Publications in 2016
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2016
Books
| Lang,H.; Adner,D.; Georgi,C.: Chapter Advances in Deposition of Metals from Metal Enolates. in the book: Patai's Chemistry of Functional Groups, ed. by I. Marek (2016) |
| Lang,H.; Adner,D.; Georgi,C.: Chapter Advances in Deposition of Transition-Metal Oxides from Metal Enolates. in the book: Patai's Chemistry of Functional Groups, ed. by I. Marek (2016) |
| Lang,H.; Adner,D.; Georgi,C.: Chapter Advances in Deposition of Main-Group Metal Oxides and Rare-Earth Oxides from Metal Enolates. in the book: Patai's Chemistry of Functional Groups, ed. by I. Marek (2016) |
| Trenkmann,Ines; Blaudeck,T.; von Borczyskowski,Christian: Chapter Static and Dynamic Quenching of Quantum Dot Photoluminescence by Organic Semiconductors and Dye Molecules. in the book: Self-Assembled Organic-Inorganic Nanostructures: Optics and Dynamics, ed. by Eduard Zenkevich, Christian von Borczyskowski (2016) pp 215-244 (ISBN 978-981-4745-43-7) |
| Blaudeck,T.: Chapter Fluorescence Quenching of Semiconductor Quantum Dots by Multiple Dye Molecules. in the book: Self-Assembled Organic-Inorganic Nanostructures: Optics and Dynamics, ed. by Eduard Zenkevich, Christian von Borczyskowski (2016) pp 201-214 (ISBN 978-981-4745-43-7) |
| Mitra,K.Y.; Weise,D.; Helmert,M.; Gurusekaran,A.; Baumann,R.R.: Chapter 6: Inkjet-Printing of Conductive Tracks on Non-Woven Flexible Textile Fabrics for Wearable Applications. in the book: Flexible and Wearable Electronics: Design and Fabrication Techniques, ed. by Dr. Haider K. Raad (2016) pp 185 - 204 (ISBN 978-0692751718) |
Papers
| Dhakal,D.; Assim,K.; Lang,H.; Bruener,P.; Grehl,T.; Georgi,C.; Waechtler,T.; Ecke,R.; Schulz,S.E.; Gessner,T.: Atomic layer deposition of ultrathin Cu2O and subsequent reduction to Cu studied by in situ x-ray photoelectron spectroscopy. J. Vac. Sci. Technol. A, 34, 1 (2016) pp 01A111 1-12 |
| Hartmann,Steffen; Sturm,Heinz; Blaudeck,T.; Hoelck,Ole; Hermann,S.; Schulz,S.E.; Gessner,T.; Wunderle,B.: Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals. Journal of Materials Science, 2016, 51 (3) (2016) pp 1217-1233 (ISBN 1573-4803; 0022-2461) |
| Dinh,Nghia Trong; Sowade,Enrico; Blaudeck,T.; Hermann,S.; Rodriguez,Raul D.; Zahn,Dietrich R.T.; Schulz,S.E.; Baumann,R.R.; Kanoun,Olfa: High-resolution inkjet printing of conductive carbon nanotube twin lines utilizing evaporation-driven self-assembly. Carbon, 96 (2016) pp 382-393 (ISSN 0008-6223) |
| Koehler,N.; Fischer,T.; Zimmermann,S.; Schulz,S.E.: A plasma assisted in situ restoration process for sidewall damaged ULK dielectrics. Microelectronic Engineering (ISSN 0167-9317) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electron transport in defective metallic and semiconducting carbon nanotubes. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2016 Mar 06-11; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Jeschke,J.; Moeckel,S.; Korb,M.; Rueffer,T.; Assim,K.; Melzer,M.; Herwig,G.; Georgi,C.; Schulz,S.E.; Lang,H.: Chemical vapor deposition of ruthenium-based layers by a single-source approach. Journal of Materials Chemistry C, 4 (2016) pp 2319--2328 |
| Streit,P.; Nestler,J.; Shaporin,A.; Schulze,R.; Gessner,T.: Thermal Design of Integrated Heating for Lab-on-a-Chip Systems. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on , Montpellier (France), 2016 Apr 17-20; Proceedings |
| Franz,M.; Ecke,R.; Kaufmann,C.; Krause,S.; Kriz,J.; Schulz,S.E.: Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys. MAM/IITC, Grenoble, 2015 Mar; Microelectronic Engineering, 156 (2016) pp 65-69 |
| Selbmann,F.; Baum,M.; Wiemer,M.; Gessner,T.: Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications. Smart Systems Integration Conference, Munich, 2016 Mar 9-10; Proceedings, pp 97-104 (ISBN ISBN 978-3-95735-040-4) |
| Haas,S.; Voigt,S.; Arnold,M.; Schwenzer,F.; Braunschweig,M.; Kuechler,M.; Kurth,S.; Gessner,T.: Novel through silicon wiring technology using dry etched sloping vertical terminals. Smart Systems Integration, München, 2016 Mar 9-10 |
| Sheremet,E.; Fuchs,F.; Paul,S.; Haas,S.; Vogel,D.; Rodriguez,P.; Zienert,A.; Schuster,J.; Reuter,D.; Gessner,T.; Zahn,D.; Hietschold,M.: Stress Analysis in Semiconductor Devices by Kelvin Probe Force Microscopy. DPG-Frühjahrstagung, Regensburg, 2016 Mar 9 |
| Kurth,S.; Voigt,S.; Haas,S.; Ikeda,K.; Akira,A: MICROELECTROMECHANICAL SYSTEM AND METHOD FOR MANUFACTURING THE SAME. WO/2016/086997 |
| Kurth,S.; Voigt,S.; Haas,S.; Ikeda,K.; Akira,A.: MICROELECTROMECHANICAL SWITCH AND METHOD FOR MANUFACTURING THE SAME. WO/2016/086998 |
| Moebius,M.; Martin,J.; Hartwig,M.; Baumann,R.R.; Otto,T.; Gessner,T.: Using quantum dot photoluminescence for load detection. AIP Advances, 6, 8 (2016) p 085309 |
| Wagner,C.; Schuster,J.; Gessner,T.: Empirical transport model of strained {CNT} transistors used for sensor applications. J Comput Electron, 15, 3 (2016) pp 881-890 |
| Wagner,C.; Schuster,J.; Schleife,A.; Schreiber,M.; Gessner,T.: Optical spectra of strained carbon nanotubes: Ab initio predictions. ICSFS 18: International Conference on Solid Films and Surfaces, Chemnitz, 2016 Aug 28 - Sep 02; Talk |
| Wagner,C.; Schuster,J.; Schreiber,M.; Schleife,A.; Gessner,T.: Optical spectra of strained carbon nanotubes: The origin of strain-induced shifts. CCTN16: 11th International Symposium on Computational Challenges and Tools for Nanotubes, Vienna (Austria), 2016 Aug 28 - Sep 02; Poster |
| Wagner,C.; Schuster,J.; Schreiber,M.; Schleife,A.; Gessner,T.: Ab initio calculation of optical spectra of strained carbon nanotubes. 17th International Conference on the Science and Application of Nanotubes and Low-Dimensional Materials (NT16), Vienna (Austria), 2016 Aug 28 - Sep 02; Poster |
| Hofmann,L.; Fischer,T.; Werner,T.; Selbmann,F.; Rennau,M.; Ecke,R.; Schulz,S.E.; Gessner,T.: Study on TSV isolation liners for a Via Last approach with the use in 3D-WLP for MEMS. Microsystem Technologies, 22, 7 (2016) p 1665–1677 |
| Haas,S.; Thieme,T.; Gessner,T.: Challenges of the Internet of Things for Sensor and Actuator Applications. SEMICON Russia 2016 , Moskau, 2016 June 8-9 |
| Haas,S.; Schueller,M.; Troeltzsch,J.; Gessner,T.; Kroll,L.: Integration von Mikro- und Nanosystemen in Hybride Strukturen. International MEMS-Forum 2016, Kursk, 2016 June 29-30 |
| Geidel,S.; Peransi Llopis,S.; Rodrigo,M.; de Diego-Castilla,G.; Sousa,A.; Nestler,J.; Otto,T.; Gessner,T.; Parro,V.: Integration of an Optical Ring Resonator Biosensor into a Self-Contained Microfluidic Cartridge with Active, Single-Shot Micropumps. 7, 153.. Micromachines, 7, 9 (2016) p 153 (ISSN 2072-666X) |
| Jaeckel,L.; Schuster,J.; Schulz,S.E.: Modeling of precursor properties and first steps towards fluid dynamics simulations for TaN ALD. ALD 2016, Dublin (Ireland), 2016 July 25-27; Poster presentation |
| Melzer,M.; Georgi,C.; Dhakal,D.; Bruener,P.; Grehl,T.; Assim,K.; Lang,H.; Ecke,R.; Schulz,S.E.; Gessner,T.: Atomic layer deposition of ultrathin closed copper films with a thickness below 3 nm. ALD 2016, Dublin, 2016 July 25-27 |
| Georgi,C.; Melzer,M.; Dhakal,D.; Assim,K.; Lang,H.; Ecke,R.; Schulz,S.E.; Gessner,T.: Thermal ALD of metallic copper on cobalt for advanced interconnects. ALD 2016, Dublin, 2016 July 25-27 |
| Assim,K.; Jeschke,J.; Jakob,A.; Dhakal,D.; Melzer,M.; Georgi,C.; Schulz,S.E.; Gessner,T.; Lang,H.: Manganese half-sandwich complexes as metal-organic chemical vapor deposition precursors for manganese-based thin films. Thin Solid Films, 619, 30 (2016) pp 265-272 |
| Hafez,N.; Ramsbeck,M.; Koegel,E.; Haas,S.; Reuter,D.; Schramm,M.; Loebel,K.-U.; Horstmann,J.T.; Gessner,T.: Electrical Analysis of Integrated Field Effect Transistors as Electromechanical Transducer for Stress. 42nd Micro and Nano Engineering, Wien, 2016 Sep 19-23 |
| Haas,S.; Hafez,N.; Loebel,K.-U.; Koegel,E.; Ramsbeck,M.; Reuter,D.; Horstmann,J.T.; Gessner,T.: Direktintegrierte Feldeffekttransistoren als elektromechanische Wandler für mechanische Spannungen an Balkenstrukturen. Mikro-Nano-Integration 6. GMM Workshop, Duisburg, 2016 Okt 05-06 |
| Clemente,I.; Koehler,N.; Miakonkikh,A.; Zimmermann,S.; Schulz,S.E.; Rudenko,K.: CF3Br plasma cryo etching of low-k porous dielectric. 3rd International School and Conference on Optoelectronics, Photonics, Engineering and Nanostructures (Saint Petersburg OPEN 2016), St Petersburg (Russia), 2016 28–30 Mar; Journal of Physics: Conference Series 741 (2016) 012204 |
| Fuchs,F.; Gemming,S.; Schuster,J.: Electronic Structure and Transport Properties of Thin Silicon Nanowires. DPG-Frühjahrstagung der SKM, Regensburg (Germany), 2016 Mar 06-11; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Fuchs,F.; Zienert,A.; Mothes,S.; Claus,M.; Gemming,S.; Schuster,J.: Investigation of Carbon Nanotube Field-effect Transistors Using Atomistic Quantum Transport and Numerical Device Simulation. 11th International Symposium on Computational Challenges and Tools for Nanotubes, Vienna (Austria), 2016 Aug 28 - Sep 02; Talk |
| Fuchs,F.; Zienert,A.; Gemming,S.; Schuster,J.: An Atomistic Model for Carbon Nanotube Field-effect Transistors: InterbandTunneling and Device Scaling. 17th International Conference on the Science and Application of Nanotubes and Low-Dimensional Materials (NT16), Vienna (Austria), 2016 Aug 28 - Sep 02; Poster |
| Fuchs,F.; Zienert,A.; Mothes,S.; Claus,M.; Gemming,S.; Schuster,J.: Comparison of Atomistic Quantum Transport and Numerical Device Simulation for Carbon Nanotube Field-effect Transistors. International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nuremberg, 2016 Sep 06 - Sep 08; Simulation of Semiconductor Processes and Devices (SISPAD), 2016 International Conference on, pp 261-264 (ISSN 1946-1577) |
| Assim,K.; Melzer,M.; Korb,M.; Rueffer,T.; Jakob,A.; Noll,J.; Georgi,C.; Schulz,S.E.; Lang,H.: Bis(beta-diketonato)-and allyl-(beta-diketonato)-palladium(II) complexes: synthesis, characterization and MOCVD application. RSC Advances , 6, 104 (2016) pp 102557-102569 |
| Hofmann,L.; Baum,M.; N.K.Devadass; Schubert,I.; Kuechler,M.; Ecke,R.; Wiemer,M.; Schulz,S.E.; Gessner,T.: 3D-Wafer Level Packaging For Mems By Using A Via Middle Approach Based On Copper Through Silicon Vias Combined With Copper Thermo-Compression Bonding. International Wafer-Level-Packaging Conference (IWLPC), San Jose, 18.-20.10.; SMTA Proceedings |
| Gessner,T.; Hofmann,L.; Wang,W.-S.; Baum,M.; Seifert,T.; Wiemer,M.; Schulz,S.E.: 3D integration technologies for MEMS (invited talk). International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Hang Zhou (China), 2016 Oct 25-28; IEEE Proceedings, pp 334-337 |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electron transport in defective metallic and semiconducting carbon nanotubes. NT16 - 17th International Conference on the Science and Application of Nanotubes and Low-Dimensional Materials, Vienna (Austria), 2016 Aug 07-13; Poster presentation; Abstract in: NT16 Abstract Book |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Improved recursive Green’s function formalism for defective carbon nanotubes. CCTN16 - 11th International Symposium on Computational Challenges and Tools for Nanotubes, Vienna (Austria), 2016 Aug 13; Poster presentation; Abstract in: NT16 Abstract Book |
| Foerster,A.; Wagner,C.; Schuster,J.; Friedrich,J.: Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes—An alternative initial step. J. Vac. Sci. Technol. A, 35 (2016) p 01B113 |
| Wiemer,M.; Roscher,F.; Seifert,T.; Gessner,T.: Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers. Pacific RIM Meeting on electrochemical and solid state science 2016, Honolulu, Hawaii (USA), 2016 Oct 2-7; ECS Transactions (ECST) , 75, 9 (2016) pp 299-310 |
| Hafez,N.; Ramsbeck,M.; Koegel,E.; Haas,S.; Reuter,D.; Schramm,M.; Loebel,K.-U.; Horstmann,T.; Gessner,T.: Electrical Analysis of Integrated Field Effect Transistors as Electromechanical Transducer for Stress.. 13. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2016 Oct 25-26 |
| Hu,X.; Schuster,J.; Schulz,S.E.; Gessner,T.: Large-scale reactive dynamics simulations of Cu ALD using a newly developed ReaxFF potential. ALD 2016, Dublin, 2016 July 25-27 |
| Wagner,C.; Schuster,J.; Schreiber,M.; Schleife,A.; Gessner,T.: Electronic structure calculations for carbon nanotubes under strain. DPG Spring Meeting of the Condensed Matter Section, Regensburg, 2016 Mar 6 - 11; Abstract in Verhandl. DPG, 51, VI (2016) p 288 (ISSN 0420-0195) |
| Croy,A.; Wagner,C.; Schuster,J.: Mechanical and vibrational properties of strained carbon nano-materials. DPG Spring Meeting of the Condensed Matter Section, Regensburg, 2016 Mar 6 - 11; Abstract in Verhandl. DPG, 51, VI (2016) p 291 (ISSN 0420-0195) |
| Rodriguez,Raul D.; Blaudeck,T.; Kalbacova,Jana; Sheremet,Evgeniya; Schulze,Steffen; Adner,David; Hermann,S.; Hietschold,Michael; Lang,Heinrich; Schulz,S.E.; Zahn,Dietrich R.T.: Metal nanoparticles reveal the organization of single-walled carbon nanotubes in bundles. RSC Advances, 6, 19 (2016) pp 15753-15758 |
| Sowade,Enrico; Blaudeck,T.; Baumann,R.R.: Self-Assembly of Spherical Colloidal Photonic Crystals inside Inkjet-Printed Droplets. Crystal Growth & Design, 16, 2 (2016) p 1017–1026 |
| Blaudeck,T.; Rodriguez,Raul D.; Kalbacova,Jana; Mehta,Ninad; Hermann,S.; Sheremet,Evgeniya; Schulze,Steffen; Adner,David; Hietschold,Michael; Zahn,Dietrich R.T.; Lang,Heinrich; Schulz,S.E.: Nanomorphology of CNT Bundles Upon Wafer-Level Fabrication of CNT-FETs. 17th International Conference on the Science and Application of Nanotubes and Low-Dimensional Materials (NT16), Wien, 7.-13. August 2016 p B27 |
| Schloesser,P.; Meyer,M.; Schueller,M.; Weigel,P.; Bauer,M.: Optimization and testing of fluidic actuators for active flow control at the engine/wing junction . EASN International Conference on Innovation in European Aeronautics Research, Porto, 2016 Oct 18-21; Proceedings |
| Schueller,M.; Weigel,P.; Lipowski,M.; Meyer,M.; Schloesser,P.; Bauer,M.: Fluidic actuators for active flow control on airframe . SPIE Industrial and Commercial Applications of Smart Structures Technologies, Las Vegas, 2016 Apr 16; Proceedings, 9801 (2016) |
| Schueller,M.: Integration von Mikro- und Nanosystemen in hybride Strukturen. 4SmartS - Symposium für Smarte Strukturen uns Systeme, Darmstadt, 2016 Apr 6-7; Proceedings |
| Schueller,M.: Die Flügel der Zukunft - AFloNext. Ingenieurspiegel-Fachmagazin für Ingenieure, 03 (2016) pp 12-13 (ISSN 1868-5919) |
| Walther,M.; Heinrich,M.; Symmank,C.; Schmidt,A.; Schueller,M.; Goetze,U.; Gessner,T.; Kroll,L.: An Economic Lightweight Concept for the Evaluation of Thermoplastic Foams for Aerodynamic Lightweight Structures. International Journal of Condition Monitoring and Diagnostic Engineering Management, 19, 1 (2016) pp 11-15 |
| Tittmann-Otto,J.; Hermann,S.; Kalbacova,J.; Hartmann,M.; Toader,M.; Rodriguez,R.D.; Schulz,S.E.; Zahn,D.R.T.; Gessner,T.: Effect of cleaning procedures on the electrical properties of carbon nanotube transistors — A statistical study. Journal of Applied Physics, 119 (2016) pp 124509-1 - 124509-8 |
| Tittmann-Otto,J.; Hartmann,M.; Schulz,S.E.; Hermann,S.: Wafer-level manufacturing and optimization of CNT-based field-effect transistors. GMM: Mikro-Nano-Integration, Duisburg (Germany), 2016 Oct 05-06; Proceedings, 86 (2016) pp 95-98 (ISBN 978-3-8007-4278-3) |
| Seliger,C.; Billep,D.; Forke,R.; Stoeckel,C.; Schulze,R.: Zukunftsorientiertes Messsystem zur Maschinendiagnostik . 5. Landshuter Symposium Mikrosystemtechnik , Landshut, 2016 Mar 9-10; Tagungsband, pp 90-98 (ISBN 978-3-9812696-9-7) |
| Wen,Q.; Schulze,R.; Billep,D.; Otto,T.; Gessner,T.: Miniaturized vortex-induced vibration energy harvester for low velocity air flow application. Semiconductor Technology International Conference (CSTIC), Shanghai (China), 2016 Mar 13-14; Proceedings |
| Heldt,G.; Weiss,A.; Helke,C.; Erben,J.; Kurth,S.; Meinig,M.; Martin,J.; Otto,T.; Hiller,K.; Reuter,D.; Gessner,T.: Elektronenstrahl-lithographisch erzeugte Nanostrukturen für optische Mikrosysteme. 13. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2016 Oct 25 - 2016 Oct 26 |
| Boettger,S.; Hermann,S.; Schulz,S.E.; Gessner,T.: Length separation of single-walled carbon nanotubes and its impact on structural and electrical properties of wafer-level fabricated carbon nanotube-field-effect transistors. Nanotechnology, 27 (2016) p 435203 |
| Hartmann,M.; Schubel,R.; Toader,M.; Jordan,R.; Schulz,S.E.; Hermann,S.: In-situ polymerization of carbon nanotube based field-effect transistors. NT16, Wien, 2016 Aug 7-13 |
| Boettger,S.; Schulz,S.E.; Hermann,S.: Chain-less CNT-FETs for a competitive wafer-level sensor technology. NT2016, Vienna, 2016 Aug 7-13; Conference Proceedings, p 48 |
| Boettger,S.; Schulz,S.E.; Hermann,S.: Exploitation of giant piezoresistivity – CNT sensors fabricated with a wafer-level technology. EUROSENSORS, Budapest, 2016 Sep 4-7 |
| Roscher,F.; Saeidi,N.; Enderlein,T.; Wiemer,M.; Gessner,T.: A new approach for 3D Integration based on printed multilayers and through polymer vias. Smart systems integration 2016, München, 2016 Mar 9-10 |
| Ziesche,S.; Ihle,M.; Gabler,F.; Roscher,F.: Ceramic substrate technology for wafer level packaging of MEMS. 39th International Spring Seminar on Electronics Technology (ISSE), Pilsen, 2016 May 18-22 (ISBN 978-1-5090-1389-0 ) |
| Vogt,H.; Altmann,F.; Braun,S.; Celik,Y.; Dietrich,L.; Dietz,D.; Van Dijk,M.; Dreiner,S.; Doering,R.; Gabler,F.; Goehlich,M.; ...; Roscher,F.; Rzepka,S.; Wiemer,M.: HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature. International Conference and Exhibition on High Temperature Electronics (HiTEC), Albuquerque (USA) , 2016 May 10-12 (ISSN 2380-4491) |
| Gabler,F.; Roscher,F.; Doering,R.; Otto,A.; Ziesche,S.; Ihle,M.; Celik,Y.; Dietz,D.; Goehlich,M.; Kappert,H.; Vogt,H.; Naumann,F; Gessner,T.: Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments. Semiconductor Technology International Conference (CSTIC), Shanghai (China), 2016 Mar 13-14 (ISBN 978-1-4673-8804-7) |
| Vogel,K.; Roscher,F.; Hertel,S.; Wiemer,M.; Gessner,T.: Waferlevel AVT mit Pd/Al-integrierten reaktiven Multilagensystemen. MikroSystemTechnik Kongress , Karlsruhe, 2015 Oct 26-28 (ISBN 978-3-8007-4100-7) |
| Saeidi,N.; Baum,M.; Wiemer,M.; Hecker,J.; Reimer,A.: Toward MR Compatible Endoscopy: Design and Development of a Prototype Endoscope. 20th International Symposium on Endoscopic Ultrasonography, Budapest, 2016 Sep 22-23 |
| Ihle,M.; Ziesche,S.; Roscher,F.; Capraro,B.; Partsch,U.: Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers. Microelectronics Packaging Conference (EMPC), Grenoble (France), 2013 Sep 9-12 (ISBN 978-2-9527-4671-7 ) |
| Bonitz,J.; Boettger,S.; Hermann,S.; Hartmann,S.; Schulz,S.E.; Wunderle,B.; Gessner,T.: Wafer-level technology for integration of carbon nanotubes into micro-electro-mechanical systems. Conference on Nano/Micro Engineered and Molecular Systems (NEMS), Matsushima Bay and Sendai MEMS City, Japan, 17-20 April, 2016, 17-20 April 2016; Nano/Micro Engineered and Molecular Systems (NEMS), 2016 IEEE 11th Annual International Conference on (ISBN 978-1-5090-1947-2 ) |
| Wuensch,D.; Baum,M.; Forke,R.; Wiemer,M.; Hiller,K.; Weidenmueller,J; Dogan,O; Goertz,M.: A highly miniaturized two-axis acceleration sensor for implantable hemodynamic controlling system. BMT 2016, Basel (Switzerland), 2016 Oct 4-6; Biomedical Engineering - Joint journal of the German Society for Biomedical Engineering in VDE and the Austrian and Swiss Societies for Biomedical Engineering, 61, 51 (2016) p 249 (ISBN ISSN 0013-5585 · e-ISSN 1862-278X) |
| Dogan,O; Weidenmueller,J; Gembaczka,P.; Stanitzki,A.; Goertz,M.; Wuensch,D.; Baum,M.; Wiemer,M.: Concept for a Miniaturized Cardiovascular Multi Sensor Implant. BMT 2016, Basel (Switzerland), 2016 Oct 4-6; Biomedical Engineering - Joint journal of the German Society for Biomedical Engineering in VDE and the Austrian and Swiss Societies for Biomedical Engineering, 61, 51 (2016) p 128 (ISBN ISSN 0013-5585 · e-ISSN 1862-278X) |
| Brunschwiler,T.; Zuercher,J.; Zimmermann,S.; Burg,B.R.; Schlottig,G.; Chen,X.; Sinha,T.; Straessle,R.; Baum,M.; Hofmann,C.; Pantou,R.; Aachen,A.; Zschenderlein,U.; Wunderle,B.; Haupt,M.; Schindler-Saefkow,F.: REVIEW OF PERCOLATING AND NECK-BASED UNDERFILLS WITH THERMAL CONDUCTIVITIES UP TO 3 W/m-K. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas (USA), 2016 May 31-Jun 3; Proceedings, 15 (2016) pp 140-150 (ISBN ISSN: 1087-9870) |
| Hermann,S.; Claus,M.; Schulz,S.E.; Schroeter,M.: Wafer-level technology platform for manufacturing of high performance CNT devices in electronics and sensors. 17th International Conference on the Science and Application of Nanotubes and Low-Dimensional Materials (NT16), Wien, 7.-13. August |
| Hermann,S.; Claus,M.; Schulz,S.E.; Schroeter,M: Modeling and Technology Platform for Analog High Frequency Carbon Nanotube Transistors. Nano Science and Technology, 6th Annual World Congress, Singapore, 2016 Oct 26-28 |
| Hermann,S.; Boettger,S.; Schulz,S.E.; Hartmann,S.; Wunderle,B.; Voigt,S.; Mehner,J.: Piezoresistive carbon nanotubes for condition monitoring and reliability considerations. NANOFIM - Nanotechnology for Instrumentation and Measurement Workshop, Chemnitz, 2016 Sep 8-9 |
| Hermann,S.; Claus,M.; Schulz,S.E.; Schroeter,M.: Modeling and Technology Platform for Analog High Frequency Carbon Nanotube Transistors. NANOFIM - Nanotechnology for Instrumentation and Measurement Workshop, Chemnitz, 2016 Sep 8-9 |
| Hermann,S.; Claus,M.; Schulz,S.E.; Schroeter,M.: Modeling and Technology Platform for Analog High Frequency Carbon Nanotube Transistors. 29th International Microprocesses and Nanotechnology Conference, Kyoto, 2016 Nov 8-11 |
| Helke,C.; Meinig,M.; Seifert,M.; Seiler,J.; Hiller,K.; Kurth,S.; Martin,J.; Gessner,T.: VIS Fabry-Pérot-Interferometer with (HL)4 PE-Si3N4/PE-SiO2 reflectors on freestanding LP-Si3N4 membranes for surface enhanced Raman spectroscopy. SPIE Photonics West, San Francisco, 13.-18.02.2016; SPIE Proceedings, Vol. 9760 (2016) pp 1-11 |
| Hann,J.; Helke,C.; Thamm,S.; Fischer,F.; Mertig,M.; Gessner,T.: Surface Assembling of DNA Origami Templates via Electrostatic Forces. 2nd International Conference nanoFIS 2016 - Integrated Functional nano Systems, Graz, 27.-29.06.2016; Proceedings |
| Hann,J.; Helke,C.; Nestler,J.; Gessner,T.: Surface patterning and assembly of DNA Origami structures by electrostatic forces. DNA Nanotechnology, Jena, 19.-21.05.2016; Proceedings |
| Hann,J.; Billep,D.; Gessner,T.: Selective deposition of PEDOT:PSS on PMMA substrate with electrostatic forces via Nanoxerography. ICOT2016 International Conference on Organic and Hybrid Thermoelectrics, Kyoto, 18.-20.01.2016 |
| Meinig,M.; Kurth,S.; Seifert,M.; Hiller,K.; Wecker,J.; Ebermann,M.; Neumann,N.; Gessner,T.: Tunable Fabry-Pérot interferometer with subwavelength grating reflectors for MWIR microspectrometers. Advanced Fabrication Technologies for Micro/Nano Optics and Photonics IX, San Francisco, CA (USA), 2016 Feb 14-17; Proceedings of SPIE, 9759 (2016) p 97590W (ISBN 9781628419948) |
| Wecker,J.; Bauch,A.; Kurth,S.; Mangalgiri,G.; Gaitzsch,M.; Meinig,M.; Gessner,T.; Nasr,I.; Weigel,R.; Kissinger,D.; Hackner,A.; Prechtel,U.: Oxygen detection system consisting of a millimeter wave Fabry-Pérot resonator and an integrated SiGe front-end. Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications IX, San Francisco, CA (USA), 2016 Feb 15-18; Proceedings of SPIE, 9747 (2016) p 97470C (ISBN 9781628419825) |
| Ebermann,M.; Neumann,N.; Hiller,K.; Seifert,M.; Meinig,M.; Kurth,S.: Tunable MEMS Fabry-Pérot filters for infrared microspectrometers: a review. MOEMS and Miniaturized Systems XV, San Francisco, CA (USA), 2016 Feb 15-17; Proceedings of SPIE, 9760 (2016) p 97600H (ISBN 9781628419955) |
| Neumann,N.; Ebermann,M.; Hiller,K.; Seifert,M.; Meinig,M.; Kurth,S.: MEMS Tunable Fabry-Pérot Filters for Infrared Microspectrometer Applications. Applied Industrial Optics: Spectroscopy, Imaging and Metrology, Heidelberg, 2016 Jul 25-28; Proceedings of Imaging and Applied Optics 2016 (ISBN 978-1-943580-15-6) |
| Seider,T.; Gessner,T.; Ebert,F.; Nendel,K.; Helbig,R.; Illing-Guenther,H.; Boeddicker,A.; Fuegmann,U.; Huebler,A.; Trautmann,M.; Nestler,D.; Wagner,G.: Hochempfindliche Feuchtigkeitssensoren für die Zustandsüberwachung von thermoplasti-schen Verbundwerkstoffen. 18. Werkstofftechnisches Kolloquium der TU Chemnitz, Chemnitz, 2016 Mar 10-11; Schriftenreihe Werkstoffe und werkstofftechnische Anwendungen, 59 (2016) pp 464-465 (ISBN 978-3-00-052212-3) |
| Ebert,F.; Seider,T.; Illing-Guenther,H.; Nendel,K.; Martin,J.; Otto,T.; Gessner,T.; Nestler,D.; Wagner,G.: Integration of humidity sensors into fibre-reinforced thermoplastic composites. 3rd International Conference on System-Integrated Intelligence: New Challenges for Product and Production Engineering, Paderborn, 2016 Jun 13-15; Procedia Technology, 26, 26 (2016) pp 207-213 |
| Selbmann,F.; Baum,M.; Wiemer,M.; Gessner,T.: Parylene C Deposition and Characterization of its Barrier Properties for the Encapsulation of MEMS for Medical Applications. Smart Systems Integration SSI, Munich (Germany), 2016 Mar 9-10; Proceedings |
| Selbmann,F.; Baum,M.; Wiemer,M.; Gessner,T.: Deposition of Parylene C and Characterization of its Hermeticity for the Encapsulation of MEMS and Medical Devices. The 11th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS 2016) , Matsushima (Japan) & Sendai (Japan), 2016 Apr 17-20; Proceedings |
| Jafarpour,S.; Kini.M; Hermann,S.; Schulz,S.E.: Effects of bilayer Co-Mo catalyst configurations on CVD synthesis of semiconducting SWCNTs. MAM, Brussel(Belgium), 2016 Mar 20-23 |
| Jafarpour,S.; Kini.M; Schulz,S.E.; Hermann,S.: Effect of different bilayer catalyst configurations on quality and electronic type selectivity of CVD grown SWCNTs. NT16, Vienna (Austria), 2016 Aug 7-13 |
| Zschenderlein,U.; Baum,M.; Schlottig,G.; Schindler-Saefkow,F.; Kumar,S.G.; Brunschwiler,T.; Wunderle,B.: Re-building the Underfill: Performance of percolating fillers at package scale. IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Montpellier (France), 2016 Apr 18-20; Proceedings, 17th (2016) pp 1-13 (ISBN ISBN 978-1-5090-2106-2) |
| Tanaka,K.; Wang,W.-S.; Baum,M.; Froemel,J.; Hirano,H.; Tanaka,S.; Wiemer,M.; Otto,T.: Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding. Journal Micromachines, 7, 234 (2016) |
| Abo Ras,M.; May,D.; Heilmann,J.; Rzepka,S.; Michel,B.; Wunderle,B.: Processing-structure-property correlations of sintered silver. 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Las Vegas (USA), 2016 May 31-Jun 3; Proceedings, p 1064–1071 (ISSN 1087-9870) |
| Albrecht,J.; Auersperg,J.; Reuther,G.; Kudella,P.; Rzepka,S.; Pufall,R.: Brittle Fracture and Damage in Bond Pad Stacks: A Study of Parameter Influences in Coupled XFEM and Delamination Simulation of Nanoindentation. Electronics Packaging Technology Conference EPTC, Singapore, 2016 Nov 30-Dec 3 |
| Albrecht,J.; Auersperg,J.; Reuther,G.; Rzepka,S.; Pufall,R.: Risk Assessment of Bond Pad Stacks: Combined Utilization of Nanoindentation and FE-Modeling. Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016), Montpellier (France), 2016 Apr 17-20; Abstract (IEEE Xplore), pp 1-4 |
| Auersperg,J.; Collet,D.; Dean,T.; Vogel,D.; Winkler,T.: Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor. 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), Halle (Saale) (Germany), 2016 Sep 19-22; Journal Microelectronics Reliability, MR12107, PII: S0026271416302323, Proceedings, 64, (2016) p 665–668 (ISSN 0026-2714) |
| Auerswald,E.; Vogel,D.; Sebastiani,M.; Lord,J.; Rzepka,S.: Best practice approaches for stress measurementson thin layer stacks. Smart Systems Integration Conference and Exhibition, Munich (Germany), 2016 Mar 9-10 |
| Auerswald,E.; Vogel,D.; Michel,B.; Rzepka,S.: Local measurement of residual stresses in thin layers with and without stress gradients. The 30th International Conference on Surface Modification Technologies, Politecnico di Milano, Campus Bovisa Milan, Milano (Italy), 2016 Jun 29-Jul 1 |
| Dudek,R.; Noack,E.; Doering,R.; Hildebrandt,M.: Zuverlässigkeitsaspekte hinsichtlich des Einsatzes keramischer Bauteile in elektronischen Baugruppen. Herbstsymposium 2016 des DKG FA 3 in Kooperation mit dem DKG FG 2 und dem GA HLK der DGM/DKG Keramische Mehrlagentechnik - Herstellverfahren und Anwendungen, Erlangen (Germany), 2016 Nov 30-Dez 1; (Vortrag + Abstract-Band) |
| Dudek,R.; Doering,R.; Rzepka,S.; Stegmeier,S.; Ehrhardt,C.; Rittner,M.; Rudzki,J.: Coupled Electro-Thermo-Mechanical Analyses on Power Cycling Induced Loadings in Sintered Silver IGBT-Modules with and with-out Overmolding. 9th International Conference on Integrated Power Electronics Systems (CIPS 2016), Nürnberg (Germany), 2016 Mar 8-10; Proceedings, (ISBN 978-3-8007-4171-7) |
| Dudek,R.; Hildebrandt,M.; Doering,R.; Rzepka,S.; Stegmeier,S.; Kiefl,S.; Sommer,V.; Mitic,G.; Weidner,K.: Analyses of Thermo-Mechanical Reliability Issues for Power Modules Designed in Planar Technology. EuroSimE 2016, Montpellier (France), 2016 Apr 17–20; Proceedings |
| Dudek,R.; Doering,R.; Hildebrandt,M.; Rzepka,S.; Stegmeier,S.; Kiefl,S.: Electro-Thermo-Mechanical Analyses on Stress in Silver Sintered Power Modules with Different Copper Interconnection. 6th Electronics System-Integration Technology Conference (ESTC 2016), Grenoble (France), 2016 Sep 13-16 |
| Dudek,R.: Coupled FE-Simulations on Stress in Silver Sintered Power Modules, Round Table “Aging of Silver Sinter Joints” (invited, leader: Prof. U. Scheuermann). ECPE Workshop on Thermal and Reliability Modelling and Simulation of Power Electronics Components and Systems, Fuerth/Nuremberg, (Germany), 2016 Nov 30–Dec 1 |
| Kaulfersch,E.; Albrecht,J.; Rzepka,S.; Michel,B.: Reliability assessment of PCB for smart secure applications. Smart Systems Integration Conference and Exhibition (SSI 2016), Munich (Germany), 2016 Mar 9-10 |
| Nowak,T.; Schacht,R.: Coupling Effects during Thermo-Fluidic Analysis of Flip-Chip Devices with Peripheral Components – CFD Simulation and Experimental Study. 14th Multiphase Flow Conference and Short Course- Multiphase Flows - Simulation, Experiment and Application, Dresden (Germany), 2016 Nov |
| Ordonez-Miranda,J.; Hermens,M.; Nikitin,I.; Kouznetsova,V.G.; van der Sluis,O.; Abo Ras,M.; Reparaz,J.S.; Wagner,M.R.; Sledzinska,M.; Gomis-Bresco,J.; Sotomayor Torres,C.M.; Wunderle,B.; Volz,S.: Measurement and modeling of the effective thermal conductivity of sintered silver pastes. International Journal of Thermal Sciences, 108, (2016) p 185–194 (ISSN 1290-0729) |
| Otto,A.; Schindler-Saefkow,F.; Haase,S.; Scheiter,L.; Hofer,G.; Armengaud,E.; Rzepka,S.: Thermo-Mechanical Stress Investigations on Newly Developed Passive Balancing Board for Battery Management Systems. AmE 2016 - Automotive meets Electronics; 7th GMM-Symposium, Dortmund (Germany), 2016 Mar 1-3; Proceedings, pp 1-6 (ISBN 978-3-8007-4167-0) |
| Otto,A.; Kaulfersch,E.; Gadhiya,G.; Hilpert,F.; Brabandt,I.; Rzepka,S.: Reliability Assessment of a Smart and Compact Inverter Developed for Electrically Powered Construction Vehicles. Smart Systems Integration Conference and Exhibition (SSI), Munich (Germany), 2016 Mar 9-10 |
| Otto,A.; Kaulfersch,E.; Frankeser,S.; Brinkfeldt,K.; Zschieschang,O.; Rzepka,S.: Reliability Investigation on SiC BJT Power Module. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM Europe 2016), Nürnberg (Germany), 2016 May 10-12, pp 1-9 |
| Otto,A.; Rzepka,S.: Next generation drive-train concept featuring self-learning capabilities enabled by extended IT functionalities, In: T. Schulze et al. (eds). Advanced Microsystems for Automotive Applications 2016, Lecture Notes in Mobility (AMAA 2016) , Berlin (Germany), 2016 Sep 2; Proceedings, pp 217-224 (ISBN 978-3-319-44765-0) |
| Reuther,G.; Kudella,P.; Albrecht,J.; Auersperg,J.; Rzepka,S.; Pufall,R.: Brittle Fracture and Damage in Bond Pad Stacks: Novel Approaches for Simulation-based Risk Assessment. 6th Electronics System-Integration Technology Conference (ESTC 2016), Grenoble (France), 2016 Sep 13-16 |
| Schacht,R.: Parametrisches transientes thermo-elektrisches PSPICE Modell für ein Stromkabel. 8. GMM/DVS-Fachtagung EBL 2016 - Elektronische Baugruppen und Leiterplatten, Fellbach (Germany), 2016 Feb 16-17 |
| Schacht,R.: Thermo-fluidisch experimentelle Untersuchung sowie CFD-Simulation für eine Leiterplatte mit Flip-Chip Aufbauten im Windkanal. 8. GMM/DVS-Fachtagung EBL 2016 Elektronische Baugruppen und Leiterplatten, Fellbach (Germany), 2016 Feb 16-17 |
| Schacht,R.: Miniaturisierter reibungsloser Lamellenlüfter. IMAPS Herbstkonferenz, München (Germany), 2016 Okt 20-21 |
| Schindler-Saefkow,F.; Pantou,R.; Schlottig,G.; Kumar,S.; Brunschwiler,T.; Keller,J.; Wunderle,B.; Rzepka,S.: Master Curve Synthesis by effective viscoelastic plastic material modeling. Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016), Montpellier (France), 2016 Apr 18-20, pp 1-7 |
| Stiebing,M.; Loertscher,E.; Steller,W.; Vogel,D.; Wolf,M.; Brunschwiler,T.; Wunderle,B.: Stress Investigations in 3D Integrated Silicon Microstructures. EuroSimE 2016, Montpellier (France), 2016 Apr 17-20; Proceedings |
| Vogel,D.; Auerswald,E.; Rzepka,S.: FIB-DIC – a New Competitive Stress Measurement Method Established by a European Development Initiative. 40th International Microelectronics and Packaging IMAPS Poland 2016 Conference, Walbrzych (Poland), 2016 Sep 25-28; Proceedings (Abstract), pp 22-24 (ISBN 978-83-932464-2-7) |
| Vogel,D.; Auerswald,E.; Gadhiya,G.; Rzepka,S.: Fast and Trusted Intrinsic Stress Measurement to Facilitate Improved Reliability Assessments. 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), Halle (Saale) (Germany), 2016 Sep 19-22; Proceedings, Microelectronics Reliability, 64 (2016) p 276–280 |
| Vogel,D.; Auerswald,E.; Gadhiya,G.; Auersperg,J.; Sebastiani,M.; Rzepka,S.: Intrinsic Stress Measurement by FIB Ion Milling Becomes an Industrial-Strength Method. Smart Systems Integration Conference and Exhibition (SSI), Munich (Germany), 2016 Mar 9-10 |
| Weissbach,M.; Albrecht,J.; Rzepka,S.: Bestimmung viskoelastischer Eigenschaften von Polymeren mittels Nanoindentation. 13. Fachtagung Mikrosystemtechnik, Chemnitz (Germany), 2016 Okt 25-26, p 3 (ISBN 978-3-00-054047-9) |
| Sowade,E.; Mitra,K.Y.; Ramon,E.; Villani,F.; Loffredo,F; Gomes,H.L.; Baumann,R.R.: Up-scaling of the manufacturing of all-inkjet-printed organic thin-film transistors: Device performance and manufacturing yield of transistor arrays. Organic Electronics, 30 (2016) pp 237-246 (ISSN 1566-1199) |
| Al-Hamry,A.; Kang,H.; Sowade,E.; Dzhagan,V.; Rodriguez,R.D.; Mueller,C.; Zahn,D.R.T.; Baumann,R.R.; Kanoun,O.: Tuning the reduction and conductivity of solution-processed graphene oxide by intense pulsed light. Carbon, 102 (2016) pp 236-244 |
| Castro,H.F.; Correia,V.; Sowade,E.; Mitra,K.Y.; Rocha,J.G.; Baumann,R.R.; Lanceros-Mendez,S.: All-inkjet-printed low-pass filters with adjustable cutoff frequency consisting of resistors, inductors and transistors for sensor applications. Organic Electronics, 38 (2016) pp 205-212 (ISSN 1566-1199) |
| Sowade,E.; Ramon,E.; Mitra,K.Y.; Martinez-Domingo,C.; Pedro,M.; Pallares,J.; Loffredo,F; Villani,F.; Gomes,H.L.; Teres,L.; Baumann,R.R.: All-inkjet-printed thin-film transistors: manufacturing process reliability and by root cause analysis. Scientific Reports, 6 (2016) p 33490 |
| Wang,Y.; Guo,H.; Chen,J.; Sowade,E.; Wang,Y; Liang,K.; Marcus,K.; Baumann,R.R.; Feng,Z.: Paper-Based Inkjet-Printed Flexible Electronic Circuits. Applied Materials & Interfaces, 8, 39 (2016) pp 26112-26118 (ISSN 1944-8244) |
| Mitra,K.Y.; Mitra,D.; Kasania,K.; Hammerschmidt,J.; Baumann,R.R.: Influence of the process workflows on the electrical properties of a UV-curable polymeric dielectric for all-inkjet-printed capacitors. Journal of Wearable and Flexible Electronics, 1, 1 (2016) pp 1 - 10 (ISSN Pending) |
| Mitra,K.Y.; Weise,D.; Hartwig,M.; Kapadia,S.; Baumann,R.R.: Time-Efficient Curing of Printed Dielectrics via Infra-Red Suitable to S2S and R2R Manufacturing Platforms for Electronic Devices. IEEE Transactions on Electron Devices, 63, 7 (2016) pp 2777 - 2784 |
| Sowade,E.; Polomoshnov,M.; Baumann,R.R.: The design challenge in printing devices and circuits: Influence of the orientation of print patterns in inkjet-printed electronics. Organic Electronics, 37 (2016) p 428–438 (ISSN 1566-1199) |
| Moya,A.; Sowade,E.; del Campo,F.J.; Mitra,K.Y.; Ramon,E.; Villa,R.; Baumann,R.R.; Gabriel,G.: All-inkjet-printed dissolved oxygen sensors on flexible plastic substrates. Organic Electronics, 39 (2016) pp 168-176 |
| Hartwig,M.; Gaitzsch,M.; Grossmann,T.D.; Heinrich,M.; Kroll,L.; Gessner,T.; Baumann,R.R.: Investigation on an Inkjet Printed Passive Sensor for Wireless Ice Detection on Wind Rotor Blades. Journal of Imaging Science and Technology, 60, 4 (2016) pp 40402-1 - 40402-7 |
| Willert,A.; Helmert,M.; Baumann,R.R.: Tailoring of Printed Primary Batteries. ICFPE 2016, Yonezawa City (Japan), 2016 Sep 8; invited Talk |
| Mitra,K.Y.; Baumann,R.R.: Printed Electronics on Paper & Foil. SYMPOSIUM INNOVATIVE PACKAGING, Munich (Germany), 2016 Apr 6; invited Talk |
| Sowade,E.; Hammerschmidt,J.; Baumann,R.R.: Membranes with pore sizes from some ten nanometers to some microns for biological applications in point of care diagnostics. EMN Meeting on Membranes, Dubai (United Arab Emirates), 2016 Apr 7; invited Talk |
| Sowade,E.; Baumann,R.R.: Printing of functional materials for smart applications. 5th Workshop on New Materials For a Better Life, Basque Center for Materials, Applications and Nanostructures, Bilboa (Spain), 2016 Nov 18; invited Talk |
| Sowade,E.; Baumann,R.R.: Printing as a powerful tool for the deposition of functional material patterns. Tech Connect World Innovation, Washington D.C. (USA), 2016 May 26; invited Talk |
| Moya,A.; Sowade,E.; del Campo,F.J.; Ramon,E.; Villa,R.; Baumann,R.R.; Gabriel,G.: All-Inkjet-Printed Dissolved Oxygen Sensor on Flexible and Plastic Substrates A. EUROSENSORS XXX, Budapest (Hungary), 2016 Sep 4-7; Talk |
| Mitra,K.Y.; Sowade,E.; Ramon,E.; Villani,F.; Loffredo,F; Gomes,H.L.; Baumann,R.R.: Performance and reliability mapping for all Inkjet-printed TFT arrays using industrial inkjet accessories. LOPEC 16, Munich (Germany), 2016 Apr 7; Talk |
| Hartwig,M.; Ortlepp,F.; Moebius,M.; Martin,J.; Otto,T.; Gessner,T.; Baumann,R.R.: Investigation on inkjet-printing of functional components for the manufacturing of a quantum dot based sensor for mechanical load detection. LOPEC 16, Munich (Germany), 2016 Apr 7; Talk |
| Hartwig,M.; Grossmann,T.D.; Heinrich,M.; Kroll,L.; Gessner,T.; Baumann,R.R.: Investigation on Inkjet Printed Passive Sensors for the Application in Lightweight Structures. NANOfIM 2016, Chemnitz (Germany), 2016 Sep 9; Talk |
| Hartwig,M.; Gaitzsch,M.; Grossmann,T.D.; Heinrich,M.; Kroll,L.; Gessner,T.; Baumann,R.R.: Investigation on an Inkjet Printed Passive Sensor for Wireless Ice Detection on Wind Rotor Blades. Printing for Fabrication 2016 (NIP), Manchester (UK), 2016 Sep 15; Talk |
| Sowade,E.; Mitra,K.Y.; Ramon,E.; Villani,F.; Loffredo,F; Gomes,H.L.; Baumann,R.R.: Manufacturing of all-inkjet-printed transistor arrays on flexible polymer substrates. SPIE Organic Photonics + Electronics, San Diego (USA), 2016 Aug 29; Talk |
| Ali,E.; Hangmann,C.; Hedayat,C.; Haddad,F.; Rahajandraibe,W.; Hilleringmann,U.: Event Driven Modeling and Characterization of the Second Order Voltage Switched Charge Pump PLL. IEEE Transactions on Circuits and Systems I: Regular Papers, 63, 3 (2016) pp 347 - 358 |
| Bueker,M.-J.; Hedayat,C.; Hilleringmann,U.; Gessner,T.: Efficient design methodology for inductive energy transmission. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI 2016), Munich (Germany), 2016 Mar 9-10 |
| Bueker,M.-J.: Design of an ultra-thin coil array for position independent wireless power transfer. Wireless congress: Systems & Applications, Munich (Germany), 2016 Nov 9-10 |
| Hangmann,C.: A Way to Significantly Speed Up Your Mixed-Signal Simulations – An Event-Driven Methodology. CDNLive EMEA – Cadence User Conference, Munich (Germany), 2016 May 2-4 |
| Hangmann,C.: Nahfeld-basierte Charakterisierungs-Techniken für Fehlersuche und Vorhersage von EMV Emissionen elektronischer Systeme – Projekt noiseLESS. EMV-Fachtagung, Seibersdorf (Germany), 2016 Apr 12-13 |
| Hangmann,C.; Mager,T.; Khan,S.; Hedayat,C.; Hilleringmann,U.: Improved RF Design Using Precise 3D Near-Field Measurements and Near-Field to Far-Field Transformations. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, 2016 (SSI), Munich (Germany), 2016 Mar 9-10 |
| Hedayat,C.: Industrie 4.0: Embedding Wireless Systems in exotic materials. Smart Plastic Congress, 2016, Bellignat (France), 2016 Apr 3 |
| Hett,T.; Frers,T.; Widhalm,A.; Berth,G.; Hilleringmann,U.; Zrenner,A.: Silicon oxynitride microdisk resonators for integrated waveguide coupling. Smart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (SSI 2016), Munich (Germany), 2016 Mar 9-10 pp 400-403 (ISBN 978-3-95735-040-4) |
| Hett,T.; Kraemer,S.; Hilleringmann,U.; Kalt,H.; Zrenner,A.: High-Q whispering gallery microdisk resonators based on silicon oxynitride. Journal of Luminescence (ISSN 0022-2313) |
| Hilleringmann,U.; Vidor,F.F.; Meyers,T.: Complementary field-effect transistors for flexible electronics. 4th Conference on Sensors, MEMS and Electro-Optical Systems (SMEOS), Skukuza (South Africa), 2016 Sep 12 - 14 |
| Hilleringmann,U.; Vidor,F.F.; Meyers,T.: Processing of Self-Aligned Complementary Field-Effect-Transistors on Glass and Foil Substrates. 7th NRW Nano-Conference, Münster, Germany, 2016 Dec 7-8 |
| Kleine,A.; Hilleringmann,U.: Low temperature layer purification by pulsed UV-irradiation for flexible dye sensitized solar cells. Smart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (SSI 2016), Munich (Germany), 2016 Mar 9-10 pp 409-412 (ISBN 978-3-95735-040-4) |
| Kleine,A.; Hilleringmann,U.: Surface Cleaning and Modification by High Intense UV-Irradition for TiO2 Nanoparticle Films in Dye Sensitized Solar Cells. The Renewable Energy & Power Quality Journal, 14 (2016) pp 160102-160108 (ISBN 2172-038X, 2016) |
| Kleine,A.; Hilleringmann,U.: Microstructured Metal Layers in Dye Sensitized Solar Cells. 6. GMM-Workshops, Duisburg (Germany), 2016 Oct 5-6; Proceedings - GMM Fachbericht, 86 (2016) pp 99-104 (ISBN 978-3-8007-4278-3) |
| Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Maskless Reduction of Crosstalk Suitable for Flexible Electronics. Smart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (SSI 2016), Munich (Germany), 2016 Mar 9-10 |
| Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Low-voltage DNTT based thin-film transistors and inverters for flexible electronics. The 42th International Conference on Micro and Nano Engineering (MNE2016), Vienna (Austria), 2016 Sep 19-23 |
| Meyers,T.; Vidor,F.F.; Kaijage,S.F.; Hilleringmann,U.: Self-aligning integration technique for organic electronics. 6.GMM-Workshop Mikro-Nano-Integration 2016, Duisburg (Germany), 2016 Oct 5-6 |
| Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Low-voltage C8-BTBT thin-film transistors for flexible electronics. 7th NRW Nano-Conference, Münster (Germany), 2016 Dec 7-8 |
| Petrov,D.; Hilleringmann,U.: Application of microcontrollers in solar-powered model gliders with sensor systems. Smart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI 2016), Munich (Germany), 2016 Mar 9-10 pp 451-454 (ISBN 978-3-95735-040-4) |
| Romero,A.; Gonzales,J.; Hilleringmann,U.; Gloesekoetter,P.: Organic Field-Effect and Nanoparticle Thin-Film Transistors: Static Model. 15. ITG/GMM-Symposium ANALOG 2016, Bremen (Germany), 2016 Sep 12 - 14; Proceedings, pp 1-6 |
| Schoenhoff,M.; Hilleringmann,U.: Magnesium Silicide TEGs as Self-Sufficient Power Supply for Smart Systems. Smart Systems Integration 2016 (SSI 2016), Munich (Germany), 2016 Mar 9-10 |
| Schoenhoff,M.; Hilleringmann,U.: TEGs as self-sufficient power supply for sensors and microelectromechanical systems. 4th Conference on Sensors, MEMS and Electro-Optical Systems (SMEOS), Skukuza (South Africa), 2016 Sep 12 - 14 |
| Vidor,F.F.; Meyers,T.; Wirth,G.I.; Hilleringmann,U.: ZnO nanoparticle thin-film transistors on flexible substrate using spray-coating technique. Microelectronic Engineering, 159 (2016) pp 155-158 |
| Vidor,F.F.; Meyers,T.; Hilleringmann,U.: Inverter circuits using ZnO nanoparticle based thin-film transistors for flexible electronic applications. Nanomaterials, 6, 9 (2016) p 154 |
| Vidor,F.F.; Meyers,T.; Mueller,K.; Wirth,G.I.; Hilleringmann,U.: Low-cost inverter on freestanding flexible substrate using ZnO. The 42th International Conference on Micro and Nano Engineering (MNE2016), Vienna (Austria), 2016 Sep 19-23 |
| Abo Ras,M.; May,D.; Wunderle,B.: Novel Test Stand for Thermal Diffusivity Measurement of Bulk and Thin Films. 22st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) 2016. IEEE, Budapest (Hungary), 2016 Sep 19-23 |
| Abo Ras,M.: Thermal and Electrical Characterization of Sintered Silver Die Attach. 11th Advanced Technology Workshop on Micropackaging and Thermal Management, La Rochelle (France), 2016 Feb 3-4 |
| Willert,A.; Helmert,M.; Baumann,R.R.: Printed Batteries Designed to Power OLED Applications". Smart Systems Integration 2016 (SSI 2016), Munich (Germany), 2016 Mar 9-10; Poster, |
| Forke,R.; Shaporin,A.; Weidlich,S.; Tsapkolenko,A.; Hiller,K.; Hahn,S.; Kuechler,M.; Koehler,D.; Konietzka,S.; Motl,T.; Friese,H.; Billep,D.: Hochpräzises MEMS-Gyroskop. 26. Chemnitzer Seminar , Chemnitz (Germany), 2016 Nov 30 |
| Kuechler,M.; Hofmann,C.: Waferadapter am elektrostatischen Chuck; Nanostrukturierung mit DRIE. 6. Workshop "Tiefes Siliziumätzen", Erfurt, CiS Forschungsinstitut für Mikrosensorik GmbH, 2016 NOV 30 |
| Huber,M.; Zienert,A.; Berger,H.-R.; Schuster,J.: Modelling of a coupled mechanical-hydrodynamic system for flow control. DPG-Frühjahrstagung, Regensburg (Germany), 2016, Mar 6-11; Poster presentation; Abstract in: Verhandlungen der DPG |
| Matthes,P.; Almeida,M.; Ecke,R.; Schulz,S.E.: Multidimensional Magnetic Field Sensing Using GMR Sensors. International Symposium on Metallic Multilayers (MML), Uppsala (Schweden), 2016 Jun 19-23 |
| Matthes,P.; Almeida,M.; Ecke,R.; Schulz,S.E.: Mehrdimensionale GMR/TMR Magnetfeldsensoren höchster Sensitivität sowie Sensoren für anwenderspezifische Feldbereiche. GMA/ITG-Fachtagung Sensoren und Messsysteme, Nürnberg (Deutschland), 2016 May 10-11; Vortrag |
| Hofmann,C.; Baum,M.; Wang,W.-S.; Wiemer,M.: Centrifugation of micro particles and self-assembly of nano particles by capillary bridging for 3D thermal interconnects. Mikro-Nano-Integration - 6. GMM-Workshop, Duisburg, 2016 Oct 5-6; Proceedings, 86 (2016) (ISBN 978-3-8007-4278-3) |
| Franz,M.; Schubert,I.; Junghans,R.; Martinka,R.; Rudolph,C.; Wachsmuth,H.; Trojan,D.; VanDevender,B.; Wrschka,P.; Gottfried,K.: Advanced Carriers on Legacy CMP Tools - an Intelligent Solution for Flexible Production Environments and R&D Labs. ECS Transactions, 72, 18 (2016) pp 17-24 (ISSN 1938-6737) |