Publications in 2011

Publications of our scientific work

Frank Schettler, TU Chemnitz

Year 2011

Papers

Haubold,M.; Baum,M.; Schubert,I.; Leidich,S.; Wiemer,M.; Gessner,T.: Low Temperature Wafer Bonding Technologies. European Microelectronics Packaging Conference EMPC 2011, Hilton Brighton Metropole, Brighton (United Kingdom), 12.-15.09.2011

Vogel,K.; Wuensch,D.; Shaporin,A; Mehner,J.; Billep,D.; Wiemer,M.: Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers. Frattura ed Integrità Strutturale, 15 (2011) pp 21-28 (ISSN 1971-8993)

Zimmermann,S.; Ahner,N.; Fischer,T.; Schaller,M.; Schulz,S.E.; Gessner,T.: Talk: A less damage patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices . MRS Spring Meeting 2011, San Francisco (USA), April 25 - 29, 2011

Zimmermann,S.; Reich,R.; Zacher,M.; Schulz,S.E.; Gessner,T.: Prediction of wafer homogeneity maps using a virtual metrology scheme consisting of time resolved OES measurements and a neural network. 11th European Advanced Equipment Control / Advanced Process Control Conference, AEC/APC 2011, Dresden (Germany), April 4-6, 2011

Waechtler,T.; Ding,S.-F.; Hofmann,L.; Mothes,R.; Xie,Q.; Oswald,S.; Detavernier,C.; Schulz,S.E.; Qu,X.-P.; Lang,H.; Gessner,T.: ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems. Microelectron. Eng., 88 (2011) pp 684-689 (ISSN 0167-9317)

Wiemer,M.; Baum,M.; Braeuer,J.; Wuensch,D.: Fügetechnologien zur Integration von MEMS und Elektronik. Packaging von Mikrosystemen, Magdeburg, 2011 Mar 17; Proceedings

Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr effect studies of copper oxide and cobalt thin films. Poster presentation, DPG Frühjahrstagung, Dresden (Germany), 2011 Mar 13-18

Waechtler,T.; Auerswald,E.; Hoebelt,I.; Nowack,M.; Noack,E.; Gollhardt,A.; Vogel,D.; Michel,B.; Schulz,S.E.; Gessner,T.: REM/FIB-Analytik für die Smart Systems Integration. ZEISS CrossBeam Workshop, Jena (Germany), 2011 May 3-4

Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Room-temperature reactive bonding by using nano scale multilayer systems. Transducers 11, Beijing (China), 2011 Jun 5-9; Proceedings, pp 1332-1335 (ISBN 978-1-4577-0157-3)

Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.: Influence of copper on catalytic carbon nanotube growth process. IITC / MAM, Dresden (Germany), 2011 May 09-12; IEEE Proceedings (ISBN 978-1-4577-0501-4)

Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.: Influence of copper on the catalytic carbon nanotube growth process. MAM / IITC, Dresden (Germany); Poster presentation

Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Novel Post-Process Gap Reduction Technology of High Aspect Ratio Microstructures Utilizing Micro Welding. Transducers 11, Beijing (China), 2011 Jun 5-9; Proceedings, pp 1352-1355 (ISBN 978-1-4577-0156-6)

Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Schulz,S.E.; Gessner,T.; Lang,H.; Zahn,D.R.T.: An Approach for Cu ALD via Reduction of Ruthenium- Containing CuxO Films for the Metallization in Spintronic and ULSI Interconnect Systems. 11th International Conference on Atomic Layer Deposition (ALD 2011), Cambridge, MA USA, June 26-29; Oral presentation

Waechtler,T.; Mueller,S.; Hofmann,L.; Mothes,R.; Ding,S.-F.; Schulz,S.E.; Lang,H.; Qu,X.P.; Gessner,T.: Copper Films Grown via Copper Oxide ALD Integrated with Different Liner Materials for Interconnect Applications. 11th International Conference on Atomic Layer Deposition (ALD 2011), Cambridge, MA USA, June 26-29; Oral presentation

Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2. E-MRS Spring Meeting, Nice (France), 2011 May 9-13

Haubold,M.; Baum,M.; Wiemer,M.; Gessner,T.: Mechanical and electrical packaging technologies by the application of functional layers at micro and nano scale. 4. Fachkongress MicroCar 2011, Leipzig (Germany), 2011 March 1

Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Nano scale Al/Pd multilayer systems for reactive bonding in Microsystems technology. XI International Symposium on Self-Propagating High Temperature Synthesis, Anavyssos (GREECE), 2011 Sep 5-9; Proceedings

Fiedler,H.; Hermann,S.; Rennau,M.; Schulz,S.E.; Gessner,T.: Fabrication and characterisation of CNT via interconnects for application in ULSI circuits. AMC 2011, San Diego (USA), 2011 Oct 4-6; Poster presentation

Zienert,A.; Schuster,J.; Streiter,R.; Gessner,T.: Quantum mechanical methods for the simulation of electronic transport through carbon nanotubes. IITC/MAM, Dresden (Germany), 2011 May 9-12; Proceedings, pp 1-3 (ISBN 978-1-4577-0503-8)

Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Ogiewa,M.; Gerlich,L.; Ding,S.-F.; Schulz,S.E.; Gessner,T.; Lang,H; Zahn,D.R.T.; Qu,X.-P.: Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems. Semiconductor Conference Dresden, Dresden, 2011 Sep 27-28; Oral presentation

Krasselt,C.; Schuster,J.; von Borczyskowski,C.: Photoinduced hole trapping in single semiconductor quantum dots at specific sites at silicon oxide interfaces. Phys. Chem. Chem. Phys., 13, 38 (2011) pp 17084 - 17092

Imhof,S.; Wagner,C.; Thraenhardt,A.; Chernikov,A.; Koch,M.; Koester,N.S.; Kolata,K.; Chatterjee,S.; Koch,S.W.; Rubel,O.; Lu,X.; Johnson,S.R.; Beaton,D.A.; Tiedje,T.: Luminescence dynamics in Ga(AsBi). Appl. Phys. Lett. , 98 (2011) p 161104

Schulz,B.; Taeuber,D.; Schuster,J.; Baumgaertel,T.; von Borczyskowski,C.: Influence of mesoscopic structures on single molecule dynamics in thin smectic liquid crystal films. Soft Matter, 7, 16 (2011) pp 7431 - 7440

Imhof,S.; Wagner,C.; Chernikov,A.; Koch,M.; Koester,N.S.; Kolata,K.; Chatterjee,S.; Koch,S.W.; Lu,X.; Johnson,S.R.; Beaton,D.A.; Tiedje,T.; Rubel,O.; Thraenhardt,A.: Evidence of two disorder scales Ga(AsBi). Phys. Status Solidi B, 248, 4 (2011) pp 851-854

Graaf,H.; Frideriszik,F.; Wagner,C.; Borczyskowski,C.v.: Optical spectroscopy of trap states in amorphous perylene derivative films. Journal of Physical Chemistry C, 115 (2011) pp 8150-8154

Belsky,P.; Streiter,R.; Wolf,H.; Schulz,S.E.; Aubel,O.; Gessner,T.: Modeling of TDDB in advanced Cu interconnect systems under BTS conditions. Microelectronic Eng. (2011), in press

Jaschinsky,P.; Erben,J.; Choi,K.-H.; Schulze,K.; Gutsch,M.; Freitag,M.; Schulz,S.E.; Steidel,K.; Hohle,C.; Gessner,T.; Kuecher,P.: Variable-shaped e-beam lithography enabling process development for future copper damascene technology. Microelectronic Eng., 88 (2011) pp 1978-1981 (ISSN 0167-9317)

Wagner,C.; Imhof,S.; Thraenhardt,A.; Chatterjee,S.; Koch,M.; Koch,S.W.; Johnson,S.R.; Beaton,D.A.; Kolata,K.; Koester,N.S.; Lu,X.; Rubel,O.; Tiedje,T.: Disorder Effects in Ga(AsBi). DPG Frühjahrstagung, Dresden, 2011 Mar 13-18; Posterbeitrag

Fischer,T.; Ahner,N.; Zimmermann,S.; Schulz,S.E.: Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials. Microelectronic Eng.

Bigot,S.; Nestler,J.; Dorrington,P.; Dimov,S.: A Costing Methodology for Products Based on Emerging Micro and Nano Manufacturing Technologies. Micro and Nanosystems, 3, 3 (2011) pp 254-262 (ISSN 1876-4029)

Hermann,S.; Ecke,R.; Schulz,S.E.; Gessner,T.: Novel nanostructure with vertically aligned carbon nanotubes: Synthesis, structural properties and applications. NT2011, Campridge (UK), 2011 Jul 10-16; Poster

Tonndorf,P.; Hietschold,M.; Schulze,S.; Erben,J.-W.; Korodi,I.: Low Energy SEM - High Resolution, Low Charging, Low Damage. . Microscopy Conference 2011- MC2011, Kiel (Germany), 2011 Aug 28-Sep 01; Poster presentation

Haubold,M.; Schubert,I.; Leidich,S.; Wiemer,M.; Gessner,T.: Entwicklung einer Verkappungstechnologie für optisch transparente NEMS/MEMS Gehäuse mit niedrigem Temperatureintrag. Mikrosystemtechnik-Kongress, Darmstadt (Germany), 10.-12.10.2011

Besser,J.; Braeuer,J.; Wiemer,M.; Gessner,T.: Elektrochemische Abscheidung von Pd/Zn-Multilagen für das Fügen mit reaktiven Materialsystemen. Mikrosystemtechnik Kongress, Darmstadt, 2011 Oct 10-12; Proceedings

Ding,S.-F.; Xie,Q.; Mueller,S.; Waechtler,T.; Lu,H.-S.; Schulz,S.E.; Detavernier,C.; Qu,X.-P.; Gessner,T.: The Inhibition of Enhanced Cu Oxidation on Ruthenium/Diffusion Barrier Layers for Cu Interconnects by Carbon Alloying into Ru. J. Electrochem. Soc., 158, 12 (2011) pp H1228-H1232 (ISSN 0013-4651)

Waechtler,T.; Mueller,S.; Schulz,S.E.; Gessner,T.: Process Development for the ALD of Thin Copper Films for ULSI Metallization Systems and Magnetosensors. SENTECH Plasma Process Technology Seminar, Berlin (Germany), 2011 Nov 22

Waechtler,T.; Mueller,S.; Mothes,R.; Tuchscherer,A.; Schubert,C.; Lehmann,D.; Haidu,F.; Schaefer,P.; Schulz,S.E.; Lang,H.; Albrecht,M.; Zahn,D.R.T.; Gessner,T.: Copper ALD for Applications in ULSI Metallization Systems and Spintronic Layer Stacks. IMEC Workshop on Atomic Layer Deposition for Applications in Nanotechnology, Leuven (Belgium), 2011 Nov 28-29

Wiemer,M.; Braeuer,J.; Besser,J.; Wuensch,D.: Developement trends in the field of wafer bonding technologies. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, pp 13-14

Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, pp 79-80

Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Lokales Mikroschweißen als post-process Technologie zur permanenten Reduzierung des Elektrodenabstandes von HARMS. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 610-613 (ISBN 978-3-8007-3367-5)

Leidich,S.; Kurth,S.; Nowack,M.; Bertz,A.; Froemel,J.; Kaufmann,C.; Gessner,T.: HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 976-979 (ISBN 978-3-8007-3367-5)

Kurth,S.; Leidich,S.; Bertz,A.; Nowack,M.; Kaufmann,C.; Faust,W.; Gessner,T.: Reliability enhancement of Ohmic RF MEMS switches. SPIE Photonics West, San Francisco (USA), 2011 Jan 22-27; Proceedings, Vol. 7928-11 (2011)

Kurth,S.; Voigt,S.; Leidich,S.; Nowack,M.; Bertz,A.; Gessner,T.: Kapazitiver MEMS-Mischer und Signalfilter für wake up receiver. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 988-991 (ISBN 978-3-8007-3367-5)

Voigt,S.; Nowack,M.; Bertz,A.; Leidich,S.; Meinig,M.; Kurth,S.; Gessner,T.; Grosser,V.; Braunschweig,M.; Krumm,R.: Autarkes Sensornetzwerk zur Überwachung von Hochspannungsleitungen. Mikrosystemtechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 354-357 (ISBN 978-3-8007-3367-5)

Froemel,J.; Baum,M.; Wiemer,M.; Roscher,F.; Haubold,M.; Jia,C.; Gessner,T.: Investigations of Thermocompression Bonding with thin Metal Layers. 16th International IEEE Conference on Solid-State Sensors, Actuators & Microsystems, Peking, 2011 Jun 5-9; proceedings, pp 990-994 (ISBN 978-1457701573)

Baum,M.; Gessner,T.: Nano Technologies for Smart Systems Integration. Sensors Expo 2011, Conference and Exhibition, Rosemont/Chicago (USA), 2011 Jun 6-8; Presentation

Baum,M.; Roscher,F.; Froemel,J.; Jia,C.; Rank,H.; Hausner,R.; Reichenbach,R.; Wiemer,M.; Gessner,T.: Metal Thermo Compression Bonding at Wafer Level and its Capabilities for 3D Integration. Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, p 83

Baum,M.; Wiemer,M.: An investigation of nano patterned surfaces and their influence on cell behavior. Tech Connect World - BioNanotech 2011, Boston (USA), 2011 Jun 13-16; Poster and Presentation

Meinig,M.; Kurth,S.; Hiller,K.; Neumann,N.; Ebermann,M.; Gittler,E.; Gessner,T.: Tunable mid-infrared filter based on Fabry-Perot interferometer with two movable reflectors. MOEMS and Miniaturized Systems X, San Francisco, CA (USA), 2011 Jan 24-26; Proceedings of SPIE, 7930 (2011) p 79300K (ISBN 9780819484673)

Baum,M.; Besser,J.; Vetter,C.; Sanchez Ordonez,S.; Wang,X.; Harazim,S.; Schmidt,O.; Wiemer,M.; Gessner,T.: Nano patterned surfaces and their influence on living cells. Biomedizinische Technik 2011, Freiburg, 2011 Sep 27-30; Proceedings Biomed Tech 2011, 56 (Supplement 1) (2011) p Poster P86 (ISSN 0939-4990)

Meinig,M.; Ebermann,M.; Neumann,N.; Kurth,S.; Hiller,K.; Gessner,T.: Dual-band MEMS Fabry-Pérot filter with two movable reflectors for mid- and long-wave infrared microspectrometers. TRANSDUCERS, Beijing (China), 2011 Jun 5-9; Proceedings, pp 2538-2541 (ISBN 978-1-4577-0157-3 )

Ebermann,M.; Neumann,N.; Meinig,M.; Kurth,S.; Hiller,K.; Gittler,E.: Tunable micromachined Fabry-Pérot Filters for infrared spectroscopy: current state and prospects. Smart Systems Integration, Dresden (Germany), 2011 Mar 22-23; Proceedings (ISBN 978-3-8007-3324-8)

Specht,H.; Meinig,M.; Kurth,S.; Hiller,K.; Ebermann,M.; Neumann,N.; Gittler,E.; Gessner,T.: Neuartiger frequenz- und amplitudenabstimmbarer Infrarotfilter. Mikrosystemtechnik Kongress, Darmstadt (Germany), 2011 Oct 10-12; Proceedings, pp 106-109 (ISBN 978-3-8007-3367-5)

Ebermann,M.; Meinig,M.; Kurth,S.; Hiller,K.; Gittler,E.; Neumann,N.: Tiny MID- and Long-Wave Infrared Spectrometer Module with a mems Dual-Band Fabry-Pérot Filter. IRS², Nürnberg (Germany), 2011 Jun 7-9; Proceedings

Kurth,S.; Seifert,M.; Zajadacz,J.; Ebermann,M.; Hiller,K.; Neumann,N.; Gessner,T.: Application of sub-wavelength structures in infrared optical filters. Smart System Integration, Dresden, 2011 March 22-23 (ISBN ISBN 978-3-8007-3324-8)

Wietstruck,M; Kaynak,M.; Tillak,B.; Kurth,S.; Erler,B.: Materialcharakterisierung eines komplexen Metallschichtstapels für einen monolithischintegrierten RF-MEMS-Schalter. Mikrosystemtechnik Kongress, Darmstadt, 2011 Oct. 10-12 (ISBN ISBN 978-3-8007-3367-5 ISBN 978-3-8007-3367-5 ISBN 978-3-8007-3367-5 ISBN 978-3-8007-3367-5)

Weiss,A.; Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Fabrication of an all-spin-coated CdSe/ZnS Quantum Dot Light-Emitting Diode. SPIE Photonics West 2011, San Francisco (USA), 2011 Jan 22-27; Proceedings of SPIE, 7945, Quantum Sensing and Nanophotonic Devices VIII, 79452Q (2011)

Martin,J.; Piasta,D.; Weiss,A.; Otto,T.; Gessner,T.: The Fluorescence of Semiconductor Nanocrystals - From Basics to Nanosensor Technology. MicroCar 2011 - Micromaterials, Nanomaterials for Automotives, Leipzig (Germany), 2011 Mar 1; Proceedings, 13 (2011) pp 202-205 (ISSN 1619-2486)

Weiss,A.; Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Fabrication of an all-spincoated CdSe/ZnS Quantum Dot Light-Emitting Diode. Smart System Integration (SSI), Dresden (Germany), 2011 Mar 22-23; Proceedings, p paper 106 (ISBN 978-3-8007-3324-8)

Schueller,M.; Schulze,R.; Zeising,V.; Gebauer,C.; Otto,T.; Gessner,T.: Model based design of micro actuators for flow control applications. Smart System Integration (SSI), Dresden (Germany), 2011 Mar 22-23; Proceedings, p Paper 97 (ISBN 978-3-8007-3324-8)

Martin,J.; Piasta,D.; Otto,T.; Gessner,T.: Influence of Charges on the Photolumindescence of Semiconductor Nanocrystals. Smart System Integration (SSI) 2011, Dresden (Germany), 2011 Mar 22-23; Proceedings, p Paper 85 (ISBN 978-3-8007-3324-8)

Martin,J.; Piasta,D.; Kiessling,T.; Otto,T.; Gessner,T.; Staudinger,U.; Demir,E.; Poetschke,P.; Voit,B.: Material integrated sensor films based on photoluminescent quantum dots. Euromat, Montpellier (France), 2011 Sept 12-15

Martin,J.; Piasta,D.; Kiessling,T.; Otto,T.; Gessner,T.; Staudinger,U.; Demir,E.; Poetschke,P.; Voit,B.: Materialintegrierte Zustandsüberwachung mit Halbleiter-Nano-Kristallen. Öffentliches Statusmeeting zum Kompetenznetzwerk für Nanosystemintegration, Chemnitz (Germany), 2011 Nov 3

Martin,J.; Piasta,D.; Kiessling,T.; Otto,T.; Gessner,T.; Staudinger,U.; Demir,E.; Poetschke,P.; Voit,B.: Materialintegrierte Sensorschicht basierend auf Quantum-Dot Limineszenz. Mikrosystemtechnikkongress (MST), Darmstadt (Germany), 2011 Okt 10-12; Proceedings, CD-ROM (ISBN 978-3-8007-3367-5)

Schueller,M.; Schulze,R.; Gebauer,C.; Lipowski,M.; Kaulfersch,E.; Nestler,J.; Otto,T.; Gessner,T.: Netzwerkmodellierung von Doppelwandler Synthetic Jet Aktoren. Deutscher Luft- und Raumfahrtkongress 2011, Bremen, 2011 Sept 27-29

Heinrich,M.; Schulze,R.; Wegener,M.; Kroll,L.; Walther,M.; Schueller,M.; Gessner,T.: Polymer-based piezoelectric modules by microinjection moulding technology for SHM. 5th International Conference on Structural Health Monitoring of Intelligent Infrastructure (SHMII-5), Cancún (Mexico), 2011 Dec 11-15; Proceedings

Baum,M.; Roscher,F.; Wiemer,M.; Gessner,T.; Raukopf,S.; Gebhardt,C.: Sensormodul und Verfahren zum Herstellen eines Sensormoduls. Patentanmeldung, DE 10 2011 001 422.5-54 (2011)

Schulze,R.; Heinrich,M.; Wegener,M.; Schueller,M.; Kroll,L.; Gessner,T.: Mikrosysteme auf Basis der Mehrkomponentenmikrospritzgießtechnologie (Microsystems based on Multi Component Micro Injection Moulding Technology). Mikrosystemtechnik Konferenz 2011, Darmstadt (Germany), 2011 Oct 10-12 pp 583-586 (ISBN 978-3-8007-3367-5 )

Gossler,C.; Kunzer,M.; Baum,M.; Wiemer,M.; Moser,R.; Passow,T.; Koehler,K.; Schwarz,U.T.; Wagner,J.: Aluminum-Germanium Wafer Bonding of (AlGaIn)N Thin Film Light-Emitting Diodes. Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, 2011 (2011) p 23f

Balaj,I.; Raschke,R.; Baum,M.; Uhlig,S.; Wiemer,M.; Gessner,T.: New generation of electrostatic carrier technology (T-ESC)for reversible thin wafer clamping with seal glass bonding. Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Chemnitz (Germany), 2011 Dec 6-8; Proceedings, 2011 (2011) p 111

Baum,M.: Nanoeffekte bieten neue Möglichkeiten für das Waferlevel-Packaging. 11. Chemnitzer Seminar Nanotechnology, Nanomaterials, and Nanoreliability, Chemnitz, 2011 Nov 24; Presentation

Baum,M.: Nanostrukturen und Nanomaterialien in Elektronik, Sensorik und Mikrosystemtechnik. Kuratoriumssitzung des Fraunhofer ENAS, Chemnitz, 2011 Sep 27; Presentation

Schulze,R.; Billep,D.; Bach,D.; Gratias,A.; Gessner,T.: Wake-up-generator detecting external events of mechanical excitation for the improvement of energy efficient wireless inertial sensor systems. Smart System Integration (SSI), Dresden, 2011 Mar 22-23; Proceedings, paper 98 (2011) (ISBN 978-3-8007-3324-8 )

Wen,Q.; Billep,D.; Schulze,R.; Gessner,T.: Rotating free fluid kinetic energy harvester based on Karman vortex street. Smart System Integration (SSI); Proceedings, paper 107 (2011) (ISBN 978-3-8007-3324-8)

Voigt,S.; Leidich,S.; Gratias,A.; Kurth,S.; Keutel,T.; Gessner,T.: Radio transmission system for power line monitoring. Smart System Integration, Dresden, 2011 March 22-23; Proceedings, p Paper 53 (ISBN 978-3-8007-3324-8)

Hammerschmidt,J.; Baumann,R.R.: Inkjet Printed Functionalities in Chemnitz. 7th ROND Conference, Örnsköldsvik (Sweden), 2011 March 1

Baumann,R.R.: Printed Functionalities and the Concept of Functional Layer Separations (keynote). WAN-AFRA Printing Summit 2011, Mainz (Germany), 2011 Apr 6-7

Marjanovic,A.; Sridhar,A.; Kus,M.; Ozel,F.; Akin,I.; Yenel,E.; Baumann,R.R.: Low temperature processing of inkjet printed metal oxides and nanoparticles. Large-Area, Organic and Polymer Electronics Convention 2011 (LOPE-C 11); Proceedings, p 111, Frankfurt/Main (Germany), 2011 June; Organic Electronics Association (OE-A) (ISBN 978-3-00-034957-7)

Baumann,R.R.: Printed Smart Objects and their Digital Fabrication (invited). International Conference on Additive Manufacturing, Loughborogh University, Loughborogh (United Kingdom), 2011 July 12

Magorian-Friedlmeier,T.; Ahlswede,E.; Romanyuk,Y.; Uhl,A.; Tiwari,A.; Baumann,R.R.; Kololuoma,T.; McAdam,C.; Kaelin,M.; Cemernjak,M.; Van Genechten,D.; Stassin,F.; Quintilla,A.: Non-Vacuum Processes for Deposition of the CIGS Active Layer in PV Cells. 26th EU PVSEC; Proceedings, paper ID 3DV.1.15, Hamburg (Germany), 2011 Sept 5-9 (ISBN http://www.eupvsec-planner.com/presentations/c10677/nova-cigs_non-vacuum_processes_for_depostion_of_the_cigs_active_layer_in_pv_cells.htm)

Baumann,R.R.: Digital Manufacturing of Printed Smart Objects (invited). German-Thai Symposium on Nanoscience and Nanotechnology 2011 on GREEN TECHNOLOGY FOR THE FUTURE, Nakhon Ratchasima (Thailand), 2011 Sept 11-14

Hammerschmidt,J.; Weise,D.; Baumann,R.R.: Micro-three-dimensional patterning by inkjet printing of UV curable inks. NP27-27th International Conference on Digital Printing Technologies / Digital Fabrication 2011; Proceedings, page 811-814, Minneapolis (USA, 2011 Oct 2-6 (ISBN 978-0-89208-296-4)

Baumann,R.R.: Printed Smart Objects and their Digital Fabrication (Keynote). IS&Ts Digital Fabrication Conference 2011 , Minneapolis/Minnesota (USA), 2011 Oct 10

Baumann,R.R.: Printing Beyond Color: Printed Smart Objects and their Digital Fabrication (keynote). ISL Asia 2011 - International Symposium on Laser-Microprocessing, Hong Kong Science Park, Hong Kong (China), 2011 Oct 20

Baumann,R.R.: Functionality Formation in Printed Flexible Electronics (invited). International Workshop on "Subsecond thermal processing of Advanced Materials 2011" (subtherm-2011), Dresden (Germany), 2011 Oct 27

Baumann,R.R.: Digital Manufacturing of Printed Electronics (invited). Symposium on Roll-to-Roll Processing of Printed Electronics and Functional Films, Singapore Institute of Manufacturing Technology, 2011 Nov 23

Baumann,R.R.: Organic and Printed Electronics enabling Electronics Everywhere (keynote). swiss e-print conference on printed electronics and functional materials, Basel (Switzerland), 2011 Dec 1

Sridhar.A.; Blaudeck,T.; Baumann,R.R.: Inkjet Printing as Key Enabling Technology for Printed Electronics. Material Matters , 6, 1 (2011) pp 12-15 (ISSN 1933-9631)

Marjanovic,A.; Hammerschmidt,J.; Perelaer,J.; Farnsworth,S.; Rawson,I.; Kus,M.; Yenel,E.; Tilki,S.; Schubert,U.; Baumann,R.R.: Inkjet printing and low temperature sintering of CuO and CdS as functional electronic layers and Schottky diodes. Journal of Materials Chemistry , 35 (2011) pp 13634-13639 (ISBN 1573-4803 (electronic version))

Sridhar.A.; Baumann,R.R.: Printed Smart Objects for the Internet of Things. Industrial Materials, 292, 04 (2011) pp 101-106 (ISSN 1022-9787)

Sowade,E.; Hammerschmidt,J.; Blaudeck,T.; Baumann,R.R.: In-flight inkjet self-assembly of spherical nanoparticle aggregates. Advanced Engeneering Materials (ISBN 1527-2648 (electronic version))

Willert,A.; Hammerschmidt,J.; Baumann,R.R.: Mass Printing Technologies for Technical Applications. Scientific Papers of the University of Pardubice, Series A, 17 (2011)

Zichner,R.; Baumann,R.R.: 3-D transponder antennas for future SHF RFID applications. Advances in Radio Science, 9 (2011) pp 401-405 (ISBN 1684-9965 (printed), 1684-9973 (electronic))

Sommer,J.-P.; Hofmann,T.; Gottwald,T.; Podlasky,A.: Leistungselektronik im Automobil mit hoher Integrationsdichte (Vortrag). MicroCar 2011; Proceedings, Leipzig (Germany), 2011 Mar 1; Series Micromaterials and Nanomaterials, pp 126-129 (ISSN 1619-2486)

Hofmann,T.; Sommer,J.-P.; Michel,B.: Project VISA: Fully Integrated Power Electronic Systems for Automotive Electronics (Poster). MicroCar 2011, Leipzig (Germany), 2011 Mar 1; Series Micromaterials and Nanomaterials, pp 234-235 (ISSN 1619-2486)

Hoelck,O.; Dermitzaki,E.; Wunderle,B.; Bauer,J.; Michel,B.: Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modeling. J. Microelectronics Reliability, 51 (2011) pp 1027-1034

Auersperg,J.; Vogel,D.; Auerswald,E.; Rzepka,S.; Michel,B.: Nonlinear Copper Behavior of TSV for 3D-IC-Integration and Cracking Risks during BEoL-Built-up.. 13th Electronics Packaging Technology Conference EPTC 2011; Proceedings (on stick file: F5.1-P0129.pdf), Singapore

Auersperg,J.; Dudek,R.; Oswald,J.; Michel,B.: Interaction Integral and Mode Separation for BEoL-cracking and -delamination Investigations under 3D-IC Integration Aspects. 12th Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011; Proceedings (on Conf-CD-ROM, paper 68), Linz (Austria), 2011 Apr 18-20

Auersperg,J.; Vogel,D.; Lehr,M.U.; Grillberger,M.; Rzepka,S.; Michel,B.: Aspects of Chip/Package Interaction and 3-D Integration Assessed by the Investigation of Crack and Damage Phenomena in low-k BEoL Stacks. IEEE Inf. Conf. IITC/MAM; Proceedings, 2011 May 8-12

Dudek,R.; Pufall,R.; Seiler,B.; Michel,B.: Studies on the Reliability of Power Packages Based on Strength and Fracture Criteria. EuroSimE 2011; Proceedings, Brussels (Belgium), 2011 May

Rzepka,S.; Walter,H.; Pantou,R.; Freed,Y.; Michel,B.: Accelerated fatigue testing methodology for reliability assessments of fiber reinforced composite polymer materials in micro/nano systems. 12th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2011; Proceedings (CD-ROM, paper 58), Linz (Austria), 2011 Apr 18-20

Dudek,R.: Popcorn Cracking (book chapter in G. Grossmann, C. Zardini (eds.): The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. Springer Verlag, London, 2011).

Dudek,R.: Thermal Fatigue Analysis. (book chapter in G. Grossmann, C. Zardini (eds.): The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects. Springer Verlage, London, 2011).

Freed,Y.; Rzepka,S.: An implementation of an accelerated testing methodology to obtain static, creep and fatigue master curves of a T300/913 unidirectional composite material. 26th ICAF Symposium, Montreal, 2011 Jun 1-3; in: Komorowski, J.: ICAF 2011 Structural Integrity: Influence of Efficiency and Green Imperatives., pp 145-153

Roscher,F.; Baum,M.; Gebhardt,C.; Raukopf,S.; Wiemer,M.; Gessner,T.: Si Interposer Technologies for three dimensional Sensor Systems. Smart Systems Integration, Dresden, Germany, 2012 Mar 22-23; Proceedings, p Paper 94 (ISBN 978-3-8007-3324-8)

E.I.Zenkevich; E.I.Sagun; V.N.Knyukshto; A.S.Stasheuski; V.A.Galievsky; A.P.Stupak; Blaudeck,T.; C.von Borczyskowski: Quantitative Analysis of Singlet Oxygen 1O2 Generation via Energy Transfer in Bioconjugates Based on Semiconductor Quantum Dots and Porphyrin Ligands. Journal of Physical Chemistry C, 115, 44 (2011) pp 21535-21545 (ISSN 1932-7447)

Lin,Y.-C.; Froemel,J.; Sharma,P.; Inoue,A.; Esashi,M.; Gessner,T.: Zr-based metallic glass as a novel MEMS bonding material. Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, Beijing, 2011 Jan 5-9 pp 509-512

Schubert,I.; Gottfried,K.; Wuensch,D.; Baum,M.; Martinka,R.: CMP process development and adaption for wafer bonding. ICPT, Seoul (South Korea), 2011 November 9-11; Proceedings, pp 270-277

Wuensch,D.; Braeuer,J.; Wiemer,M.; Gessner,T.: Plasma activated bonding of the heterogeneous material combinations LiTaO3/Si and poly-Si/SiO2. SSI, Dresden (Germany), March 22-23; Proceedings (ISBN 978-3-8007-3324-8)

Otto,T.; Enderlein,T.; Nestler,J.; Morschhauser,A.; Klenert,P.; Gessner,T.: Micromachining of polymers on base of renewable raw materials for microfluidic systems. MikroSystemTechnik Kongress 2011, Darmstadt, 2011 Oct 10-12; Proceedings, pp 654-657 (ISBN 978-3-8007-3367-5)

Frers,T.; Assion,F.; Berth,G.; Zrenner,A.; Hilleringmann,U.: Variable Coupling of Microcavities with Poly-Silicon Heater. Smart System Integration 2011, Dresden (Germany), 2011 Mar 22-23; Proceedings, Paper 67 (2011) (ISBN 978-3-8007-3324-8)

Hilleringmann,U.; Wolff,K.; Assion,F.; Vidor,F.F.; Wirth,G.I.: Semiconductor Nanoparticles for Electronic Device Integration on Foils. IEEE Africon 2011, Livingstone (Zambia), 2011 Sep 13-15 (ISSN 2153-0025)

Meyer zu Hoberge,S.; Hilleringmann,U.; Jochheim,C.; Liebich,M.: Piezoelectric sensor array with evaluation electronic for counting grains in seed drills. IEEE Africon 2011, Livingstone (Zambia), 2011 Sep 13-15 (ISBN 2153-0025, 978-1-61284-992-8 (Print), 978-1-61284-993-5)

Mager,T.; Reinhold,C.; Hedayat,C.: Three Dimensional Near Field Scanning Measurement Techniques for Im-proved RF Design. MicroCar 2011, Leipzig (Germany), 2011 Mar 1

Reinhold,C.; Hangmann,C.; Mager,T.; Hedayat,C.; Hilleringmann,U.: Plane Wave Spectrum Expansion from Near-Field Measurements on Non-Planar Lattices. 5th International Conference on Electromagnetic Near-Field Characterization and Imaging - ICONIC 2011 (IEEE), Rouen (France), 2011 Nov 30-Dec 2

Wiegand,C.; Hangmann,C.; Hedayat,C.; Hilleringmann,U.: Modeling and Simulation of Arbitrary Ordered Nonlinear Charge-Pump Phase-Locked Loops. Semiconductor Conference Dresden (SCD), Dresden (Germany), 2011 Sep 27-28 (ISBN 978-1-4577-0431-4 (print))

Vidor,F.F.; Wolff,K.; Hilleringmann,U.: Performance Improvement and Hysteresis Reduction for Printable ZnO-Nanoperticle Thin-Film Transistors. Smart System Integration (SSI), Dresden (Germany), 2011 Mar 22-23; Proceedings (ISBN 978-3-8007-3324-8)

Wolff,K.; Hilleringmann,U.: Integration Technique for Optically Transparent ZnO Nanoparticle Thin-film Transistors. Smart System Integration (SSI), Dresden (Germany), 2011 Mar 22-23; Proceedings (ISBN 978-3-8007-3324-8)

Wolff,K.; Hilleringmann,U.: Solution processed inverter based on zinc oxide nanoparticle thin-film transistors with poly(4-vinylphenol) gate dielectric. Solid-State Electronics, 62, 1 (2011) pp 110-114 (ISSN 0038-1101)

Lee,J.-W.; Lin,Y.-C.; Kaushik,N.; Sharma,P.; Makino,A.; Inoue,A.; Esashi,M.; Gessner,T.: Micromirror with large-tilting angle using Fe-based metallic glass. Optics Letters, 36, 17 (2011) pp 3464-3466

Lee,J.-W.; Lin,Y.-C.; Chen,N.; Louzguine,D.V.; Esashi,M.; Gessner,T.: Development of the Large Scanning Mirror using Fe-based Metallic Glass Ribbon. Journal of Japanese Applied Physics, 50, 8R (2011) pp 087301-1-087301-3

Mueller,M.; Roscher,F.; Sowade,E.; Seifert,T.; Wiemer,M.; Gessner,T.; Baumann,R.R.: Aerosol jet as a deposition method for conductive layers in micro- system-technology using nanoparticle inks. Printing Future Days, Chemnitz, 2011 Nov

Roscher,F.; Baum,M.; Braeuer,J.; Wuensch,D.; Wiemer,M.; Gessner,T.: Current Results and Future Approaches in Wafer-Level-Packaging at Fraunhofer ENAS. Semicon Europe , Dresden, 2011 Oct 11-13

Chen,N.; Roscher,F.; Asao,N.; Louzguine-Luzgin,D.V.; Sharma,P.; Wang,J.Q.; Xie,G.Q.; Ishikawa,Y.; Hatakeyama,N.; Lin,Y.C.; Esashi,M.; Yamamoto,Y.; Inoue,A.: Formation and properties of Au-based nanograined metallic glasses. Acta Materialia, 59, 16 (2011) pp 6433-6440

Kuechler,M.; Hofmann,L.; Hahn,R.; Bertz,A.; Gessner,T.: Eingesetzte Ätzanlage; Fortschritte in der Anwendung des tiefen Siliziumätzens (DRIE). 1. Workshop "Tiefes Siliziumätzen", Dresden, Fraunhofer IPMS, 2011 Feb 14

Gessner,T.; Vogel,M.; Otto,T.; Schulz,S.E.; Baumann,R.R.: Smart Systems. CSTIC, Shanghai (China), 2011 03 13-14; China Semiconductor Technology International Conference 2011 (CSTIC), 2011 Mar 13-14, Shanghai (China), ECS Transactions, vol. 34 (1) 2011, 34, 1 (2011) pp 1059-1064