| Schade,A.: Synthesis of 5-(4-Formylphenyl)barbituric Acid to Access Enolizable Chromophoric Barbituric Acids. SynOpen, 08, 03 (2024) pp 217-222 |
| Schade,A.; Melzer,M.; Zimmermann,S.; Schwarz,T.; Stoewe,K.; Kuhn,H.: Plastic Waste Recycling─A Chemical Recycling Perspective. ACS Sustainable Chem. Eng.
, 12, 33 (2024) p 12270–12288 |
| Helke,C.; Seiler,J.; Meinig,M.; Grossmann,T.D.; Bonitz,J.; Haase,M.; Zimmermann,S.; Ebermann,M.; Kurth,S.; Reuter,D.; Hiller,K.: Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process.. EEJ Transactions on Electrical and Electronic Engineering 2024, 19, 5 (2024) pp 767-772 |
| Haase,M.; Sayyed,M.; Langer,J.; Reuter,D.; Kuhn,H.: About the Data Analysis of Optical Emission Spectra of Reactive Ion Etching Processes - The Method of Spectral Redundancy Reduction. Plasma, 7 (2024) pp 258-283 |
| Helke,C.; Schermer,S.; Hartmann,S.; Voigt,A.; Reuter,D.: Intra-Level Mix & Match investigations of negative tone photoresists mr-EBL 6000.5 and ma-N 1402 for i-line stepper and electron beam lithography. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Bonitz,J.; Helke,C.; Dittmar,N.; Schermer,S.; Haase,M.; Hofmann,L.; Reuter,D.: Scalable fabrication approach for single pixel microlens arrays. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Helke,C.; Schermer,S.; Hartmann,S.; Bonitz,J.; Haase,M.; Linn,E.; Haedrich,M.; Zanzal,A.; Reynolds,P.; DeMoor,S.; Voigt,A.; Reuter,D.: 2.5D-Patterning of photonic structures by electron beam and i-line stepper based grayscale lithography processes. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Gottwald,M.; Hartmann,S.; Helke,C.; Sendel,M.; Biller,H.; Schirmer,M.; Reuter,D.: Progress on an Intra-Level Mix & Match approach of the chemically amplified positive-tone photoresist SX AR-P 7200.14 for EBL and i-line stepper lithography. 67th International Conference on Electron, Ion and Photon Beam Technology and Nanofabrication, La Jolla Torrey Pines (USA), 2024 May 28-31; Proceedings, pp 1-2 |
| Braun,S.; Loebel,S.; Haumann,I.; Becker,M.; Suess,K.-T.: Aluminium als Material für die Leiterplattentechnik – Neuerungen in der prozesstechnischen Umsetzung
. Elektronische Baugruppen und Leiterplatten, Fellbach, 2024 Mar 05-06; GMM Fachbericht 107, 12 (2024) pp 177-183 (ISBN 978-3-8007-6266-8) |
| Braun,S.; Wiemer,M.; Schulz,S.E.: Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level. Micromachines, 15, 746 (2024) pp 1-18 |
| Behl,C.; Behlert,R.; Seiler,J.; Helke,C.; Shaporin,A.; Hiller,K.: Characterization of Thin AlN/Ag/AlN-Reflector Stacks on Glass Substrates for MEMS Applications. Micro, 4, 1 (2024) pp 142-156 |
| Schermer,S.; Helke,C.; Reinhardt,M.; Hartmann,S.; Tank,F.; Wecker,J.; Heldt,G.; Voigt,A.; Reuter,D.: Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach. Micro and Nano Engineering, 23, 100264 (2024) pp 1-6 |
| Bickmann,C.; Meinecke,C.; Korten,T.; Sekulla,H.; Helke,C.; Blaudeck,T.; Reuter,D.; Schulz,S.E.: Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces. Micro and Nano Engineering, 23, 100265 (2024) pp 1-5 |
| Forke,R.; Tsukamoto,T.; Shaporin,A.; Weidlich,S.; Buelz,D.; Hahn,S.; Tanaka,S.; Hiller,K.: Advancement in the MEMS Gyroscope from a Vibrating Tuning Fork to a Tuned Ring with Comb Electrodes. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: High Sensitivity Mode-Localized Ring Resonator With Tunable Sensitivity. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: Mode Localization and Frequency Modulation Sensing Using Superposed in-Phase and Anti-Phase Oscillations. IEEE MEMS, Austin, TX (USA), 2024 Jan 21-25; Proceedings (ISBN 979-8-3503-5792-9) |
| Roehlig,D.; Kuhn,E.; Teichert,F.; Traehnhardt,A.; Blaudeck,T.: Function phononic crystals. Europhysics Letters, 145, 2 (2024) p 26001 (ISBN 0295-5075, 1286-4854) |
| Shaporin,A.; Wecker,J.; Runge,J.; Voigt,S.; Melzer,M.; Kurth,S.; Hiller,K.: High precision electrostatic MEMS actuators for in-plane Fabry-Pérot gas sensors. 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania, Italy, 2024 Apr 7-10; Proceedings, pp 1-5 |
| Tank,F.; Wecker,J.; Stoeckel,C.; Helke,C.; Schermer,S.; Shaporin,A.; Hiller,K.; Reuter,D.: Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP). SPIE OPTO, San Francisco, California, United States, 2024 Jan 27 - Feb 1; Proceedings Volume 12889, Integrated Optics: Devices, Materials, and Technologies XXVIII |
| Haase,M.; Dittmar,N.; Kneidinger,A.; Schuster,P.; Bachhuber,F.; Helke,C.; Reuter,D.: Combining nano-scale imprint lithography and reactive ion etching to fabricate high-quality surface relief gratings. Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII, Proc. SPIE 12898 (2024) p 128980L |
| Langenickel,J.; Rodrıguez,L.P.; Martin,J.; Moebius,M.; Michaelis,D.; Munzert,P.; Weiss,A.; Danz,N.: Fabrication and characterization of quantum dot based LEDs with enhanced emission properties by micro cavities. SPIE OPTO, San Francisco, California, United States, 2024 Jan 25-30; Proceedings Volume 12906, Light-Emitting Devices, Materials, and Applications XXVIII |
| Hofmann,C.; Wuensch,D.; Otto,T.; Kraeusel,V.; Landgrebe,D.; Froehlich,A.; Kroll,M.; Kimme,J.: Verfahren zum Erwärmen einer Vielzahl von elektrisch leitfähigen Strukturen sowie Vorrichtung zur Verwendung in dem Verfahren. DE 10 2019 206 248 A1
AT 521456 B1 |
| Jaeckel,L.; Zienert,A.; Zeun,A.; Seidel,A.-S.; Schuster,J.: Surface chemistry models for low temperature Si epitaxy process simulation in a single-wafer reactor . Journal of Vacuum Science & Technology A, 42, 2 (2024) p 022702 |
| Huber,M.; Schuster,J.; Schmidt,O.G.; Kuhn,H.; Karnaushenko,D.: A Mechanical–Electrical Model to Describe the NegativeDifferential Resistance in Membranotronic Devices. Phys. Status Solidi Rapid Res. Lett., p 2300397 |
| Lorenz,E.; Gehre,J.; Jaeckel,L.; Schuster,J.: Harnessing Particle Raytracing for Real-Time Vapor Deposition Simulations in Evolving Topographies
. MNE, Berlin, 2023 Sep 26; Proceedings |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Schermer,S.; Helke,C.; Haase,M.; Ghosal,S.; Hanisch,A.; Bonitz,J.; Lou-Hofmann,J.; Hofmann,L.; Vogel,K.; Schulz,S.E.: Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023 May 30 - June 02 pp 795-799 |
| Cirulis,I.; Zschenderlein,U.; Braun,S.; Radestock,M.; Pantou,R.; Vogel,K.; Selbmann,F.; Kurth,S.; Wunderle,B.; Kuhn,H.: Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration. 24th European Microelectronics and Packaging Conference EMPC, Cambridge, 2023 September 11-14; Proceedings, 24 (2023) pp 1-5 (ISBN 978-0-9568086-9-1) |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Hanisch,A.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Schulz,S.E.; Ghosal,S.; Hofmann,L.: Process and Design Challenges for Hybrid Bonding. ESC Transaction, 112, 3 (2023) pp 73-81 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Kinner,R.; Suroshe,R.; Kuechler,M.; Stephan,R.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, 2023 Dec 5-8; IEEE Xplore, pp 469-473 |
