Equipment
Cleanroom facilities and equipment
Jacob Müller, TU Chemnitz
The ZfM provides cleanroom facilities and equipment on MEMS and nano processing on 6“ and 8“ wafer size. The processing of 4“ wafer is also possible, but with some restrictions.
- 1300 m² clean room area, ISO4…ISO6
- Surface processing (thinning, polishing, cleaning)
- High temperature processes and layer deposition (PVD, CVD, ALD), various materials
- Patterning/Lithography: mask aligner, Waferstepper (0.35 µm), e-beam (20 nm)
- Wet and dry etching, various materials
- Wafer and chip bonding, wire bonding
- Inline metrology including CD SEM, AFM, FIB, probers