Publications
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2025
Books
| Stoeckel,C.: Chapter Piezoelektrische Mikrosysteme : Entwurf, Fertigung und Charakterisierung piezoelektrischer mikroelektromechanischer Wandlersysteme auf Basis von Aluminiumnitrid . in the book: Piezoelektrische Mikrosysteme : Entwurf, Fertigung und Charakterisierung piezoelektrischer mikroelektromechanischer Wandlersysteme auf Basis von Aluminiumnitrid Habilitation , ed. by Stoeckel, Chris (2025) p 232 (ISBN 978-3-96100-255-9) |
Papers
| Jaeckel,T.; Dubey,V.; Diex,K.; Wuensch,D.: Investigations On Low-Temperature Aluminium (Al) Thermocompression Bonding Using Surface Passivation Technique On Chip And Wafer Level. WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Richter,D.; Diex,K.; Stoll,F.; Nazari,P.; Wuensch,D.; Wiemer,M.: Plasma Activated Low-Temperature Wafer Bonding of LiTaO3 to Si . WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Akaram,S.; Dubey,V.; Uhlig,D.; Wuensch,D.; Wiemer,M.; Kuhn,H.: Impact of plasma activation and patterns on bondfront propagation for fusion/hybrid wafer bonding . WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Nandi,S.; Hofmann,C.; Vogel,K.; Kroll,M.; Hiller,K.: Finite Element Modeling and Experimental Validation of Induction Heating for Efficient TLP Bonding with Cu-Sn Layers . 25th International Conference on the Computation of Electromagnetic Fields, Naples, 2025 June 22-26 |
| Selbmann,F.; Kuehn,M.; Roscher,F.; Wiemer,M.; Kuhn,H.; Joseph,Y.: Parylene adhesive bonding on chip and wafer for the realization of biocompatible microsystems . IEEE International Conference on Device Technologies for Diversified Applications (DTDA), Sendai, Japan, 2025 October 20-22 |
| Zugermeier,M.; Roscher,F.; Goebelt,M.; Gorski,D.; Gueth,F.; Horvath,A.; Knechtel,R.; Noll,A.; Seifert,T.; Stoll,F.; Thon,J.E.: From Development to Industrialization of a Screen-Printing Process for Wafer-Level Packaging of Miniaturized Sensors . WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Roscher,F.; Gueth,F.; Fitz,V.; Selbmann,F.; Seifert,T.: Additive deposition technologies: from 2D towards 3D electronic systems . 2nd Microprinting Workshop on Emerging Trends in Materials, Methods, and Applications, Bad Schandau, Germany, 2025 August 25-27 |
| Cirulis,I.; Kuehn,M.; Rincon,F.; Selbmann,F.; Roscher,F.; Zschenderlein,S.; Braun,S.; Wunderle,B.; Wiemer,M.; Kuhn,H.: Fabrication of Parylene-Aluminium Redistribution Layer interposer for sensor packaging applications . 27th IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2025 December 2-5 |
| Rincon,.; Zschenderlein,U.; Kuehn,M.; Selbmann,F.; Wunderle,B.: Fatigue delamination study of parylene interface for a substrate material application . 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025 April 06-09 (ISBN 979-8-3503-9300-2) |
| Selbmann,F.; Schaller,F.; Song,S.; Kuehn,M.; Roscher,F.; Zimmermann,S.; Kuhn,H.: Parylene C based memristors for the realization of ultra-thin and flexible smart systems . 2025 Smart Systems Integration Conference and Exhibition (SSI), Prague, Czech Republic, 2025 April 8-10 pp Page(s):1 - 7 (ISBN 979-8-3315-1244-6) |
| Hennig,K.; Mattern,K.; Aerchlimann,K.; Heinrich,D.; Schmiedel,D.; Makert,G.R.; Fertey,J.; Friedrich-Stoeckigt,A.; Selbmann,F.; Morschhauser,A.; Baum,M.; Kuhlmeier,D.: Innovative Organ-on-Chip model Systems with Applications in Cancer, Neurology, and Infectious Diseases . Microphysiolocal Systems World Summit 2025, Brussels, Belgium, 2025 June 9-13 |
| Lykova,M.; Wuensch,D.; Richter,D.; Wiemer,M.: Oxide-free SiC-Si Room-Temperature Wafer Bonding: Thermal and Mechanical Characterization. WaferBond´25, Chemnitz, Germany, 2025 December 3-4 |
| Vishwanatha,M.; Selvam,K.; Saeidi,N.; Wiemer,M.; Kuhn,H.: Underwater Object Detection Using Capacitive Micromachined Ultrasonic Transducers (CMUTs). Sensor and Test |
| Pakki,V.S.S.; Vishwanatha,M.; Saeidi,N.; Guttmann,M; Deutschbein,C.; Selvam,K.; Wiemer,M.; Kuhn,H.: Investigating the Acoustic Focusing Performance of PDMS Lens for Ultrasound Transducers. 2025 ICU PADERBORN INTERNATIONAL CONGRESS ON ULTRASONICS, Paderborn (Germany), 2025 Oct 19-22; Proceedings, pp 190-193 |
| Mulay,S.; Stoeckel,C.; Schwenzer,F.; Bankwitz,J.: Design and Technology for Cavity SOI Piezoelectric Micromachined ultrasonic Transducers (PMUTs) with an infinite cell array design.. International Congress on Ultrasonics, Paderborn, Germany; 2025 ICU PADERBORN - 9th International Congress on Ultrasonics, pp 61-64 (ISBN 978-3-910600-08-9) |
| Selvam,K.; Saeidi,N.; Schwarzmann,Y.; Vishwanatha,M.; Pakki,V.; Wiemer,M.; Kuhn,H.: Non-contact detection of concentration in fluid mixtures using Capacitive Micromachined Ultrasound Transducer (CMUT). IEEE SENSORS, Vancouver (Canada), 2025 Oct 19-22; Talk |
| Vishwanatha,M.; Kraljevski,I.; Alkhasli,I.; Saeidi,N.; Selvam,K.; Wiemer,M.; Kuhn,H.: Investigating Performance Enhancements of CMUT Based Flow Measurement Using Regression Techniques . IEEE SENSORS, Vancouver (Canada), 2025 Oct 19-22; Poster |
| Janssen,Mathis; Murkina,Anastasiia D.; Hann,J.; Kloes,Gunnar; Moebius,M.; Meinecke,C.; Morschhauser,A.; Cortajarena,Aitziber L.; Reuter,D.: A Methodology for Validation of DNA Origami–Quantum Dot Hybridization. Appl. Nano, 6, 4 (2025) p 30 |
| Schuster,J.: NOVEL APPROACHES FOR HALOGEN-FREE AND SUSTAINABLE ETCHING OF SILICON AND GLASS (HALOFREEETCH) . Green ICT Connect 2025, Berlin (Germany), 2025 Oct 15-16; Poster |
| Schuster,J.; Umlauf,G.; Obrusnik,A.; Bamdad,M.; Hu,X.; Stastna,K.: Towards halogene-free plasma-etching of silicon and glass – part I: Project introduction and first results from computational screening and process modeling. EuroNanoLab Dry Etch Expert Group, Ilmenau, 2025 Nov 11-12; Invited talk |
| Wei,W.; Fuchs,F.; Zienert,A.; Hu,X.; Schuster,J.: First-principles analysis of the effect of magnetic states on the oxygen vacancy formation energy in doped La0.5Sr0.5CoO3 (LSC) perovskite. Psi-k conference, Lausanne (Switzerland), 2025 August 25–28; Poster |
| Qu,J; Hu,X.; Deconinck,M.; Liu,L.; Cheng,Y.; Zhao,R.; Wang,M.; Zhang,H.; Vaynzof,Y.; Schuster,J.; Cabot,A.; Leistner,K.; Li,F.: Trisodium Citrate-Assisted Synthesis of Edge-Abundant Nickel-Iron Layered Double Hydroxides for Efficient Oxygen Evolution Reaction. ChemCatChem, 17, e202401667 (2025) pp 1-9 |
| Hu,X.; Fuchs,F.; Zienert,A.; Wei,W.; Schuster,J.: Computational study of performance metrics and discharge mechanisms in lithium–sulfur batteries. Psi-k 2025 Conference, Lausanne (Switzerland), 2025 August 25-28; Poster |
| Bekemeier,S; Rêgo,C.R.C.; Mai,H.L.; Saikia,U; Waseda,U.; Apel,M.; Arendt,F.; Aschemann,A.; Bayerlein,B.; Courant,R.; Dziwis,G.; Fuchs,F.; Giese,U.; Schuster,J.; et al.: Advancing Digital Transformation in Material Science: The Role of Workflows Within the MaterialDigital Initiative. Advanced engineering materials, 27, 8 (2025) p 2402149 |
| Huber,M.; Schuster,J.: Influence of surface roughness and water diffusion on the prebond strength in direct wafer bonding. WaferBond25, Chemnitz (Germany), 2025 Dec 03-04; Talk; Abstract in: Proceedings of WaferBond25 |
| Zhao,Z.; Doering,H.; Blangiardi,F.; Gottschall,N.; Schwarzenberg,S.; Beltran,R.B.; Doering,A.; Maier,D.; Streiter,R.; Langer,J.; Heinkel,U.; Kuhn,H.: SenMooVe: A Platform for Sensor-based Air Quality Monitoring in Public Transport Vehicles. 2025 Smart Systems Integration Conference and Exhibition, SSI 2025, Prague (Czech Republic), 2025 Apr 8-10; Proceedings (ISBN 979-833151244-6, 979-8-3315-1245-3) |
| Rothe,T.; Lauff,A.; Shaporin,A.; Thieme,P.; Sayyed,M.A.; Gottfried,K.; Schuster,J.; Langer,J.; Jaeckel,L.; Stoll,M.; Kuhn,H.: Real-Time Interfacial Pressure Prediction in CMP Using Machine Learning Surrogates of Finite Element Simulations. International Journal of Automation Technology, 19, 5 (2025) pp 879 - 889 (ISSN 1881-7629) |
| Selvam,K.; Saeidi,N.; Schwarzmann,Y.; Wiemer,M.; Kuhn,H.: Investigation of Capacitive Micromachined Ultrasound Transducer for NDT and material inspection in metals and alloys. 2025 IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2025, Chemnitz (Germany), 2025 May 19-22; Proceedings (ISBN 979-833150500-4, 1091-5281) |
| Selbmann,F.; Schaller,F.; Song,S.; Kuehn,M.; Roscher,F.; Zimmermann,S.; Kuhn,H.: Parylene C based memristors for the realization of ultra-thin and flexible smart systems. 2025 Smart Systems Integration Conference and Exhibition, SSI 2025, Prague (Czech Republic), 2025 Apr 8-10; Proceedings (ISBN 979-833151244-6) |