Publications in 2010
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2010
Books
| Waechtler,T.: Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices. published by Universitätsverlag Chemnitz, 2010 (ISBN 978-3-941003-17-0) |
| Leidich,S.: Entwicklung eines integrierten Mikroresonators für die kernmagnetische Resonanzspektroskopie kleinster Probenvolumen (ISBN 9783941003149) |
Papers
| Nestler,J.; Morschhauser,A.; Hiller,K.; Otto,T.; Bigot,S.; Auerswald,J.; Knapp,H.F.; Gavillet,J.; Gessner,T.: Polymer Lab-on-Chip systems with integrated electrochemical pumps suitable for large scale fabrication. Int. J. Adv. Manuf. Technol., 47, 1 (2010) pp 137-145 (ISSN 0268-3768) |
| Griffiths,C.A.; Bigot,S.; Brousseau,E.; Worgull,M.; Heckele,M.; Nestler,J.; Auerswald,J.: Polymer inserts tooling for prototyping of micro fluidic components in micro injection moulding. Int. J. Adv. Manuf. Technol., 47 (2010) p 111–123 (ISSN 0268-3768) |
| Jia,C.; Wiemer,M.; Reuter,D.; Hiller,K.; Gessner,T.: A Method for the Fabrication of Extra-Thin Silicon Substrates. Smart System Integration 2010, Milano, Italy, 2010 Mar 23-24 |
| Boettge,B.; Braeuer,J.; Wiemer,M.; Petzold,M.; Bagdahn,J.: Status of low temperature bonding using reactive multilayer films. 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration, The University of Tokyo, Hongo, 2010 January 19-20; Proceedings |
| Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.: NEMS/MEMS Integration for future One-chip mobile RF-systems. DFG workshop on nanoelectronics, Bad Honnef, 2010 Jan 17-19; proceedings |
| Braeuer,J.; Boettge,B.; Wiemer,M.; Petzold,M.; Gessner,T.: Selbst ausbreitende exotherme Reaktionen als interne Wärmequelle für die Aufbau- und Verbindungstechnik von Mikrosystemen. MNI, Erfurt, 2010 Mar 3-4; Proceedings, 2 (2010) pp 14-18 (ISBN 978-3-8007-3216-6) |
| Baum,M.; Vetter,C.; Haehnel,M.; Haenel,J.; Wiemer,M.; Gessner,T.: Mikrostrukturierung von dünnen Kunststofffolien durch Heißprägen. Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, Darmstadt (Germany), 2010 May 10-11; GMM-Fachbericht, 65 (2010) pp 88-90 (ISBN 978-3-8007-3253-1) |
| Boettge,B.; Braeuer,J.; Wiemer,M.; Petzold,M.; Bagdahn,J.; Gessner,T.: Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology . Journal of Micromechanics and Microengineering, 20 (2010) pp 064018 1-8 |
| Wiemer,M.; Braeuer,J.; Wuensch,D.; Gessner,T.: Wafer Bonding as a Key Technology for 3D Integration of MEMS and Electronics . Microtech 2010, Anaheim, CA (USA), 2010 Jun 21-24; Proceedings |
| Wolf,H.; Streiter,R.; Friedemann,M.; Belsky,P.; Bakaeva,O.; Letz,T.; Gessner,T.: Simulation of TaNx deposition by Reactive PVD. Microelectronic Eng., 87 (2010) p 1907–1913 (ISSN 0167-9317) |
| Ding,S.-F.; Xie,Q.; Waechtler,T.; Lu,H.-S.; Schulz,S.E.; Qu,X.-P.: Inhibition of enhanced Cu oxidation on ruthenium. 2010 International Interconnect Technology Conference (IITC), Burlingame, CA (USA), 2010 Jun 6-9; Proceedings, pp 1-3 (ISBN 978-1-4244-7676-3) |
| Jakob,A.; Rueffer,T.; Schmidt,H.; Djiele,P.; Koerbitz,K.; Ecorchard,P.; Haase,T.; Kohse-Hoeinghaus,K.; Fruehauf,S.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: Disilver(I) Coordination Complexes: Synthesis, Reaction Chemistry, and Their Potential Use in CVD and Spin-Coating Processes for Silver Deposition. Eur. J. Inorg. Chem., (2010) pp 2975-2986 (ISSN 1434-1948) |
| Nestler,J.; Otto,T.; Sommer,J.-P.; Michel,B.; Gessner,T.; Bier,F.F.: Self-contained microfluidic cartridges for in-vitro diagnostic applications: Recent advances and improvements. Smart Systems Integration, Como (Italy), 2010 Mar 23-24; Proceedings |
| Wuensch,D.; Wiemer,M.; Gabriel,M; Gessner,T.: Low temperature wafer bonding for microsystems using dielectric barrier discharge. mst news, 1/10 (2010) pp 24-25 |
| Wuensch,D.; Mueller,B; Wiemer,M.; Gessner,T.; Mischke,H: Aktivierung mittels Niederdruckplasma zur Herstellung von Si- Verbunden im Niedertemperatur-Bereich und deren Charakterisierung mittels Mikro-Chevron-Test. MNI, Darmstadt, 2010 May 10-11; Proceedings, pp 66-71 (ISBN 978-3-8007-3253-1) |
| Baum,M.; Wiemer,M.; Gessner,T.: Untersuchungen zur in-vivo Zustandsbestimmung von Gelenkendoprothesen mit integrierten Mikrosensoren. Intelligente Implantate und Prothesen - Entwicklungen in Medizin und Technik, Charité - Universitätsmedizin Berlin, 2010 Jul 1; Poster, 24. Treffpunkt Medizintechnik (2010) |
| Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.: NEMS/MEMS and passive components integration by using novel LTCC substrate. Smart Systems Integration, Como (Italy), 2010 Mar 23-24 |
| Waechtler,T.; Ding,S.-F.; Hofmann,L.; Mothes,R.; Xie,Q.; Oswald,S.; Detavernier,C.; Schulz,S.E.; Qu,X.-P.; Lang,H.; Gessner,T.: ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. Materials for Advanced Metallization (MAM), Mechelen (Belgium), 2010 Mar 7-10 |
| Boettge,B.; Braeuer,J.; Wiemer,M.; Petzold,M.: Reaktives Bonden für spannungsarmes Fügen in der Mikrosystemtechnik. PLUS, 6 (2010) pp 1384-1390 |
| Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Investigations Regarding Through Silicon Via Filling for 3D Integration by Periodic Pulse Reverse Plating with and without Additives. Materials for Advanced Metallization (MAM), Mechelen (Belgium), 2010 Mar 7-10; Microelectron. Eng., (2010) p in press (DOI: 10.1016/j.mee.2010.07.004) (ISSN 0167-9317) |
| Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Pulse Reverse Electroplating for TSV Filling in 3D Integration. Smart Systems Integration, Como (Italy), 2010 Mar 23-24; Proceedings (ISBN 978-3-8007-3081-0) |
| Hofmann,L.; Ecke,R.; Schulz,S.E.; Gessner,T.: Metallisierungsverfahren für die 3D Integration in der Mikroelektronik und Mikrosystemtechnik. Galvanotechnik, 08/2010 (2010) pp 1880-1884 (ISBN ISSN 0016-4232 B 20696) |
| Baum,M.; Jia,C.; Haubold,M.; Wiemer,M.; Schneider,A.; Rank,H.; Trautmann,A.; Gessner,T.: Eutectic Wafer Bonding for 3-D Integration. Electronic System-Integration Technology Conference (ESTC), 2010, Berlin, 2010 Sep 14-16; Proceedings, 3rd (2010) (ISBN 978-1-4244-8553-6) |
| Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Lang,H.: Investigation of Formic Acid Reduction of Ruthenium-Containing Copper Oxide Layers Prepared by ALD . Baltic ALD 2010 & GerALD 2, Hamburg, 16.09.-17.09.; Talk |
| Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Transport in carbon nanotubes: Contact models and size effects. IWEPNM 2010, Kirchberg (Austria), 2010 Mar 6-13; Phys. Status Solidi B, 247 (2010) p 3002–3005 (ISSN 0370-1972) |
| Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Electronic Transport in Carbon Nanotubes with Copper Contacts. Psi-k, Berlin (Germany), 2010 Sep 12-16; Poster presentation |
| Braeuer,J.; Wiemer,M.; Gessner,T.: Reaktives Fügen löst Temperaturprobleme. VµE Nachrichten, 38 (2010) p 10 |
| Wiemer,M.; Braeuer,J.; Wuensch,D.; Gessner,T.: Reactive Bonding and Low Temperature Bonding of Heterogeneous Materials. ECS Transactions, 33 (2010) pp 307-318 |
| Nowack,M.; Reuter,D.; Bertz,A.; Kuechler,M.; Aurich,T.; Dittrich,C.; Gessner,T.: A Novel Three-Axis AIM Vibration Sensor for High Accuracy Condition Monitoring. IEEE Sensors 2010 Conference, Waikoloa (USA), 2010 Nov 1-4; Proceedings, pp 879-884 (ISBN 978-1-4244-8168-2) |
| Nestler,J.; Morschhauser,A.; Otto,T.; Koger,B; Brandenburg,A.; Wunderlich,K.; Ehrentreich-Foerster,E.; Bier,F.F.; Gessner,T.: Highly-integrated, low-cost in-vitro diagnostic platform for miniaturized assay development. MicroTAS, Netherlands, 2010; Proceedings, pp 1223-1225 (ISBN 978-0-9798064-3-8) |
| Schulze,K.; Jaschinsky,P.; Erben,J.; Gutsch,M.; Blaschta,F.; Freitag,M.; Schulz,S.E.; Steidel,K.; Hohle,C.; Gessner,T.; Kuecher,P.: Variable-Shaped E-Beam lithography enabling process development for future copper Damascene technology (Poster). 36th International Conference on Micro- and Nanoengineering (MNE), Genoa (Italy), 2010 Sept 19-22 |
| Fischer,T.; Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials (Talk). Advanced Metallization Conference, Albany, NY (USA), 2010 Oct 5-7 |
| Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Electronic Transport through Carbon Nanotubes with Metal Contacts. IWEPNM 2010, Kirchberg in Tirol (Austria), 2010 Mar 6-13; Poster presentation |
| Belsky,P.; Streiter,R.; Wolf,H.; Aubel,O.: Modeling of dielectric reliability in copper damascene interconnect systems under BTS conditions. Materials for Advanced Metallization (MAM 2010), Mechelen (Belgium), 2010 Mar 7-10 |
| Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. 10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, Ostende (Belgium), 2010 Sep 20-22; Proceedings, pp 48-49 |
| Belsky,P.; Streiter,R.; Wolf,H.; Schulz,S.E.; Aubel,O.; Gessner,T.: Modeling of TDDB in advanced Cu interconnect systems under BTS conditions (Talk). Advanced Metallization Conference 2010, Albany, NY (USA), 2010 Oct 5-7 |
| Hermann,S.; Fiedler,H.; Waechtler,T.; Falke,M.; Ecke,R.; Schulz,S.E.; Gessner,T.: Approaches for Fabrication of Carbon Nanotube Vias. Nanoelectronic Days 2010, Aachen (Germany), 2010 Oct 4-7; Poster presentation |
| Hammerschmidt,J.; Eck,E.-M.; Sowade,E.; Jahn,S.F.; Ebert,S.; Morschhauser,A.; Goedel,W.A.; Baumann,R.: Complete Digital Fabrication of Polymeric Microsieves. NIP26: International Conference on Digital Printing Technologies and Digital Fabrication 2010, Austin, Texas, September 2010; Proceedings, 26 (2010) pp 538-540 |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods. AMC, Baltimore (USA), October 13-15, 2009; Proceeding of the Advanced Metallization Conference 2009, pp 101-110 (ISBN 987-1-60511-218-3) |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Influence of the additives argon, O2, C4F8, H2, N2 and CO on plasma conditions and process results during the etch of SiCOH in CF4 plasma. Materials for Advanced Metallization MAM 2010, Mechelen (Belgium), 2010 Mar 7-10 |
| Zimmermann,S.; Ahner,N.; Fischer,T.; Schulz,S.E.; Gessner,T.: Talk: A combined Etch, Cleaning and k-restore Process for less damage integration of ultra low-k materials. SEMICON 2010, Dresden (Germany), October 19-21, 2010 |
| Martin,J.; Schwittlinsky,M.; Piasta,D.; Streit,P.; Billep,D.; Otto,T.; Gessner,T.: Thermoelectric generators based on polymers and nanocomposites.. Smart System Integration (SSI), Como (Italy), 2010; Proceedings |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Zimmermann,H.; Ruelke,H.; Lang,N.; Roepcke,J.; Schulz,S.E.; Gessner,T.: Etch processes for dense and porous SiCOH materials: plasma states and process results. 3rd International Workshop Plasma Etch and Strip in Microelectronics, PESM 2010, Grenoble (France), 4-5 March 2010 |
| Zimmermann,S.; Ahner,N.; Blaschta,F.; Schaller,M.; Ruelke,H.; Schulz,S.E.; Gessner,T.: Analysis of the impact of different additives during etch processes of dense and porous low-k with OES and QMS. MAM 2009, Grenoble (France), 2009 Mar 9-11; Microelectronic Engineering, 87 (2010) pp 337-342 (ISBN 0167-9317 (ISSN)) |
| Martin,J.; Piasta,D.; Hammacher,J.; Wegener,M.; Dittrich,C.; Otto,T.: Sensitive Feuchtesensoren auf der Basis von Nanokompositen.. 2. GMM-Workshop Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, Darmstadt, 2010 |
| Piasta,D.; Martin,J.; Wegener,M.; Hammacher,J.; Otto,T.; Gessner,T.: High sensitive humidity sensor based on polymers and nanocomposites.. Smart System Integration (SSI), Como (Italy), 2010; Proceedings |
| Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Charakterisierung des Ausschaltens von CdSe/Zns-Nanokristallen.. Öffentliches Statusseminar nanett, Chemnitz, 2010 |
| Schulz,B.; Taeuber,D.; Friedriszik,F.; Graaf,H.; Schuster,J.; von Borczyskowski,C.: Optical Detection of Heterogeneous Single Molecule Diffusion in Thin Liquid Crystal Films. PhysChemChemPhys, 12 (2010) pp 11555-11564 |
| Kowerko,D.; Schuster,J.; Amecke,N.; Abdel-Motaleb,M.; Dobrawa,R.; Wuerthner,F.; von Borczyskowski,C.: FRET and Ligand Related NON-FRET Processes in Single Quantum Dot-Perrylene Bisimide Assemblies. PhysChemChemPhys, 12 (2010) pp 4112-4123 |
| Koehler,D.; Pohle,A.; Konietzka,S.; Heinz,S.; Lange,A.; Billep,D.; Forke,R.; Horstmann,J.T.; Loebel,K.-U.; Ramsbeck,M.: Hochpräzise integrierte Sensorsignalverarbeitung zur Anregung, Kalibrierung und Auswertung von MEMS-Gyroskopen. 10. Chemnitzer Fachtagung Mikrosystemtechnik- Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Okt 20-21; Proceedings, pp 129-132 (ISBN 978-3-00-032052-1) |
| Huang,C.; Chen,D.; Leidich,S.; Gessner,T.: Compact meta-material transmission line balun based on meander lines structure and MEMS technology. Microelectronic Eng., 87 (2010) pp 584-587 (ISSN 01679317) |
| Akiba,A.; Mitarai,S.; Morita,S.; Ikeda,I.; Kurth,S.; Leidich,S.; Bertz,A.; Nowack,M.; Froemel,J.; Gessner,T.: A fast and low actuation voltage MEMS switch for mm-wave and its integration. IEEE International Electron Devices Meeting, San Francisco (USA), 2010 Dec 6-8 pp 828-831 |
| Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Zajadazc,J.; Gessner,T.: Nanostrukturierte Breitbandreflektoren und deren Anwendung in abstimmbaren mikromechanischen Infrarot-Filtern. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz, 20.-21. Oktober 2010 |
| Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Zajadacz,J.; Gessner,T.: Sub-wavelength structures for infrared filtering. Proc. of SPIE, Vol. No. 7713 (2010) pp 771363S-1 – 771363S-11 |
| Meinig,M.; Kurth,S.; Hiller,K.; Ebermann,M.; Gittler,E.; Gessner,T.: Entwurf und Technologie eines Dualband Fabry-Pérot-Filters für den mittleren Infrarotbereich mit zwei beweglichen Reflektoren. 10. Fachtagung Mikrosystemtechnik, Chemnitz, 21.-22. Oktober 2010 pp 32-37 |
| Ebermann,M.; Neumann,N.; Hiller,K.; Gittler,E.; Meinig,M.; Kurth,S.: Recent advances in expanding the spectral range of MEMS Fabry-Pérot filters. Proc. of SPIE, Vol. 7594 (2010) pp 75940V-75940V-10 |
| Neumann,N.; Ebermann,M.; Gittler,E.; Meinig,M.; Kurth,S.; Hiller,K.: Uncooled IR sensors with tunable MEMS Fabry-Pérot filters for the long-wave infrared range. IEEE Sensors , Hawei, 2010 |
| Ebermann,M.; Neumann,N.; Hoppe,S.; Hiller,K.; Gittler,E.; Meinig,M.; Kurth,S.: Miniaturisiertes Spektrometermodul für den mittleren und langwelligen Infrarotbereich mit mikromechanischem Dual-Band Fabry-Pérot Filter. 10. Fachtagung Mikrosystemtechnik, 21.-22. Oktober 2010 pp 26-31 |
| Specht,H.; Kurth,S.; Billep,D.; Kaufmann,C.; Gessner,T.: Image based test methodology for laser display scanners. Proc. of Smart Systems Integration |
| Hofmann,L.; Braeuer,J.; Baum,M.; Schulz,S.E.; Gessner,T.: Electrochemical deposition of reactive nanoscale metallization systems for low temperature bonding in 3D integration. AMC, Baltimore (USA), October 13-15, 2009; Proceeding of the Advanced Metallization Conference 2009, pp 241-251 (ISBN 987-1-60511-218-3) |
| Mager,T.; Reinhold,C.; Hedayat,C.: Three Dimensional Near Field Scanning Measurement Techniques for Improved RF Design.. Chemnitzer Seminar 2010 |
| Wiegand,C.; Hedayat,C.; Hilleringmann,U.: Non-linear behaviour of Charge-Pump Phase-Locked Loops. Advances in Radio Science 2010 |
| Bonitz,J.; Hermann,S.; Kaufmann,C.; Gessner,T.: Technologie zur Integration von Kohlenstoffnanoröhren für Intertialsensoren.. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20 - 21 (ISBN 978-3-00-032052-1) |
| Gessner,T.; Vogel,M.; Schulz,S.E.; Wiemer,M.; Hiller,K.; Kurth,S.: Mikro- und Nanotechnologien für Smart Integrated Systems.. Industrie Management, 6 (2010) (ISBN 1434-1980, ISBN-13: 97839442183215) |
| Gessner,T.; Vogel,M.; Hiller,K.; Otto,T.; Bertz,A.; Billep,D.: Challenges of Smart System Integration.. ECS Transaction, 27 (2010) pp 295 - 300 (ISSN 1938-6737) |
| Gessner,T.; Vogel,M.: Smart Systems Integration - Eine Herausforderung für zukünftige Mikro- und Nanosysteme.. LIFIS online (Internet-Zeitschrift des Leibniz-Instituts für interdisziplinäre Studien e.V. (LIFIS) (ISSN 1864-6972) |
| Gessner,T.; Vogel,M.; Kaufmann,C.; Hiller,K.; Kurth,S.; Nestler,J.; Otto,T.: Micro/nano technologies towards smart systems integration.. 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Shanghai (China), 2010 Nov 1 - 4 (ISBN 978-1-4244-5797-7) |
| Hermann,S.; Loschek,S.; Haibo,Y.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Integration von Kohlenstoffnanoröhren für MEMS/NEMS Anwendungen.. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, 2010 Oct 20 - 21 (ISBN 978-3-00-032052-1) |
| Hermann,S.; Pahl,B.; Ecke,R.; Schulz,S.E.; Gessner,T.: Carbon Nanotubes for Nanoscale low temperature flip chip connections.. Microelectronic Engineering, 87, 3 (2010) pp 438 - 442 |
| Jakob,A.; Rueffer,T.; Ecorchard,P.; Walfort,B.; Koerbitz,K.; Fruehauf,J.; Schulz,S.E.; Gessner,T.; Lang,H.: Phosphane copper(I) dicarboxylates: Synthesis and their potential use as precursors for the spin-coating process in the deposition of copper.. Zeitschrift für Anorganische und Allgemeine Chemie, 636, 11 (2010) pp 1931 - 1940 (ISSN 1521-3749) |
| Kuechler,M.; Hofmann,L.; Hahn,R.; Bertz,A.; Gessner,T.: Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE).. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20-21 (ISBN 978-3-00-032052-1) |
| Mothes,R.; Shen,Y.; Jakob,A.; Walfort,B.; Rueffer,T.; Schulz,S.E.; Waechtler,T.; Gessner,T.; Lang,H.: Phosphite Copper(I)Trifluoroacetates [((RO)3P)mCuO2CCF3](m = 1, 2, 3): Synthesis, Solid State Structures and Their Use as CVD Precursors.. Dalton Transactions, 39, 46 (2010) pp 11235 - 11247 |
| Oszinda,T.; Schaller,M.; Fischer,D.; Walsh,C.; Schulz,S.E.: Investigation of physical and chemical property changes of ultra low-k SiOCH in aspect of cleaning and chemical repair processes.. Microelectronic Engineering, 87, 457 (2010) |
| Oszinda,T.; Schaller,M.; Dittmar,K.; Jinag,L.; Schulz,S.E.: How to evaluate surface free energies of dense and ultra low-k dielectrics in pattern structure.. ECS Transactions, 28, 2 (2010) pp 355 - 360 (ISSN 1938-6737) |
| Oszinda,T.; Schaller,M.; Schulz,S.E.: Chemical Repair of Plasma Damaged Porous Ultra Low-k SiOCH Film Using a Vapor Phase Process. Journal of the Electrochemical Society, 157, 12 (2010) pp H1140 - H1147 (ISSN 0013-4651) |
| Oszinda,T.; Schaller,M.; Leppack,S.; Schulz,S.E.: Restoration of plasma damaged porous ultra low-k SiOCH films: A coating process with UV activation versus a vapor phase process with thermal activation. Advanced Metallization Conference (AMC 2010), Albany, NY (USA), 2010 Oct 5 - 7; MRS Conference Proc.; Materials Research Society, pp 55 - 64 (ISBN 978-1-6051-1218-3, ISSN 1048-0854) |
| Schulz,S.E.; Gessner,T.: Neue Materialien und Technologien für Nanoelektronik und Sensorik. VµE, 40 (2010) p 16 |
| Tuchscherer,A.; Shen,Y.; Jakob,A.; Mothes,R.; Al-Anber,M.; Walfort,B.; Rueffer,T.; Fruehauf,S.; Ecke,R.; Schulz,S.E.; Gessner,T.; Lang,H.: Lewis-base Copper(I)Formates: Synthesis, Reaction Chemistry, Structural Characterization and Their Use as Spin-Coating Precursors for Copper Deposition. Inorganica Chimica Acta, 365, 2 (2010) pp 10 - 19 (ISSN 0020-1693) |
| Vogel,M.; Hiller,K.; Bertz,A.; Wiemer,M.; Gessner,T.: Smart Integrated Systems - Developments of Fraunhofer ENAS. Microsystems Technology in Germany 2010/Mikrosystemtechnik in Deutschland 2010, pp 18 - 19 (ISSN 2191-7183) |
| Voigt,S.; Tenholte,D.; Franke,D.; Reuter,D.; Hiller,K.; Gessner,T.; Mehner,J.: Gütebestimmung von MEMS-Strukturen im Zeitbereich mittels Laser Doppler Vibrometer und einem Logarithmierer. 10. Chemnitzer Fachtagung Mikrosystemtechnik - Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2010 Oct 20 - 21 (ISBN 978-3-00-032052-1) |
| Shirangi,M.H.; Michel,B.: Moisture Sensitivity of Plastic Packages of IC Devices. (ed. Fan, X. J.) Springer Series on Micro- and Optoelectronic Materials, Heidelberg, New York 2010, pp 29-69 |
| Rzepka,S.; Mueller,A.; Michel,B.: Virtual Prototyping Advanced by Statistic and Stochastic Methodology. EuroSimE, Bordeaux (France), 2010 Apr 26 - 28 pp 563 - 571 |
| Sommer,J.-P.; Uhlig,P.; Kulke,R.; Michel,B.: Design of Low Loss Beam Forming Networks - Supported by Numerical Simulation and Materials Characterisation. Int. Conf. on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Xian (China), 2010 Aug 16 - 19; Proceedings, A19 (2010) pp 65 - 70 |
| Dudek,R.; Doering,R.; Kreyssig,K.; Michel,B.: Theoretical Analysis on the Shear Test. EuroSimE, Bordeaux (France), 2010 Apr 26 - 28; Proceedings |
| Hedayat,C.; Wiegand,C.: Electromagnetic Compatibility: Design of Micro and Nano Systems. Chemnitzer Seminare 2010 |
| Mager,T.; Reinhold,C.; Hedayat,C.; Schubert,G.: Vorstellung eines verbesserten dreidimensionalen Nahfeld-Scanners zur automatischen Störfestigkeits- und Störabstrahlungsanalyse im Automotiv-Umfeld. EMV 2010, Düsseldorf (Germany) |
| Mager,T.; Reinhold,C.; Hedayat,C.; Schubert,G.: Electromagnetic Near-Field Scanning in Time and Frequency Domain for EMI Characterisation. Smart Systems Integration, Como (Italy), 2010 Mar 23 - 24; Proceedings (CD-Rom) (ISBN 978-3-8007-3208-1) |
| Wiegand,C.; Hangmann,C.; Hedayat,C.; Hilleringmann,U.: A Resonance PLL-based Tracking System for Capacitive Sensors - MEMS/NEMS. Smart Systems Integration (SSI 2010), Como (Italy), 2010 Mar 23 - 24; Proceedings (ISBN 978-3-8007-3208-1 (CD-Rom)) |
| Wiegand,C.; Hedayat,C.: Schneller zum effizienten Entwurf. VµE Nachrichten - Fraunhofer Mikroelektronik, 41 (2010) p 10 |
| Wiegand,C.; Hedayat,C.: Efficient Designs Made Faster. Fraunhofer VµE - Microelectronic News, 41 (2010) p 10 |
| Baumann,R.R.; Willert,A.; Blaudeck,T.: Manufacturing of modular electronic devices employing the concept of functionality layer separations: Towards an adapted workflow for functional printing. Advances in Printing and Media Technology , 37 (2010) pp 327-334 |
| Jahn,S.F.; Blaudeck,T.; Baumann,R.R.; Jakob,A.; Ecorchard,P.; Rueffer,T.; Lang,H.; Schmidt,P.: Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing Ligand. Chemistry of Materials, 22, 10 (2010) pp 3067-3071 (ISSN 0897-4756) |
| Jahn,S.F.; Jakob,A.; Blaudeck,T.; Schmidt,P.; Lang,H.; Baumann,R.R.: Inkjet printing of conductive patterns with an aqueous solution of [AgO2C(CH2OCH2)3H] without any additional stabilizing ligands. Thin Solid Films, 518, 12 (2010) pp 3218-3222 (ISSN 0040-6090) |
| Baumann,R.R.: Roadmap for Organic and Printed Electronics. Functional Printing Workshop, Plataforma 3NEO, Madrid (Spain), 2010 Dec 2 |
| Willert,A.; Siegel,F.; Hoesel,M.; Akowanou,C.; Knittel,D.; Baumann,R.R.: Hybrid R2R-machine Concept for Aligned Deposition of Functional Materials. MRS Fall/Symposium D: Challenges in Roll-to-Roll (R2R) Fabrication for Electronics and Other Functionalities, Boston, MA (USA), 2010 Nov 29 - Dec 3 |
| Baumann,R.R.: Printable Components for Smart Objects. Proceedings of The International Conference on Flexible and Printed Electronics (ICFPE 2010), Hsinchu (Taiwan), Oct 2010 |
| Baumann,R.R.; (Vortragender:Blaudeck,T.): Support Processes for Printed Electronics. 3rd International Symposium on Laser Micromachining, Chemnitz (Germany), 2010 Oct 27 - 28 |
| Baumann,R.R.: Drucktechnische Herstellung dünner Schichten aus Funktionstinten.. Workshop: Organische Dünne Schichten - Grundlagen und Anwendungen, Dresden (Germany), 2010 Oct 22 |
| Baumann,R.R.: Printed Electronics - Eine Zukunft für Verlage?. (Podiumsdiskussion) Forum Verlagsherstellung Hot Spot Publishing Services, Frankfurt SPARKS, Frankfurter Buchmesse, Frankfurt/Main (Germany), 2010 Sept 6 |
| Baumann,R.R.: Development of intelligent printing systems for patterned material deposition. PRODI Workshop and Seminar,Fraunhofer EMFT, Munich (Germany), 2010 Oct 4 - 6 |
| Baumann,R.R.; (Vortragender:Blaudeck,T.): Gedruckte Verpackungen für das Internet der Dinge. OE-A Forum Organische und Gedruckte Elektronik - Chancen für die Verpackungstechnik, Messe FachPack, Nürnberg (Germany), 2010 Sept 30 |
| Baumann,R.R.: Functional Layers and Device Manufacturing based on Printing Technologies. Academia 2010 Workshop: Transparent and flexible Electronics, Univ. Leipzig, Leipzig (Germany), 2010 Sept 28 |
| Sridhar,A.: Surface modification of a PCB substrate for better adhesion of inkjet printed circuit structures. 37th iarigai International Research Conference, Montreal, 2010 Sept 12 - 15 |
| Sowade,E.; Blaudeck,T.; Baumann,R.R.: Printed self-organized functional layers. NanoMA 2010 Workshop: Nano and Microstructures at Interfaces, TU Chemnitz, Center of Nanostructured Materials and Analytics, Sayda, Erzgebirge (Germany), 2010 Sept 2 - 3 |
| Baumann,R.R.: Highly Flexible Printed Thin Film Battery. Micromachine/MEMS, Tokyo (Japan), 2010 July 28 - 30 |
| Baumann,R.R.: Neue Druckprodukte Drucken in der Zukunft. Japanisch-Deutsches Forum 2010 Druckmaschinen und Druckindustrie, driven by drupa, Tokyo (Japan), 2010 July 8 |
| Baumann,R.R.: Printable Batteries for Smart Objects. CIMTEC 2010: 5th Forum on New Materials, Montecatini Terme (Italy), 2010 June 13 - 18 |
| Baumann,R.R.: Printed Smart Objects: Energy and Communication Considerations. Proceedings of Large-Area, Organic and Polymer Electronics Convention 2010 (LOPE-C 10), Frankfurt/Main (Germany), June 2010 |
| Baumann,R.R.: Solution Processing of Inorganic and Hybrid Materials for Electronics and Photonics. Functional Materials, 2010 MRS Spring Meeting, Moscone West and San Francisco, CA (USA), 2010 Apr 6 - 8 |
| Baumann,R.R.: Die Zukunft des Inkjets. designforum, Wien (Austria), 2010 Mar 18 |
| Baumann,R.R.: Industrielle Druckverfahren und ihre Anwendungen im Funktionsdruck. OTTI-Fachforum Gedruckte Elektronik, Regensburg (Germany), 2010 Mar 8 - 9 |
| Baumann,R.R.: Printed functionalities of smart objects. nano Tech 2010, Tokyo (Japan), 2010 Feb 17 - 19 |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Electronic transport properties of copper atomic wires. AMC, Baltimore, MD (USA), 2009 Oct 13-15; Proceeding of the Advanced Metallization Conference , XXV (2010) pp 127-130 |
| Mohammadzadeh,S.; Streiter,R.; Gessner,T.: Geometry dependent of I-V characteristics of gold atomic-sized contacts. 9th IEEE Conference on Nanotechnology, Genoa (Italy), 2009 Jul 26-30 ; Proceeding of the IEEE-Nano, pp 884-884 (ISBN 978-1-4244-4832-6) |
| Schulze,R.; Schueller,M.; Billep,D.; G.Pfeifer: Design of Piezoelectric Cantilever Actuators for Silicon Based MEMS. Actuator 10, Bremen (Germany), 2010 Jun 14-16; Proceedings, pp 378-381 (ISBN 3-933339-12-6) |
| Schueller,M.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: LEM Based Design Optimization of SJAs. Actuator 10, Bremen (Germany), 2010 June 14-16; Proceedings, pp 983-986 (ISBN 978-3-933339-12-6) |
| Otto,T.; Saupe,R.; Stock,V.; Gessner,T.: MEMS Temmperature Scanner System: Principle, Advances and Applications. SPIE Photonics West, San Francisco, 2010 Jan 23-28; Proceedings, 7594 (2010) pp 759412-1 bis 759412-6 |
| Otto,T.; Nestler,J.; Gessner,T.: Fluidischer Aktor mit verformbarer Verschlussanordnung und langer Lagerfähigkeit. Patentanmeldung (PCT/EP2011/070061) |
| Otto,T.; Nestler,J.; Gessner,T.: Mikrofluidvorrichtung und Verfahren zum Herstellen derselben. Patentanmeldung (PCT/EP2011/070788) |
| Otto,T.; Nestler,J.; Gessner,T.: Mikrofluidisches System mit Temperierung und Verfahren zur Temperierung in einem mikrofluidischen System. Patentanmeldung (PCT/EP2011/070664) |
| Otto,T.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Gessner,T.: Picosecond Laser Micro-Machining as a versatile tool for prototyping in polymer and semiconductor based micro system technologies. ISL 2010 - International Symposium on Laser-Micromachining , Chemnitz, 2010 Oct 27-28 |
| Gessner,T.; Vogel,M.; Otto,T.; Schulz,S.E.; Baumann,R.R.: Business Units and Core Competences of Fraunhofer ENAS . Micromaterials and Nanomaterials , 12 (2010) pp 4-7 (ISSN 1619-2486) |
| Otto,T.: Micro- and Nanotechnologies for Smart Systems. Micromaterials and Nanomaterials , 12 (2010) pp 54-58 (ISSN 1619-2486) |
| Wegener,M.; Schuberth,R.; Morschhauser,A.; Otto,T.: Ferroelektrische Polymere und Ferroelektrete als piezoelektrische Wandler in großflächigen taktilen Sensor-Arrays / Ferroelectric polymers and ferroelectrets as piezoelectric transducers in large-scale tactile sensor arrays. Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, Darmstadt (Germany), 2010 05 10-11; Technologien und Werkstoffe der Mikrosystem- und Nanotechnik, 2. GMM-Workshop, Darmstadt (Germany), 2010 May 10-11, GMM-Fachbericht 65, 65, 2 (2010) pp 114-119 (ISBN 978-3-8007-3253-1) |