Publications in 2015
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2015
Books
| Gaebler,Christian; Schliebe,Christian; Adner,David; Blaudeck,T.; Hildebrandt,Alexander; Lang,Heinrich: Chapter Inkjet Printing of Group-11 Metal Structures. in the book: Comprehensive Guide for Nanocoatings Technology, Volume 1: Deposition and Mechanism, ed. by Aliofkhazraei, M. (2015) (ISBN 978-1-63482-447-7) |
| Poliks,M.D.; Blaudeck,T.: Hierarchical, High-Rate, Hybrid and Roll-to-Roll Manufacturing (Proceedings MRS Fall Meeting 2014, Symposium ZZ), ed. by Materials Research Society, Warrendale, PA (USA) (2015) (ISSN 1946-4274) |
| Schulze,R.; Nestler,J.; Streit,P.; Billep,D.; Otto,T.; Gessner,T.: Chapter Kombinierte Simulation integrierter mikrofluidischer Aktoren. in the book: Dresdner Beiträge zur Sensorik Band 60: Nichtelektrische Netzwerke: Wie die Systemtheorie hilft die Welt zu verstehen , ed. by Gerlach, G., Marschner, U., Starke, E. (2015) pp 165-173 (ISBN 978-3-95908-025-5) |
| Baum,M.: Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen (Dissertation) (ISBN 978-3-944640-48-8) |
| Dudek,R.; Doering,R.; Kreyssig,K.; Seiler,B.; Nowottnick,M.; Ehrhardt,S.: Chapter Kapitel 6: Charakterisierung der Verbindungseigenschaften. in the book: Neue Reflowlöttechnologie für elektronische Anwendungen bis 300 °C, Buchreihe: Aufbau- und Verbindungstechnik in der Elektronik, Band 19, pp 78-114 (ISSN 1614-6131) |
| Dudek,R.; Doering,R.; Kreyssig,K.; Seiler,B.; Nowottnick,M.; Ehrhardt,S.: Chapter Kapitel 7: Demonstrator. in the book: Neue Reflowlöttechnologie für elektronische Anwendungen bis 300 °C, Buchreihe: Aufbau- und Verbindungstechnik in der Elektronik, Band 19, pp 115-129 (ISSN 1614-6131) |
| Dimino,I.; Ciminello,M.; Concilio,A.; Pecora,R.; Amoroso,F.; Magnifico,M.; Schueller,M.; Gratias,A.; Volovick,A.; Zivan,L.: Chapter Distributed Actuation and Control of a Morphing Wing Trailing Edge. in the book: Intelligent Aircraft Structures (SARISTU) - Proceedings of the final project conference, pp 171-186 |
Papers
| Ueberschaer,O.; Almeida,M.J.; Matthes,P.; Mueller,M.; Ecke,R.; Rueckriem,R.; Schuster,J.; Exner,H.; Schulz,S.E.: Optimized Monolithic 2D Spin-Valve Sensor for High Sensitivity Compass Applications. IEEE Trans. Magn., 51 (2015) p 4002404 |
| Seifert,T.; Sowade,E.; Roscher,F.; Wiemer,M.; Gessner,T.; Baumann,R.R.: Additive Manufacturing Technologies Compared: Morphology of Deposits of Silver Ink Using Inkjet and Aerosol Jet Printing. Industrial & Engineering Chemistry Research, 54, 2 (2015) pp 769-779 |
| Meinecke,C.; Mueller,M.; Rennau,M.; Reuter,D.; Ebert,R.; Bertz,A.; Exner,H.; Gessner,T.: Technologieentwicklung einer post-process Elektrodenspaltverringerung zur Herstellung von hochaüflösenden Sensorsystemen. Mikrosystemtechnik-Kongress, Karlsruhe, 2015 Oct 26. - 28.; Proceedings, pp 559-562 (ISBN 978-3-8007-4100-7) |
| Wagner,C.; Schuster,J.; Gessner,T.: Carbon nanotubes under strain: Electronic and Optical properties. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Talk; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Foerster,A.; Wagner,C.; Schuster,J.; Gemming,S.; Schulz,S.E.: k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials — A DFT and MD Study . DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Talk; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Foerster,A.; Koehler,N.; Zimmermann,S.; Fischer,T.; Wagner,C.; Schuster,J.; Gemming,S.; Schulz,S.E.; Gessner,T.: Experimental and Theoretical Investigations on an in situ k-restore Process with Plasma Enhanced Fragmentation for Damaged ULK Materials. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 15 - Mar 20; Poster; Abstract in: Verhandlungen der DPG (VI) 50, 3/2015 (ISSN 0420-0195) |
| Forke,R.; Hiller,K.; Hahn,S.; Konietzka,S.; Motl,T.; Koehler,D.; Heinz,S.; Billep,D.; Gessner,T.: Yet Another Tuning Fork Gyroscope. IEEE International Symposium on Inertial Sensors and Systems (ISISS 2015), Hapuna Beach, HI (USA), 2015 Mar 23-26; Proceedings, pp 5-8 |
| Fuchs,F.; Zienert,A.; Wagner,C.; Schuster,J.; Schulz,S.E.: Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing. Microelectronic Eng., 137 (2015) pp 124-129 |
| Fuchs,F.; Zienert,A.; Schuster,J.: Investigation of Carbon Nanotube Based Field-effect Transistors Using Atomistic Quantum Transport and Numerical Device Simulation. IWEPNM, Kirchberg in Tirol, 2015 Mar 7-14; Poster; |
| Fuchs,F.; Zienert,A.; Schuster,J.: Carbon nanotube based field-effect transistors: comparison between atomistic quantum transport and numerical device simulation. DPG-Frühjahrstagung der SKM, Berlin, 2015 Mar 15 - 20; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Strong localization in defective carbon nanotubes. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2015 Mar 10-15; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Mothes,R.; Jakob,A.; Waechtler,T.; Schulz,S.E.; Gessner,T.; Lang,H.: [Ag{S2CNR(C2H4OH)}] as Single-Source Precursor for Ag2S – Synthesis, Decomposition Mechanism, and Deposition Studies. European Journal of Inorganic Chemistry, 2015, 10 (2015) p 1726–1733 |
| Banerjee,S.; Buelz,D.; Reuter,D.; Hiller,K.; Gessner,T.; Salvan,G.; Zahn,D.R.T.: TSCuPc/Au Hybrid Trench Devices: a Comparative Study of Solution Processed and Thermally Evaporated Molecular Channels. DPG Spring Meeting , Berlin, 2015 Mar 15-20 |
| Schueller,M.; Weigel,P.; Lipowski,M.; Nestler,J.; Otto,T.; Gessner,T.: Integration and Test of Synthetic Jet Actuators. Smart Systems Integration SSI, Copenhagen, 2015 Mar 11-12; Proceedings |
| Lipowski,M.; Stiehl,C.; Schueller,M.; Nestler,J.; Otto,T.; Gessner,T.; Kroll,L.: Pulsed Jet Actuators and their integration in composite structures. Smart Systems Integration SSI, Copenhagen, 2015 Mar 11-12; Proceedings |
| Billep,D.; Schulze,R.; Gessner,T.: Sensormodul mit Weckeinrichtung / Sensor module with waking device / Module capteur comprenant un dispositif réveil. EP 2 646 837 B1 |
| Otto,T.; Geidel,S.; Morschhauser,A.; Streiter,R.; Gessner,T.; Heibutzki,B.; Nestler,J.: Mobile communication and control for Smart Microfluidic Systems. International Conference on Signal Processing and Communication (ICSC), 2015, Noida, Uttar Pradesh (INDIA), 2015 Mar 16-18 pp 177-182 (ISBN 978-1-4799-6760-5) |
| Wang,W.-S.; Lin,Y.-C.; Gessner,T.; Esashi,M.: Fabrication of Nanoporous Gold and the Application for Substrate Bonding at Low Temperature. Japanese Journal of Applied Physics, 54, 3 (2015) p 030215 (ISSN 0021-4922) |
| Gaitzsch,M.; Voigt,S.; Haas,S.; Kurth,S.; Gessner,T.: RF MEMS Switch for Modulated Backscatter Communication. MEMSWAVE 2015, Barcelona, 2015 June 30; Proceedings of MEMSWAVE 2015, pp 78-80 (ISBN 978-84-943928-7-0) |
| Dhakal,D.; Georgi,C.; Ecke,R.; Assim,K.; Schulz,S.E.; Bruener,P.; Grehl,T.; Lang,H.; Gessner,T.: XPS and LEIS investigations of ultrathin Cu2O deposited by atomic layer deposition and subsequent reduction to Cu. 18. Tagung Festkörper Analytik, Wien, 2015 July 6-8 |
| Foerster,A.; Wagner,C.; Gemming,S.; Schuster,J.: Theoretical investigation of an in situ k-restore process for damaged ultra-low-k materials based on plasma enhanced fragmentation. Journal of Vacuum Science & Technology B , 33, 5 (2015) p 052203 |
| Foerster,A.; Wagner,C.; Schuster,J.; Gemming,S.: Theoretical investigation of in situ k-restore processes for damaged ultra-low-k dielectrics. MAM/IITC, Grenoble, 2015 May 18-21; Microelectronic Eng. |
| Moebius,M.; Ma,X.; Martin,J.; Doty,M.F.; Otto,T.; Gessner,T.: Photoluminescence quenching of InP/ZnS quantum dots by charge injection. SPIE, San Francisco, 2015 Feb 7-12; Proceedings of SPIE, 9370 (2015) |
| Han,J.; Lin,Y.-C.; Chen,L.; Tsai,Y.-C.; Ito,Y.; Guo,X.; Hirata,A.; Fujita,T.; Esashi,M.; Gessner,T.; Chen,M.: On-Chip Micro-Pseudocapacitors for Ultrahigh Energy and Power Delivery. Advanced Science, 2, 5 (2015) p 1500067 |
| Vogel,K.; Wiemer,M.; Gessner,T.; Vogel,J.; Lin,Y.-C.; Tsai,Y.-C.; Esashi,M.; Tanaka,S.: Evaluation of sputtered Pd76Cu6Si18 metallic glass for MEMS application. The Smart Systems Integration (SSI2015), Copenhagen (Denmark), 2015 Mar 11-12; Proceedings, pp 240-247 (ISBN 978-3-86359-296-7) |
| Dhakal,D.; Hu,X.; Georgi,C.; Schuster,J.; Ecke,R.; Schulz,S.E.; Gessner,T.: Growth Monitoring by XPS and LEIS Investigations of Ultrathin Copper Films Deposited by Atomic Layer Deposition. Symposium of the ALD-Lab, SEMICON Europa, Dresden, 2015 Oct 06-08 |
| Ueberschaer,O.; Almeida,M.; Matthes,P.; Ecke,R.; Mueller,M.; Exner,H.; Schulz,S.E.: Innovative 2D spin valve sensors in monolithic integration for high-sensitivity compass applications. 13th Symposium Magnetoresistive Sensors and Magnetic Systems, Wetzlar (Germany), 2015 Mar 3-4; Proceedings |
| Pérez,N.; Melzer,M.; Makarov,D.; Ueberschaer,O.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.: High-performance GMR sensorics on flexible Si membranes. Applied Physics Letters, 106, 15 (2015) |
| Almeida,M.; Ueberschaer,O.; Matthes,P.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Innovative 2D GMR sensors in monolithic integration for high-sensitivity applications. Nanotech 2015, Tokyo (Japan), 2015 Jan 26 - 30 |
| Matthes,P.; Almeida,M.; Mueller,M.; Ebert.R.; Ecke,R.; Ueberschaer,O.; Exner,H.; Schulz,S.E.: Laser Induced Exchange Bias Realignment Enabling a Monolithic Integration of More Dimensional Magnetic Field Sensors. ILACOS - International Laser And Coating Symposium, Dresden (Germany), 2015 Oct 7; Proceedings |
| Matthes,P.; Almeida,M.; Ueberschaer,O.; Mueller,M.; Ebert,R.; Ecke,R.; Exner,H.; Schulz,S.E.: GMR based 2D magnetic field sensors. SEMNICON Europa, Dresden (Germany), 2015 Oct 6-8; Proceedings |
| Ueberschaer,O.; Almeida,M.; Matthes,P.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Monolithic integration of focused 2D GMR spin valve magnetic field sensor for high-sensitivity (compass) applications. SPIE Optics + Photonics, San Diego (USA), 2015 Aug 9-13; Proceedings |
| Almeida,M.; Matthes,P.; Ueberschaer,O.; Mueller,M.; Ecke,R.; Exner,H.; Schulz,S.E.: Laser Based Exchange Bias Setting Influence on Spin-Valve Sensors Magnetic Properties. Spinicur Summer School, Braga (Portugal), 2015 Sep 7-11; Proceedings |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Simulation of ALD chemistry of (nBu3P)2Cu(acac) and Cu(acac)2 precursors on Ta(110) surface. Microelectronic Engineering, 137, 2 (2015) pp 23-31 |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Surface chemistry of copper metal and copper oxide atomic layer deposition from copper(II) acetylacetonate: a combined first-principles and reactive molecular dynamics study. Physical Chemistry Chemical Physics, 17 (2015) pp 26892-26902 |
| Hu,X.; Zienert,A.; Schuster,J.; Schulz,S.E.; Gessner,T.: Reactive Molecular Dynamics Study of Copper Metal and Copper Oxide Atomic Layer Deposition from Copper(II) Acetylacetonate. 15th International Conference on Atomic Layer Deposition (ALD 2015), Portland (USA), June 28 - July 02 |
| De Diego-Castilla,G.; Pantoja,S.; Geidel,S.; Peransi,S.; Nestler,J.; Martins,R.; Sousa A.; Gomez-Elvira,J.; Moreno-Paz,M.; Cuesta,L.; Parro,V.: A Photonic Biosensor For Space Applications (PBSA) . 46th Lunar and Planetary Science Conference, the Woodlands (United States), 2015 Mar 16-20; Proceedings, 46 (2015) p 2109 |
| Meinecke,C.; Mueller,M.; Rennau,M.; Bertz,A.; Ebert,R.; Reuter,D.; Exner,H.; Gessner,T.: Micro welding of aluminum for post process electrode gap reduction using femtosecond laser. 18th International Conference on Solid-State Sensors, Actuators and Microsystems Transducers 2015, Anchorage, AK (USA), 2015 June 21-25; Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference, pp 1354-1357 |
| Ortlepp,F.; Hartwig,M.; Moebius,M.; Martin,J.; Otto,T.; Gessner,T.; Baumann,R.R.: Inkjet-printing of conductive components for the manufacturing of a quantum dot based sensor for optical health monitoring. 6th International Scientific Conference on Print and Media Technology, Chemnitz (Germany), 2015 Oct 5-7; Proceddings of Printing Future Days 2015, pp 147-148 (ISBN 978-3-86135-626-4) |
| Weiss,A.; Langenickel,J.; Heinrich,K.; Martin,J.; Otto,T.; Gessner,T.: Semiconductor nanocrystals – versatile building blocks for innovative microsystems. AMA Conferences, Nuremberg, 2015 May 19 - 21; Proceedings SENSOR 2015, pp 674-678 (ISBN 978-3-9813484-8-4) |
| Nestler,D.J.; Jung,H.; Trautmann,M.; Wielage,B.; Wagner,G.; Seider,T.; Martin,J.; Otto,T.; Gessner,T.; Ebert,F.; Illing-Guenther,H.; Nendel,K.; Boeddicker,A.; Fuegmann,U.; Huebler,A.: Printed functionalities in hybrid laminates. 2nd International MERGE Technologies Conference : IMTC 2015 Lightweight Structures, Chemnitz, 2015 Oct 1-2; Conference proceedings, pp 273-280 (ISBN 978-3-95735-025-1) |
| Seider,T.; Martin,J.; Boeddicker,A.; Ruehling,J.; Wett,D.; Nestler,D.J.; Wagner,G.; Huebler,A.; Otto,T.; Gessner,T.: Highly-sensitive humidity sensors for condition monitoring of hybrid laminates. 20th Symposium on Composites, Vienna (Austria), 2015 July 1-3; Materials Science Forum, 825-826 (2015) pp 579-585 (ISBN 978-3-03835-515-1) |
| Moebius,M.; Martin,J.; Poppitz,E.A.; Hartwig,M.; Dzhagan,D.; Gordan,O.D.; Lang,H.; Zahn,D.R.T.; Baumann,R.R.; Otto,T.; Gessner,T.: Integrated load detection sensor for lightweight structures based on quantum dots. 2nd International MERGE Technologies Conference : IMTC 2015 Lightweight Structures, Chemnitz (Germany), 2015 Oct 1-2; Conference proceedings, pp 371-372 (ISBN 978-3-95735-025-1) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Strong localization in quasi one-dimensional systems with realistic defects: application to carbon nanotubes. Psi-K 2015 Conference, San Sebastian (Spain), 2015 Sep 6-10; Poster presentation; Abstract in: Psi-K Conference 2015 Abstract Book |
| Jafarpour,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Towards type-selective SWCNTs growth: Comparative study on characterization techniques for an effective CVD process Development. NT, Nagoya(Japan) |
| Jafarpour,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Towards type-selective SWCNT growth: Investigation of catalyst type, composition and structure. MC2015, Güttingen(Germany), 2015 Sep 7-11 |
| Hille,Toni; Blaudeck,T.; Hermann,S.; Schulz,S.E.: Optimizing Dispersion Preparation for the Wafer-Level Deposition of CNTs. DPG-Frühjahrstagung, Berlin, 2015 Mar 15-20; Verhandlungen (ISSN 0420-0195) |
| Kasper,Laura; Adner,David; Blaudeck,T.; Hermann,S.; Lang,Heinrich; Schulz,S.E.: Wafer-level decoration of carbon nanotubes with preformed gold nanoparticles for optical sensing. 3rd Erlangen Symposium on Synthetic Carbon Allotropes (SCA 2015), Erlangen, 2015 Oct 04-07; Verhandlungen |
| Kasper,Laura; Blaudeck,T.; Hermann,S.; Schulz,S.E.: Wafer-level fabrication and characterization of photosensitive CNT-FETs . DPG-Frühjahrstagung, Berlin, 2015 Mar 15-20; Verhandlungen (ISSN 0420-0195) |
| Kalbacova,Jana; Rodriguez,Raul D.; Blaudeck,T.; Hermann,S.; Adner,David; Lang,Heinrich; Schulz,S.E.; Zahn,Dietrich R.T.: Probing the structure of carbon nanotube bundles: A Raman spectroscopy study with metal nanoparticles. Optical Nanospectroscopy II, Dublin, 2015 Mar 18-20; Proceedings |
| Mehta,Ninad; Hille,Toni; Singh Thakur,Dheeraj; Sheremet,Evgeniya; Blaudeck,T.; Schulze,Steffen; Hermann,S.; Hietschold,Michael; Schulz,S.E.: Spectroscopic Monitoring and Data Evaluation of Carbon Nanotube Dispersion Preparation. ESR Conference: Nanospectroscopy for Two-Dimensional Materials, Chemnitz, 2015 Sep 08-10; Proceedings |
| Kasper,Laura; Alam Bhuiyan,Ifte Khairul; Adner,David; Kalbacova,Jana; Blaudeck,T.; Rodriguez,Raul D.; Hermann,S.; Zahn,Dietrich R.T.; Lang,Heinrich; Schulz,S.E.: Characterization of Gold-Decorated Carbon Nanotube Field-Effect Transistors in Planar Device Geometry. ESR Conference: Nanospectroscopy for Two-Dimensional Materials, Chemnitz, 2015 Sep 08-10; Proceedings |
| Hartmann,Steffen; Shaporin,A.; Hermann,S.; Bonitz,J.; Heggen,Marc; Markert,M.; Meszmer,Peter; Sturm,Heinz; Hoelck,Ole; Blaudeck,T.; Schulz,S.E.; Mehner,J.; Wunderle,B.; Gessner,T.: Towards Nanoreliability of CNT based Sensor Applications: Investigations of Carbon Nanotube-Metal Interfaces Combining Molecular Dynamics Simulations, Advanced In-Situ Experiments and Analytics. 16th IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Budapest, 2015 April 19-22; Proceedings (ISBN 978-1-4799-9949-1) |
| Blaudeck,T.; Adner,David; Hermann,S.; Lang,Heinrich; Gessner,T.; Schulz,S.E.: Wafer-level decoration of carbon nanotubes in field-effect transistor geometry with preformed gold nanoparticles using a microfluidic approach. Microelectronic Engineering, 137 (2015) pp 135-140 |
| Sowade,Enrico; Blaudeck,T.; Baumann,R.R.: Inkjet Printing of Colloidal Nanospheres: Engineering the Evaporation-Driven Self-Assembly Process to Form Defined Layer Morphologies . Nanoscale Research Letters, 2015, 10 (2015) p 362 (ISSN 1556-276X) |
| Zienert,A.; Schuster,J.; Gessner,T.: Electronic Transport in Metallic Carbon Nanotubes with Metal Contacts. The AIMR International Symposium 2015, Sendai (Japan), 2015 Feb 16-19 |
| Hermann,S.; Bonitz,J.; Boettger,S.; Hartmann,S; Shaporin,A.; Mehner,J.; Wunderle,B.; Schulz,S.E.; Gessner,T.: Carbon Nanotube based sensors in MEMS/NEMS. SSI, Copenhagen, 2015 Mar 11-12 |
| Gessner,T.; Otto,T.; Schulz,S.E.; Hermann,S.; Blaudeck,T.; Spudat,C.: Vorrichtungen zur Aussendung und/oder zum Empfang elektromagnetischer Strahlung und Verfahren zur Bereitstellung derselben . DE102013221758 (A1) |
| Hartmann,M.; Hermann,S.; Pohl,D.; Rellinghaus,B.; Schulz,S.E.: A wafer-level test platform for statistical TEM analysis of integrated carbon nanotubes. 3rd Dresden Nanoanalysis symposium 2015, 2015 April 17 |
| Hartmann,M.; Hermann,S.; Pohl,D.; Rellinghaus,B.; Schulz,S.E.: A wafer-level test platform for statistical TEM analysis of the structural properties of integrated carbon nanotubes. DPG 2015, 2015 Mar 15-20 |
| Weidlich,S.; Forke,R.; Billep,D.; Konietzka,S.; Koehler,D.; Hiller,K.; Gessner,T.: Modulare aktive Probecard zur Systemcharakterisierung von mikro-elektromechanischen Sensoren am Beispiel von Gyroskopen. Mikrosystemtechnik Kongress, Karlsruhe, 2015 Okt 26-28; Proceedings, pp 595-598 (ISBN 978-3-8007-4100-7) |
| Hofmann,L.; Dempwolf,S.; Reuter,D.; Ecke,R.; Gottfried,K.; Schulz,S.E.; Knechtel,R.; Gessner,T.: 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding. SPIE Microtechnologies, Barcelona, Spain, 2015 May ; Proceedings of SPIE, 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 951709 (2015) |
| Hofmann,L.; Reuter,D.; Schubert,I.; Wuensch,D.; Rennau,M.; Ecke,R.; Vogel,K.; Gottfried,K.; Schulz,S.E.; Gessner,T.: 3d Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages. International Wafer-Level-Packaging Conference, San Jose, CA, USA, 2015 October 13-15; SMTA Proceedings |
| Haas,S.; Schramm,M.; Reuter,D.; Loebel,K.-U.; Horstmann,J.T.; Gessner,T.: Direct integrated strain sensors for robust temperature behaviour. Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers-2015 18th International Conference on, pp 184-187 |
| Hartwig,M.; Ortlepp,F.; Moebius,M.; Martin,J.; Otto,T.; Gessner,T.; Baumann,R.R.: Inkjet-printed quantum dot-based sensor for structural health monitoring. MRS Spring Meeting 2015, San Francisco (California), 2015 Apr 6-10; MRS Online Proceedings Library, 1788 (2015) |
| Kaspar,M.; Waechtler,T.; Ecke,R.; Georgi,C.; Schulz,S.E.; Lang,H.; Gessner,T.: A Novel Dicobaltatetrahedrane Precursor Studied for the MOCVD of Cobalt Metal Layers (Poster). Materials for Advances Metalization (MAM), Grenoble, 2015 May 18 - 21 |
| Meinig,M.; Kurth,S.; Helke,C.; Seifert,M.; Hiller,K.; Ebermann,M.; Neumann,N.; Gessner,T.: Electrically tunable Fabry-Pérot interferometer with inherent compensation of the influence of gravitation and vibration. Smart Systems Integration, Copenhagen, 2015 Mar 11-12; Proceedings, pp 204-211 (ISBN 978-3-86359-296-7) |
| Ebermann,M.; Neumann,N.; Binder,S.; Meinig,M.; Seifert,M.; Kurth,S.; Hiller,K.: A fast MEMS infrared microspectrometer for the measurement of hydrocarbon gases. 18th International Conference on Solid-State Sensors, Actuators and Microsystems, Anchorage, 2015 Jun 21-25; Proceedings of TRANSDUCERS, pp 2037-2040 (ISBN 978-1-4799-8955-3) |
| Rupprecht,J.; Kurth,S.; Hiller,K.; Seifert,M.; Besser,J.; Meinig,M.; Ebermann,M.; Neumann,N.; Gessner,T.: Subwavelength Grating Reflectors for Fabrication Cost Reduction of Fabry-Perot Infrared Filters. Materials Today: Proceedings, 2, 8 (2015) pp 4280-4288 |
| Wecker,J.; Mangalgiri,G.; Kurth,S.; Meinig,M.; Hackner,A.; Prechtel,U.; Gessner,T.: Oxygen Detection by Rotational Spectroscopy with a Small Size Millimeter Wave Resonator. International Journal of Microwave and Optical Technology, 10, 6-I (2015) pp 410-416 (ISSN 1553-0396) |
| Nossol,P.; Schaufuss,J.; Tsapkolenko,A.; Rost,F; Arnold,B.; Kroll,L.; Mehner,J.; Gessner,T.: Preliminary Investigations of Processing Impact on Microelectronic Devices by Injection Moulding Technology. 2nd International MERGE Technologies Conference : IMTC 2015 Lightweight Structures, Chemnitz (Germany), 2015 October 1-2; Conference proceedings, pp 293-302 (ISBN 978-3-95735-025-1) |
| Banerjee,S.; Buelz,D.; Reuter,D.; Hiller,K.; Gessner,T.; Zahn,D.R.T.; Salvan,G.: Photosensitive Organic / Inorganic Hybrid Trench Devices for Sensor Applications. ECME 2015, Strasbourg (France), 2015 Sep 1-5 |
| Helke,C.; Nestler,J.; Gessner,T.: Surface patterning and self-assembly of DNA-Origami based transistor nanoarchitectures. Smart Systems Integration, Copenhagen, Mar 11-12; Proceedings, pp 410-413 (ISBN 978-3-86359-296-7) |
| Hann,J.; Helke,C.; Nestler,J.; Billep,D.; Gessner,T.: Nanoxerography and Electrical Nanoimprint Lithography for Optimization of Thermoelectric Properties of PEDOT:PSS. Workshop on µ-contact-printing and nanoimprint lithography Dresden, Dresden, Mar 09; Proceedings, p 25 |
| Grossmann,T.D.; Gaitzsch,M.; Hartwig,M.; Heinrich,M.; Symmank,C.; Schmidt,A.; Kurth,S.; Gessner,T.; Baumann,R.R.; Kroll,L.; Goetze,U.: Remote Ice Detection on Rotor Blades of Wind Turbines. 2nd International MERGE Technologies Conference, Chemnitz (Germany), 2015 Oct 1-2; Proceedings, pp 265-271 (ISBN 978-3-95735-025-1) |
| Hartwig,M.; Gaitzsch,M.; Heinrich,M.; Grossmann,T.D.; Kroll,L.; Gessner,T.; Baumann,R.R.: Printing of conductive patterns for application in smart lightweight structures. Smart Systems Integration 2015, Copenhagen (Denmark) |
| Hartwig,M.; Gaitzsch,M.; Heinrich,M.; Grossmann,T.D.; Kroll,L.; Gessner,T.; Baumann,R.R.: Inkjet and gravure printing of conductive patterns for the application in lightweight structures. Printing Future Days, Chemnitz (Germany), 2015 Oct 5-7; Proceedings (ISBN 978-3-86135-626-4) |
| Hartwig,M.; Mischke,A.; Gaitzsch,M.; Grossmann,T.D.; Heinrich,M.; Kurth,S.; Kroll,L.; Gessner,T.; Baumann,R.R.: Inkjet and gravure printed conductive grid patterns for the application in functional lightweight structures. 581. Wilhelm und Else Heraeus-Seminar on Flexible, Stretchable and Printable High Performance Electronics, Bad Honnef (Germany) |
| Gaitzsch,M.; Grossmann,T.D.; Hartwig,M.; Heinrich,M.; Kurth,S.; Gessner,T.; Baumann,R.R.; Kroll,L.: Efficient K-Band Antennas Fabricated with Large-Scale-Processes. 2nd International MERGE Technologies Conference, Chemnitz (Germany), 2015 Oct 1-2 |
| Froemel,J.; Baum,M.; Wiemer,M.; Gessner,T.: Low-Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism. Journal of Microelectromechanical Systems (JMEMS), Vol. 24, 6 (2015) pp 1973-1980 (ISBN ISSN: 1057-7157 ) |
| Enderlein,T.; Nestler,J.; Otto,T.; Gessner,T.: Fabrication of Micro Needle arrays using an Ultra short pulse Laser. Smart System Integration, Copenhagen, 2015 Mar 11-12; Proceedings, pp 388-391 (ISBN ISBN 978-3-86359-296-7) |
| Seifert,T.; Baum,M.; Roscher,F.; Wiemer,M.; Gessner,T.: Aerosol Jet Printing of Nano Particle Based Electrical Chip Interconnects. nanoFIS 2014 - Functional Integrated nanoSystems, Graz (Austria), 2014 Dec 3-5; Materials Today: Proceedings, 2, 8 (2015) pp 4262-4271 (ISSN 2214-7853) |
| Schueller,M.; Lipowski,M.; Schirmer,E.; Walther,M.; Symmank,C.; Schmidt,A.; Kroll,L.; Gessner,T.; Goetze,U.: Fluidic actuators in composite structures: design, manufacturing, and life cycle-related evaluation. IMTC 2015, Chemnitz, 2015 Oct 1-2 |
| Wright,D.N; Taklo,M.M.V.; Baum,M.; Hofmann,C.; Kristiansen,H.: Novel compliant fine pitch interconnect using Metal Coated Polymer Spheres. IMAPS Nordic, Helsingor (DK), 2015 Jun 9; Proceedings |
| Zuercher,J.; Yu,K.; Schlottig,G.; Baum,M.; Taklo,M.M.V.; Wunderle,B.; Warszynki,P.; Brunschwiler,T.: Nanoparticle assembly and sintering towards all-copper flip chip interconnects . Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th , San Diego, CA, 2015 May 23-26 ; Proceedings, 65th (2015) pp 1115-1121 (ISSN 15304236 ) |
| Hofmann,C.; Baum,M.; Bodny,F.; Wiemer,M.; Gessner,T.; Brunschwiler,T.; Zuercher,J.; Burg,B.R.; Zimmermann,S.: Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects. Smart Systems Integration 2015, Copenhagen (DK), 2015 Mar 11-12; Proceedings, 9th (2015) pp 85-92 (ISBN 978-3-86359-296-7) |
| Roscher,F.; Seifert,T.; Baum,M.; Wiemer,M.; Gessner,T.: Printed metallic nanoparticles as intermediate layers for low temperature wafer level packaging an as an alternative towards conventional wire bonding. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Braunschweig, Germany, 7-9 December, 2015 |
| Baum,M.; Wang,W.-S.; Vogel,K.; Hofmann,L.; Devadass,N.K.; Roscher,F.; Wiemer,M.; Gessner,T.: Optimization of surface pretreatments for oxide removal prior to Cu-Cu thermocompression bonding. Conference for Wafer Bonding for Microsystems 3D- and Wafer Level Integration, Braunschweig,Germany, 7-9 December, 2015 |
| Albrecht,J.; Dudek,R.; Auersperg,J.; Pantou,R.; Rzepka,S.: Thermal and mechanical behaviour of an RFID based smart system embedded in a transmission belt determined by FEM simulations for Industry 4.0 applications. EurosimE , Budapest (Hungary), 2015 Apr 19-22 |
| Auersperg,J.; Albrecht,J.: Combined bulk fracture and material interface delamination simulation of the nano indentation test. Microreliability-Seminar, Fraunhofer ENAS Chemnitz (Germany), 2015 Mar 26 |
| Auersperg,J.; Breuer,D.; Machani,K.V; Rzepka,S.; Michel,B.: FEA to Tackle Damage and Cracking Risks in BEoL Structures under Copper Wire Bonding Impact. International Advanced Metallization Conference 32nd Edition, Austin/TX (USA), 2015 Sept 9-10 |
| Auersperg,J.; Kaulfersch,E.; Breuer,D.; Machani,K.V; Rzepka,S.; Michel,B.: Evaluation of Pattern Scale Stress Effects of 28 nm Technology during Wire Bond and Cu Pillar Flip Chip Assembly. 23. Chemnitzer Seminar, Fraunhofer ENAS Chemnitz (Germany), 2015 Sep 28. |
| Auersperg,J.; Breuer,D.; Machani,K.V; Rzepka,S.; Michel,B.: Fracture mechanics for bonding on ULK. MicroClean-Konferenz, Dresden (Germany), 2015 May 19-20 |
| Auersperg,J.; Breuer,D.; Machani,K.V; Rzepka,S.; Michel,B.: FEA Study of Damage and Cracking Risks in BEoL Structures under Copper Wirebonding Impact. International Conference on Thermal. Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE, Budapest (Hungary), 2015 Apr 19-22 |
| Brueckner,J.; Dehé,A.; Auerswald,E.; Vogel,D.; Dudek,R.; Rzepka,S.: Mechanical Characterization of Poly-Silicon Membranes by Efficient Experimental Tests and Numerical Simulations. Smart Systems Integration Conference 2015 (SSI), Copenhagen (Denmark), 2015 Mar 11-12; Proceedings, pp 380-383 (ISBN 978-3-86359-296-7) |
| Brueckner,J.; Dehé,A.; Auerswald,E.; Vogel,D.; Dudek,R.; Rzepka,S.: An Improved Micromechanical Method for Investigating the Statistical Strength of Poly-Silicon Membranes. 12th International Conference on the Mechanical Behavior of Materials, Karlsruhe (Germany), 2015 May 10-14 |
| Brueckner,J.; Dehé,A.; Auerswald,E.; Dudek,R.; Vogel,D.; Michel,B.; Rzepka,S.: Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation. Journal of Microsystem Technologies |
| Brueckner,J.; Glacer,C.; Dehé,A.; Auerswald,E.; Hildebrandt,M.; Vogel,D.; Rzepka,S.: Miniaturisierte On-Chip Teststrukturen zur Festigkeitsüberwachung von Poly-Silizium. MikroSystemTechnik Kongress 2015, Karlsruhe (Germany), 2015 Oct 26-28 |
| Dudek,R.; Doering,R.; Rzepka,S.; Ehrhardt,C.; Guenther,M.; Haag,M.: Electro-Thermo-Mechanical Analyses on Silver Sintered IGBT-Module Reliability in Power Cycling. EuroSimE 2015, Budapest (Hungary), 2015 Apr; Proceedings |
| Dudek,R.; Doering,R.; Rzepka,S.; Seiler,B.; Kreyssig,K.: Finite-Elemente Analysen zur thermomechanischen Beanspruchung von Diffusionslöt- und Sinterverbindungen. 4. DVS-Tagung Weichlöten 2015 - Trends und Entwicklungsschwerpunkte in der Leistungselektronik, Hanau (Germany), 2015 Mar 24-25; Proceedings |
| Dudek,R.; Doering,R.; Rzepka,S.; Ehrhardt,C.; Hutter,M.; Rudzki,J.; Osterwald,F.; Eisele,R.; Stegmeier,S.; Weidner,K.; Rittner,M.: Investigations on Power Cycling Induced Fatigue Failure of IGBTs with Silver Sintered Interconnects. 20th European Microelectronics and Packaging Conference (EMPC), Friedrichshafen (Germany), 2015 Sep 14-16 |
| Dudek,R.; Hildebrandt,M.; Doering,R.; Rzepka,S.; Trageser,H.; Kohl,R.; Schuch,B.: Fatigue Failure of SAC and Innolot Joints under Test- and Field Cycling Environments. EPTC 2015, Singapore, 2015 Dec; Proceedings |
| Dudek,R.; Doering,R.; Hildebrandt,M.; Ruemmler,N.; Rzepka,S.: Simulation zur Lebensdauerprognose zuverlässiger Systeme (Thermische Aspekte und Vibration). 7. Berliner Technologieforum, Berlin (Germany), 2015 May; Vortrag |
| Dudek,R.; Rzepka,S.: The Impact of the Fabrication Process on the Microstructure and hence on the Reliability Relevant Behavior of Materials and Components in Smart Systems. 3rd 'European Expert Workshop on Reliability of Electronics and Smart Systems' (EuWoRel), Berlin (Germany), 2015 Nov; Proceedings |
| Kaulfersch,E.; Auersperg,J.; Breuer,D.; Braemer,B.; Rzepka,S.: Evaluation of Pattern Scale Stress Effects of 28nm Technology during Wire Bond and Cu-Pillar Flip Chip. EMPC 2015 Submissions, Friedrichshafen (Germany), 2015 Sep 14-16 (ISBN 978-09568086-1-5) |
| Rost,F.; Schindler-Saefkow,F.; Schaufuss,J.; Vogel,D.; Michel,B.; Mehner,J.; Rzepka,S.: Mechanical stress induced in Si sensors during bonding and packaging processes. Smart Systems Integration Conference 2015 (SSI), Copenhagen (Denmark), 2015 Mar 11-12; Proceedings, pp 40-47 (ISBN 978-3-86359-296-7) |
| Bayat,P.; Vogel,D.; Rodriguez,R.D.; Sheremet,E.; Zahn,D.R.T.; Rzepka,S.; Michel,B.: Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy. Microelectronic Engineering, 137, 2 (2015) p 101–104 (ISSN 0167-9317) |
| Vogel,D.; Auerswald,E.; Auersperg,J.; Rzepka,S.: Stress Measurements on TSVs and BEoL Structures with High Spatial Resolution. China Semiconductor Technology International Conference (CSTIC), Shanghai (China), 2015 Mar 15-16; Proceedings |
| Brinkfeldt,K.; Edwards,M.; Andersson,D; Neumaier,K.; Zschieschang,O.; Hilpert,F.; Otto,A.; Kaulfersch,E.: Modeling and Fabrication of a SiC-based Power Module with Double Sided Cooling. SMTA Pan Pacific 2015, Big Island Hawaii (USA), 2015 Feb 2-5 |
| Armengaud,E.; Macher,G.; Kurtulus,C.; Groppo,R.; Haase,S.; Hofer,G.; Otto,A.; Schmidt,H.; Stankiewicz,S.: Improving HV battery efficiency by smart control systems. Smart Systems Integration Conference 2015 (SSI), Copenhagen (Denmark), 2015 Mar 11-12; Proceedings, pp 325-332 (ISBN 978-3-86359-296-7) |
| Brinkfeldt,K.; Ottosson,J.; Neumaier,K.; Zschieschang,O.; Otto,A.; Kaulfersch,E.; Andersson,D: Thermo-Mechanical Simulations of a SiC Power Module with Double Sided Cooling. EuroSimE 2015, Budapest (Hungary), 2015 Apr 19-22 pp 1-7 (ISBN 978-1-4799-9949-1) |
| Merten,E.; von Essen,T.; Luczak,F.; Otto,A.; Lunding,A.; Bast,M.; Abo Ras,M.; Rzepka,S.: Reliability Investigation and Design of High Power Converter Modules Based on Material Characterization, Simulation and Experimental Verification. EuroSimE 2015, Budapest (Hungary), 2015 Apr 19-22 |
| Brinkfeldt,K.; Ottosson,J.; Neumaier,K.; Zschieschang,O.; Kaulfersch,E.; Edwards,M.; Otto,A.; Andersson,D: Design and Fabrication of a SiC-Based Power Module with Double-Sided Cooling for Automotive Applications. Adv. Microsystems for Automotive Applications (AMAA) 2015, Berlin (Germany), 2015 Jul 7-8; Smart Systems for Green and Automated Driving, pp 157-171 (ISBN 978-3-319-20854-1, Online ISBN: 978-3-319-20855-8/Series ISSN: 2196-5544) |
| Schindler-Saefkow,F.; Raschke,T.; Rzepka,S.: Identifikation von Material- und Prozessparametern in Elektronik- & MEMS-Packages mit Hilfe des Stresschips. MikroSystemTechnik Kongress 2015 p 757 ff |
| Heilmann,J.; Nikitin,I.; May,D.; Pressel,K.; Wunderle,B.: Thermo-Mechanical Characterization and Reliability Modelling of Sintered Silver based Thermal Interface Materials. 21st Therminic Conference, Paris (France), 2015 Sep 30-Oct 2; Proceedings |
| Springborn,M.; Wunderle,B.; May,D.; Mrossko,R.; Manier,C.-A.; Abo Ras,M.; Oppermann,H.; Xhonneux,T.; Caroff,T.; Mitova,R.: Transient Thermal Management by Using Double-sided Assembling, Thermo-electric Cooling and Phase-change Based Thermal Buffer Structures: Design, Technology and Application. 21st Therminic Conference, Paris (France), 2015 Sep 30-Oct 2; Proceedings |
| Schlag,R.; Abo Ras,M.; Arlt,V.; May,D.; Winkler,T.; Wunderle,B.: Precision Determination of Thermoreflectance Coefficients for Localised Thermometry. 21st Therminic Conference, Paris (France), 2015 Sep 30-Oct 2; Proceedings |
| May,D.; Fritzsche,S.; Cardoso,A.; Schacht,R.; Wunderle,B.: IR Pulse Thermography as Failure Analytical Tool Applied to Die Attach Processes. 21st Therminic Conference, Paris (France), 2015 Sep 30-Oct 2; Proceedings |
| Abo Ras,M.; May,D.; Schacht,R.; Bast,M.; Eisele,R.; Michel,B.; Winkler,T.; Rzepka,S.; Wunderle,B.: LaTIMA - nan innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials. 21st Therminic Conference, Paris (France), 2015 Sep 30-Oct 2; Proceedings |
| Stiebing,M.; Vogel,D.; Steller,W.; Wolf,M.J.; Wunderle,B.: Challenges in the Reliability of 3D Integration using TSVs. 16th EuroSimE Conference, Budapest (Hungary), 2015 Apr 19-24; Proceedings |
| Kumar,S.G.; Zschenderlein,U.; Baum,M.; Brunschwiler,T.; Schlottig,G.; Schindler-Saefkow,F.; Haupt,M.; Wunderle,B.: Advances in Percolated Thermal Underfill (PTU) Simulations for 3D-Integration. 16th EuroSimE Conference, Budapest (Hungary), 2015 Apr 19-24; Proceedings |
| Stoeckel,C.; Billep,D.; Konietzka,S.; Zimmermann,S.; Otto,T.: Wake Up MEMS for Inertial Sensors. IEEE International Symposium on Inertial Sensors and Systems 2015, Hapuna Beach, Hawaii (USA), 2015 Mar 23-26; Proceedings, pp 101-104 (ISBN 978-1-4799-5914-3) |
| Fischer,T.; Heinrich,K.; Spudat,C.; Martin,J.; Otto,T.; Gessner,T.; Kroll,L.: Quantum dot-based sensor layer in lightweight structures. Microelectronik Engineering – Nanotechnology and Processing for electronics, MEMS, Energy, Life Sciences, 146 (2015) pp 57-61 (ISSN 0167-9317) |
| Zschenderlein,U.; Kumar,S.G.; Baum,M.; Brunschwiler,T.; Wunderle,B.: Experimental thermal and mechanical characterisation of Percolating Thermal Underfills (PTU) for thermally enhanced Flip-Chip packages. 16th EuroSimE Conference, Budapest (Hungary), 2015 Apr 19-24; Proceedings |
| Heilmann,J.; Nikitin,I.; Onken,T.; Pressel,K.; Wunderle,B.: Acceleration of Lifetime Modelling by Isothermal Fatigue Tests. 16th EuroSimE Conference, Budapest (Hungary), 2015 Apr 19-24; Proceedings |
| Wunderle,B.; Schulz,M.; Braun,T.; May,D.; Bauer,J.; Hoelck,O.; Walter,H.; Keller,J.: A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement. 55th ECTC Conference, San Diego, (USA), 2015 May 26-29; Proceedings |
| Hoelck,O.; Wunderle,B.: In: Microelectronics Packaging Materials: Investigating the Influence of Moisture by Molecular Dynamics Simulations. Molecular Modeling and Multiscaling Issues for Electronic Materials Applications, 2 (2015) |
| Ali,E.; Rahajandraibe,W.; Haddad,F.; Tall,N.; Hangmann,C.; Hedayat,C.: Exact and Approximated Discrete-Time Non-Linear Model of Voltage Switched CP-PLL. IEEE 58th International Midwest Symposium on Circuits and Systems, 2015 |
| Poshtan,E.A.; Rzepka,S.; Silber,C.; Wunderle,B.: Accelerated Determination of Interfacial Fracture Toughness in Microelectronic Packages under Cyclic Loading. 55th ECTC Conference, San Diego, (USA), 2015 May 26-29; Proceedings |
| Ali,E.; Rahajandraibe,W.; Haddad,F.; Tall,N.; Hangmann,C.; Hedayat,C.: Modeling and PVT characterization of arbitrary ordered VSCPPLL using an efficient event-driven approach. IEEE 13th International New Circuits and Systems Conference, 2015 |
| Hangmann,C.; Hedayat,C.; Hilleringmann,U.: Fast and Accurate Event-Driven Simulation of a Mixed-Signal System Using the Example of a PLL. Smart Systems Integration Conference 2015 (SSI), Copenhagen (Denmark), 2015 Mar 11-12; Proceedings, pp 396-401 (ISBN 978-3-86359-296-7) |
| Ali,E.; Rahajandraibe,W.; Haddad,F.; Tall,N.; Hangmann,C.; Hedayat,C.: Simulation and Validation of Arbitrary Ordered VSCP-PLLs Using Event-Driven Macromodeling. IEEE International Symposium on Circuits and Systems, 2015 |
| Hangmann,C.; Hedayat,C.; Hilleringmann,U.: Ereignisgesteuerte Methode für schnelle und präzise Analysen. Mikroelektronik Nachrichten - Fraunhofer Mikroelektronik, p 59 |
| Schoenhoff,M.; De Boor,J.; Assion,F.; Hilleringmann,U.: A Process for Mass Production of Magnesium Silicide as a TEG Material. International Conference on Thermoelectrics, 2015 |
| Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Integration process of a self-aligned contact setup for flexible electronics. The 41th International Conference on Micro and Nano Engineering (MNE2015), 2015 |
| Vidor,F.F.; Meyers,T.; Hilleringmann,U.: Flexible Electronics: Integration Processes for Organic and Inorganic Semiconductor-Based Thin-Film Transistors. Electronics, 4 (2015) pp 480-506 |
| Vidor,F.F.; Meyers,T.; Hilleringmann,U.; Wirth,G.I.: Influence of UV irradiation and humidity on a low-cost ZnO nanoparticle TFT for flexible electronics. IEEE 15th International Conference on Nanotechnology (IEEE-NANO), 2015 |
| Vidor,F.F.; Meyers,T.; Hilleringmann,U.; Wirth,G.I.: ZnO nanoparticle thin-film transistors on flexible substrate using spray-coating technique. The 41th International Conference on Micro and Nano Engineering (MNE2015), 2015 |
| Sowade,E.; Kang,H.; Mitra,K.Y.; Weiss,O.J.; Weber,J.; Baumann,R.R.: Roll-to-roll infrared (IR) drying and sintering of an inkjet-printed silver nanoparticle ink within 1 second. Journal of Materials Chemistry C 09/2015, 3, 45 (2015) pp 11815-11826 |
| Dinh,N.T.; Sowade,E.; Blaudeck,T.; Hermann,S.; Rodriguez,R.D.; Zahn,D.R.T.; Schulz,S.E.; Baumann,R.R.; Kanoun,O.: High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly. Carbon 09/2015, 96 (2015) pp 382-396 |
| Gomes,H.L.; Medeiros,M.C.R.; Villani,F.; Canudo,J.; Loffredo,F.; Miscioscia,R.; Martinez-Domingo,C.; Ramon,E.; Sowade,E.; Mitra,K.Y.; Baumann,R.R.; McCulloch,I.; Carrabina,J.: All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime. Microelectronics Reliability 05/2015, 55 (2015) pp 1192-1195 |
| Castro,H.; Sowade,E.; Rocha,J.G.; Alpuim,P.; Machado,A.V.; Baumann,R.R.; Lanceros-Mendez,S.: Degradation of all-inkjet-printed organic thin-film transistors with TIPS-pentacene under processes applied in textile manufacturing. Organic Electronics 03/2015, 22 (2015) pp 12-19 |
| Niittynen,J.; Sowade,E.; Kang,H.; Baumann,R.R.; Maentysalo,M.: Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers. Scientific Reports 03/2015, 5:8832 (2015) |
| Deetuam,C.; Weise,D.; Samthong,C.; Praserthdam,P.; Baumann,R.R.; Somwangthanaroj,A.: Electrical conductivity enhancement of spin-coated PEDOT:PSS thin film via dipping method in low concentration aqueous DMSO. Journal of Applied Polymer Science 03/2015, 132, 24 (2015) |
| Sowade,E.; Goethel,F.; Zichner,R.; Baumann,R.R.: Inkjet printing of UHF antennas on corrugated cardboards for packaging applications. Applied Surface Science 01/2015, 332 (2015) pp 500-506 |
| Sternkiker,C.; Sowade,E.; Mitra,K.Y.; Zichner,R.; Baumann,R.R.: Upscaling of the Inkjet Printing Process for the Manufacturing of Passive Electronic Devices. IEEE Transactions on Electron Devices 01/2015 |
| Weise,D.; Sternkiker,C.; Baumann,R.R.: Intense pulsed light sintering and parameter optimization of various inkjet printed silver electrodes. NIP & Digital Fabrication Conference, vol. 2015, no. 1, January 2015 (2015) pp 62-65(4) |
| Weise,D.; Mitra,K.Y.; Sowade,E.; Baumann,R.R.: Intense Pulsed Light Sintering of Inkjet Printed Silver Nanoparticle Ink: Influence of Flashing Parameters and Substrate. MRS Online Proceeding Library 01/2015, 1761 (2015) |
| Mitra,K.Y.; Weise,D.; Hartwig,M.; Baumann,R.R.: Infra-red curing methodology for Roll-to-Roll (R2R) manufacturing of conductive electrodes through inkjet technology applicable for devices in the field of flexible electronics. MRS Online Proceeding Library 01/2015, 1791 (2015) |
| Benchirouf,A.; Zichner,R.; Mueller,C.; Kanoun,O.: Electromagnetic Simulation of Flexible Strain Sensor based Microstrip Patch Antenna. IJMOT, 2015, pp 397-401 |
| Willert,A.; Helmert,M.; Baumann,R.R.: Printed primary battery solutions to power integrated applications. Media Technology Research Seminar, Institute of Print and Media Technology, 2015 Jan 20; Talk |
| Willert,A.: Digital Fabrication of printed Smart Objects. ivam Workshop, Oulu (Finland), 2015 Jun 10; Talk |
| Willert,A.; Helmert,M.; Baumann,R.R.: Tailoring Printed Primary Batteries for Various Kinds of Applications. Plastic Electronics Conference Europe, Dresden (Germany), 2015 Oct 6-8; Talk |
| Willert,A.; Baumann,R.R.: Technology and Applications of Printed Primary Batteries. Masterclass of IDTechEx Printed Electronics Berlin, 2015 Apr 27; Talk |
| Willert,A.; Sowade,E.; Zichner,R.; Baumann,R.R.: Functional Material Deposition and Functionality Forming. Institute of Print and Media Technology, Media Technology Research Seminar, 2015 Apr 21; Talk |
| Helmert,M.; Harnisch,T.; Weise,D.; Hartwig,M.; Weber,J.; Fuchs,H.; Weiss,O.; Baumann,R.R.: Comparison of thermal, infrared and photonic sintering of screen printed metal-organic decomposition silver layers. 7th LOPEC 2015, Munich (Germany), 2015 Mar 3-5; Talk |
| Baumann,R.R.: Digital Fabrication: Routes to Manufacture Small Batches of Printed Electronics. 2015Flex, Monterey, California (USA), 2015 Feb 23-26; Talk |
| Baumann,R.R.: Printing Technologies for High Volume Applications. Forum Be-Flexible 2015, Munich (Germany), 2015 Nov 17-18; Talk |
| Zichner,R.; Baumann,R.R.: Sustainable Manufacturing of High Performance RF Components – On the Readiness of Industrialization. FLEX2015, Monterey (USA), 2015 Feb 23-26; Talk |
| Zichner,R.; Baumann,R.R.: Printing as a highly productive manufacturing method of high frequency components like antennas. WFMN15, Chemnitz (Germany), 2015 Feb 10-13; Talk |
| Sowade,E.; Baumann,R.R.: Printing beyond color - manufacturing of smart objects. Nanomercosur, Buenos Aires (Argentina), 2015 Oct 06-08; Talk |
| Sowade,E.; Mitra,K.Y.; Ramon,E.; Villani,F.; Gomes,H.L.; Carrabina,J.; Baumann,R.R.: Inkjet printing of thin-film transistors on flexible substrates. 581. Wilhelm und Else Heraeus-Seminar on Flexible, Stretchable and Printable High Performance Electronics, Bad Honnef (Germany), 2015 Jan 12-14; Talk |
| Mitra,K.Y.; Helmert,M.; Weise,D.; Baumann,R.R.: Inkjet-printing of conductive electrodes on flexible textile fabrics for wearable applications. LOPEC15, Munich (Germany), 2015 Mar 04; Talk |
| Weise,D.; Hartwig,M.; Mitra,K.Y.; Wagenbach,A.; Shah,K.Y.; Baumann,R.R.: Controlling the ink spreading on uncoated paper for inkjet printed nanoparticle silver inks in combination with intense pulsed light (IPL) sintering. Printing Future Days, Chemnitz (Germany), 2015 Oct 05-07; Talk |
| Mitra,K.Y.; Polomoshnov,M.; Weise,D.; Sowade,E.; Ramon,E.; Martinez-Domingo,C.; Baumann,R.R.: All Inkjet-printed OTFT manufactured on paper substrate for cheap printed electronic applications. E-MRS, Lille (France), 2015 May 12; Talk |
| Weise,D.; Baumann,R.R.: Intense pulsed light sintering and parameter optimization of various inkjet printed silver electrodes. Digital Fabrication and Digital Printing NIP31, Portland, Oregon (USA), 2015 Sep 27-Oct 01; Talk |
| Mitra,K.Y.; Helmert,M.; Baumann,R.R.: Inkjet-printed conductive electrodes for wearable and flexible applications. 581. Wilhelm und Else Heraeus-Seminar, Physikzentrum Bad Honnef (Germany), 2015 Jan 12-14; Poster |
| Weise,D.; Baumann,R.R.: Intense Pulsed Light (IPL) sintering of inkjet printed nanoparticle silver ink – Influence of flashing parameters and substrate. 581. Wilhelm und Else Heraeus-Seminar on Flexible, Stretchable and Printable High Performance Electronics, Bad Honnef (Germany), 2015 Jan 12-14; Poster |
| Sternkiker,C.; Sowade,E.; Mitra,K.Y.; Zichner,R.; Baumann,R.R.: Inkjet printing of passive electronic components using industrial printheads. 581. Wilhelm und Else Heraeus-Seminar on Flexible, Stretchable and Printable High Performance Electronics, Bad Honnef (Germany), 2015 Jan 12-14; Poster |
| Lin,Y.; Tsai,Y.-C.; Ono,T.; Liu,P.; Esashi,M.; Gessner,T.; Chen,M.: Metallic glass as a mechanical material for micro scanners. Advanced Functional Materials, 25, 35 (2015) p 5677–5682 |
| Goetze,U.; Symmank,C.; Dressel,M.; Schueller,M.; Schmidt,A.; Lipowski,M.; Gessner,T.; Otto,T.: Life cycle-oriented analysis and evaluation of active flow control in wind turbines. International Journal of Condition Monitoring and Diagnostic Engineering Management, 18, 3 (2015) pp 11-20 |
| Schueller,M.: Forschungsergebnisse machen das Flugzeug der Zukunft umweltfreundlicher . Ingenieurspiegel - Fachmagazin für Ingenieure, 03 (2015) pp 8-9 (ISSN 1868-5919) |
| Schueller,M.; Lipowski,M.; Schirmer,E.; Walther,M.; Otto,T.; Gessner,T.; Kroll,L.: Integration of fluidic jet actuators in composite structures. SPIE Active and Passive Smart Structures and Integrated Systems, San Diego, 2015 Apr 2; Proceedings, 9431 (2015) |
| Boettger,S.; Hermann,S.; Schulz,S.E.: Length separation of single-walled carbon nanotubes and influence on CNT-FET properties. IEEENano, Rome, 2015 Jul 27-30 |
| Boettger,S.; Hermann,S.; Schulz,S.E.: Towards Giant Piezoresistance – Process Improvements for Highly Sensitive CNT-based-Sensors. IMTC 2015 Leigtweight Structures, Chemnitz, 2015 Oct 1-2; Conference Proceedings (ISBN 978-3-95735-025-1) |
| Roscher,F.; Seifert,T.; Wiemer,M.; Gessner,T.: Additive Manufacturing for zero and first level packaging of Electronics and MEMS using Aerosol-Jet Deposition of Metal Nanoparticles. Semiconductor Technology International Conference (CSTIC), Shanghai (China), 2015 Mar 15-17 |
| Ebermann,M.; Neumann,N.; Hiller,K.; Seifert,M.; Meinig,M.; Kurth,S.: Enhanced resolution Fabry-Pérot microspectrometers. IRS², Nürnberg, 2015 May 19-21; Proceedings IRS², pp 913-917 (ISBN 978-3-9813484-8-4) |
| Franz,M.; Ecke,R.; Kaufmann,C.; Kriz,J.; Schulz,S.E.: Investigation of barrier formation and stability of self-forming barriers with CuMn, CuTi and CuZr alloys. IITC/MAM, Grenoble, 2015; 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), pp 95-98 (ISBN 978-1-4673-7356-2) |