Layer deposition

The ZfM, especially the department "Layer Deposition", is highly competent in the development and fabrication of conductive and isolating layers and layer stacks for microelectronic and microsystems technologies. The department "Layer deposition" offers support for advanced process modules for research and development purposes and small volume prototyping. Process modules available include:

• Physical Vapor Deposition (Sputtering, electron-beam)
• Vertical Sputtering System MRC 643 (materials: Ti, TiN, Ta, TaN, Cu)
• Vertical Sputtering System MRC 643 (materials: Al, Al-Alloys, Cr, TiW, W)
• R&D Sputtering System FHR MS 150 x 4 (materials: Ag, Al, Au, Co, Cr, MoNi, MoFe, Ti, TiN)
• R&D Sputtering System FHR MS 150 x 4 -AE-B (materials: Al, Al-Alloys, Hf, Pyrex)
• R&D Electron-Beam-Evaporation (materials Al, Cu, Pd, Pt, ...)
• Chemical Vapor Deposition (MO-CVD, PE-CVD, LP-CVD)
• MO-CVD R&D System Varian Gartek (Cu, TiN)
• PE-CVD System Precision 5000 Mark II Applied Materials (SiO₂, Si₃N₄, Si_xO_yN_z, SiCOH, SiCH)
• PE-CVD System Plasmalab Plasma Technology (SiO₂, Si₃N₄)
• PE-CVD System Microsys 400 Roth & Rau (Diamond-like Carbon)
• LP-CVD System LP-Thermtech (SiO₂, Si₃N₄, polysilicon)
• High temperature processes (diffusion / thermal oxidation / annealing / RTP)

For the characterization of the deposited layers and layer stacks we use a lot of measuring methods and systems, for example:

• KLA Tencor surface profiler Alpha step 500
• Thin film stress measurement system TENCOR FLX 2900
• White light interferometer Nanometrics NanoSpec / AFC
• Ellipsometey: Gaertner L11B (632,8 nm)
• Spectroscopic Ellipsometry: Sentech instruments GmbH SE 850 (190 nm - 2550 nm).

Contact

Dr. Sven Zimmermann
E-Mail: sven.zimmermann@…