Waferbonding
The term waferbonding describes all technologies for joining two or more wafer substrates directly or using certain intermediate layers. At Fraunhofer ENAS waferbonding technologies are applied to package sensor and actor components as well as electronics at wafer level. 3D integration technologies using metalized through silicon vias (TSV) could be performed additionally.
Available technologies are:
- Silicon direct bonding
- Anodic bonding
- Glas frit bonding
- Eutectic bonding
- Adhesive bonding
- Laser assisted bonding
For more details about waferbonding please visit the website of Fraunhofer ENAS.
More information
Contact
Dr. Maik Wiemer
E-Mail:
maik.wiemer@…
