| Hu,X.; Fuchs,F.; Zienert,A.; Wei,W.; Schuster,J.: Computational study of performance metrics and discharge mechanisms in lithium–sulfur batteries. Psi-k 2025 Conference, Lausanne (Switzerland), 2025 August 25-28; Poster |
| Bamdad,M.; Hu,X.; Schuster,J.: Development of Halogen-Free Etching Chemistries for Si and SiO2: A Screening Approach for Enhanced Reactivity. PESM2025, Chemnitz (Germany), 2025 Jun 16,17; Poster |
| Dick,D.; Fuchs,F.; Schuster,J.; Gemming,S.: An Extended Hückel Theory Parameter Set for Efficient Electronic Structure Calculations of SiGe Alloys. physica status solidi – Rapid Research Letters (pss RRL), p 2500087 (ISSN 1862-6254) |
| Dick,D.; Fuchs,F.; Gemming,S.; Schuster,J.: Quantum confinement and stoichiometry fluctuations in nm-thin SiGe layers. DPG Frühjahrestagung, Regensburg, 2025 Mar 16-21; Talk, Abstract in: Verhandlungen der DPG |
| Melzer,M.; Grossmann,T.D.; Wecker,J.; Schumann,A.; Seifert,T.; Hiller,K.; Zimmermann,S.: Miniaturized Plasma Systems as Enabler for Novel Sensor Generations. PT21, Kiel, 2025 Sep 23-25; 21. Plasma Technology Conference, |
| Wecker,J.; Tank,F.; Schermer,S.; Stoeckel,C.; Helke,C.; Shaporin,A.; Schumann,A.-K.; Martin,J.; Forke,R.; Hiller,K.; Haase,M.; Weiss,A.; Reuter,D.: Nanolithographic Waveguides, Couplers and Ring Resonators made of Si3N4 and AIN for Photonics and Quantum Technologies. 2025 Smart Systems Integration Conference and Exhibition (SSI), Prague, Czech Republic, 2025 April 08-10 pp 1-6 (ISBN 979-8-3315-1244-6) |
| Hann,J.; Moebius,M.; Meinecke,C.; Janssen,M.; Gottwald,M.; Morschhauser,A.; Martin,J.; Murkina,A.D.; Cortajarena,A.L.; Reuter,D.: DNA Origami Based Approach for an Electrically Driven Single-Photon Source for Contaminant Detection in Water. 2025 Smart Systems Integration Conference and Exhibition (SSI), Prague, Czech Republic, April 2025 April 08-10; IEEE Xplore, pp 1-6 (ISBN 979-8-3315-1244-6) |
| Forke,R.; Shaporin,A.; Hahn,S.; Weidlich,S.; Kuechler,M.; Wuensch,D.: On the Feasibility of the BDRIE-HS* Technology for a MEMS Gyroscope. 2025 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Lindau (Germany), 2025 May 10-13; Proceedings (ISBN 979-8-3503-8932-6) |
| Huber,M.; Zienert,A.; Schuster,J.: Evolution of water layers on wafer surfaces during bond chamber evacuation. J. Vac. Sci. Technol. B, 43, 4 (2025) p 043001 |
| Shaporin,A.; Forke,R.; Wecker,J.; Tank,F; Seifert,T.; Hiller,K.; Schumann,A.-K.; Stoeckel,C.; Reuter,D.: Optomechanical Inertial Sensors Based on Ring Resonators: Design Approaches and Technology. 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025 Apr 6-9; Proceedings, 26 (2025) pp 1-6 |
| Manoharan,G.; Hann,J.; Selyshchev,O.; Meinecke,C.; Otto,T.; Schulz,S.E.; Zahn,D.R.T.; Blaudeck,T.: FluidFM Deposition of Semicondutor Quantum Dots From Aqueous Dispersions. Nano Select, p 0:e70011 |
| Havryliuk,Y.; Dzhagan,V.; Ivakhno-Tsehelnyk,O.; Karnaukhov,A.; Hann,J.; Zahn,D.R.T.: Raman spectra and Seebeck coefficient of Cu2ZnSnS4 nanocrystals/PEDOT:PSS composite films. Thin Solid Films, 815 (2025) p 140618 |
| Franz,M.; Jaeckel,L.; Hu,X.; Kassner,L.; Thurm,C.; Rittrich,D.; Helke,C.; Schuster,J.; Daniel,M.; Stahr,F.; Rueffer,N.; Kretschmer,R.; Schulz,S.E.: Low-temperature ALD of metallic cobalt using the CoCOhept precursor: Simulation-assisted process development for deposition on temperature sensitive 3D-structures. Journal of Vacuum Science & Technology A, 43, 2 (2025) p 022412 (ISSN 0734-2101) |
| Qu,J; Hu,X.; Deconinck,M; Liu,L; Cheng,Y; Zhao,R; Wang,M; Zhang,H; Vaynzof,Y; Schuster,J.; Cabot,A; Leistner,K; Li,F: Trisodium Citrate-Assisted Synthesis of Edge-Abundant Nickel-Iron Layered Double Hydroxides for Efficient Oxygen Evolution Reaction. ChemCatChem, 17 (2025) p e202401667 |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Characterization of the ion angle distribution function in low-pressure plasmas using a micro-electromechanical system. 1st German-Japanese Plasma Processing Workshop for Advanced Microelectronics, Bochum, 2025 Feb 13-14 |
| Marc Stevens; Fuchs,F.; AndréHermannsdorfer; Teichert,F.; Martin Koehne; Schuster,J.; Hermann,S.: Wafer level drop casting and AlCl3 doping for highly conductive thin graphene paths. Diamond and Related Materials, 153 (2025) (ISSN 0925-9635) |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Characterization of the ion angle distribution function in low-pressure plasmas using a micro-electromechanical system. Journal of Vacuum Science & Technology A, 43 (2025) p 013002 |
| Saeidi,N.: Capacitive Micromachined Ultrasonic transducers: overview and application example underwater object detection.
Mikromechanische Ultraschallwandler (MUT). GMA/ITG-Fachtagung Sensoren und Messsysteme 2024, Nürnberg, 2024 Jun 11-12 |
| Saeidi,N.; Valente,V.: CMOS/MEMS Integration Approaches for Miniaturized Sensors.. |
| Vishwanatha,M.; Selvam,K.; Saeidi,N.; Wiemer,M.; Kuhn,H.: Object detection using Capacitive Micromachined Ultrasonic Transducers (CMUTs). Smart Systems Integrations Conference (SSI), , Hamburg, 2024 April 16-18 |
| Andleeb,A.; Sudhil Deshpande,V.; Selvam,K.; Saeidi,N.; Guttman,M.; Deutschbein,C.: Design and Modeling of Mesoscale Polymere Based Acoustic Lenses for Miniaturized Ultrasonic Transducers . Smart Systems Integrations Conference (SSI), , Hamburg, 2024 April 16-18 |
| Selvam,K.; Saeidi,N.; Morschhauser,A.; Schermer,S.; Zhou,C.; Kinner,R.; Wiemer,M.; Kuhn,H.: Preliminary Investigation of Using Perminex Resist for Low Temperature Adhesive Bonding . Smart Systems Integrations Conference (SSI), , Hamburg, 2024 April 16-18 |
| Saeidi,N.; Selvam,K.; Vishwanatha,V.; Wiemer,M.; Kuhn,H.: High temperature liquid level monitoring using Capacitive Micromachined Ultrasound Transducer (CMUT). IEEE, Taipei, Taiwan, 2024 September 22-26 ; 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS) (ISSN 1099-4734) |
| Vishwanatha,M.; Selvam,K.; Saeidi,N.; Wiemer,M.; Kuhn,H.: Underwater sensing applications using Capacitive Micromachined Ultrasonic Transducers (CMUTs). IEEE, Taipei, Taiwan, 2024 September 22-26 (ISSN 1099-4734) |
| Diex,K.; Jaeckel,T.; Wuensch,D.; Vogel,K.; Bonitz,J.; Hanisch,A.; Wiemer,M.; Schulz,S.E.: Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration. 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg (Germany), 2024 Apr 16-18; Proceedings (ISBN 979-8-3503-8877-0, 979-8-3503-8878-7) |
| Blangiardi,F.; Beltrán,B.R.; Zhao,Z.; Streiter,R.; Roessler,M; Langer,J.; Heinkel,U.; Kuhn,H.: Exploring Data Fusion for AI-Based People Counting in a Static Public Transport Vehicle Using Multiple IR-UWB Transceivers. 2024 Sensor Data Fusion: Trends, Solutions, Applications (SDF), Bonn (Germany), 2024 Nov 25-27; Proceedings (ISBN 979-8-3315-2744-0, 979-8-3315-2745-7) |
