Publications in 2012
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2012
Books
| Wiemer,M.; Wuensch,D.; Braeuer,J.; Gessner,T.: Chapter Plasma-Activated Bonding. in the book: Handbook of Wafer Bonding, ed. by Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo (2012) pp 101-118 (ISBN 978-3-527-32646-4) |
| Forke,R.: Mikromechanisches kraftgekoppeltes Sensor-Aktuator-System für die resonante Detektion niederfrequenter Schwingungen (ISBN 978-3-941003-74-3) |
| Wietstruck,M.; Kaynak,M.; Zhang,W.; Wolansky,D.; Kurth,S.; Erler,B.; Tillack,B.: Chapter Material properties characterization of BiCMOS BEOL metal stacks for RF-MEMS applications. in the book: Novel RF MEMS Technologies, ed. by G. Papaioanou, A. Muller, D. Dascalu, R. Sorrentino (2012) pp 161-170 (ISBN 978-973-27-281-0) |
Papers
| Enderlein,T.; Baum,M.; Nestler,J.; Otto,T.; Besser,J.; Wiemer,M.; John,B.; Haenel,J.; Gessner,T.: Laser Micromachining and micro hot embossing for highly integrated Lab-on-Chip Systems. Smart System Integration (SSI), Zürich, 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Schumacher,S.; Nestler,J.; Otto,T.; Wegener,M.; Ehrentreich-Foerster,E.; Michel,D.; Wunderlich,K.; Palzer,S.; Sohn,K.; Weber,A.; Burgard,M.; Grzesiak,A.; Teichert,A.; Brandenburg,A.; Koger,B.; Albers,J.; Nebling,E.; Bier,F.F.: Highly-integrated lab-on-chip system for point-of-care multiparameter analysis. Lab Chip, 12, 3 (2012) pp 464-473 (ISSN 1473-0197) |
| Jia,C.; Reuter,D.; Wen,Zhiyu; Baum,M.; Wiemer,M.; Gessner,T.: FEM simulation and its application in MEMS design . Proceedings of 2011 Semiconductor Conference Dresden (SCD) , Dresden, 27-28 Sept. 2011 (ISBN 978-1-4577-0431-4 ) |
| Haubold,M.; Lin,Y.; Froemel,J.; Wiemer,M.; Esashi,M.; Gessner,T.: A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface. Microsystem Technologies |
| Reuter,D.; Ghosh,J.; Rennau,M.; Hiller,K.; Salvan,G.; Fronk,M.; Zahn,D.R.T.; Bof Bufon,C.C.; Schmidt,O.G.: I-V Characteristics of Copper Phthalocyanine Based Laterally Stacked Devices Fabricated by Semiconductor Processing. Poster presentation, DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Arekapudi,P.K.; Reuter,D.; Lehmann,D.; Zahn,D.R.T.: Structural and Electrical Characterization of 3D Gate Organic Field Effect Transistor . Poster presentation, DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Reuter,D.; Nowack,M.; Shaporin,A.; Rockstroh,J.; Haas,S.; Bertz,A.; Mehner,J.; Gessner,T.: Out of Plane Capacitive Transducer in Air Gap Insulation Microstructures Technology for High Precision Monolithic 3-Axis Sensors. Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8 ) |
| Fiedler,H.; Toader,M.; Hermann,S.; Rennau,M.; Schulz,S.E.; Hietschold,M.; Gessner,T.: Fabrication and characterization of CNT via interconnects for application in integrated circuits. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30; Talk (ISBN Abstract in: Verh. Dtsch. Phys. Ges. (ISSN 0420-0195)) |
| Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Kerr-effect studies on copper oxide thin films produced by atomic layer deposition on SiO2. Thin Solid Films, 520, 14 (2012) pp 4741-4744 (ISSN 0040-6090) |
| Schuster,J.; Schulz,S.E.; Herrmann,T.; Richter,R.: Modeling and Simulation of the Interplay between Contact Metallization and Stress Liner Technologies for Strained Silicon. Materials for Advanced Metallization Conference (MAM), Grenoble, 2012 Mar 11-14; Talk, Book of Abstracts |
| Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk, Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Zienert,A.; Wagner,C.; Mohammadzadeh,S.; Schuster,J.; Streiter,R.; Schulz,S.E.; Gessner,T.: Simulation of Nanostructures for Sensor and Circuit Applications. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Schmeisser,M.; Schuster,J.; Schulz,S.E.; Auer,A.: Quantum chemical modeling of basic reaction steps for the reduction of ALD-grown copper oxide films. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden, 2012 June 17-20; Poster |
| Wagner,C.; Schuster,J.; Hartmann,Steffen; Wunderle,B.; Schulz,S.E.; Gessner,T.: Nanomechanics of CNTs for Sensor Application. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Wagner,C.; Hartmann,S.; Schuster,J.; Wunderle,B.; Schulz,S.E.; Gessner,T.: Nanomechanics of CNTs for Sensor Simulation. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Talk; Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Sommer,J.; Zienert,A.; Schuster,J.: Band structure und electronic transport properties of cobalt decorated carbon nanotubes. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Poster presentation; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Wagner,C.; Schuster,J.; Gessner,T.: Piezoresistance of semimetallic carbon nanotubes. 76. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Poster, Abstract in: Verhandlungen der DPG (2012) (ISSN 0420-0195) |
| Wagner,C.; Schuster,J.; Gessner,T.: DFT investigations of the piezoresistive effect of carbon nanotubes for sensor application. physica status solidi (b), 249, 12 (2012) pp 2450-2453 |
| Voigt,S.; Kurth,S.; Gessner,T.: Sensornetzwerk zum Monitoring von Hochspannungsleitungen. 3. Landshuter Symposium Mikrosystemtechnik, Landshut, 2012 Mar 13-14 |
| Zienert,A.; Schuster,J.; Gessner,T.: Quantum transport simulations in metallic carbon nanotubes with metal contacts. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2012 Mar 25-30; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Poster presentation; Summary Proceedings, Vol. IV (2012) (ISBN 978-3-9814766-4-4) |
| Sommer,J.; Zienert,A.; Gemming,S.; Schuster,J.; Schulz,S.E.; Gessner,T.: Band gap tuning of carbon nanotubes for sensor and interconnect applications - a quantum simulation study. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23 (ISBN 978-1-4673-1590-6) |
| Streit,P.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: Comparison of lumped and finite element modeling for thermoelectric devices. Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Ahner,N.; Zimmermann,S.; Schaller,M.; Schulz,S.E.: Optimized wetting behavior of water-based cleaning solutions for plasma etch residue removal by application of surfactants. Solid State Phenomena, 187 (2012) pp 201-205 (ISSN 1012-0394) |
| Vogel,M.; Braeuer,J.; Wiemer,M.; Nestler,J.; Kurth,S.; Otto,T.; Gessner,T.: Smart Systems for Different Applications from Fraunhofer ENAS. in: Mikrosystemtechnik in Deutschland 2012, pp 72-73 (ISSN 2191-7183) |
| Kurth,S.; Hiller,K.; Meinig,M.; Gessner,T.: Tunable Fabry-Pérot Interferometers for Infrared Spectroscopy. Mikrosystemtechnik in Deutschland 2012, pp 48-49 (ISSN 2191-7183) |
| Wagner,C.; Schuster,J.; Gessner,T.: DFT simulations for CNT sensors. International Alumni Workshop AMASING, Dresden (Germany), 2012 Jun 04-09; Invited Talk |
| Gessner,Thomas; Koehler,Thomas: Smart Systems Integration - short review and further development of smart systems. Smart Systems Integration SSI2012, Zurich (Switzerland), 2012 Mar 21 - 22; Proceedings (CD-ROM), Paper 0, 2012 |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Variation of the growth behavior of copper oxide deposited via ALD on thermally pretreated CNTs. DPG Frühjahrstagung, Berlin (Germany), 2012 Mar 25-30 |
| Melzer,M.; Foerster,A.; Waechtler,T.; Wagner,C.; Fiedler,H.; Schuster,J.; Hermann,S.; Schulz,S.E.; Gessner,T.: Controlling the growth morphology of ALD copper oxide on CNTs by thermal oxidation prior to the ALD. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20 |
| Salvan,G.; Fronk,M.; Robaschik,P.; Zahn,D.R.T.; Albrecht,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.: Heterostructures of Copper Oxide Layers Produced by ALD with Ferromagnetic Layers Studied by Magneto-Optical Kerr Effect Spectroscopy. AVS 12th International Conference on Atomic Layer Deposition (ALD 2012 & BALD 2012), Dresden (Germany), 2012 June 17-20 |
| Waechtler,T.; Mueller,S.; Fiedler,H.; Melzer,M.; Schulz,S.E.; Gessner,T.: ALD of Metal and Metal Oxide Thin Films for Applications in ULSI Metallization Systems and Spintronic Layer Stacks. EFDS Workshop on Atomic Layer Deposition, Dresden (Germany), 2012 Mar 7 |
| Melzer,M.; Waechtler,T.; Mueller,S.; Fiedler,H.; Hermann,S.; Rodriguez,R.D.; Villabona,A.; Sendzik,A.; Mothes,R.; Schulz,S.E.; Gessner,T.; Zahn,D.R.T.; Hietschold,M.; Lang,H.: Copper oxide ALD on thermally pretreated CNTs for interconnect applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Mueller,S.; Waechtler,T.; Tuchscherer,A.; Mothes,R.; Gordan,O.; Lehmann,D.; Haidu,F.; Schulz,S.E.; Lang,H.; Zahn,D.R.T.; Gessner,T.: An Approach for Cu ALD on Co/Ni as Liners for ULSI Interconnects and Magnetic Film Systems for Spintronic Applications. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Salvan,G.; Fronk,M.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Mothes,R.; Lang,H.; Schubert,C.; Albrecht,M.; Zahn,D.R.T.: Magneto-optical Kerr Effect Studies of Heterostructures of Ferromagnetic and Copper Oxide Layers Produced by Atomic Layer Deposition. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Gordan,O.D.; Lehmann,D.; Haidu,F.; Mueller,S.; Waechtler,T.; Schulz,S.E.; Lang,H.; Braun,W.; Gessner,T.; Zahn,D.R.T: Copper Oxidation and Reduction: A Combined Ellipsometry and Photoemission Study. Materials for Advanced Metallization Conference (MAM), Grenoble (France), 2012 Mar 11-14 |
| Zimmermann,S.; Ahner,N.; Fischer,T.; Oszinda,T.; Uhlig,B.; Schulz,S.E.; Gessner,T.: A Low Damage Patterning Scheme for Ultra Low-k Dielectrics. Future Fab International, vol. 42 (2012) pp 94-101 |
| Braeuer,J.; Schneider,W.; Dietrich,T.R.; Brode,W.; Schaefer,R.: Erarbeitung einer Raumtemperatur-Bondtechnologie in der Mikrosystemtechnik. PLUS, 7 (2012) pp 1631-1637 |
| Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Novel nano-scale energetic systems for low-temperature and stress-free joining of dissimilar materials. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: A novel technique for MEMS packaging: Reactive bonding with integrated material systems. Sensors and Actuators A: Physical, 188 (2012) pp 212-219 (ISSN 0924-4247) |
| Froemel,J.; Lin,Y.; Wiemer,M.; Gessner,T.; Esashi,M.: Low temperature metal interdiffusion bonding for micro devices . Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on, Tokyo, Japan, 22-23 May 2012 p 163 (ISBN 978-1-4673-0743-7) |
| Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. ICNFA, Montreal, 2012 Aug 7-9; Talk |
| Fiedler,H.; Ecke,R.; Hermann,S.; Schulz,S.E.; Gessner,T.: Back-end-of the line compatible homogeneous coating of vertical aligned carbon nanotubes with a conductive diffusion barrier for interconnect applications. Proceedings of the 3rd International Conference on Nanotechnology: Fundamentals and Applications (ISBN 978-0-9867183-3-5) |
| Gebauer,C.; Schueller,M.; Hiller,K.; Schulze,R.; Otto,T.; Gessner,T.: Design and Manufacturing of Micro Synthetic Jet Actuators. Smart System Integration (SSI), Zürich, 2012 Mar 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Moebius,M.; Weiss,A.; Otto,T.; Gessner,T.: Chip-based optical sensor to determine the arterial oxygen concentration. Smart System Integration (SSI), Zürich, 2012 Mar 21-22 (ISBN 978-3-8007-3423-8) |
| Morschhauser,A.; Stiehl,C.; Geidel,S.; Nestler,J.; Otto,T.; Gessner,T.: Towards integration of silica membrand based DNA extraction on chip. Smart System Integration (SSI), Zürich, 2012 Mar 21-22 (ISBN 978-3-8007-3423-8) |
| Zienert,A.; Schuster,J.; Gessner,T.: Quantum Transport Through Carbon Nanotubes with Metal Contacts. International Alumni Workshop AMASING, Dresden (Germany), 2012 Jun 04-09; Invited Talk |
| Morschhauser,A.; Stiehl,C.; Grosse,A.; Nestler,J.; Otto,T.; Gessner,T.: Membrane based sample preparation chip. Biomedical Engineering, 57, Suppl. 1 (2012) pp 923-925 (ISSN 0013-5585) |
| Zienert,A.; Schuster,J.; Gessner,T.: Quantum Transport Through Carbon Nanotubes with Metal Contacts. MolMat, Barcelona (Spain), 2012 Jul 3-6; Poster presentation |
| Helke,C.; Schueller,M.; Hiller,K.; Schulze,R.; Braeuer,J.; Nestler,J.; Otto,T.; Gessner,T.: Bonding technologies for standard bulk PZT ceramics without the need of after process polarization especially on thin silicon membranes. Actuator, Bremen, 2012 Jun 18-20; Proceedings, pp 705-708 (ISBN 978-3-933339-19-5) |
| Fischer,T.; Schulz,S.E.; Gessner,T.; Prager,L.; Hohage,J.; Ruelke,H.; Richter,R.: A complimentary study of vacuum ultraviolet curing procedures on high tensile stress SiXNYHZ PECVD silicon nitride layers. JVST:B |
| Fischer,T.; Prager,L.; Hohage,J.; Ruelke,H.; Schulz,S.E.; Richter,R.; Gessner,T.: A two-step UV curing process for producing high tensile stressed silicon nitride layers. MRS Spring Meeting, San Francisco; 2012 MRS Spring Meeting Proceedings |
| Besser,J.; Baum,M.; Wiemer,M.; Gessner,T.; Sanchez-Ordonez,S.; Thanner,C.; Vetter,C.: Thermal and UV nanoimprint lithography for applications from the micro to the nano scale. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, Paper 28 (2012) (ISBN 978-3-8007-3423-8) |
| Raukopf,S.; Gebhardt,C.; Roscher,F.; Baum,M.; Kinner,R.; Wiemer,M.; Gessner,T.: Si Interposer Technologies for three dimensional AMR Sensor Systems. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, p Paper 40 (ISBN 978-3-8007-3423-8) |
| Balaj,I.; Raschke,R.; Baum,M.; Uhlig,S.; Wiemer,M.; Gessner,T.; Grafe,J.: Development of transfer Electrostatic Carriers (T-ESC) for thin 300 mm wafer handling using seal glass bonding technology. Smart Systems Integration, Zurich, Switzerland, 2012 Mar 21-22; Proceedings, Paper 53 (2012) (ISBN 978-3-8007-3423-8) |
| Baum,M.; Besser,J.; John,B.; Keiper,B.; Haenel,J.; Wiemer,M.; Gessner,T.: Micro hot embossing and micro laser welding technologies for fluidic applications. Micromechanics and Microsystems Europe Workshop MME 2012, Ilmenau, 2012 Sep 9-12; Proceedings, Paper 1673, A 12 (2012) (ISBN 978-3-938843-71-0) |
| Schulze,R.; Gessner,T.; Schueller,M.; Forke,R.; Billep,D.; Heinrich,M.; Sborikas,M.; Wegener,M.: Integration of Piezoelectric Polymer Transducers into Microsystems for Sensing Applications. Applications of Ferroelectrics held jointly with 2012 European Conference on the Applications of Polar Dielectrics and 2012 International Symp Piezoresponse Force Microscopy and Nanoscale Phenomena in Polar Materials (ISAF/ECAPD/PFM), 2012 Intl Symp, Aveiro (Portugal), 2012 Jul 9-13 pp 1-4 (ISBN 978-1-4673-2668-1 ) |
| Tuchscherer,A.; Georgi,C.; Roth,N.; Schaarschmidt,D.; Rueffer,T.; Waechtler,T.; Schulze,S.E.; Oswald,S.; Gessner,T.; Lang,H.: Ruthenocenes and Half-Open Ruthenocenes: Synthesis, Characterization, and Their Use as CVD Precursors for Ruthenium Thin Film Deposition. Eur. J. Inorg. Chem., 2012, 30 (2012) pp 4867-4876 (ISSN 1099-0682) |
| Gessner,T.; Schulz,S.E.; Waechtler,T.; Lang,H.; Jakob,A.: Substrat mit einer Kupfer enthaltenden Beschichtung und Verfahren zu deren Herstellung mittels Atomic Layer Deposition und Verwendung des Verfahrens. Patent, DE 10 2007 058 571 B4 (2012) |
| Harazim,S.; Helke,C.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Sanchez,S.; Grimm,D.; Otto,T.; Schmidt,O.; Gessner,T.: LoC Integrationsstrategien für aufgerollte Sensoren. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings, pp 147-152 (ISBN 978-3-00-039162-0) |
| Nowack,M.; Leidich,S.; Reuter,D.; Kurth,S.; Kuechler,M.; Bertz,A.; Gessner,T.: Micro arc welding for electrode gap reduction of high aspect ratio microstructures. Sensors and Actuators A: Physical, 188 (2012) pp 495-502 |
| Haas,S.; Schramm,M.; Heinz,S.; Loebel,K.-U.; Reuter,D.; Bertz,A.; Gessner,T.; Horstmann,J.T.:11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings, pp 242-246 (ISBN 978-3-00-039162-0) |
| Gossler,C.; Kunzer,M.; Baum,M.; Wiemer,M.; Moser,R.; Passow,T.; Koehler,K.; Schwarz,U.T.; Wagner,J.: Aluminum-Germanium Wafer Bonding of (AlGaIn)N Thin Film Light-Emitting Diodes. Microsystem Technologies, in press (2012) (ISSN 1432-1858) |
| Nestler,J.; Enderlein,T.; Geidel,S.: Laser Micromachining for Micro- and Lab-on- Chip-Systems. ILACOS (International Laser and Coating Symposium), Dresden (Germany), 2012 Oct 17-18 |
| Geidel,S.; Enderlein,T.; Morschhauser,A.; Nestler,J.; Otto,T.; Gessner,T.: Laserbasierter Multilayer-Fügeprozess zur Erzeugung heterogener und druckstabiler mikrofluidischer Systeme. 11. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2012 Oct 23-24; Proceedings (ISBN 978-3-00-039162-0) |
| Brombacher,C.; Grobis,M.; Lee,J.; Fidler,J.; Eriksson,T.; Werner,T.; Hellwig,O.; Albrecht,M.: L10 FePtCu bit patterned media. Nanotechnology, 2, 23 (2012) |
| Fiedler,H.; Melzer,M.; Waechtler,T.; Hermann,S.; Schulz,S.E.; Gessner,T.: Nanomaterials for Interconnects. 8th Interregional Workshop on Advanced Nanomaterials (IWAN 2012), Frankfurt (Oder) (Germany), 2012 Nov 12-13 |
| Waechtler,T.: Atomic Layer Deposition Processes for Integration in ULSI Metallization Systems and Spintronic Sensor Devices. SEMICON Europa 2012, Dresden, 2012 Oct 9-11 |
| Waechtler,T.; Auerswald,E.; Hoebelt,I.; Nowack,M.; Noack,E.; Gollhardt,A.; Vogel,D.; Michel,B.; Schulz,S.E.; Gessner,T.: FIB/SEM Analysis for Smart Systems Integration. Smart Systems Integration (SSI 2012), Zürich (Switzerland), 2012 Mar 21-22 |
| Fiedler,H.; Toader,M.; Hermann,S.; Rodriguez,R.D.; Sheremet,E.; Rennau,M.; Schulze,S.; Waechtler,T.; Hietschold,M.; Zahn,D.R.T.; Schulz,S.E.; Gessner,T.: Distinguishing between Individual Contributions to the Via Resistance in Carbon Nanotubes Based Interconnects. ECS Journal of Solid State Science and Technology, 1, 6 (2012) pp M47-M51 (ISSN 2162-8769) |
| Koehler,D.; Hiller,K.; Forke,R.; Konietzka,S.; Pohle,A.; Billep,D.; Heinz,S.; Lange,A.: Development and Characterization of a high precision vibratory MEMS gyroscope system. International MEMS Forum, Moscow (Russia), 2012 Oct 03-04 |
| Koehler,D.; Hiller,K.; Forke,R.; Konietzka,S.; Billep,D.; Heinz,S.; Lange,A.: Development and Characterization of a high precision vibratory MEMS gyroscope system with low-noise integrated readout and control electronics. Sensorsysteme 2012, 14th Leibniz Conference of Advanced Science, Lichtenwalde (Germany), 2012 Oct 18-19 |
| Koehler,D.; Hiller,K.; Forke,R.; Konietzka,S.; Pohle,A.; Billep,D.; Heinz,S.; Lange,A.: Development and Characterization of a high precision vibratory MEMS gyroscope system with low-noise integrated readout and control electronics. 11. Chemnitzer Fachtagung Mikrosystemtechnik-, Mikromechanik & Mikroelektronik, Chemnitz (Germany), 2012 Oct 23-24 |
| Hofmann,K.; Billep,D.; Forke,R.; Hiller,K.; Gessner,T.: Robust Design of MEMS structures. Smart System Integration, Dresden (Germany), 2011 Mar 22-23; Proceedings, Paper 72 (ISBN 978-3-8007-3324-8) |
| Sickmann,J.; Schuster,J.; Richter,R.; Wuerfel,A.; Geisler,H.; Engelmann,H.-J.; Lichte,H.: Strain mapping of tensile strained transistors by dark-field off-axis electron holography. Proceedings of 15th European Microscopy Congress (EMC), Manchester, September,16th - 21st ; Poster |
| Wagner,C.; Schuster,J.; Gessner,T.: Simulation von Kohlenstoffnanoröhrchen für NEMS. MST 2012, Chemnitz (Germany), 2012 Oct 23-24 (ISBN 978-3-00-039162-0) |
| Hermann,S.; Fiedler,H.; Yu,H.; Loschek,S.; Bonitz,J.; Schulz,S.E.; Gessner,T.: Wafer level approaches for the integration of carbon nanotubes in electronic and sensor applications. Systems, Signals and Devices (SSD), Chemnitz, 2012 Mar 20-23; Systems, Signals and Devices (SSD), 2012 9th International Multi-Conference on (ISBN 978-1-4673-1589-0) |
| Hermann,S.; Fiedler,H.; Loschek,S.; Schulz,S.E.; Gessner,T.: Processes for wafer level integration of carbon nanotubes in electronic and sensor applications. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2012 Oct 23-24; Proceedings (ISBN 9783000391620) |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration in Interconnects and MEMS/NEMS. Advanced metallization conference 2012, Albany, 2012 Oct 9-11; Invited Talk |
| Toader,M.; Fiedler,H.; Schulz,S.E.; Hietschold,M.: Conductive AFM for CNTs characterisation. DPG Frühjahrstagung, Berlin, 2012 Mar 25-30; Poster |
| Toader,M.; Fiedler,H.; Hermann,S.; Schulz,S.E.; Gessner,T.; Hietschold,M.:International Confererence on Superlattices, Nanostructures and Nanodevices, Dresden (Germany), 2012 Jul 22-27 |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Novel form of carbon nanotube films with a self-assembled carbon-metal heterostructure. Vth International Conference on Molecular Materials, Barcelona (Spain), 2012 Jul 03-06 |
| Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schaefer,P.; Zahn,DRT; Albrecht,M.; Hietschold,M.; Schulz,S.E.; Gessner,T.: Growth of carbon nanotube forests between a bi-metallic catalyst layer and a SiO2 substrate to form a self-assembled carbon-metal heterostructure. Carbon, 50, 13 (2012) pp 4765-4772 (ISSN 0008-6223) |
| Schuster,J.; Mohammadzadeh,S.; Streiter,R.; Wagner,C.; Zienert,A.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Nanodevices. Nanofair 2012, Dresden, June 13; Talk |
| Schuster,J.; Streiter,R.; Wolf,H.; Schulz,S.E.; Gessner,T.: Modeling and Simulation of Equipment and Processes for the Deposition of Thin Films . SEMICON Europa , Dresden, Oct 9-11; Talk |
| Wagner,C.; Schuster,J.; Gessner,T.: Simulation von Kohlenstoffnanoröhrchen für NEMS. MST 2012, Chemnitz (Germany), 2012 Oct 23-24; Talk |
| Wagner,C.; Schuster,J.; Gessner,T.: Piezoresistance of semimetallic nanotubes. International Winterschool on Electronic Properties of Novel Materials, Kirchberg (Austria), 2012 Mar 03-10; Poster presentation |
| Voigt,S.; Pfeiffer,M.; Grolms,A.; Kurth,S.; Keutel,T.; Brockmann,C.; Braunschweig,M.: Autarkes Sensornetzwerk zum Monitoring von Hochspannungsleitungen. Chemnitzer Fachtagung Mikrosystemtechnik – Mikromechanik & Mikroelektronik, Chemnitz, 2012 Oct 23-24 |
| Voigt,S.; Wolfrum,J.; Pfeiffer,M.; Keutel,T.; Brockmann,C.; Grosser,V.; Lissek,S.; During,H.; Rusek,B.; Braunschweig,M.; Kurth,S.; Gessner,T.: Sensornetzwerk zum Monitoring von Hochspannungsleitungen. , VDE-Kongress Smart Grid - Intelligente Energieversorgung der Zukunft, Stuttgart, 2012 Nov 5-6 |
| Voigt,S.; Kurth,S.; Gessner,T.: Autonomous sensor network for power line monitoring. SSI - Smart System Integration Conference, Zürich, 2012 Mar 21-22 |
| Kurth,S.; Hiller,K.; Neumann,N.; Seifert,M.; Ebermann,M.; Specht,H.; Meinig,M.; Gessner,T.: Fabry-Perot tunable infrared filter based on structured reflectors. SPIE Photonics Europe, Brussels, 2012 Apr 16-20; Proc. of SPIE, 8428 (2012) p 84281O |
| Hermann,S.; Schulz,S.E.; Gessner,T.: Wafer Level Approaches for Carbon Nanotube Integration beyond CMOS and MEMS/NEMS. INC8 - International Nanotechnology Conference on Communication and Cooperation, Tsukuba; invited Talk, 2012 May 8-11 |
| Rodriguez,R.D.; Toader,M.; Hermann,S.; Mueller,S.; Gordan,O.D.; Yu,H.; Schulz,S.E.; Hietschold,M.; Zahn,D.R.T.: Nanoscale Optical and Electrical Characterization of Aligned Semiconducting Single-Walled Carbon Nanotubes in a Field Effect Transistor. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27 |
| Hermann,S.; Schulze,S.; Ecke,R.; Liebig,A.; Schulz,S.E.; Gessner,T.: Novel carbon nanotube film with a self-assembled carbon-metal heterostructure. International Conference on the Physics of Semiconductors, Dresden (Germany), 2012 July 22-27 |
| Hermann,S.; Bonitz,J.; Kaufmann,C.; Schulz,S.E.; Gessner,T.; Shaporin,A.; Voigt,S.; Mehner,J.; Hartmann,S.; Wunderle,B.: Wafer-level technology for piezoresistive electro-mechanical transducer based on Carbon Nanotubes. Herrenhausen Conference „Downscaling Science“ , Hanover (Germany), 2012 Dec 12-14 |
| Sowade,E.; Hammerschmidt,J.; Blaudeck,T.; Baumann,R.R.: In-flight inkjet self-assembly of spherical nanoparticle aggregates. Advanced Engeneering Materials, 14, 1-2 (2012) pp 98-100 (ISBN 1527-2648 (electronic version)) |
| Zenkevich,E.I.; Blaudeck,T.; A.Milekhin; C.von Borczyskowski: Size-dependent non-FRET photoluminescence quenching in nanocomposites based on semiconductor quantum dots CdSe/ZnS and functionalized porphyrin ligands. International Journal of Spectroscopy, 2012 (2012) p 971791 (14 pp) (ISSN 1687-9449) |
| Blaudeck,T.; E.I.Zenkevich; M.M.S.Abdel-Mottaleb; K.Szwaykowska; D.Kowerko; F.Cichos; C.von Borczyskowski: Formation Principles and Ligand Dynamics of CdSe Quantum Dots and Functionalised Dye Molecules. ChemPhysChem, 13, 4 (2012) pp 959-972 (ISSN 1439-4235) |
| Zenkevich,E.I.; Blaudeck,T.; D.Kowerko; A.P.Stupak; F.Cichos; C.von Borczyskowski: Ligand Exchange Dynamics and Temperature Effects upon Formation of Nanocomposites Based on Semiconductor CdSе/ZnS Quantum Dots and Porphyrins: Ensemble and Single Object Measurements. Macroheterocycles, 5, 2 (2012) pp 98-114 (ISSN 1998-9539) |
| Blaudeck,T.; P.Andersson Ersman; M.Sandberg; S.Heinz; A.Laiho; J.Liu; I.Engquist; M.Berggren; Baumann,R.R.: Simplified large-area manufacturing of organic electrochemical transistors combining printing and a self-aligning laser ablation step. Advanced Functional Materials, 22, 14 (2012) pp 2939-2948 (ISSN 1616-3028) |
| Blaudeck,T.; S.Heinz; P.Andersson Ersman; M.Sandberg; A.Laiho; J.Liu; I.Engquist; M.Berggren; Baumann,R.R.: Manufacturing of Organic Electrochemical Transistors combining Two Printing Technologies and a Self-Aligning Laser Ablation Step. ILACOS (International Laser and Coating Symposium, Dresden (Germany), 2012 Oct 17-18 |
| Benchirouf,A.; Sowade,E.; Al-Hamry,A.; Blaudeck,T.; Kanoun,O.; Baumann,R.R.: Investigation of RFID passive strain sensors based on carbon nanotubes using printing technology. SSD (Signals, Systems and Devices), Chemnitz, 2012 March 20-23; Proceedings (ISBN 978-1-4673-1590-6) |
| Sowade,E.; Blaudeck,T.; Baumann,R.R.: Preparation of spherical, ordered colloidal aggregates using inkjet printing. MRS Spring Meeting , San Francisco, 2012 Apr 9-13; MRS Proceedings, 1453 (2012) p 1292 (5 pp) (ISSN 0272-9172) |
| Sowade,E.; Belgardt,C.; Blaudeck,T.; Baumann,R.R.: Bottom-up Nanoengineering by Combining Directed Self-assembly and Inkjet Printing. MRS Fall Meeting 2012 , Boston, 2012 November 25-30 |
| Blaudeck,T.; Adner,D.; Hermann,S.; Lang,H.; Schulz,S.E.; Gessner,T.: Wafer-level Integration of Functionalized Carbon Nanotubes as Prototypes for Tunable Sensors. MRS Fall Meeting 2012, Boston, 2012 November 25-30 |
| Loschek,S.; Hermann,S.; Haibo,Y.; Schulz,S.E.: Structuring of carbon nanotubes for field emission based movement sensors. 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz (Germany), 2012 March 20-23 (ISBN 978-1-4673-1589-0) |
| Loschek,S.; Hermann,S.; Haibo,Y.; Schulz,S.E.: Field emitting carbon nanotubes in MEMS-structures for movement sensors. 11. Chemnitzer Fachtagung Mikrosystemtechnik , Chemnitz (Germany), 2012 Oct 23-24 (ISBN 978-3-00-039162-0) |
| Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.: Mechanical characterization of glass frit bonded wafers. YSESM, Brasov, 2012 May 30 - June ; Proceedings of 11th Youth Symposium on experimental solid mechanics, pp 239-245 (ISBN 978-606-19-0078-7) |
| Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.: Influence of test speed on the bonding strength of glass frit bonded wafers. YSESM, Brasov, 2012 May 30 - June 2; Abstract Book of 11th Youth Symposium on experimental solid mechanics, pp 100-101 (ISBN 978-606-19-0079-4) |
| Vogel,K.; Baum,M.; Roscher,F.; Kinner,R.; Rank,H.; Mayer,T.; Wiemer,M.; Gessner,T.: Festigkeitsanalyse an thermokompressionsgebondeten Sensorstrukturen in Abhängigkeit von der Oberflächenvorbehandlung. 11. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2012, Oktober 23-24; Proceedings, pp S5-2, 6S. (ISBN 978-3-00-039162-0) |
| Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Using of Different Nano Scale Energetic Material Systems for Reactive Bonding . ECS - Honolulu PRiME 2012 , Honolulu, Hawaii, October 7 - October 12, 2012; Proceedings, p 2976 (ISSN 2151-2043) |
| Braeuer,J.; Wiemer,M.; Gessner,T.: Hermetic and Room-Temperature Wafer-Level-Packaging Based On Nano Scale Energetic Systems. MRS Fall Meeting, Boston, MA, November, 25-30; Proceedings, Invited Talk |
| Braeuer,J.; Besser,J.; Froemel,J.; Wiemer,M.; Gessner,T.: Robust and high-reliability packages for high pressure sensors by using reactive wafer bonding. Semicon Japan, Tokio, Japan, 2012 December 5-7; Proceedings, STS Session 11 Packaging |
| Bonitz,J.: Reaktive nanoskalige Mehrschichtsysteme lösen Temperaturprobleme bei Mikrosystemen. MECHATRONIK, 12 (2012) pp 14-15 |
| Braeuer,J.: Reaktive nanoskalige Mehrschichtsysteme lösen Temperaturprobleme bei Mikrosystemen. MECHATRONIK, 12 (2012) pp 14-15 |
| Bargiel,S.; Jia,C.; Baranski,M.; Froemel,J.; Passilly,N.; Gorecki,C.; Wiemer,M.: Vertical Integration Technologies for Optical Transmissive 3-D Microscanner based on Glass Microlenses. Procedia Engineering, 47 (2012) pp 1133-1136 (ISSN 1877-7058) |
| Braeuer,J.; Besser,J.; Wiemer,M.; Gessner,T.: Integrated nano scale multilayer systems for reactive bonding in microsystems technology. Electronic System-Integration Technology Conference (ESTC), Amsterdam, Netherlands, 17-20 Sept. 2012; Proceedings (ISBN 978-1-4673-4645-0) |
| Abo Ras,M.; Schacht,R.; May,D.; Wunderle,B.; Winkler,T.; Michel,B.: Universal test system for the characterization of the most common thermal interface materials.. 7th Workshop on Thermal Management, La Rochelle (France), 2012 Feb 1-2 |
| Abo Ras,M.; Schacht,R.; May,D.; Wunderle,B.; Winkler,T.; Michel,B.: Test stand for the Characterisation of Thermal Interface Materials from the macro level up to the nano level. 13th Leibniz Conference of Advanced Science, Nanoscience, Lichtenwalde (Germany), 2012 Apr 26-27 |
| Auersperg,J.; Vogel,D.; Auerswald,E.; Rzepka,S.; Michel,B.: Nonlinear Copper Behavior of TSV and the Cracking Risks during BEoL-Built-up for 3D-IC-Integration. 13th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE , Cascais (Portugal), 2012 Apr 16-18; Proceedings (ISBN 978-1-4673-1511-1) |
| Auersperg,J.; Dudek,R.; Braemer,B.; Pufall,R.; Seiler,B.; Michel,B.: Capturing Interface Toughness Parameters from Shear Testing Using Different Fracture Mechanics Approaches. IEEE 14th Electronics Packaging Technology Conference, Singapore, 2012 Dec 5-7; Proceedings (ISBN 978-1-4673-4551-4) |
| Baumann,R.R.: Printed smart objects and their digital fabrication. nano week 2012, Symposium “The Cutting Edge of Printable Electronics - a Japanese-European Symposium", nano tech 2012 - The 11th International Nanotechnology Exhibition & Conference, Tokyo (Japan), 2012 Feb 15-17 |
| Dudek,R.; Braemer,B.; Auersperg,J.; Pufall,R.; Walter,H.; Seiler,B.; Wunderle,B.: Determination of Interface Fracture Parameters by Shear Testing Using Different Theoretical Approaches. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012), Cascais (Portugal), 2012 Apr 16-18 |
| Dudek,R.; Doering,R.; Pufall,R.; Kanert,W.; Seiler,B.; Rzepka,S.; Michel,B.: Delamination modeling for power packages by the cohesive zone approach. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, pp 187-193 |
| Faust,W.; Noack,E.; Michel,B.: Möglichkeiten und Grenzen der Computertomographie bei materialografischen Untersuchungen. Chances and Limits of Computer Tomography in Materialographic Investigations. Praktische Metallographie / Practical Metallography , 6/2012 (2012) pp 328-342 |
| Hammerschmidt,J.; Wolf,F.; Goedel,W.A.; Baumann,R.R.: Inkjet printing of reinforcing patterns for the mechanical stabilization of fragile, polymeric microsieves. Langmuir, 28, 6 (2012) p 3316–3321 |
| Hammerschmidt,J.; Sowade,E.; Mitra,K.Y.; Wohlleben,L.M.; Baumann,R.R.: The Influence of Post-Treatment Strategies in Inkjet Printing on the Morphology of Layers and the Functional Performances of Electronic Devices. NIP28 - 28th International Conference on Digital Printing Technologies / Digital Fabrication 2012, Quebec (Canada), 2012 Sep 09-13; Proceedings, pp 444-447 (ISBN 978-0-89208-301-5) |
| Hofmann,T.; Gottschling,S.; Schuch,B.; Neumann,A.; Sommer,J.-P.: Schaltungskonzepte und Prozesstechnik: Ergebnisse aus dem Förderprojekt VISA Integration von Halbleiterbauelementen. Fachtagung Elektronische Baugruppen und Leiterplatten EBL, Fellbach (Germany), 2012 Feb 14-15 |
| Kang,H.; Ueberfuhr,P.; Siegel,F.; Baumann,R.R.: Machine directional register modeling for multilayer printing in hybrid roll-to-roll printing systems. Materials Science Engineering (MSE) , Darmstadt (Germany), 2012 Sep 25-27 |
| Kraemer,F.; Meier,K.; Wiese,S.; Rzepka,S.: FEM stress analysis in BGA components subjected to JEDEC drop test applying high strain rate lead-free solder material models. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012), Cascais (Portugal), 2012 Apr 16-18 |
| Lorwongtragool,P.; Sowade,E.; Dinh,T.N.; Kanoun,O.; Kerdcharoen,T.; Baumann,R.R.: Inkjet printing of chemiresistive sensors based on polymer and carbon nanotube networks. IEEE 9th International Multi-Conference on Systems, Signals and Devices (SSD), Chemnitz (Germany), 2012 March 20-23 (ISBN 978-3-9814766-4-4) |
| Lorwongtragool,P.; Sowade,E.; Kerdcharoen,T.; Baumann,R.R.: All Inkjet-Printed Chemical Gas Sensors Based on CNT/Polymer Nanocomposites: Comparison between Double Printed Layers and Blended Single Layer. ECTI-CON2012 - 9th International Conference of Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology Association, Hua Hin (Thailand), 2012 May 16-18 (ISBN 978-1-4673-2026-9) |
| Lorwongtragool,P.; Sowade,E.; Hammerschmidt,J.; Kerdcharoen,T.; Baumann,R.R.: Inkjet Printing of Chemiresistive Sensors for the Detection of Volatile Organic Compound. NIP28 - 28th International Conference on Digital Printing Technologies / Digital Fabrication, Quebec (Canada), 2012 Sep 09-13; Proceedings, pp 564-567 (ISBN 978-0-89208-301-5) |
| Lorwongtragool,P.; Sowade,E.; Baumann,R.R.; Kerdcharoen,T.: Towards Polymer/CNT Gas Sensor using Inkjet printing. 7th Annual Conference of the Thai Physics Society (SPC), Phra Nakhon Si Ayutthaya (Thailand), 2012 May 9-12 |
| Michel,B.; Winkler,T.: Möglichkeiten der Bruchmechanik für die Schadensvermeidung in den Bereichen Automobil, Luftfahrt und Elektronik. Scientific Reports University of Applied Sciences Mittweida, pp 2-5 (ISSN 1437-7624) |
| Otto,A.; Rzepka,S.; Mager,T.; Michel,B.; Lanciotti,C.; Guenter,T.; Kanoun,O.: Battery Management Network for Fully Electrical Vehicles Featuring Smart Systems at Cell and Pack Level. 16th International Forum - Advanced Microsystems for Automotive Applications - Smart Systems for Safe, Sustainable and Networked Vehicles, Berlin (Germany), 2012 May 30-31 |
| Otto,A.; Rzepka,S.; Mager,T.; Michel,B.; Lanciotti,C.; Guenther,T.; Kanoun,O.: Battery Management Network for Fully Electrical Vehicles Featuring Smart Systems at Cell and Pack Level. AMAA Advanced Microsystems for Automotive Applications, Berlin (Germany), 2012 May 30-31 (ISBN 978-3-642-29672-7 (Print), 978-3-642-29673-4 (Online)) |
| Otto,A.; Steinau,M.; Schwartz,R.; Cavro,P.; Lanciotti,C.; Winkler,T.; Michel,B.; Rzepka,S.: Reliable Power Module as Part of a Novel Battery Management System at Macro-Cell Level for Fully Electrical Vehicles. CESA Automotive Electronics, Paris (France), 2012 Dec 04-05 |
| Pantou,R.; Shah,D.; Michel,B.; Rzepka,S.: Humidity effects on the fatigue of fiber reinforced polymers in micro/nano functional systems. International Semiconductor Conference Dresden-Grenoble (ISCDG), Grenoble (France), 2012 Sep 24-26 pp 199-202 |
| Poshtan,E.A.; Rzepka,S.; Wunderle,B.; Silber,C.; Bargen,T.v.; Michel,B.: The Effects of Rate-dependent Material Properties and Geometrical Characteristics on Thermo-mechanical Behavior of TQFP Package. IEEE 14th Electronics Packaging Technology Conference, Singapore, 2012 Dec 5-7; Proceedings (ISBN 978-1-4673-4551-4) |
| Rost,F.; Schindler-Saefkow,F.; Schulz,M.; Otto,A.; Rzepka,S.; Michel,B.: Mikro-Nano-Integration, Health Monitoring durch in-situ Messung der Eigenspannungen im Package. 4. GMM Workshop, Berlin (Germany), 2012 Nov 12-13 (ISBN 978-3-8007-3473-3 / ISSN 1432-3419) |
| Rzepka,S.; Vogel,D.; Auerswald,E.; Michel,B.: Quantitative Determination of the Mechanical Stresses in BEoL Films and Structures on Si Wafers with Sub-micron Spatial Resolution by fibDAC. MRS Spring Meeting, San Francisco / CA (USA), 2012 Apr 09-12; Proceedings, mrss12-1428-c08-02, 1428 (2012) |
| Rzepka,S.; Otto,A.; Dudek,R.; Michel,B.: Novel Architecture for Battery Management Systems in Fully Electrical Cars. SSI Smart Systems Integration, Zurich (Switzerland), 2012 Mar 21-22 |
| Rzepka,S.; Otto,A.; Michel,B.: Novel Battery Management Architecture with Satellite Smart Systems Embedded in Individual Cells. ATA & SAE International Conference: Towards Sustainable Mobility; Centro Congressi Lingotto, Torino (Italy), 2012 Nov 07-08. |
| Schacht,R.; Nowak,T.; Walter,H.; Wunderle,B.; Abo Ras,M.; May,D.; Wittler,O.; Lang,K.-D.: Experimentelle und numerische Untersuchungen zur Lebensdauerabschätzung von Durchkontaktierungen in Leiterplatten. EBL-2012 - 6. DVS/ GMM-Tagung, Fellbach (Germany), p 237 ff (ISBN 978-3-8007-3403-0) |
| Schacht,R.; Hausdorf,A.; Wunderle,B.; Michel,B.: Frictionless Air Flow Blade Fan for Thermal Management of Electro. 13th IEEE ITHERM Conference, San Diego (USA), 2012 May 30-Jun 1 p 1320 ff (ISBN 978-1-4244-9532-0) |
| Schacht,R.; Hausdorf,A.; Wunderle,B.; Michel,B.: Miniaturized Frictionless Fan Concept for Thermal Management of Electronic. International Workshop on Thermal Investigation of ICs and Systems, Budapest (Hungary), 2012 May 30 - Jun 1 p 111 ff (ISBN 978-2-35500-022-5) |
| Schindler-Saefkow,F.; Rost,F.; Otto,A.; Faust,W.; Wunderle,B.; Michel,B.; Rzepka,S.: Stress chip measurements of the internal package stress for process characterization and health monitoring. 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2012), Cascais (Portugal), 2012 Apr 16-18 |
| Schindler-Saefkow,F.; Rost,F.; Otto,A.; Winkler,T.; Rzepka,S.; Michel,B.: Reliability Characterization by Stress Chip Measurements. MSE Materials Science Engineering, Darmstadt (Germany), 2012 Sep 25-27 |
| Schindler-Saefkow,F.; Otto,A.; Faust,W.; Wunderle,B.; Michel,B.; Rzepka,S.: Hochgenaue Bestimmung mechanischer Spannungen in Elektronik- und MEMS-Komponenten durch ein Stressmesschip. 11. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz (Germany), 2012 Oct 23-24 (ISBN 978-3-00-039162-0) |
| Siegel,F.; Kohl,A.; Enns,E.; Willert,A.; Deger,W.; Dziallas,H.; Baumann,R.R.: Adapted gravure printing process for the production of carbon based electrodes. Journal of Print and Media Technology Research, 1, 3 (2012) pp 141-148 (ISSN 2223-8905) |
| Siegel,F.; Kohl,A.; Enns,E.; Willert,A.; Deger,W.; Dziallas,H.; Baumann,R.R.: Disturbance factors in a one impression gravure printing process for the production of PEM fuel cell electrodes. 39th International Research Conference Advances in Printing and Media Technology , Ljubljana (Slovenia), 2012 Sep 09-12; Proceedings |
| Zichner,R.; Baumann,R.R.: R2R Screen Printed RFID Transponder Antennas for Vehicle Tracking Systems. The International Conference on Flexible and Printed Electronics (ICFPE 2012), Toyko (Japan), 2012 Sep 06-08 |
| Ueberfuhr,P.; Hammerschmidt,J.; Glaeser,K.; Goedel,W.A.; Baumann,R.R.: .: Inkjet System for Printing Mechanical Reinforcing Patterns Directly on Fragile Membranes Floating on Liquid Surfaces. NIP28 - 28th International Conference on Digital Printing Technologies / Digital Fabrication 2012, Quebec (Canada), 2012 Sep 09-13; Proceedings, pp 550-553 (ISBN 978-0-89208-301-5) |
| Willert,A.: Printing and patterning. Large-Area, Organic and Polymer Electronics Convention 2012 (LOPE-C 12), München (Germany), 2012 Jun 19-21 |
| Willert,A.; Hammerschmidt,J.; Baumann,R.R.: Printing Technologies for Technical Applications. Scientific Papers of the University of Pardubice, Series A, 17 (2012) (ISBN 978-80-7395-459-9/1211-5541) |
| Wunderle,B.; Abo Ras,M.; Springborn,M.; May,D.; Kleff,J.; Oppermann,H.; Toepper,M.; Caroff,T.; Schacht,R.; Mitova,R.: Modelling and characterisation of smart power devices. 18th International Workshop on THERMalNvestigation of ICs and Systems, Budapest (Hungary) p 229 ff. (ISBN 978-2-35500-022-5) |
| Zichner,R.; Willert,A.; Baumann,R.R.: Research on Screen Printed Copper UHF RFID Transponder Antennas for Book Tagging. Large-Area, Organic and Polymer Electronics Convention 2012 (LOPE-C 12), München (Germany), 2012 June 19-21 |
| Zichner,R.; Baumann,R.R.: Manufacturing of printed 3D RFID Transponder Antennas. Materials Science and Engineering - MSE 2012, Darmstadt (Germany), 2012 Sep 25-27 |
| Messerschmid,M.; Schleunitz,A.; Spreu,C.; Werner,T.; Vogler,M.; Reuther,F.; Bertz,A.; Schift,H.; Gruetzner,G.: Thermal Nanoimprint Resist for the Fabrication of High-Aspect-Ratio Patterns . Microelectronic Engineering, 98 (2012) pp 107-111 |
| Braeuer,J.; Gessner,T.; Hofmann,L.; Wiemer,M.; Letsch,H.; Baum,M.: Microstructure with reactive bonding. US-Patent (US8299630B2) |
| Hartwig,I.; Ecke,R.; Braemer,B.; Auerswald,E.; Schulz,S.E.: Evaluating the adhesion of ultra-thin layers . MSE, Darmstadt(Germany), Sept 25-27; Poster |
| Hartwig,I.: Akustische Oberflächenwellen zur Bestimmung der Haftfestigkeit dünner Schichten . 16. Deutsche Physikerinnentagung (DPT), Freiburg i. Br.(Germany), Oct 25-28; Talk |
| Wuensch,D.; Hofmann,Ch.; Besser,J.; Schubert,I.; Gottfried,K.; Wiemer,M.; Gessner,T.: 3D Integration for MEMS devices using photosenitive glass. SSI, Zurich (Switzerland), 2012 March 21-22; Proceedings (ISBN 978-3-8007-3423-8) |
| Wen,Q.; Schulze,R.; Streit,P.; Billep,D.; Otto,T.; Gessner,T.: The Design of Vortex Induced Vibration Fluid Kinetic Energy Harvesters. PowerMEMS, Atlanta (USA), 2012 Dec 02-05; Proceedings PowerMEMS, pp 243-246 |
| Bachmann,M.; Gerken,B.; Mager,T.; Hedayat,C.: High Precision 3D Surface Reconstruction by Fusion of the Shape fram Shading and the Light Sectioning Techniques. BVAu 2012 - 3 Jahreskolloquium , Lemgo (Germany), 2012 Nov 15 (ISBN 978-3-9814062-3-8) |
| Bachmann,M.; Gerken,B.; Mager,T.; Hedayat,C.: Hochpräzise Konturerfassung unstetiger heterogener Oberflächen mit weitgehend unbekannter Topologie . 11.Oldenburger 3D-Tage, Conference, Oldenburg (Germany), 2012 Feb 01-02 |
| Kanwar,K.; Fischer,C.; Geneiss,V.; Mager,T.; Ballhausen,U.; Hedayat,C.; Hilleringmann,U.: Electrical characterization of rubber mixture sheets based on a coaxial probe method in combination with 3D electromagnetic simulation model. IEEE RFID-TA12, Conference, Nizza (France), 2012 Nov 05-07 |
| Ali,E.; Hangmann,C.; Wiegand,C.; Hedayat,C.; Kraus,D.: Event-Driven Simulation Of The 2nd Order Voltage Operated Charge-Pump PLL. SAME 2012, Conference, Sophia Antipolis (France), 2012 Oct 02-03 |
| Wolff,K.; Hilleringmann,U.: Inverter circuits on glass substrates based on ZnO-nanoparticle thin-film transistors. Solid-State Electronics, 67, 1 (2012) pp 11-16 (ISSN 0038-1101) |
| Assion,F.; Schoenhoff,M.; Hilleringmann,U.: Titaniumdisilicide as High-Temperature Contact Material for Thermoelectric Generators. International Conference on Thermoelectrics, Aalborg (Denmark), 2012 Jul 9-12 |
| Hilleringmann,U.; Wolff,K.; Assion,F.; Vidor,F.F.; Wirth,G.I.: Electronic Device Integration on Foils Using Semiconductor Nanoparticles. Smart System Integration Conference, Zurich (Switzerland), 2012 Mar 21-22 |
| Assion,F.; Schoenhoff,M.; Hilleringmann,U.: Formation and Properties of TiSi2 as Contact Material for High-temperature Thermoelectric Generators. MRS Fall Meeting, Boston (USA), 2012 Nov 25-30 |
| Ohms,B.; Kleine,A.; Hilleringmann,U.: Increasing the Efficiency of Solar Cells by Combining Silicon- and Dye Sensitized Devices. International Conference on Renewable Energies and Power Quality (ICREPQ-12), Santiago de Compostela (Spain), 2012 Mar 28-30 |
| Ohms,B.; Kleine,A.; Hilleringmann,U.: Increasing the Efficiency of low Cost dye Sensitize Solar Cells on Foil Substrate. Photovoltaic Technical Conference - Thin Film & Advanced Silicon Solutions 2012 |
| Petrov,D.; Assion,F.; Hilleringmann,U.: Design and Implementation of a Measurement System for Automatically Measurement of Electrical Parameters of Thermoelectric Generators. MRS Fall Meeting, Boston (USA), 2012 Nov 25-30 |
| Assion,F.; Schoenhoff,M.; Hilleringmann,U.: Thermoelectric Generators with TiSi2 Contacts for High-Temperature Applications. IAV Conference: Thermoelectrics, Berlin (Germany), 2012 Nov 21-23 |
| Bueker,M.-J.; Geneiss,V.; Hedayat,C.; Hilleringmann,U.: Entwurfsmethodik für induktive Energieübertragungssysteme. Elektronik wireless power congress, München (Germany), 2012 Jul 04-05 |
| Martin,J.; Staudinger,U.; Demir,E.; Spudat,C.; Poetschke,P.; Voit,B.; Otto,T.; Gessner,T.: Nanosensor technology based on semiconductor nanocrystals. SPIE Photonics West, San Francisco (USA), 2012 Jan 21-26; Proceedings SPIE, 8264 (2012) p 82641M |
| Tsai,Y.-C.; Lin,Y.-C.; Abe,T.; Esashi,M.; Gessner,T.: RIE Patterning Technology of Zr-based Metallic Glass for MEMS Devices Fabrication. IEEE Sensors, Taipei (Taiwan), 2012 Oct 28-31; Proceedings, pp 339-342 (ISBN 1930-0395, 978-1-4577-1766-6 (print)) |
| Wang,W.-S.; Lin,Y.-C.; Gessner,T.; Esashi,M.: Substrate bonding at low temperature by using plasma activated porous gold. IEEE Sensors, Taipei (Taiwan), 2012 Oct 28-31; Proceedings, pp 335-338 (ISBN 978-1-4577-1765-9, 978-1-4577-1766-6 (print)/1930-0395) |
| Lee,J.-W.; Kawai,Y.; Tanaka,S.; Lin,Y.-C.; Gessner,T.; Esashi,M.: Fabrication of Freestanding Pb(Zr,Ti)O Film Microstructures Using Ge Sacrificial Layer. Japanese Journal of Applied Physics, 51, 2R (2012) pp 021502-1-021502-3 |
| Heinrich,H.; Schulze,R.; Wegener,M.; Kroll,L.; Walther,M.; Schueller,M.; Gessner,T.: Micro Injection Moulded MEMS with Integrated Piezoelectric PVDF. 1st Joint International Symposium on System Integrated Intelligence 2012: New Challenges for Product and Production Engineering, Hannover (Germany), 2012 Jun 27-29; Proceedings , pp 201-203 |
| Ebermann,M.; Neumann,N.; Hiller,K.; Gittler,E.; Meinig,M.; Kurth,S.: Widely tunable Fabry-Perot filter based MWIR and LWIR microspectrometers. Next-Generation Spectroscopic Technologies V, Baltimore, Maryland, USA, 2012 Apr 23-24; Proceedings of SPIE, 8374 (2012) p 83740X (ISBN 9780819490520) |
| Ebermann,M.; Neumann,N.; Hiller,K.; Meinig,M.: Spektral abstimmbare IR-Sensoren für die industrielle Prozessmesstechnik und die medizinische Gasanalyse. tm - Technisches Messen Plattform für Methoden, Systeme und Anwendungen der Messtechnik, 79, 10 (2012) p 440–450 |
| Roscher,F.; Braeuer,J.; Baum,M.; Besser,J.; Wiemer,M.; Seifert,T.; Gessner,T.: Nanotechnologien im Packaging – Neue Materialien und Verfahren für die Mikrosystemtechnik. Mikro-Nano-Integration - 4. GMM-Workshop, Berlin, 2012 Nov 12-13; GMM-Fb. 74: Mikro-Nano-Integration (ISBN 978-3-8007-3473-3) |
| Kuechler,M.: Vergleichende Charakterisierung von Ätzanlagen; Profilneigung—tilt. 2. Workshop "Tiefes Siliziumätzen", Chemnitz, Fraunhofer ENAS, 2012 Apr 17 |
| Streit,P.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: Combined Simulation for thermoelectric devices and systems. European Conference on Thermoelectrics, Aalborg (Denmark), 2012 07 9-12; 31st International & 10th European Conference on Thermoelectrics, July 9th-12th, 2012, Aalborg, Denmark |
| Otto,T.: Trends in Smart System Integration at Fraunhofer ENAS. Micromaterials and Nanomaterials, 14 /2012, 14 (2012) pp 38-41 (ISSN 1619-2486) |
| Kaulfersch,E.; Schueller,M.; Otto,T.; Rzepka,S.; Michel,B.: Fraunhofer ENAS contributes to the EU Joint Technology Initiative „Clean Sky“. Annual Report 2011 Fraunhofer ENAS, Fraunhofer Institute for Electronic Nano Systems ENAS (editor, 2012), pp 30-31 |