Publications in 2005
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2005
Books
| Wiemer,M.; Froemel,J.; Gessner,T.; Otto,T.: Chapter Wafer bonding in micro mechanics and microelectronics – an overview. in the book: The World of Electronic Packaging and System Integration, pp 307-313 (ISBN 3-932434-76-5) |
| Lohmann,C.; Reuter,D.; Bertz,A.; Gessner,T.: Chapter High Aspect Ratio Micromachining using the AIM Technology. in the book: The World of Electronic Packaging and System Integration, pp 544-548 (ISBN 3-932434-76-5) |
Papers
| Schlegel,M.; Bennini,F.; Mehner,J.; Herrmann,G.; Mueller,D.; Doetzel,W.: Analyzing and Simulation of MEMS in VHDL-AMS Based on Reduced Order FE-Models. accepted for IEEE Sensors Journal (ISSN 1530-437X) |
| Billep,D.; Hiller,K.; Froemel,J.; Tenholte,D.; Reuter,D.; Doetzel,W.; Gessner,T.: Post-processing gap reduction in a micromachined resonator for vacuum pressure measurement . SPIE Symposium on Microtechnologies for the New Millennium 2005, Sevilla (Spain), 2005 May 09-11; Procceedings, p 341 |
| Jakob,A.; Schmidt,H.; Walfort,B.; Rheinwald,G.; Fruehauf,S.; Schulz,S.; Gessner,T.; Lang,H.: Tri-n-Butyl-Phosphan-Silber(I)-Komplexe mit Carboxylat-, Troponolat- bzw. N-Hydroxyphthalimid-Teilstrukturen; Synthese und Verwendung als Spin-On-Precursoren. Zeitschrift für anorganische und allgemeine Chemie, 631 (6-7) (2005) pp 1079-1086 (ISSN 0044-2313) |
| Froemel,J.; Wiemer,M.; Bagdahn,J.: Mechanische Zuverlässigkeit der Verkapselung von MEMS. Microcar 2005, Leipzig, 22.06.2005 |
| Shen,Y.; Rueffer,T.; Schulz,S.E.; Gessner,T.; Wittenbecher,L.; Sterzel,H.-J.; Lang,H.: Me3SiC≡C-CMe=CH2 copper(I) β-diketonates: Synthesis, solid state structure, and low-temperature chemical vapour deposition. Journal of Organometallic Chemistry, 690 (17) (2005) pp 3878-3885 (ISSN 0022-328X) |
| Belsky,P.; Streiter,R.; Wolf,H.; Gessner,T.: Application of Molecular Dynamics to the Simulation of IPVD. Advanced Metallization Conference 2004, San Diego CA, U.S.A., 2004 Oct 19-21; MRS Conf. Proc. AMC XX, Material Research Society, Warrendale PA (2005), pp 787-792 (ISBN 1-55899-814-4 / ISSN 1048-0854) |
| Ecke,R.; Schulz,S.E.; Hecker,M.; Engelmann,H.-J.; Gessner,T.: W(Si)N Diffusion Barriers for Cu Metallization deposited by PECVD. Advanced Metallization Conference 2004, San Diego CA, U.S.A., 2004 Oct 19-21; MRS Conf. Proc. AMC XX, Material Research Society, Warrendale PA (2005), pp 793-799 (ISBN 1-55899-814-4 / ISSN 1048-0854) |
| Koerner,H.; Bueyuektas,K.; Eisener,B.; Liebmann,R.; Schulz,S.E.; Seidel,U.; Gessner,T.: Impact of Ultra Low k dielectrics on RF-Performance of Inductors. Advanced Metallization Conference 2004, San Diego CA, U.S.A., 2004 Oct 19-21; MRS Conf. Proc. AMC XX, Material Research Society, Warrendale PA (2005), pp 143-149 (ISBN 1-55899-814-4 / ISSN 1048-0854) |
| Gessner,T.; Schulz,S.E.; Schulze,K.; Ecke,R.; Fruehauf,S.; Streiter,R.: Challenges of Advanced Interconnect Systems: Cu diffusion barrier, porous low k dielectrics and thermal issues, Invited Talk. ICMAT 2005, Singapore, 2005 June |
| Blaschta,F.; Schulz,S.E.; Gessner,T.: Impact of reducing resist stripping processes at elevated temperature on ULK and HM materials. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 427-433 (ISSN 0167-9317) |
| Shen,Y.; Jakob,A.; Djiele,P.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane- and Phosphite-Silver(I)-a-Hydroxy-Carboxylates and -Glycinates: Synthesis and their Use as CVD Precursors . J. Organomet. Chem. |
| Bonitz,J.; Ecke,R.; Schulz,S.E.; Gessner,T.: Different SiH4 Treatments of CVD TiN Barrier Layers . Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 618-622 (ISSN 0167-9317) |
| Schulze,K.; Schuldt,U.; Kahle,O.; Schulz,S.E.; Uhlig,M.; Uhlig,C.; Dreyer,C.; Bauer,M.; Gessner,T.: Novel low-k polycyanurates for integrated circuit (IC) metallization. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 356-361 (ISSN 0167-9317) |
| Fruehauf,S.; Himcinschi,C.; Rennau,M.; Schulze,K.; Schulz,S.E.; Friedrich,M.; Gessner,T.; Zahn,D.R.T.; Le,Q.T.; Caluwaerts,R.: Scaling down thickness of ULK materials for 65nm node and below and its effect on electrical performance. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 405-410 (ISSN 0167-9317) |
| Schneider,D.; Fruehauf,S.; Schulz,S.E.; Gessner,T.: The current limits of the laser-acoustic test method to characterize low-k films. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 393-398. (ISSN 0167-9317) |
| Zimmermann,S.; Zhao,Q.T.; Trui,B.; Wiemer,M.; Kaufmann,C.; Mantl,S.; Dudek,V.; Gessner,T.: Fabrication and characterization of buried silide layers on SOI substrates for BICMOS-applications. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 454-459 (ISSN 0167-9317) |
| Wolf,H.; Streiter,R.; Rzehak,R.; Meyer,F.; Springer,G.: Empirical Modeling of Oxide CMP at Chip Scale. Materials for Advanced Metallization - MAM, Dresden, 2005 March 6-9; Microelectronic Eng. 82/3-4 (2005) 686-694 (ISSN 0167-9317) |
| Blaschta,F.; Schulz,S.E.; Gessner,T.: H2-Strip Processes on Low-k Materials, Talk. European Congress on Advanced Materials and Processes EUROMAT, Prague, Czech Republic, 2005 Sep 5-8 |
| Schulze,K.; Schuldt,U.; Kahle,O.; Schulz,S.E.; Uhlig,M.; Uhlig,C.; Dreyer,C.; Bauer,M.; Gessner,T.: Polycyanurates – A Low-k Material Approach. European Congress on Advanced Materials and Processes EUROMAT, Prague, Czech Republic, 2005 Sep 05-08 |
| Reuter,D.; Bertz,A.; Billep,D.; Scheibner,D.; Buschnakowski,S.; Doetzel,W.; Gessner,T.: In-Process Gap Reduction of Capacitive Transducers. Transducers05, Seoul (Korea), 2005 Jun 5-9; Tech. Digest, pp 1358-1361 |
| Schmidt,H.; Jakob,A.; Haase,T.; Kohse-Hoeinghaus,K.; Schulz,S.E.; Waechtler,T.; Gessner,T.; Lang,H.: nBu3P-Silber(I)-β-Diketonate: Synthese, Gasphasenuntersuchungen und Verwendung als CVD-Precursoren. Zeitschrift für Anorganische und Allgemeine Chemie, 631 (13-14) (2005) pp 2786-2791 (ISSN 0044-2313) |
| Lohmann,C.; Bertz,A.; Reuter,D.; Kuechler,M.; Gessner,T.: Flexible Herstellung und Charakterisierung von Inertialsensoren basierend auf der AIM-Technologie. Mikrosystemtechnik Kongress, Freiburg, 2005 Oct 10-13 p 539–542 (ISBN 978–3–8007–2926–5) |
| Froemel,J.; Wiemer,M.; Gessner,T.: Packaging of MEMS structures in SCREAM technology using anodic bonding. Micro System Technologies 2005, Munich (Germany), 2005 October 5-6; Proceedings , pp 99-104 (ISBN 3-7723-7040-3) |
| Gessner,T.; Froemel,J.; Jung,E.; Reichl,H.: MEMS and MOEMS Packaging. 2nd Mechatronics and Microsystems Symposium DCMM, Delft (Netherlands), 2005 September 7-8 |
| Voigt,S.; Leidich,S.; Kurth,S.; Gessner,T.; Doetzel,W.: Koplanare elektromagnetische Koppler zur Signalkontaktierung von RF-MEMS Bauelementen bei Mikrowellenfrequenzen. Mikrosystemtechnik Kongress, Freiburg, 2005 Oct 10-12; Proceedings, pp 397-400 (ISBN 978–3–8007–2926–5) |
| Forke,R.; Mehner,J.; Doetzel,W.; Gessner,T.: Mikromechanisches gekoppeltes Schwingsystem für frequenzselektive Vibrationsmessungen. 7. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2005 Oct 26-27; Proceedings, pp 143-148 (ISBN 3-00-016889-3) |
| Zeun,H.; Heinz,S.; Ebest,G.: Nonlinear Behaviour of High-ohmic Polysilicon Resistors in Integrated Circuits. Conference Applied Electronics, Pilsen (Tschechien), 2005 Sep 7-8; Proceedings, pp 361-364 (ISBN 80-7043-369-8) |
| Ebest,G.; Mrwa,A.; Erler,K.; Rindelhardt,U.: Light trapping and optical losses in solar cells with RIE textured surfaces. 20th PVSEC, Barcelona (Spain), 2005 Jun 6-10 |
| Baum,M.; Nestler,J.; Rost,D.; Weissmantel,S.; Otto,T.; Reisse,G.; Gessner,T.: Improved Silicon Master Tools for Hot Embossing. Micro System Technologies 2005, Munich (Germany), 2005 Oct 5-6; Proceedings, pp 76-82 (ISBN 3-7723-7040-3) |
| Baum,M.; Hientzsch,M.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Verschleißmonitoring bei Hüftgelenkendoprothesen durch integrierte Mikrosensorik. Mikrosystemtechnik Kongress 2005, 2005 Oct 10-12; Proceedings, pp 633-636 (ISBN 3-8007-2926-1) |
| Mehner,J.; Schaporin,A.; Kolchuzhin,V.; Doetzel,W.; Gessner,T.: Parametric Model Extraction for MEMS based on Variational Finite Element Techniques. Transducers05, Seoul (Korea), 2005 June 5-9; Tech. Digest, pp 776-780 |
| Mehner,J.; Schaporin,A.; Kolchuzhin,V.; Doetzel,W.; Gessner,T.: Variational Finite Element Technologies for Parametric Model Extraction for MEMS. Micro System Technologies 2005, Munich (Germany), 2005 Oct. 5-6; Proceedings, pp 516-523 (ISBN 3-7723-7040-3) |
| Mehner,J.; Kolchuzhin,V.; Schaporin,A.; Doetzel,W.; Gessner,T.: Finite Element Based Reduced Order Modeling for Micro Electro Mechanical Systems (MEMS). Mikrosystemtechnik Kongress 2005, Freiburg, 2005 Oct. 10-13 pp 657-660 (ISBN 978-3-8007-2926-5) |
| Mehner, J. E.; Shaporin, A.; Kolchuzhin, V.; Doetzel, W.; Gessner, T.: Novel Modeling Techniques of MEMS Sensors and Actuators for Electronic and System Design in Automotive Applications. 2. Fachkongress Microcar 2005 Mikrowerkstoffe, Nanowerkstoffe fur den Automobilbau, Leipzig, 2005 Jun 22 |
| Kolchuzhin,V.; Mehner,J.; Doetzel,W. : Geometrically Parameterized Finite Element Model of a Silicon Strain Gauge. 7. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2005 Oct 26-27 pp 190-195 (ISBN 3-00-016889-3) |
| Hiller,K.; Kuechler,M.; Billep,D.; Schroeter,B.; Dienel,M.; Scheibner,D.; Gessner,T.: Bonding and Deep RIE - a powerful combination for high aspect ratio sensors and actuators. SPIE Photonics West, Conf. MF01 Microfabrication, Santa Clara, January 2005; Proceedings , pp paper MF01 5715-8 |
| Otto,T.; Saupe,R.; Stock,V.; Bruch,R.; Gruska,B.; Gessner,T.: A novel dual-detector micro spectrometer. SPIE Photonics West: MOEMS and Miniaturized Systems V, San Jose; Proceedings of SPIE , 5719 (2005) pp 76-82 |
| Jia,Chenping; Wiemer,M.; Mueller,R.; Otto,T.; Gessner,T.: Fabrication of embedded micro-channels by intended under-etching and trench filling. Micro System Technologies 2005, Munich (Germany), Oct. 5-6; Proceedings, pp 71-75 (ISBN 3-7723-7040-3) |
| Jia,Chenping; Wiemer,M.; Zichner,N.; Otto,T.; Gessner,T.: Fabrication and characterisation of a bulk micro-machined ultrasonic transducer. 2005 IEEE Ultrasonic Symposium, Rotterdam (Netherlands), Sep. 19-21; Proceedings |
| Jia,Chenping; Nestler,J.; Otto,T.; Gessner,T.: FEM simulation and its application in MEMS design. 17. International Wissenschaftliche Konferenz Mittweida, Mittweida (Germany), Nov. 3-4; Proceedings (ISSN 1437-7624) |
| Bertz,A.; Lohmann,C.; Reuter,D.; Gessner,T.: Efficient and Flexible High Aspect Ratio Micromachining for the Fabrication of low-g-Sensors (invited). Microcar 2005, Leipzig, June 22; Micromaterials and Nanomaterials, Volume of Abstracts, 04 2005 (2005) p 79 (ISSN 1619-2486) |
| Puschmann,R.; Schwarzer,N.; Richter,F.; Fruehauf,S.; Schulz,S.E.: A usable concept for the indentation of thin porous films. Z. Metallkd., 96/11 (2005) pp 1272-1277 (ISSN 0044-3093) |
| Lohmann,C.; Bertz,A.; Reuter,D.; Kuechler,M.; Gessner,T.: Validierung der AIM–Technologie: Darstellung der Leistungsfähigkeit anhand hergestellter Sensor- und Aktorstrukturen. 7. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2005 Oct 26-27 (ISBN 3-00-016889-3) |
| Streiter,R.: Thermal issues of low-k, ULK and airgaps (Invited talk). Advanced Metallization Conference (AMC) 2005, Colorado Springs CO (USA), 2005 Sep 27-29 |
| Schulze,K.; Schulz,S.E.; Rennau,M.; Gessner,T.: Formation of Air Gap structures via wet etch removal of sacrificial dielectrics (Talk). Advanced Metallization Conference (AMC) 2005, Colorado Springs CO (USA), 2005 Sep 27-29 |
| Hata,S.; Froemel,J.; Gessner,T.: The improvement of the bonding strength of low temperature anodic bonding. Japan Institute of Electronics Packaging: Packaging Workshop, Tokyo, 2005 Mar 16-18 |
| Martin,J.; Cichos,F.; von Borczyskowski,C.: Confocal microscopy of electrostatic properties of Si-quantum dots and silica surfaces by charge sensitive dye molecules. Opt. Spectr., 99 (2005) pp 281-288 |
| Scheibner,D.; Mehner,J.; Reuter,D.; Gessner,T.; Doetzel,W.: A spectral vibration detection system based on tunable micromechanical resonators. Sensors and Actuators A, 123-124 (2005) pp 63-72 |
| Okada,H.; Itoh,T.; Froemel,J.; Gessner,T.; Suga,T.: Room temperature vacuum sealing using surfaced activated bonding with Au thin films. The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005 Jun 5-9; Digest of Technical papers, 1 (2005) pp 932-935 |
| Wiemer,M.; Froemel,J.; Gessner,T.; Otto,T.: Chapter Wafer bonding in micro mechanics and microelectronics - an overview. Anniversary edition 60th birthday of Herbert Reichl, 2005 Goldbogen Verlag, Dresden (Germany) ; B. Michel, R. Aschenbrenner (Hrsg.), The World of Electronic Packaging and System Integration – Anniversary edition 60th birthday of Herbert Reichl, 2005 Goldbogen Verlag, Dresden (Germany) , pp 307-313 (ISBN 3-932434-76-5) |
| Nestler,J.; Baum,M.; Otto,T.; Gessner,T.: Micro Systems Applications in Biotechnology and Health Care. Annual Report 2004; Annual Report 2004 Center for Microtechnologies (ZfM), Editors: T. Gessner, W. Seckel (2005), 2004 (2005) pp 94-95 |
| Gessner,T.; Schulz,S.E.; Hiller,K.; Otto,T.; Radehaus,C.; Doetzel,W.; Mueller,D.; Loebner,B.; Wanielik,G.; Neubert,U.; Lutz,J.: Profillinie 3: Mikroelektronik und Mikrosystemtechnik. FORSCHUNG MIT PROFIL, pp 1-162 (ISSN 0946-1817) |