Publications in 2007
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2007
Books
| Gottfried,K.; Schubert,I.; Schulze,K.; Schulz,S.E.; Gessner,T.: Chapter CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices. in the book: ICPT - International Conference on Planarization/CMP, ed. by Dr. Zwicker, Gerfried (2007) pp 297-302 (ISBN 9783800730650) |
Papers
| Iacopi,F.; Beyer,G.; Travaly,Y.; Waldfried,C.; Gage,D.M.; Dauskardt,R.H.; Houthoofd,K.; Jacobs,P.; Adriaensens,P.; Schulze,K.; Schulz,S.E.; List,S.; Carlotti,G.: Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure. Acta Materialia, 55(4) (2007) pp 1407-1414 |
| Kolchuzhin,V.; Mehner,J.; Gessner,T.; Doetzel,W.: Application of Higher Order Derivatives Method to Parametric Simulation of MEMS. EuroSimE, London (England), 2007 Apr 16-18; Proceedings, pp 588-593 (ISBN 1-4244-1106-8) |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Impact of Dielectric Material and Metal Arrangement on Thermal Behaviour of Interconnect Systems. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 445-451 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Ecke,R.; Rennau,M.; Zimmermann,S.; Schulz,S.E.; Gessner,T.: Influence of barrier crystallization on CV characteristics of MIS structures. Advanced Metallization Conference 2006 (AMC 2006), San Diego CA (USA), 2006 Oct 17-19; MRS Conf. Proc. AMC XXII, Materials Research Society, Warrendale PA (2007), pp 123-128 (ISBN 1-55899-865-9 / ISSN 1048-0854) |
| Fruehauf,S.; Gessner,T.; Haase,T.; Jakob,A.; Kohse-Hoeinghaus,K.; Lang,H.; Schulz,S.E.; Waechtler,T.: Novel Copper(I) and Silver(I) Complexes as Precursors for Chemical Vapor Deposition and Spin-Coating of Copper and Silver. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 531-533 (ISBN 978-3-8007-3009-4) |
| Wieland,R.; Ecke,R.; Klumpp,A.; Merkel,R.; Schulz,S.E.; Ramm,P.: 3D-integrated Si- and SiGe CMOS-devices by ICV-SLID technology. Smart Systems Integration 2007, Paris (F), Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 649-651 (ISBN 978-3-8007-3009-4) |
| Baum,M.; Letsch,H.; Shaporin,A.; Otto,T.; Gessner,T.: Development and Characterization of Cu to Cu bonding technology. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 427-429 (ISBN 978-3-8007-3009-4) |
| Baum,M.; Schaufuss,J.; Boese-Landgraf,J.; Otto,T.; Gessner,T.: Smart Hip Joint Implants. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 273-279 (ISBN 978-3-8007-3009-4) |
| Hiller,K.; Nestler,J.; Gessner,T.; Gavillet,J.; Getin,S.; Quesnel,E.; Martin,S.; Delapierre,G.; Soechtig,J.; Voirin,G.; Buergi,L.; Auerswald,J.; Knapp,H.F.; Stanley,R.; Bigot,S.; Dimov,S.; Ehrat,M.; Lieb,A.; Beckers,M.-C.; Dresse,D.; Victor-Pujebet,E.: Integration aspects of a polymer based SPR biosensor with active micro optical and micro fluidic elements. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 295-302 (ISBN 978-3-8007-3009-4) |
| Auerswald,J.; Niedermann,P.; Dias,F.; Keppner,H.; Bigot,S.; Beckers,M.-C.; Nestler,J.; Hiller,K.; Gessner,T.; Knapp,H.F.: Bonding of glass chip based SPR sensors to thermoplastic microfluidic scaffolds. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 153-160 (ISBN 978-3-8007-3009-4) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Auerswald,J.; Knapp,H.F.; Otto,T.; Gessner,T.: Fully integrated polymer based microfluidic pumps and valves in Lab-on-Chip systems for Point-of-Care use. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 565-568 (ISBN 978-3-8007-3009-4) |
| Bleul,K.; Bonitz,J.; Haenel,J.; Kaufmann,C.; Keiper,B.; Mehner,J.; Petsch,T.: Laser Trimming of MEMS. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 581-583 (ISBN 978-3-8007-3009-4) |
| Wiemer,M.; Froemel,J.; Hiller,K.; Reuter,D.; Jia,C.: Bulksiliziummikromechanik, Entwicklungstendenzen und Beispiele. Technologien und Werkstoffe der Mikro- und Nanosystemtechnik, Karlsruhe, 07.-08. Mai 2007; GMM-Fachbericht , 53 (2007) pp 17-24 |
| Otto,T.; Nestler,J.; Baum,M.; Schroeder,H.; Ebling,F.; Bruch,R.; Gessner,T.: Integrated polymer multimode waveguides for microfluidic sensing applications. Nanosensors, Microsensors, and Biosensors and Systems 2007, San Diego, USA, 18-22 March 2007; Proc. SPIE, 6528 (2007) pp U224-U231 (ISBN 978-0-8194-6649-5) |
| Reuter,D.; Bertz,A.; Gessner,T.: Thin Film Encapsulation of High Aspect Ratio Microstructures using sacrificial CF-Polymer. Smart Systems Integration 2007, Paris (F), 2007 Mar 27-28; Proceedings, VDE VERLAG GMBH, Berlin und Offenbach (2007), pp 597-599 (ISBN 978-3-8007-3009-4) |
| Reuter,D.; Bertz,A.; Werner,T.; Nowack,M.; Gessner,T.: Thin Film Encapsulation of Microstructures using sacrificial CF-Polymer. Transducers07, Lyon (F), 2007 Jun 11-14; Tech. Digest |
| Rudra,S.; Friedrich,M.; Louis,S.; Gordan,O.; Waechtler,T.; Zahn,D.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. 71st Annual Meeting of the Deutsche Physikalische Gesellschaft and DPG Spring Meeting of the Division Condensed Matter, Regensburg (Germany), 2007 Mar 26-30 |
| Rudra,S.; Friedrich,M.; Louis,S.J.; Waechtler,T.; Himcinschi,C.; Zahn,D.R.T.: Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits. 4th International Conference on Spectroscopic Ellipsometry, Stockholm (Sweden), 2007 Jun 11-15 |
| Waechtler,T.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Composite films of copper and copper oxide deposited by ALD . AVS 7th International Conference on Atomic Layer Deposition - ALD 2007, San Diego, California (USA), 2007 Jun 24-27 |
| Forke,R.; Scheibner,D.; Mehner,J.; Gessner,T.; Doetzel,W.: Adjustable Force Coupled Sensor-Actuator System for Low Frequency Resonant Vibration Detection. Transducers 07 - 14th International Conference on Solid-State Sensors, Actuators and Microsystems, Lyon (France), 2007 Jun 10-14; Proceedings, pp 1725-1728 (ISBN 1-4244-0841-5) |
| Roth,N.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) complexes as CVD precursors. Surf. Coat. Technol., 201 (22-23) (2007) pp 9089-9094 (ISSN 0257-8972) |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Thermal Behavior of Interconnect Systems: A Comparison of low-k, Airgap and SiO2 Integration (Talk). MicroNanoReliability, Berlin, 2007 Sept 2-5 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Electrical characterization of Airgap structures: Impact of film thickness and film permittivity on effective dielectric constant (Talk). European Congress on Advanced Materials and Processes EUROMAT, Nuernberg, 2007 Sept 10-13 |
| Waechtler,T.; Jakob,A.; Roth,N.; Oswald,S.; Schulz,S.E.; Lang,H.; Gessner,T.: Copper thin films grown via ALD of copper oxide. European Congress on Advanced Materials and Processes - EUROMAT, Nuremberg (Germany), 2007 Sep 10-13 |
| Schulz,S.E.; Ahner,N.: Deposition and properties of porous ultra-low-k dielectric films (Invited Talk). 8th Seminar Porous Glasses - Special Glasses, Wroclaw, 2007 Sept 4-8 |
| Shaporin,A.; Hanf,M.; Forke,R.; Mehner,J.; Gessner,T.; Doetzel,W.: Test-Structure based MEMS Characterization Technique. Smart Systems Integration 2007, Paris (France), 2007 Mar 27-28; Proceedings, pp 625-627 (ISBN 978-3-8007-3009-4) |
| Griffiths,C.A.; Bigot,S.; Brusseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer insert tooling for prototyping of micro fluidic components in micro injection moulding. 4M2007 - International Conference on Multi-Material Micro Manufacture, Borovets (Bulgaria), 2007 Oct 3-5; Proceedings, pp 305-308 (ISBN 978-1904445-53-1) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps. 4M2007 - International Conference on Multi-Material Micro Manufacture, Borovets (Bulgaria), 2007 Oct 3-5; Proceedings, pp 319-322 (ISBN 978-1904445-53-1) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Bigot,S.; Auerswald,J.; Gavillet,J.; Otto,T.; Gessner,T.: Electrochemical microfluidic pumps based on super absorbing polymers. uTAS2007 - 11th Internationl Conference on Miniaturized Systems for Chemistry and Life Sciences, Paris (France), 2007 Oct 7-11; Proceedings, pp 1504-1506 (ISBN 978-09798064-0-7) |
| Bonitz,J.; Kaufmann,C.; Gessner,T.; Bundesmann,C.; Eichentopf,I.-M.; Maendl,S.; Neumann,H.: Hochreflektiver mikromechanischer Scanner für Materialbearbeitung und medizinische Anwendungen. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 513-516 (ISBN 978-3-8007-3061-2) |
| Schwerdtner,R.; Otto,T.; Schuberth,R.; Bach,D.; Wegener,M.; Danz,R.; Gessner,T.: Flexible taktile Sensorarrays auf Basis verschiedener piezoelektrischer Funktionspolymere. Mikrosystemtechnik-Kongress MST 2007, Dresden(Germany), 2007 Oct 15-17; Proceedings, pp 155-158 |
| Froemel,J.; Sato,Y.; Ohtaka,K; Gessner,T.: Development of wafer level packaging for MEMS micro mirrors. Smart System Integration, Paris, 27-28. März 2007 (ISBN 978-3-8007-3009-4) |
| Froemel,J.; Zimmermann,S.; Wiemer,M.; Gessner,T.: Fabrication of SOI substrates with buried silicide layers for BICMOS-applications. Nano-Hetero System Integration, Sendai (Japan), 2007 Jul 30 |
| Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.: Reproduciple reliable AuSi eutectic wafer bond process with high yield. IMECE2007, Seattle (USA), 2007 Nov 11-15 |
| Bagdahn,J.; Bernasch,M.; Fischer,C.; Wiemer,M.: Comparison of the mechanical properties of low temperature bonded test samples. Semiconductor Wafer Bonding 9: Science, technology and application, Cancun, 2006 Okt pp 269-278 (ISBN 1-56677-506-X) |
| Wiemer,M.; Froemel,J.; Bagdahn,J.; Knechtel,R.: Waferbond technologies and quality assesment. Micromaterials and Nanomaterial, Berlin, 2007 Sept. 2-5 p 264 (ISSN 1619-2486) |
| Wiemer,M.; Bagdahn,J.; Beckert,E.; Eichler,M.; Hollaender,A.; Vogel,D.: Bonding and reliability for 3D mechanical, optical and fluidic systems. Smart System Integration, Paris, 2007 March 27-28 p 399 (ISBN 978-3-8007-3009-4) |
| Fischer,T.; Toepper,M.; Juergensen,N.; Ehrmann,O.; Wiemer,M.; Reichl,H.: Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresist. Smart System Integration, Paris, 2007 Mar 27-28 pp 473-475 (ISBN 978-3-8007-3009-4) |
| Jia,C.; Wiemer,M.; Kurth,S.; Otto,T.; Gessner,T.: Design and fabrication of a micromechanical vertical resonator. Smart System Integration, Paris, 2007 March 27-28 pp 497-499 (ISBN 978-3-8007-3009-4) |
| Wiemer,M.; Jia,C.; Froemel,J.: Herstellungstechnologie und Testverfahren von Fügeverbindungen der Sensorebenen. ZVEI: Qualifizierungsmethoden für Drucksensor-Anwendungen, Nürnberg, 2007 May 24 |
| Zimmermann,S.; Q.T.Zhao; H.Hoehnemann; Wiemer,M.; Kaufmann,C.; S.Mantl; V.Dudek; Gessner,T.: Roughness improvement of the CoSi2/Si-interface for an application as buried silicide. Material for Advanced Metallization MAM 2007, Bruges (Belgium), March 4-7 |
| Morschhauser,A.; Nestler,J.; Voigt,S.; Schueller,M.; Otto,T.; Gessner,T.: Permanentmagnetische Membranen für mikrofluidische Aktorik. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 813-815 (ISBN 978-3-8007-3061-2) |
| Voigt,S.; Morschhauser,A.: PDMS-Membran mit partiell verteilten Magnetpartikeln für Schalteranwendungen. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17; Proceedings, pp 809-812 (ISBN 978-3-8007-3061-2) |
| Baum,M.; Mann,M.; Ebling,F.; Keiper,B.; Haenel,J.; Otto,T.; Gessner,T.: Mikrostrukturierung von Kunststoffen durch Heißprägen und Laserablation. MST-Kongress 2007, Dresden (Deutschland), 2007 Okt. 15-17; Proceedings, VDE VERLAG GMBH, Berlin-Offenbach (2007), pp 623-626 (ISBN 978-3-8007-3061-2) |
| Bertz,A.; Fendler,R.; Schuberth,R.; Hentsch,W.; Gessner,T.: A New Method for High-Rate Deep Dry Etching of Silicate Glass with Variable Etch Profile. Transducers07, Lyon (France), 2007 June 10-14; Digest of Technical Papers, pp 81-84 (ISBN 1-4244-0841-5) |
| Thieme,T.; Bertz,A.; Gessner,T.; Dittrich,C.: Neue Technologie in der Herstellung – neue Chance am Markt. Mikrosystemtechnik-Kongress, Dresden (Germany), 2007 Oct 15-17; Proceedings, pp 135-138 (ISBN 978-3-8007-3061-2) |
| Nowack,M.; Reuter,D.; Rennau,M.; Bertz,A.; Gessner,T.: Wafer-Level Active Testing of Capacitive Inertial Sensors. MicroNanoReliability, Berlin (Germany), 2007 Sep 2-5; Micromaterials and Nanomaterials, p 175 (ISSN 1619-2486) |
| Jia,C.; Hiller,K.; Wiemer,M.; Otto,T.; Gessner,T.: Low-Temperature Ti-Si bonding and its application in micro-device fabrication. Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, Halle, 09.-11.12.2007 |
| Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.: Improvement of solid Au-Si eutectic bond process. Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007, 09.-11.12.2007 |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Impact of wet etch media on diffusion barriers, copper, and the Cu/SiC:H interface (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Waechtler,T.; Oswald,S.; Pohlers,A.; Schulze,S.; Schulz,S.E.; Gessner,T.: Copper and copper oxide composite films deposited by ALD on tantalum-based diffusion barriers (Poster). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Hofmann,L.; Kuechler,M.; Gumprecht,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations on via geometry and wetting behavior for the filling of Through Silicon Vias by copper electro depostition (Talk). Advanced Metallization Conference (AMC), Albany (USA), 2007 Oct 09-11 |
| Waechtler,T.; Schulz,S.E.; Oswald,S.; Gessner,T.: Atomic Layer Deposition of Copper and Copper Oxide for Applications in Microelectronic Metallization Systems. NanoScience 2007 - 5th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 2007 Oct 18-20; Micromaterials and Nanomaterials, Iss. 07/2007 (2007) pp 26-27 (ISSN 1619-2486) |
| Forke,R.; Scheibner,D.; Hiller,K.; Gessner,T.; Doetzel,W.; Mehner,J.: Spektrale Vibrationsmessung mit mikromechanischen kraftgekoppelten Silizium-Schwingern. 8. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz, 2007 Nov 14-15; Proceedings, pp 67-72 (ISBN 978-3-00-022168-2) |
| Shaporin,A.; Forke,R.; Doetzel,W.; Mehner,J.: MEMS Characterization Technique Based on Special Designed Test-Structures. Mikrosystemtechnik Kongress, Dresden, 2007 Okt 15-17; Proceedings, pp 873-876 (ISBN 978-3-8007-3061-2) |
| Leidich,S.; Hofmann,L.; Riemer,T.; Kurth,S.; Gessner,T.: Integrated Micro Resonators for Nuclear Magnetic Resonance Spectroscopy. Smart Systems Integration, Paris, 2007 Mar 27-28 (ISBN 978-3-8007-3009-4) |
| Leidich,S.; Hofmann,L.; Riemer,T.; Kurth,S.; Schubert,I.; Kaufmann,C.; Gessner,T.: Mikrospulen und RF-MEMS Varaktoren für die kernmagnetische Resonanzspektroskopie – Applikationen und Technologie. 8. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2007 Nov 14-15 (ISBN 978-3-00-022168-2) |
| Leidich,S.; Kurth,S.; Gessner,T.: Continuously Tunable RF-MEMS Varactor for High Power Applications. ISMOT, Rom, 2007 Dez 17-21 |
| Saupe,R.; Otto,T.; Weiss,A.; Stock,V.; Gessner,T.: Packaging aspects of MEMS-based optical systems. Smart Systems Integration, Paris, 2007 Mar 27-28 pp 605-607 (ISBN 978-3-8007-3009-4) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Fritzsch,U.; Gessner,T.: MEMS-based NIR-Spectrometers: The next generation of analytical instruments. The 7th International Conference on ASIC, Guillin, 2007 Oct 26-29 |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Forensische Untersuchungen mittels MEMS-Spektrometern. Mikrosystemtechnik-Kongress, Dresden, 2007 Oct 15-17 pp 493-496 (ISBN 978-3-8007-3061-2) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Mikrospiegelspektrometer für den Nahinfraroten Spektralbereich – Applikationen & Trends. 8. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2007 Nov 14-15 pp 144-147 (ISBN ISBN 978-3-00-022168-2) |
| Otto,T.; Saupe,R.; Weiss,A.; Stock,V.; Gessner,T.: Miniaturisierung in der instrumentellen Analytik dank Mikrospiegeln. apv news, 2/07 (2007) pp 14-15 |
| Froemel,J.; Wiemer,M.; Gessner,T.: AVT als Basis erfolgreicher MEMS-Kommerzialisierung. Mikroproduktion, 1/2007 (2007) pp 10-14 (ISSN 1614-4538) |
| Baum,M.; Gessner,T.: Siliziumätzen schafft Sensibilität. Mikroproduktion, 1/2007 (2007) p 16 (ISBN ISSN 1614-4538) |
| Baum,M.; Gessner,T.: Das intelligente Produkt gewinnt. Mikroproduktion, 2/2007 (2007) pp 42-43 (ISBN ISSN 1614-4538) |
| Gottfried,K.; Schubert,I.; Schulze,K.; Schulz,S.E.; Gessner,T.: CMP issues arising from novel materials and concepts in the BEOL of advanced Microelectronic Devices. ICPT - International Conference on Planarization/CMP Technology, Dresden (Germany), 2007, Oct 25-27 pp 297-302 (ISBN 9783800730650) |
| Gottfried,K.; Schubert,I.; Schulze,K.: CMP an Airgap basierten Interconnectsystemen. CMP Nutzertreffen, Duisburg, Apr 20 |
| Martin,J.; Otto,T.; Gessner,T.: Modeling of Mass Printed Organic Field Effect Transistors. Smart Systems Integration 2007, Paris (France), 2007 Mar 27-28; Proceedings, pp 549-551 (ISBN 978-3-8007-3009-4) |
| Schulze,K.; Schulz,S.E.; Gessner,T.: Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation. Materials for Advanced Metallization (MAM), Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84/11 (2007) pp 2587-2594 |
| Otto,T.; Martin,J.; Gessner,T.: Nanotechnology for polymerbased sensor and actuator arrays. 5th Leibniz Conference of Advanced Science: NanoScience 2007, Lichtenwalde (Deutschland), 2007 Oct 18-20; Proceedings, pp 64-69 |
| von Borczyskowski,C.; Cichos,F.; Martin,J.; Schuster,J.; Issac,A.; Brabandt,J.: Common luminescence intensity fluctuations of single particle and single molecules in non-conducing matrices. The European Physical Journal - Special Topics, 144 (1) (2007) pp 13-25 |
| Kurth,S.; Froemel,J.; Voigt,S.; Leidich,S.; Nestler,J.; Shaporin,A.; Doetzel,W.; Gessner,T.: Switch Arrangement with a Plurality of Switches arranged in the Form of a Matrix and Method for switching Switches arranged in the Form of a Matrix . Patentschrift WO002007104528A1, DE102006029024B3 |
| Froemel,J.; Otto,T.; Nestler,J.; Gessner,T.: Method and Device for molding Structures. Patentschrift WO002007025519A3 |
| Ahner,N.; Schulz,S.E.; Blaschta,F.; Rennau,M.: Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics. Materials for Advanced Metallization - MAM, Brugge (Belgium), 2007 Mar 4-7; Microelectronic Engineering, 84 (2007) pp 2606-2609 (ISSN 0167-9317) |
| Otto,T.; Morschhauser,A.; Nestler,J.; Voigt,S.; Gessner,T.: Verfahren und Vorrichtung zur Lokalisierung von Partikeln in Matrixwerkstoffen. Patentschrift (DE102007051977) |
| Schuberth,R.; Otto,T.; Schwerdtner,R.; Bach,D.; Wegener,M.; Gessner,T.: Demonstration des Einsatzes flächiger low-cost-Sensoren am Beispiel eines trainingsunterstützenden Tischtennisschlägers. Mikrosystemtechnik-Kongress MST 2007, Dresden (Germany); Proceedings, pp 1087-1090 |
| Masina,R.; Bruch,R.; Landry,J.P.; Zhu,X.D.; Parikh,A.N.; Otto,T.: Novel optical and biophotonic analysis on lipid based nanomaterials. SSI; Smart Systems Integration 2007 - European Conference ans Exhibition on Integration Issues of Miniaturizes Systems : MEMS, MOEMS, ICs and Electronic Components, SSI 2007, 2007 (2007) |
| Otto,T.; Martin,J.; Gessner,T.: Nanotechnology for Sensor and Actuator Arrays based on Polymers / Nanotechnologie für polymerbasierte Sensor- und Aktorarrays, Micromaterials and Nanomaterials. NanoScience 2007, volume of abstracts 7/2007, 7/2007, 7 (2007) pp 32-33 (ISSN 1619-2486) |
| Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps. International Conference on Multi-Material Micro Manufacture, Scotland; Proceedings 4M2007 - International Conference on Multi-Material Micro Manufacture. - Scotland, UK : Whittles Publishing, pp 319-322 (ISBN 978-1904445-53-1) |