| Selvam,K.; Saeidi,N.; Schwarzmann,Y.; Vishwanatha,M.; Pakki,V.; Wiemer,M.; Kuhn,H.: Non-contact detection of concentration in fluid mixtures using Capacitive Micromachined Ultrasound Transducer (CMUT). IEEE SENSORS, Vancouver (Canada), 2025 Oct 19-22; Proceedings (ISBN 979-8-3315-4467-6, 979-8-3315-4468-3, 2168-9229, 1930-0395) |
| Sharma,H.; Albrecht,J.; Horn,T.; Pantou,R.; Rzepka,S.: Development of a Python-Based MasterCurveCreator Tool for Viscoelastic Materials. 2025 Smart Systems Integration Conference and Exhibition (SSI), Prague (Czech Republic), 2025 Apr 8-10; Proceedings (ISBN 979-8-3315-1244-6, 979-8-3315-1245-3) |
| Richter-Trummer,S.O.; Mathew,A.; Albrecht,J.; Rzepka,S.; Grosse-Kockert,C.; May,D.; Heimler,P.; Xong,D.; Alalsuss,M.; Basler,T.: Physics-Based Reliability Analysis of Power Modulesat Substrate and Component Level. PCIM 2025 - Power Conversion and Intelligent Motion, Nürnberg (Germany), 2025 May 6-8; Proceedings to appear |
| Feuchter,M.; Baumgartl,H.; Gadhiya,G.; Hanke,M.; Srivatsan,B.; Gromala,P.; Rzepka,S.: Compact Models for Nonlinear Thermo-Mechanical Simulations of Chiplets in Automotive. 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas (TX, USA), 2025 May 27-30; Proceedings, pp 208-215 (ISBN 979-833153932-0, 979-8-3315-3933-7, 2377-5726, 0569-5503) |
| Mathew,A.; Richter-Trummer,S.O.; Albrecht,J.; Rzepka,S.; Grosse-Kockert,C.; May,C.; Heimler,P.; Xie,D.; Alaluss,M.; Basler,T.: Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level. PCIM Conference 2025: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nürnberg (Germany), 2025 Ma 6-8; Proceedings, pp 222-333 (ISBN 978-380076541-6) |
| Lehmann,T.; Perezki,E.; Ihlemann,J.: Strain Investigations Around Circular Boundaries Based on Digital Image Correlation Data Using Parametrisation and Optimised Smoothing. Strain, 61, 1 (2025) |
| Kolas,K.A.; Sharma,P.; Boldyrjew-Mast,R.; Tranchero,M.; Rzepka,S.: Investigation of thermal performance of various thermal interface materials used in top-side-cooled MOSFETs. 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), Grenoble (France), 2025 Sep 15-18; Proceedings (ISBN 978-1-7395005-1-1, 979-8-3315-6575-6) |
| Horn,T.D.; Albrecht,J.; Mathew,A.; Eichhorn,R.; Rzepka,S.: Toward Lifetime Prediction under variable Load Conditions in Power Electronics: Evaluation of Damage Accumulation Rules for Solder System Attach. 27th Electronics Packaging Technology Conference, Resorts World Sentosa (Singapore), 2025 Dez 2-5; Proceedings to appear |
| Dudek,R.; Kreyssig,K.; Prinz,M.; Richter-Trummer,S.; Albrecht,J.; Rzepka,S.; Fruehauf,P.; Weigert,A.: Analyses of Materials Behavior and Solder Fatigue Test and Prediction Results for Long-Term Thermal Cycling. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht (Netherlands), 2025 Apr 6-9; R. Dudek, K. Kreyßig, M. Prinz, S. Richter-Trummer, S. Rzepka, P. Fruehauf and A. Weigert, “”, Proc. EuroSimE, Utrecht, Netherlands, April 06-09, 2025. (ISBN 979-8-3503-9300-2, 979-8-3503-9301-9, 2833-8596, 2833-8553) |
| Chacko,J.; Kolas,K.A.; Rzepka,S.: A concept for monitoring the failure risk of a power electronic component using a surrogate model. NORDPAC 2025, Copenhagen (Denmark), 2025 Jun 10-12; Proceedings (ISBN 978-91-89971-83-7, 979-8-3315-2552-1) |
| Chacko,J.; Kolas,K.A.; Rzepka,S.: FE approach to determine the effect of delamination in power electronic modules for automotive applications. SSI 2025, Prague (Czech Republic), 2025 Apr 8-10; Proceedings (ISBN 979-8-3315-1244-6, 979-8-3315-1245-3) |
| Bhoi,S.K.; Chakraborty,S.; Agdhaei,A.; Mathew,A.; Horn,T.D.; Liebig,S.; Albrecht,J.; Christoph,A.; De Doncker,R.W.; Hegazy,O.: A Streamlined Test-Oriented Lifetime Assessment Framework for Automotive Power Electronics Converters. TPEL - IEEE Transactions on Power Electronics, pp 1-21 (ISBN 0885-8993, 1941-0107) |
| Albrecht,J.; Horn,T.D.; Dudek,R.; Mathew,A.; Rzepka,S.: Development of a Reproducible, Stable, and Scalable Evaluation Routine for Lifetime Assessment of Power and Microelectronic Devices Based on Physics of Failure Principles. EPTC 2025 – Electronics Packaging Technology Conference, Resorts World Sentosa (Singapore) , 2025 Dez 2-5; Proceedings, to appear |
| Albrecht,J.; Horn,T.D.; Hertenstein,L.; Rzepka,S.: Physics-of-Failure based Lifetime Prediction for Power Electronics under Mission Profile Load Conditions. 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht (Netherlands), 2025 Apr 6-9; Proceedings, pp 1-7 (ISBN 979-8-3503-9300-2, 979-8-3503-9301-9, 2833-8596, 2833-8553) |
| Albrecht,J.: Streamlining Lifetime Assessment for New Electronic Packages Using Universal Material-Based Lifetime Models. 41st Chemnitzer Seminar, Chemnitz (Germany), 2025 Feb 14; Talk |
| Albrecht,J.; Horn,T.: Development of a Reproducible, Stable, and Scalable Evaluation Routine for Lifetime Assessment of Power and Microelectronic Devices Based on Physics of Failure Principles. EPTC 2025 - Electronics Packaging Technology Conference, Resorts World Sentosa (Singapore), 2025 Dez 2-5; Proceedings |
| Albrecht,J.; Horn,T.: Development of a Reproducible, Stable, and Scalable Evaluation Routine for Lifetime Assessment of Power and Microelectronic Devices Based on Physics of Failure Principles. EuWoReL 2025, Berlin (Germany), 2025 Oct 15-16; Proceedings |
| Kriesten,D.; Poellmann,N.; Wecker,J.; Schroeder,D.; Brand,S.; Benndorf,C.; Strieter,E.; Kabakci,N.J.; Kurth,S.; Altmann,F.: Characterization, testing & reliability for heterogeneous integration of chiplets. Proceedings |
| Jaeckel,T.; Dubey,V.; Diex,K.; Wuensch,D.: Investigations On Low-Temperature Aluminium (Al) Thermocompression Bonding Using Surface Passivation Technique On Chip And Wafer Level. WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Richter,D.; Diex,K.; Stoll,F.; Nazari,P.; Wuensch,D.; Wiemer,M.: Plasma Activated Low-Temperature Wafer Bonding of LiTaO3 to Si
. WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Akaram,S.; Dubey,V.; Uhlig,D.; Wuensch,D.; Wiemer,M.; Kuhn,H.: Impact of plasma activation and patterns on bondfront propagation for fusion/hybrid wafer bonding
. WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Nandi,S.; Hofmann,C.; Vogel,K.; Kroll,M.; Hiller,K.: Finite Element Modeling and Experimental Validation of Induction Heating for Efficient TLP Bonding with Cu-Sn Layers
. 25th International Conference on the Computation of Electromagnetic Fields, Naples, 2025 June 22-26 |
| Selbmann,F.; Kuehn,M.; Roscher,F.; Wiemer,M.; Kuhn,H.; Joseph,Y.: Parylene adhesive bonding on chip and wafer for the realization of biocompatible microsystems
. IEEE International Conference on Device Technologies for Diversified Applications (DTDA), Sendai, Japan, 2025 October 20-22 |
| Zugermeier,M.; Roscher,F.; Goebelt,M.; Gorski,D.; Gueth,F.; Horvath,A.; Knechtel,R.; Noll,A.; Seifert,T.; Stoll,F.; Thon,J.E.: From Development to Industrialization of a Screen-Printing Process for Wafer-Level Packaging of Miniaturized Sensors
. WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Roscher,F.; Gueth,F.; Fitz,V.; Selbmann,F.; Seifert,T.: Additive deposition technologies: from 2D towards 3D electronic systems
. 2nd Microprinting Workshop on Emerging Trends in Materials, Methods, and Applications, Bad Schandau, Germany, 2025 August 25-27 |
| Cirulis,I.; Kuehn,M.; Rincon,F.; Selbmann,F.; Roscher,F.; Zschenderlein,S.; Braun,S.; Wunderle,B.; Wiemer,M.; Kuhn,H.: Fabrication of Parylene-Aluminium Redistribution Layer interposer for sensor packaging applications . 27th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2025 December 2-5 |
| Rincon,.; Zschenderlein,U.; Kuehn,M.; Selbmann,F.; Wunderle,B.: Fatigue delamination study of parylene interface for a substrate material application
. 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025 April 06-09 (ISBN 979-8-3503-9300-2) |
