulation of Deep Submicron Interconnection Systems. Proc. Advanced Metallization Conference 2001 (AMC 2001), Montreal, 2001 OCT 09-11; Materials Research Society, Warrendale i.p.
Streiter,R.; Wolf,H.; Zhu,Z.; Xiao,X.; Gessner,T.: Application of Combined Thermal and Electrical Simulation for Optimization of Deep Submicron Interconnection Systems. European Workshop on Materials for Advanced Metallization 2001 (MAM 2001), Sigtuna, 2001 MAR 05-07; Microelectron. Eng. 60/1-2 (2001) 39
Torma,V; Reuter,T.; Vidoni,O.; Schumann,M.; Radehaus,C.; Schmid,G.: The Diode Behavior of Asymmetrically Ordered Au55 Clusters. ; ChemPhysChem, 2, 8-9 (2001) pp 546-548
Uhlig,M.; Bertz,A.; Werner,T.; Gessner,T: Plasma Deposited CF Polymer Films as Ultra Low k Intermetal Dielectric, Film Properties and Application. 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2001), Potsdam, 2001 OCT 21-24(ISBN0- 7803-7220-4)
Wachutka,G.; Mehner,J.; Schrag,G.; Voigt,P.: Design and Simulation of MEMS. 11. International Conference on Solid-State Sensors and Actuators (Transducers 01), München, Tutorial 4
Wibbeler,J.; Mehner,J.; Vogel,F.; Bennini,F.: Development of ANSYS/ Multiphysics Modules for MEMS by CAD- FEM GmbH. Intern. Congress on FEM Technology 2001, Potsdam
Wibbeler,J.; Scheibner,D.; Mehner,J.: Improved Coupled- Field FE Analysis of Micromachined Electromechanical Transducers. 11. International Conference on Solid- State Sensors and Actuators (Transducers 01), München pp 240-243
Wiemer,M.; Otto,T.; Gessner,T.: Ãœbersicht zur Mikrosystemtechnik: Definition, Technologien, Markt und Probleme in 2001. ; VTE, Heft 5
Wiemer,M.; Otto,T.; Gessner,T.; Hiller,K.; Kapser,K.; Seidel,H.; Bagdahn,J.; Petzold,M.: Implementation of a low temperature wafer bonding process for acceleration sensors. Spring Meeting, San Francisco; MRS 2001
Wiemer,M.; Otto,T.; Gessner,T.; Hiller,K.; Kapser,K.; Seidel,H.; Bagdahn,J.; Petzold,M.: Einsatz von Niedertemperaturbondverfahren für die Fertigung von Sensoren. 5. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, 2001 OCT 23/24; Tagungsband T-4, p 171
Xiao,X.; Streiter,R.; Wolf,H.; Ruan,G.; Murray,C.; Gessner,T.: Simulation of the dielectric constant of aerogels and estimation of their water content. ; Microelectronic Engineering 55, pp 53-57
Zhu,Z.; Xiao,X; Streiter,R.; Ruan,G.; Otto,T.; Wolf,H.; Gessner,T.: Closed-form formulae for frequency-dependent 3-D interconnect inductance. ; Microelectron. Eng. 56/3-4, pp 359-370
2000
Ahl,E.; Manthey,W.; Wolf,K.; Knoefler,R.; Gessner,T.: Simulation und Realisierung eines mikromechanischen Positionssensors. Tagungsband Sensoren und Meßsysteme 2000, Ludwigsburg, 2000 MAR 13/14; VDI Berichte Nr. 1530, pp 933-939
Bagdahn,J.; Ploessl,A.; Wiemer,M.; Petzold,M.: Measurement of the local strength distribution of directly bonded silicon wafers using the micro-chevron-test, Fifth Int. Symp. on Semicond. Wafer Bonding: Science, Technol. and Appl., Honululu (Wawaii)
Ball,M.; Erler,K.; Mrwa,A.; Ebest,G.: Automatic Methods for Treatment of the Dark Current Characteristics of Solar Cells. 16th European Photovoltaic Solar Energy Conference, Glasgow, 2000 MAY 01-05; Subject Number 2
Beddies,G.; Hortenbach,H.; Falke,M.; Braeuer,J.; Sakar,D.K.; Teichert,S.: Plasma etching of ternary silicide top layers. ; Microelectronic Engineering, 50 (2000) pp 199-209
Bennini,F.; Fruehauf,J.; Doetzel,W.: High force and large displacement electrostatic actuators with curved electrodes using silicon bulk micromachining. ; Actuator 2000
Beyer,R; Burghardt,H; Thurzo,I.; Zahn,D.R.T.; Gessner,T.: A deconvolution of transient response of (100) Si/SiO2 semiconductor-insulator interface states according to small pulse excitation: evidence of different branches of charge transition. ; Solide-State Electronics 44(2000), pp 1436-1470
Bohn,T.; Unger,K.; Mueller,D.: Erfahrungen bei der Erstellung wiederverwendbarer Module für Standardschnittstellen. 45th International Scientific Colloquium, Ilmenau Technical University, Ilmenau, 2000 Oct 04-06(ISSN0943-7207)
Bohn,T.; Unger,K.; Mueller,D.: Erstellung von wiederverwendbaren Modulen für Standardschnittstellen. Dresdner Arbeitstagung Schaltungs- und Systementwurf DASS 2000, Dresden, 2000 MAY 16/17
Doetzel,W.; Gerlach,G.: Entwurf in der Mikrosystemtechnik. ; University Press
Doetzel,W.; Kaufmann,C: Silicium-Mikromechanik – neue Technologien für neue Produkte. ; Lehren und Lernen 2000
Doetzel,W.; Tracey,M.; Sutton,N.,Johnstone,I.: A microfluidic based instrument for cytomechanical studies of blood. 1st Annual International IEEE-EMBS Conference on Microtechnologies in Medicine and Biology, Lyon, 2000 OCT
Eichhorn,K.: Entwurf und Anwendung von ASICs für musterbasierte Klassifikationsverfahren am Beispiel eines Schwingungsüberwachungssystems. Technische Universität, Fakultät für Elektrotechnik und Informationstechnik, Chemnitz, 2000 DEC; Dissertationsschrift
Erler,K.; Ball,M.; Mrwa,A.; T.Werner; Ebest,G.: Drastische Minderung der Oberflächenreflexion von multi- und einkristallinem Silizium-Material durch RIE.
Fruehauf,J.; Hannemann,B.: Wet etching of undercut sidewalls in {001}-silicon. ; Sensors and Actuators A79 (2000), pp 55-63
Fruehauf,J.; Hannemann,B.; Loehr,K.: Measurement of form profiles of microstructures using stylus instruments - problems ans tools-. X. International Colloquium on Surfaces, Chemnitz University of Technology, 2000 Jan 31- Feb 02 pp 322-329
Gaertner,E.; Fruehauf,J.; Jaensch,E.: Plastic reshaping of silicon microstructures: process, characterization and application. 3rd International Conference and Poster Exhibition Micro Materials, Berlin, 2000 APR 17-19
Gessner,T.: Simulation of the dielectric constant of aerogels and estimation of their water content. European Workshop on Materials for Advanced Metallization 2000 (MAM 2000), Stresa, 2000 Feb 28- MAR 01
Gessner,T.: Recent Progress of Microactuators. ; ACTUATOR 2000
Gessner,T.; Bertz,A.; Heinz,S.: Vertikal-Transistor mit beweglichem Gate und Verfahren zu dessen Herstellung. Deutsche Patentanmeldung: 10029501.0, 2000 JUL
Gessner,T.; Doetzel,W.; Hiller,K.; Kaufmann,C.; KurthS.: Mikromechanische Sensoren und Aktoren - Funktionsprinzipien, Technologien und Applikationen. VDI-VDA-GMA Fachtagung Sensoren und Meßsysteme 2000, Ludwigsburg, 2000 MAR; VDI Berichte , 1520 (2000) pp 211-220
Gessner,T.; Gottfried,K.; Hoffmann,R.; Kaufmann,C.; Weiss,U.; Charetdinov,E.: Metal oxide gas sensor for high temperature application. ; Microsystem Technologies, 6, Nr. 5 (2000)
Gessner,T.; Kaufmann,C.; Hoffmann,R.; Gottfried,K.; Wiemer,M.: Development of contact and wiring systems for high temperature sensor applications. 3rd International Conference an Poster Exhibition Micro Materials Micro Mat 2000,, 2000 APR 17-19 pp 196-199
Gessner,T.; Kurth,S.; Kaufmann,C.; Markert,J.; Doetzel,W.: Micromirrors and micromirror arrays for scanning applications. ; Proc. of SPIE, 4178 (2000) p 35
Gottfried,K.; Fritzsche,H.; Kaufmann,C.; Hoffmann,R.; Raschke,T.; Wiemer,M.; Vogel,M.; Springer,G.; Dietel,U.; Ludewig,T.; Gessner,T.: A high temperature stable metallization concept for a gas sensor application. 5th International High Temperature Electronics Conference, Albuquerque, 2000 Jun 12-15
Grajal,J.; Moreno,D.; Krozer,V.: 2-D Design of Schottky Diodes. IEEE Intern. Terahertz Electronics Conf., Darmstadt, 2000 OCT
Jaensch,E.; Gaertner,E.; Fruehauf,J.: Biegebruchfestigkeiten von geätzten und verformten Silizium-Mikrostrukturen. Freiberger Forschungsforum, 51. Berg- und Hüttenmännischer Tag, 2000 JUN 14-16
Knoefler,R.; Wolf,K.; Ahl,E.; Kotarsky,U.; Manthey,W.; Kuechler,M.; Bertz,A.; Gessner,T.: Micromechanical scanning device for large vertical range with high resolution. 7th International Conference On New Actuators, Bremen, 2000 JUN 19-21; Actuator 2000, pp 83-86
Koenig,D.; Ebest,G.: The negatively charged insulator-semiconductor structure: Concepts, technological considerations and applications. ; Solid State Electronics, 44, ISS. 1 (2000) pp 111-116
Koenig,D.; Ebest,G.: Antipolar counterpart to the positively charged SiOxNy layer for improvement of field effect solar cells, Oral session OC 9/5. 16th European Photovoltaic Solar Energy Conference, Glasgow, 2000 MAY 01-05
Koenig,D.; Koenig,K.; Ebest,G.: Solarzellen-Oberfläche. Deutsche Patentanmeldung, Prüfungsantrag, Aktenzeichen 100 57 296.0, 2000 NOV 17
Koenig,D.; Koenig,K.; Ebest,G.: Solarzelle unter Verwendung eines Kontaktrahmens und Verfahren zu deren Herstellung. Deutsche Patentanmeldung, Prüfungsantrag, Aktenzeichen 100 57 297.3, 2000 NOV 17
Kretzschmar,C.; Siegmund,R.; Mueller,D.: Adaptive Bus Encoding Technique for Switching Activity Reduced Data Transfer over Wide System Busses. International Workshop - Power and Timing Modeling, Optimization and Simulation, Göttingen, 2000 SEP 13-15; PATMOS 2000
Kretzschmar,C.; Siegmund,R.; Mueller,D.: Adaptive Partielle Businvert-Kodierung zur verlustleistungsreduzierten Datenübertragung auf Systembussen. Dresdner Arbeitstagung Schaltungs- und Systementwurf DASS 2000, Dresden, 2000 MAY 16/17
Kretzschmar,C.; Siegmund,R.; Mueller,D.: Adaptive schaltaktivitätsmindernde Buskodierverfahren zur Verlustleistungsreduktion in rekonfigurierbaren Hardwarearchitekturen. ITG Workshop Mikroelektronik fuer die Informationstechnik, Darmstadt, ITG-Fachbericht Nr. 162, 2000 NOV 20-21(ISBN3-8007-2586-X)
Krozer,V.; Chi-ILin; Hartnagel,H.L.: Direktes Extraktionsverfahren für die Ersatzschaltbildparameter von Diodenbauelementen. ITG-Diskussionssitzung: Anforderungen und Charakterisierungen nichtlinearer HF-Schaltungen, München, 2000 APR 04-05
Krozer,V.; Schuessler,M.; Ganis,H.; Brandt,M.; C.Sydlo,B.Mottet,S.Cassette,S.; Delage,H.L.Hartnagel: Fast Physics Based Wafer-Level Reliability Characterisation. 2000 Integrated Reliability Workshop, Lake Tahoe, 2000 OCT
Krujatz,J.; Werner,T.; Kaufmann,C.; Gessner,T.: Optical properties and film stress behavior of Silver Reflection Coatings for Micro Mirrors. 3rd International Conference an Poster Exhibition Micro Materials Micro Mat, 2000 APR 17-19 pp 788-791
Kuechler,M.; Knoefler,R.; Steiniger,C.; Raschke,T.; Gessner,T.; Dudek,R.; Doering,R: Stress-induced lateral deflections of microstructures. 3rd International Conference and Exhibition, MicroMat 2000,Berlin, 2000 APR 17-19
Kurth,S.; Kehr,K.; Faust,W.; Kaufmann,C.; Doetzel,W.; Gessner,T.; Michel,B: Deformation behavior of micromirror arrays under optical power. 3rd International Conference an Poster Exhibition Micro Materials Micro Mat, 2000 APR 17-19 pp 1210-1212
Loehr,K.; Mehner,J.: Simulation viskoser Dämpfung an Mikrostrukturen. Statusseminar REV-Projekt, München, 2000 NOV
Lucklum,R.; Zimmermann,B.; Hauptmann,P.; Kaufmann,C.; Gottfried,K.; Hoffmann,R.; Gessner,T.; Vogel,M.; Dietel,U.; Springer,G: TiO2 gas sensor for high temperature application. 14th European Conference on Solid-State Transducers, Koppenhagen, 2000 AUG 27-30; Eurosensors XIV
Manthey,W.; Wolf,K.; Ahl,E.; Knoefler,R.; Bertz,A.: Mikromechanischer Positionssensor. Technisches Messen 67 pp 144-150
Markert,M.; Bertz,A.; Gessner,T.; Ye,Y.; Zhao,A.; Ma,D.: High Throughput, High Quality Dry Etching of Copper/ Barrier Film Stacks. Microelectronic Engineering 50 pp 417-423
Mehner,J.; Bennini,F.; Doetzel,W.: Modeling and Simulation of Microelectromechanical Systems. 18th International Congress on FEM Technology, Friedrichshafen
Mehner,J.; Gabbay,L.; Senturia,S.D.: Computer-Aided Generation of Nonlinear Reduced-Order Dynamic Macromodels--I: Non-Stress-Stiffened Case. ; Journal of Microelectromechanical Systems, pp 262-269
Mehner,J.; Gabbay,L.; Senturia,S.D.: Computer-Aided Generation of Nonlinear Reduced-Order Dynamic Macromodels--II: Stress-Stiffened Case. ; Journal of Microelectromechanical Systems, pp 270-279
Mehner,J.; Kehr,K.; Schroeter,B.; Kaufmann,C.; Doetzel,W.; Gessner,T.: A Resonance Method for the Determination of Young's Modulus and Residual Stress of Thin Microstructures. 3rd International Conference an Poster Exhibition Micro Materials Micro Mat, MICROMAT, Berlin, 2000 APR 17-19 pp 497-500
Mehner,J.; Wibbeler,J.; Bennini,F.; Doetzel,W.: Modeling and Simulation of microelectro- mechnical Components. ; System Design Automation 2000, pp 163-177
Morris,J.E.,Radehaus,C.,Hietschold,M.,Henning,K.,Hoffmann,K.,Kiesow,A.: Discontious Metal Thin Films & the Single Electron Transistor. The Knowledge Foundation, San Francisco, 2000 Nov 02-03; Conf. on Novel Mat. for Electronics Miniaturisation
Mrwa,A.; Ebest,G.; Rennau,M.; Beyer,A.: High Efficiency MIS Inversion Layer Solar Cells Prepared by Rapid Thermal Process. 16th European Photovoltaic Solar Energy Conference, Glasgow, 2000 MAY 01-05; Poster VA 1/11
Mrwa,A.; Ebest,G.; Rennau,M.; Beyer,A.: Comparison of different emitter diffusion methods for MINP solar cells: thermal diffusion and RTP. ; Solar Energy Materials & Solar Cells, 61, ISS. 2 (2000) pp 127-134
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.: Rapid thermal annealed spin-on glass process for multicrystalline pn-silicon solar cells. 16th European Photovoltaic Solar Energy Conference, Glasgow, 2000 MAY 01-05; Poster VA 1/4
Mrwa,A.; Erler,K.; Ball,M.; Ebest,G.: Multikristalline Silizium-Solarzellen auf der Basis von spin-on und RTP.
Neubert,R.; Otto,T.,Radehaus,C.: Entwicklung eines neuartigen Analysesystems auf der Basis des Integralen Messprinzips. 14th international Scientific Conference of University of Applied Sciences, Mittweida, 2000 NOV 08-11
Otto,T.; Neubert,R.; Radehaus,C.: Spectrometer module with LED for colour measurement. ; Journal of the University of Applied Sciences, 10 (2000)
OttoT.,KuhnM.,KaufmannCh.andGessnerT.: Beugungsgitter aus Silizium für den Einsatz im NIR/IR- Bereich. 14th International Conference Mittweida; Journal of the University of Applied Sciences Mittweida, IWKM 2000, F (2000) pp 79-86
OttoT.,RuanG.,XiaoX.,StreiterR.andGessnerT.: Determination for the Number of Grain, the Average Length of Grain and the Activation Energy in Polysilicon Resistor. ; Journal of Fudan University (Nature Science), 39, Nr. 2 (2000) pp 135-140
OttoT.,SchubertA.,BoehmJ.andGessnerT.: Fabrication of Micro Optical Components by High Precision Embossing. ; SPIE 2000 Micromachining and Microfabrication, 4179 (2000) pp 96-106
Reutter,A.; Buchholz,C.; Schneider,J.; Bohn,T.; Unger,K.: Ein universelles Wiederverwendungssystem für den industriellen Einsatz: Testbenchgenerierung. 3. Workshop zum Förderschwerpunkt "Smart System Engineering" (SSE), Berlin, 2000 APR 11/12
Reutter,A.; Buchholz,C.; Schneider,J.; Bohn,T.; Unger,K.: Key Issues in Developing a Comprehensive Reuse System for Industrial Usage. MEDEA Conference on Embedded System Design, München, 2000 OCT 11-13
Reutter,A.; Schneider,J.; Ruelke,St.; Bohn,T.; Unger,K.: A Reuse System including tool and methods for IP management, code analysis and testbench generation. IP based Design '2000 (International workshop)
Richter,K.; Riedel,S.; Schulz,S.E.; Gessner,T.: WNx Film Deposition by PECVD Using WF6/ N2/ H2 Gas Mixture. Advanced Metallization Conference in 2000, San Diego, 2000 OCT 03-05
Richter,K.; Riedel,S.; Schulz,S.E.; Gessner,T.; Leschke,M.; Lang,H.: Metallorganische Precursoren für Metallisierungssysteme in der Mikroelektronik. 3. Zwischenbericht im Rahmen der Förderung des SMWK (Project No. 7533-70-0380-98/1), Chemnitz, 2000 JAN
Richter,K.; Riedel,S.; Schulz,S.E.; Gessner,T.; Leschke,M.; Lang,H.: Metallorganische Precursoren für Metallisierungssysteme in der Mikroelektronik. 4. Zwischenbericht im Rahmen der Förderung des SMWK (Project No. 7533-70-0380-98/1), Chemnitz, 2000 JUL
Riedel,S.: Kupfer-CVD: Probleme und Potentiale. GMM-Workshop Interconnect Technologies, München, 2000 JUL 06/07
Riedel,S.; Schulz,S.E.; Baumann,J.; Rennau,M.; Gessner,T.: Influence of Different Treatment Techniques on the Barrier Properties of MOCVD TiN Against Copper Diffusion. European Workshop for Advanced Metallization, Stresa, 2000 FEB 28- MAR 01
Riedel,S.; Schulz,S.E.; Gessner,T.: Investigation of The Plasma Treatment in a Multistap TiN MOCVD Process. ; Microelectronic Engineering 50, pp 533-540
Riedel,S.; Weiss,K.; Schulz,S.E.; Gessner,T.: Adhesion Study on Copper Films Deposited by MOCVD. MRS Conference Proceedings ULSI XV, MRS Warrendale, PA pp 195-199
RuanG.,LiangQ.L.,StreiterR.,SongR.R.,OttoT.andGessnerT.: Application of ANSYS in the VLSI Interconnect Simulation. ; Semiconductor Technology( in Chinese), 25, Nr.1 (2000) pp 53-56
RuanG.,XiaoX.,SongR.R.,StreiterR.,OttoT.andGessnerT.: Numerical Simulation of Capacitance and Time Delay at Room Temperature and 77K. ; Microelectronics (in Chinese), 30, Nr.1 (2000) pp 1-4
RuanG.,XiaoX.,SongR.R.,StreiterR.,OttoT.andGessnerT.: Numerical Simulation of Time Delay and Cross-Talk Noise for the Interconnect in VLSI Circuits. ; ACTA Electronina Sinca (in Chinese), 28, Nr. 5 (2000) pp 142-144
Schauwecker,B.; Przyrembel,G.; Kuhlow,B.; Radehaus,C.: Small-Size Silicon-Oxynitride AWG Demultiplexer operating around 725nm. ; IEEE Photonics Technology Letters, 12 No. 12 (2000) p 1645ff.
Schlegel,C.; Symanzik,H.-G.; Heinz,S.; Ebest,G.: Elektrostatisch betätigte Mikroaktoren - integrierte Hochvolt-Verstärker. 14. Internationale Wissenschaftliche Konferenz Mittweida, 2000 NOV; Scientific Reports, 10 (2000)
Schlegel,C.; Symanzik,H.-G.; Heinz,S.; Ebest,G.: Integrierte Hochvolt-Schaltungstechnik, Ergebnispräsentation zum Forschungsvertrag, Alpha microelectronics GmbH.
Schlegel,M.; Mueller,D.: Gesamtsystemsimulation mit VHDL-AMS am Beispiel der Rundumprojektion mit 2D-Mikrospiegelarray. 14th International Scientific Conference Mittweida, Mittweida, 2000 NOV 08-11; Scientific Reports, Journal of the University of Scientific Reports, Journal of the University of Applied Science Mittweida, 10 (2000) pp 87-94(ISSN1437-7624)
Schneider,G.; Hamback,D.; Kaulich,B.; Hoffmann,N.; Hasse,W.; Schulz,S.E.: Non-destructive high resolution in-situ studies of the electromigration in passivated Cu interconnects and integrated circuit conductors by x-ray micrsocopy. Advanced Metallization Conference, AMC, San Diego
Schroeter,B.; Mehner,J.; Kaufmann,C.; Doetzel,W.; Gessner,T.: Elastic Properties of Thin Films Determined by Means of a Resonant Method. ; Materialsweek
Schuessler,M.; Mottet,B.; Sydlo,C.; Krozer,V.; Hartnagel,H.L.; Jakoby,R.: Model for the Decrease in HBT Collector Current under DC Stress based on Recombination Enhanced Defect Reactions. European Symp. On Reliability ESREF, Dresden, 2000 Oct
Schulz,S.E.: Entwicklunggsstand von ultra low-k Materialien. GMM-Workshop for Plasma Technologies, Erlangen, 2000 JUN 28/29
Schulz,S.E.: Characterisation of Low-k Dielectrics. Technical Seminar of Solid State Measurements, Paris, 2000 SEP 26
Schulz,S.E.: Nanaoporöse Schichten (Aerogele, Xerogele): Eigenschaften und Applikationsmöglichkeiten. IFM2000, Industriefachmesse für Produktionstechnik, Automatisierung und Qualitätssicherung, Dresden, 2000 OCT 20
Schulz,S.E.; Koerner,H.; Helneder,H.; Schwerd,M.; Wendt,H.; Murray,C.; Streiter,I.; Gessner,T.: Properties of Ta and TaN barriers and sputtered Cu seed layers on capped and non-capped porous silicon oxide. Advanced Metallization Conference, AMC, San Diego
Schulz,S.E.; Koerner,H.; Murray,C.; Streiter,I.; Gessner,T.: Influence of barrier and cap layer deposition on the properties of capped and non-capped porous silicon oxide. European Workshop for Advanced Metallization, Stresa, 2000 FEB 28- MAR 01
Schulz,S.E.; Murray,C.: Porous SiO2 as ultra low k dielectric: Deposition, Properties and Integration. European Workshop for Advanced Metallization, Stresa, 2000 Feb 28- Mar 01
Schulz,S.E.; Murray,C.; Streiter,I.; Gessner,T.: Materialien für Low-k Dielektrika: Eigenschaften und Applikation von porösen SiO2-Schichten. GMMWorkshop Interconnect Technologies, München, 2000 JUL 06/07
Schulz,S.E.; Riedel,S.; Uhlig,M.; Markert,M.: 5. Zwischenbericht zum Verbundprojekt Fortschrittliche Kupfer-Metallisierungssysteme (FOKUM, FKZ 01M2972A des BMBF), Teilvorhaben: Prozess- und Verfahrensentwicklung für die Höchstintegration.
Schumann,M.: Herstellung von SET-Strukturen mit herkömmlichen Methoden. Doktorandenseminar, 2000 Jan 17/18
Schumann,M.; Raschke,Th.; RadehausC.: Deposition Processes for Single Electron Tunneling (SET) Structures. European Meeting on the Technology and Application of SET Devices, PTB Braunschweig, 2000 JUN 05-06
Schumann,M.; Raschke,Th.; RadehausC.: SET-Bauelemente bei Raumtemperatur auf der Basis von Metallclustern. Jahresmitgliederversammlung Kompetenzzentrum Ultradünne funktionale Schichten, Dresden, 2000 NOV 21
Schwalbe,G.; Baumann,J.; Kaufmann,C.; Gessner,T.; Gilman,P.; Koenigsmann,H.: Comparative study og copper and CuAl0,3wt.% films, European Workshop Materials for Advanced metallization.
Siebert,K.; Quast,H.; Segschneider,G.; Tautz,S.; Kiesel,P.; Doehler,G.H.; Roskos,H.G.; Krozer,V.: An Optoelectronic CW THz Source for Imaging Applications. IEEE Intern. Terahertz Electronics Conf., Darmstadt, 2000 OCT
Siegmund,R.; Mueller,D.: Synthesis of System-on-Chip Communication Architectures from Interface-based System Specifications. ITG Workshop Mikroelektronik fuer die Informationstechnik, Darmstadt, ITG-Fachbericht Nr. 162, 2000 NOV 20/21(ISBN3-8007-2586-x)
SiegmundR.; Kretzschmar,C.; Mueller,D.: Adaptive Partial Businvert Coding for Power- Efficient Data Transfer over Wide System Busses. XIII International Symposium on Integrated Systems and Circuit Design SBCCI 2000, Manaus, 2000 SEP pp 18-23(ISBN0-7695-0843-X)
SongR.R.,RuanG.,LiangQ.Q.,XiaoX.,StreiterR.,OttoT.andGessnerT.: A Comprehensive Delay Model for CMOS Inverters Based on Velocity Saturation. ; Chinese Journal of Semiconductor, 21, Nr.7 (2000) pp 711-716
SongR.R.,RuanG.,XiaoX.,StreiterR.,OttoT.andGessnerT.: Geometrical Optimizing design of Interconnection for Deep Sub-micrometer VLSI Circuits. ; Research and Progress of Solid-State Electronics (in Chinese), 20, Nr.1 (2000) pp 85-93
Steen,C.; Tautz,S.; Kiesel,P.; Doehler,G.H.; Segschneider,G.; Siebert,K.; Roskos,H.G.; Krozer,V.: Observation of THz Oscillations and Efficient THz Emission From Contacted Low-Temperature-Grown GaAs Structures. IEEE Intern. Terahertz Electronics Conf., Darmstadt, 2000 OCT
Streiter,R.; Wolf,H.; Weiss,U.; Xia,X.; Gessner,T.: Optimization of ULSI Interconnect Systems Including Aerogels by Thermal and Electrical Simulation. GMM-Workshop Interconnect Technologies, München, 2000 JUL 06/07
Streiter,R.; Wolf,H.; Weiss,U.; Xiao,X.; Gessner,T.: Optimization of ULSI interconnection systems including aerogels by thermal and electrical simulation. Proc. Advanced Metallization Conference 1999 (AMC 1999), Orlando, 2000 SEP 28-30 pp 335-342
Symanzik,H.-G.; Schlegel,C.; Heinz,S.: Hochvoltansteuerung für Mikroaktoren - von der diskreten zur integrierten Lösung. Kolloquium des Sonderforschungsbereiches 379, 2000 JAN 20
Thurzo,I.; Beyer,R.,Zahn,D.R.T.: Experimental evidence for complementary spatial sensitivities of capacitance and charge deep-level transient spectroscopies. ; Semicond. Sci. Technol. , 15 (2000) pp 378-385
Uhlig,M.: PECVD-Fluorpolymere für den zukünftigen Einsatz als Low-k Dielektrikum: Eigesnchaften und Integrationsaspekte. GMM-Workshop Interconnect Technologies, München, 2000 JUL 06/07
Uhlig,M.; Bertz,A.; Rennau,M.; Schulz,S.E.; Werner,T.; Gessner,T.: Low k (≈2.0) Plasma CF Polymer Films Modified by In Situ Deposited Carbon Rich Adhesion Layers. MRS Conference Proceedings ULSI XV, MRS Warrendale, PA pp 395-401
Uhlig,M.; Bertz,A.; Rennau,M.; Schulz,S.E.; Werner,T.; Gessner,T.: Electrical and Adhesion Properties of Plasma-Polymerised Ultra-Low k Dielectric Films With High Thermal Stability. ; Microelectronic Engineering, 50 (2000) pp 07-14
Ullmann,J.; Hasse,W.; Koetter,T.; Schulz,S.E.: Influence of test structure shape and test conditions in high accelerated Cu-electromigration tests. MRS Conference Proceedings ULSI XV, MRS Warrendale, PA pp 721-726
Weiss,K.; Riedel,S.; Schulz,S.E.; Helneder,H.; Schwerd,M.; Gessner,T.: Characterization of Electroplated and MOCVD Copper for Trench Fill in Damascene Architecture. MRS Conference Proceedings ULSI XV, MRS Warrendale, PA pp 125-131
Weiss,K.; Riedel,S.; Schulz,S.E.; Schwerd,M.; Helneder,H.; Wendt,H.; Gessner,T: Development of Different Copper Seed Layers with Respect to the Copper Electroplating Process. ; Microelectronic Engineering, 50 (2000) pp 433-440
Wiemer,M.; Herzinger,K.; Gessner,T.: Silizium-Waferbonden: Montageprozesse für Silizium- und Glasmaterialien in der Mikromechanik. ; DVS-Berichte, 193 (2000)
Wiemer,M.; Hiller,K.; Gessner,T.: Patterning of SOI-materials for fabrication of resonator systems using waferbonding approaches. ; Proc. of MICRO MAT, pp 438-441
Wiemer,M.; Hiller,K.; Gessner,T.; Kloss,T.; Schneider,K.; Leipold-Haas,U.; Bagdahn,J.; Petzold,M.: Investigation of bonding behaviour of different borosilicate glasses. ; Proc. of MICRO MAT, pp 1280-1282
Xiao,X.; Streiter,R.; Ruan,G.; Song,R.; Otto,T.; Gessner,T.: Modeling and Simulation for Dielectric Constant of Aerogel. ; J. Microelectron. Eng., 54/3-4 (2000) pp 295-301
Xiao,X.; Streiter,R.; Wolf,H.; Ruan,G.; Murray,C.; Gessner,T.: Simulation of the dielectric constant of aerogels and estimation of their water content. European Workshop on Materials for Advanced Metallization 2000, Stresa, 2000 FEB 28- MAR 01