Publications in 2004
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2004
Books
| Herrmann,G.; Mueller,D.: ASIC – Entwurf und Test (ISBN 3446217096) |
| Herrmann,G.; Dost,G.: Chapter Entwurf und Technologie von Mikroprozessoren. in the book: Taschenbuch Mikroprozessortechnik, ed. by Beierlein, T.; Hagenbruch, O. (2004) |
Papers
| Nestler,J.; Baum,M.; Otto,T.; Gessner,T.: Potentials for Microsystems in Biotechnology and Healthcare. 6th International Scientific Conference SATERRA, Mittweida (Germany), 2004 Nov 11-13; Scientific Reports of the Hochschule Mittweida, 6'2004 (2004) pp 1-4 (ISSN 1437-7624) |
| Gessner,T.: Microelectronics and MEMS: Overview about FhG-IZM and the Fraunhofer Organization. Fraunhofer (IZM) - SERC a-star MEMS Workshop, IME Singapore, 2004 Nov 8 |
| Reuter,D.; Bertz,A.; Schwenzer,G.; Gessner,T.: Selective adhesive bonding with SU-8 for zero-level-packaging. SPIE Int. Symposium Smart Materials, Nano- and Micro-Smart Systems, Sidney (Australia), 2004 Dec 12-15 |
| Otto,T.; Saupe,R.; Stock,V.; Fritzsch,U.; Bruch,R.; Gessner,T.: Packaging and Characterization of Miniaturized Spectral Sensing Devices. SPIE Photonics West: MOEMS and Miniaturized Systems IV, San Jose (USA), 2004 Jan 27-28; Proc. of SPIE, 5346 (2004) pp 134-140 |
| Otto,T.; Saupe,R.; Kaufmann,C.; Gessner,T.: Infrared Micro Mirror Spektrometer for Gas Analysis. Actuator 2004, 9th International Conference on New Actuators, Bremen (Germany), 2004 June 14-16; Proceedings, pp 254-257 |
| Hammer,K.; Heinz,S.; Zeun,H.; Ebest,G.: Using of High-end Design Tools in Education. Proceedings Conference Applied Electronics 2004, Pilsen (Tschechien), 2004 Sep 8-9 pp 64-67 (ISBN 80-7043-274-8) |
| Zeun,H.; Uhle,J.; Heinz,S.; Ebest,G.: Hochohmige Polysilizium-Widerstände in integrierten Hochvolt-Schaltungen. 10. GMM-Workshop "Methoden und Werkzeuge zum Entwurf von Mikrosystemen", Cottbus, 2004 Okt 20-22 pp 227-230 (ISSN 0947-1413) |
| Blaschta,F.; Schulze,K.; Schulz,S.; Gessner,T.: SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes. Microelectronic Eng., 76 (2004) pp 8-15 |
| Schulze,K.; Schulz,S.E.; Fruehauf,S.; Gessner,T.: Improvement of mechanical integrity of ultra low k dielectric stack and CMP compatibility. Microelectronic Engineering, 76 (2004) pp 38-45 |
| Bonitz,J.; Schulz,S.E.; Gessner,T.: Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials. Microelectronic Engineering, 76 (2004) pp 82-88 |
| Amro,R.; Lutz,J.; Lindemann,A.: Evaluation of a DCB based Transfer Molded Component for Application with High Temperature Swings. PCIM Europe 2004, Nuremberg (Germany) |
| Amro,R.; Lutz,J.; Lindemann,A.: Power Cycling with High Temperature Swing of Discrete Components based on Different Technologies. 35th IEEE Power Electronics Specialists Conference, Aachen; Proceedings, pp 2593 - 2598 |
| Belsky,P.; Streiter,R.; Wolf,H.; Gessner,T.: Application of Molecular Dynamics to the Simulation of IPVD. AMC, San Diego (USA), 2004 Oct 19-21 |
| Geiger,W.; Breng,U.; Deppe-Reibold,O.; Fuchs,W.; Gutmann,W.; Hafen,M.; Handrich,E.; Huber,M.; Kunz,J.; Leinfelder,P.; Newzella,A.; Ohmberger,R.; Ruf,M.; Schroeder,W.; Spahlinger,G.; Rasch,A.; Hiller,K.; Billep,D.: Test Results of the Micromechanical Coriolis Rate Sensor µCORS II. DGON 2004 Symposium Gyro Technology, Stuttgart |
| Baum,M.: Optical devices and biomedical application. A*Star IZM Workshop, Singapore, 2004 Nov 8 |
| Gessner,T.: Advanced Silicon Micromachining Technologies. MEMS Workshop, Industrial Technology Research Institute ITRI, Taiwan, 2004 Mar 1 |
| Gessner,T.: MEMS Metallization. Invited Talk, MRS Spring Meeting 2004, San Francisco (USA), 2004 Apr 12-16 |
| Gessner,T.; Schulz,S.E.: Selected Challenges for Advanced Interconnect Systems. Invited Talk, E-MRS 2004, Strasbourg (France), 2004 May 24-28 |
| Gessner,T.; Hiller,K.; Huebler,A.; Kurth,S.: Micro Scanners for Spectrum Analysis Systems. Invited Talk, Actuator 2004, Bremen (Germany), 14 Jun 2004 |
| Gessner,T.: Microsystems Technologies. Leipziger Messe Z 2004, Leipzig |
| Gessner,T.: Copper Metallization systems and low k dielectrics. Joint Workshop on Materials for Advanced Interconnects, Fudan University Shanghai (China), 2004 Jul 13-14 |
| Gessner,T.: Mikroelektronik- und Mikrosystemtechnik-Forschung am Zentrum für Mikrotechnologien der Technischen Universitaet Chemnitz in Kooperation mit dem Fraunhofer IZM. Kolloquium am ZMN Ilmenau, Ilmenau (Germany), 2004 Jul 30 |
| Gessner,T.: Microelectronics and MEMS: Challenges for the Technology Transfer into the Industry within the Fraunhofer Organization. MINAPIM, Manaus, Amazonas (Brazil), 2004 Sep 15-18 |
| Gessner,T.: Technology Approaches for Inertial Sensors. Invited Talk, ISINTIT 2004, Nanjing (China), 2004 Oct 15-16 |
| Gessner,T.: Mikrosysteme im Automobil. Chemnitzer Automobiltagung, TU Chemnitz, Chemnitz (Germany), 21 Oct 2004 |
| Gessner,T.: The Scientific System in Germany – Universities, Max-Planck-Institutes, Fraunhofer Organization, Leibniz-Foundation and Helmholtz-Foundation. Workshop at Chongqing University, Chongqing (China), 2004 Oct 12 |
| Gessner,T.: Systems Integration – A Challenge for Micro- and Nanotechnologies. Kolloquium caesarianum, Stiftung caesar, Bonn (Germany), 2004 Oct 26 |
| Gessner,T.: Challenges and trends for advanced interconnect systems – contribution and experiences of TU Chemnitz / ZfM and FhG-IZM Chemnitz. AMD-Silicon Saxony, Dresden (Germany), 2004 Nov 3 |
| Gessner,T.; Bertz,A.; Lohmann,C.; Wiemer,M.; Kurth,S.; Hiller,K.: Advanced Silicon Micromachining. Suss MEMS Seminar, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, Shanghai (China), 2004 Nov 12 |
| Gessner,T.; Hiller,K.; Bertz,A.: MEMS for automotive applications. Nanofair 2004, 2004; VDI-Berichte 1839, pp 77-82 |
| Hanf,M.,Doetzel,W.: Characterization of charges in MEMS devices. Actuator 2004, Bremen (Germany); Proceedings, pp 498-501 |
| Hanf,M.; Kurth,S.; Billep,D.; Hahn,R.; Faust,W.; Heinz,S.; Doetzel,W.; Gessner,T.: A Dynamically Driven Micro Mirror Array as Light Modulator in a Hadamard Transform Spectrometer (HTS). Eurosensors XVIII, Roma (Italy), 2004 Sep |
| Hanf,M.; Doetzel,W.: Micromechanical electrostatic field sensor for the detection of surface charges. EUROSENSORS XVII, Guimaraes (Portugal), 2004; Sensors and Actuators, 115, 2-3 (2004) pp 280-285 (ISSN 0924-4247) |
| Hanf,M.; Markert,J.; Doetzel,W.: Measurement and evaluation of surface of micro mechanical mirror structures. XI. Internationales Colloquium on Surfaces, Chemnitz (Germany), 2004 Feb 2-3 |
| Jerinic,V.; Mueller,D.: Safe integration of parameterized IP . Integration, the VLSI journal, 37 (2004) pp 193-221 |
| Kretzschmar,C.; Siegmund,R.; Mueller,D.: Adaptive Bus Line Grouping for Power Efficient Data Transfer over Wide System Buses. GI/ITG/GMM Workshop: Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, Kaiserslautern (Germany), 2004 Feb 23-25 |
| Kretzschmar,C.; Nieuwland,A.K.; Mueller,D.: Why Transition Coding for Power Minimization of on-Chip Buses does not work. Design Automation and Test in Europe (DATE), Paris (France), 2004 Feb 16-20 |
| Kretzschmar,C.; Bitterlich,T.; Mueller,D.: A High-Level DSM Bus Model for Accurate Exploration of Transmission Behaviour and Power Estimation of Global System Buses. Integrated Circuit and System Design, Power and Timing Modeling, Optimization and Simulation, 14th International Workshop, PATMOS, , Santorini (Greece), 2004 Sep 15-17 |
| Kretzschmar,C.; Scheithauer,M.; Mueller,D.: Adaptive Bus Encoding Schemes for Power-efficient Data Transfer in DSM Environments. IFIP Working Conference on Distributed and Parallel Embedded Systems (DIPES), Toulouse (France), 2004 Aug 23-26 |
| Kurth,S.: Meßtechnische Parameterbestimmung an MEMS-Baulementen. Materialsweek 2004, Munich (Germany), 2004 Sep 21-23 |
| Kurth,S.: Test, Charakterisierung und Zuverlässigkeit mikromechanischer Komponenten. MEMUNITY Workshop, Waldbronn (Germany), 2004 Mar |
| Leidich,S.; Voigt,S; Kurth,S; Rawat,B.; Gessner,T.: Microwave Phase Shifter in Bulk Micro Mechanic Technology. International Conference of Applied Electronics, Plzen (Czech Republic), 2004 |
| Markert,E.; Schlegel,M.; Herrmann,G.; Mueller,D.: Beschreibung von mechatronischen Systemen mit SystemC-AMS. 10. GMM-Workshop "Methoden und Werkzeuge für den Entwurf von Mikrosystemen", Cottbus (Germany), 2004 Oct 20-22; Proceedings, p 59ff |
| Mehner,J.: MEMS design, simulation and modelling. A*Star IZM Workshop, Singapore, 2004 Nov 8 |
| Mueller,A.-D.; Mueller,F.; Mehner,J.; Gessner,T.; Hietschold,M.: Sensor-actuator arrays for dynamic Atomic Force Microscopy and their application in temporary MESFET devices. Actuator 2004, Bremen (Germany), 2004 |
| Saupe,R.; Otto,T.; Mehner,J.; Kurth,S.; Kaufmann,C.; Gessner,T.: Electrostatic Driven Scanning Micro Mirrors Applied in Spectral Sensing Devices. VDI/VDE/IT mstnews, 03/2004 (2004) pp 40-42 |
| Scheibner,D.; Mehner,J.; Reuter,D.; Kotarsky,U.; Gessner,T.; Doetzel,W.: Characterization and self-test of electrostatically tunable resonators for frequency selective vibration measurements. Sensors and Actuators A, 111 (2004) pp 93-99 |
| Schlegel,M.; Herrmann,G.; Mueller,D.: Eine neue Hardware-Komponente zur Fuzzy-Pattern- Klassifikation . Dresdener Arbeitstagung Schaltungs- und Systementwurf DASS'04, Dresden (Germany), 2004 Apr 19-20; Proceedings, pp 21-26 |
| Schlegel,M.; Herrmann,G.; Mueller,D.: Erweiterte Kostenmodellierung mit VHDL/VHDL- AMS. GI/ITG/GMM-Workshop:Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, 2004 Feb 24-25; Berichte aus der Informatik (Shaker Verlag, Aachen), pp 147-155 |
| Schroeter,B.; Mehner,J.; Hiller,K.; Gessner,T.; Doetzel,W.: A Novel Microactuator Based on the Working Principle of a Step-by-Step Switchgear. Actuator 04 , Bremen (Germany); Proceedings, pp 242-245 |
| Shaporin,A.; Kolchuzhin,V.; Mehner,J.; Doetzel,W.: Parametric Variational Finite Element Method for MEMS Electrostatic Problems. 10. GMM Cottbus, Cottbus (Germany); Proceedings, pp 39-46 (ISSN 0947-1413) |
| Siemieniec,R.; Niedernostheide,F.-J.; Schulze,H.-J.; Suedkamp,W.; Kellner-Werdehausen,U.; Lutz,J.: Irradiation induced deep levels in Silicon. Electrochemical Society, Honolulu, Hawaii (USA), 2004 Oct; Proceedings, 05 (2004) pp 369-384 |
| Wiemer,M.: Wafer bonding and MEMS packaging technologies. A*Star IZM Workshop, Singapore, 2004 Nov 8 |
| Shen,Y.Z.; Leschke,M.; Schulz,S.E.; Ecke,R.; Gessner,T.; Lang,H.: Synthesis of tri-n-butylphosphine copper(I) beta-diketonates and their use in chemical vapour deposition of copper. CHINESE JOURNAL OF INORGANIC CHEMISTRY, 20 (11) (2004) pp 1257-1264 (ISSN 1001-4861) |
| Knechtel,R.; Froemel,J.; Wiemer,M.: Wafer level Incapsulation of microsystems using glass frit bonding. Workshop on Waferbonding for MEMS Technologies, Halle, 10-12 Oktober 2004 |
| Froemel,J.; Billep,D.; Wiemer,M.: Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. Workshop on Wafer Bonding for MEMS Technologies, Halle, 11,12 Oktober 2004 |
| Fruehauf,S.; Schulz,S.E.; Gessner,T.: Integrationspotential mesoporöser SiO2-Schichten als ultra-low-k Dielektrikum. Vakuum in Forschung und Praxis, 16 (2004) pp 194-198 (ISSN 0947-076X) |
| Ecke,R.; Schulz,S.E.; Hecker,M.; Engelmann,H.-J.; Gessner,T.: W(Si)N Diffusion Barriers for Cu Metallization deposited by PECVD. Advanced Metallization Conference AMC 2004, San Diego, USA, 2004 Oct 19-21 |
| Koerner,H.; Bueyuektas,K.; Eisener,B.; Liebmann,R.; Schulz,S.E.; Seidel,U.; Gessner,T.: Impact of Ultra Low k dielectrics on RF-Performance of Inductors. Advanced Metallization Conference AMC 2004, San Diego, USA, 2004 Oct 19-21 |
| Himcinschi,C.; Friedrich,M.; Fruehauf,S.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.: Contributions to the static dielectric constant of low-k xerogel films derived from ellipsometry and IR spectroscopy. Thin Solid Films, 455-456 (2004) pp 433-437 |
| Puschmann,R.; Schwarzer,N.; Fruehauf,S.; Richter,F.; Schulz,S.E.; Gessner,T.: Neues Konzept für den Eindruckversuch an porösen Schichten. DPG Frühjahrstagung 2004, 2004 Mar |
| Puschmann,R.; Schwarzer,N.; Richter,F.; Fruehauf,S.; Schulz,S.E.: A usable concept for the indentation of thin porous films. NanoMech Workshop, Hückelhoven, 2004 Sep |
| Lohmann,C.; Gottfried,K.; Bertz,A.; Reuter,D.; Hiller,K.; Kuhn,M.; Gessner,T.: MEMS Metallization. Materials, Technology and Reliabilitity for Advanced Interconnects and Low-k Dielectrics – 2004 (Eds. R.J Carter, C.S. Hau-Riege, G.M. Kloster, T.-M. Lu, S.E. Schulz), MRS Symp. Proc. 812 (2004) pp 233-242 (ISBN 1-55899-762-8) |
| Schulz,S.E.; Ecke,R.: Advanced CVD Technology for Diffusion Barrier and Cu Deposition, Invited talk. 3rd International Semiconductor Technology Conference (ISTC 2004), Shanghai, China, 2004 Sep 15-17 |
| Schulz,S.E.; Blaschta,F.; Eisener,B.; Fruehauf,S.; Schulze,K.; Seidel,U.; Koerner,H.; Gessner,T.: SiO2 Aerogel ULK Integration into Copper Damascene Interconnects for RF Devices. Advanced Metallization Conference (AMC 2003), Conf. Proc. AMC XIX, MRS Warrendale PA (2004) pp 97-105 (ISBN 1-55899-757-1) |
| Zimmermann,S.; Ecke,R.; Rennau,M.; Schulz,S.E.; Hecker,M.; Voss,A.; Engelmann,H.-J.; Mattern,N.; Zschech,E.; Gessner,T.: Characterisation of a PECVD WNx Barrier Layer Against Copper Diffusion. Advanced Metallization Conference (AMC 2003), Conf. Proc. AMC XIX, MRS Warrendale PA (2004) pp 397-402 (ISBN 1-55899-757-1) |
| Diefenbach,K.-H.; Erler,K.; Mrwa,A.; Denissov,S.; Ebest,G.; Rindelhardt,U.: Emitter Formation at RIE textured Surfaces. PVSEC, Paris, 2004 June 7-11 |
| Fruehauf,J.; Kroenert,S.: Linear Silicon Gratings with Different Profiles: Trapezodial, Triangular, Rectangular, Arched. Proc.. International Colloquium on Surfaces, Chemnitz (Germany), 2004 February 2-3 |
| Fruehauf,J.; Kroenert,S.; Brand,U.; Krueger-Sehm,R.: Reachable precision of silicon dimensional standards. Proceedings of the EUSPEN , p 217 |
| Fruehauf,J.; Gaertner,E.; Brand,U.; Doering,L.: Silicon springs for the calibration of the force of hardness testing instruments and tactile profilometers. Proceedings of the EUSPEN, p 362 |
| Herrmann,G.; Mueller,D.: ASIC – Entwurf und Test. |
| Herrmann,G.; Dost,G.: Entwurf und Technologie von Mikroprozessoren . |
| Schlegel,M.; Bennini,F.; Mehner,J.; Herrmann,G.; Mueller,D.; Doetzel,W.: Analyzing and Simulation of MEMS in VHDL-AMS Based on Reduced Order FE-Models. IEEE Sensores Journal |
| Fruehauf,J.: Ätzmasken- Entwurf und Simulation des kristallorientierungsabhängigen Silizium- Ätzens. Tagungsband 10. GMM- Workshop Methoden und Werkzeuge zum Entwurf von Mikrosystemen, pp 19-23 |
| Jia,Ch.; Wiemer,M.; Gessner,T.: Low temperature direct bonding with on wafer metal interconnections. workshop on wafer bonding for MEMS technologies, Halle (Germany), 2004 October 10-12 |
| Knechtel,R.; Wiemer,M.; Knaup,M.; Bagdahn,J.: An non-destructive test structure for bond strength evaluation in silicon-glass bonds. workshop on wafer bonding for MEMS technologies, Halle (Germany), 2004 October 10-12 |
| Krueger-Sehm,R.; Haessler-Grohne,W.; Fruehauf,J.: Traceable calibration standard for the lateral axis of contact stylus instruments. Wear, 257 Nr. 12 (2004) pp 1241-1245 |
| Mehner,J.; Doetzel,W.; Gessner,T.: Advanced Technologies for Microsystems Design. Anniversary book for Prof. Dr. H. Reichl´s 60th birthday, ed. B.Michel & R.Aschenbrenner, 2004, pp 241-245 |
| Mueller,F.; Long,T.D.; Mueller,A.-D.; Gessner,T.; Hietschold,M.: Resonance shifts in capacitively controlled actuator arrays. Actuators 2004, Bremen (Germany), 2004 |
| Schulz,S.E.: CVD Thin Films for Barrier, Hard Mask, Etch and CMP Stop Application, Short Course Lecture. Advanced Metallization Conference AMC 2004, San Diego (USA), 2004 Oct 18 |
| Wiemer,M.; Froemel,J.; Jia,Ch.; Gessner,T.: Bonding, contacting and sealing of MEMS structures on wafer level. Sensors and Materials |
| Martin,J.; Cichos,F.; Chan,I.Y.; Huisken,F.; von Borczyskowski,C.: Photoinduced Processes in Silicon Nanoparticles. Israel Journal of Chemistry, 44 (4) (2004) pp 341-351 |
| Cichos,F.; Martin,J.; von Borczyskowski,C.: Emission intermittency in silicon nanocrystals. Phys. Rev. B, 70 (2004) p 115314 |
| Cichos,F.; Martin,J.; von Borczyskowski,C.: Characterizing the Non-stationary Blinking of Silicon Nanocrystals. J. Lumin., 107(1-4) (2004) pp 160-165 |
| Martin,J.; Cichos,F.; von Borczyskowski,C.: Spectroscopy of Single Silicon Nanoparticles. J. Lumin., 108 (2004) pp 347-350 |
| Otto,T.; Nestler,J.; Baum,M.; Gessner,T.: Mikrofluidische Vorrichtung für die optische Analyse. Patentschrift (DE 102004015906B4) |
| Schulze,K.; Schulz,S.E.; Fruehauf,S.; Koerner,H.; Seidel,U.; Schneider,D.; Gessner,T.: Improvement of mechanical integrity of ultra low-k dielectric stack and CMP compatibility. Materials for Advanced Metallization (MAM), Brussels (Belgium), 2004 Mar 7-10; Microelectronic Eng., 76 (2004) pp 38-45 |
| Saupe,R.; Otto,T.; Stock,V.; Fritzsch,U.; Gessner,T.: Packaging and Characterization of Micro-Opto-Electro-Mechanical Systems. ISMOT, Ostrava (Czech Republic), 2004 04 07; 9th International Symposium on Microwave and Optical Technology 2003 (ISMOT), Ostrava (Czech Republic), Proceedings of SPIE, vol. 5445, 2004 Apr 07, Vol. 5445 (2004) pp 152-155 (ISBN 0-8194-5368-4) |