Publications in 2017
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2017
Books
| Hilleringmann,U.: Chapter Ätzung von Nanostrukturen. in the book: Nanotechnologie und Nanoprozesse, 2. Auflage, ed. by W. R. Fahrner (2017) pp 174-197 (ISBN 978-3-662-48907-9) |
| Hilleringmann,U.; Horstmann,J.T.; Job,R.: Chapter Erweiterung konventioneller Bauelemente durch Nanotechniken. in the book: Nanotechnologie und Nanoprozesse, 2. Auflage, ed. by W. R. Fahrner (2017) pp 245-258 (ISBN 978-3-662-48907-9) |
| Hilleringmann,U.: Chapter Halbleitende Nanopartikel für Feldeffekttransistoren. in the book: Nanotechnologie und Nanoprozesse, 2. Auflage, ed. by W. R. Fahrner (2017) p 290–296 (ISBN 978-3-662-48907-9) |
Papers
| Jafarpour,S.; Kini.M; Hermann,S.; Schulz,S.E.: Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes. Microelectronic Eng., 176 (2017) p 95–104 |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects. Journal of Computational Physics, 334 (2017) pp 607-619 (ISSN 0021-9991) |
| Arnold,M.; Voigt A.; Haas,S.; Schwenzer F.; Schwenzer,G.; Reuter,D.; Gruetzner G.; Gessner,T.: Spray-coatable negative photoresist for high topography MEMS applications. Journal of Micromechanics and Microengineering, 27, 035016 (2017) p 9 |
| Arnold,M.; Viogt A.; Haas,S.; Schwenzer F.; Schwenzer,G.; Reuter,D.; Gruetzner G.; Hiller,K.: Novel negative tone spray-coatable photoresist for photolithography processing over high topographical steps. Smart System Integration 2017, Cork, 08.03.-09.03; Proceedings, p 8 |
| Hofmann,L.; Reuter,D.; Schubert,I.; Wuensch,D.; Rennau,M.; Ecke,R.; Vogel,K.; Gottfried,K.; Schulz,S.E.; Gessner,T.: 3D Wafer Level Packaging By Using Cu-Through Silicon Vias For Thin Mems Accelerometer Packages. Journal of Surface Mount Technology, 30, 1 (2017) pp 1-8 |
| Selbmann,F.; Hofmann,L.; Baum,M.; Roscher,F.; Wiemer,M.; Schulz,S.E.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for MEMS applications. Materials for Advanced Metallization (MAM), Dresden, Mar. 26-29; Proceedings |
| Fuchs,F.; Schuster,J.; Gemming,S.: NiSi2-Si interfaces as building blocks for reconfigurable field-effect transistors: from the atomic structure to device characteristics. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk; Abstract in: Verhandlungen der DPG |
| Fuchs,F.; Schuster,J.; Gemming,S.: Simulation of Reconfigurable Field-effect Transistors: Impact of the NiSi 2 -Si Interfaces, Crystal Orientation, and Strain. Material for Advanced Metallization (MAM), Dresden, 2017 Mar 26-29; Talk |
| Joseph,T; Fuchs,F.; Schuster,J.; Schulz,S.E.: Electronic Structure Simulation of Thin Silicon Layers: Impact of Orientation, Confinement, and Strain. Material for Advanced Metallization (MAM), Dresden, 2017 Mar 26-29; Poster |
| Buja,Oana-M.; Gordan,Ovidiu D.; Leopold,Nicolae; Morschhauser,A.; Nestler,J.; Zahn,Dietrich R.T.: Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate. Beilstein J. Nanotechnol, 2017, 8 (2017) p 237–243 |
| Banerjee,S.; Buelz,D.; Solonenko,D.; Reuter,D.; Deibel,C.; Hiller,K.; Zahn,D.R.T.; Salvan,G.: HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes. Nanotechnology, 28, 19 (2017) |
| Pleul,M.; Streit,P.; Polster,K.; Schulze,R.; Schuh,A.; Meinecke,C.; Reuter,D.: Robust vibration Sensor for condition monitoring in railway appli-cations. Smart Systems Integration, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 443-446 |
| Georgi,C.; Melzer,M.; Nichenametla,C.K.; Lang,H.; Schulz,S.E.: Low-temperature chemical vapor deposition of cobalt oxide from a novel dicobaltatetrahedrane precursor. Joint EuroCVD-21 BalticALD-15, Linköping (Sweden), 2017 June 11-14 |
| Georgi,C.; Melzer,M.; Bankwitz,J.; Nichenametla,C.K.; Lang,H.; Schulz,S.E.: Thermal ALD of metallic copper on cobalt for advanced interconnects. MAM2017 – Materials for Advanced Metallization Conference, Dresden (Germany), 2017 March 26-29 |
| Banerjee,S.; Buelz,D.; Reuter,D.; Hiller,K.; Zahn,D.R.T.; Salvan,G.: Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions. Beilstein J. Nanotechnol., 8 (2017) p 1502–1507 |
| Geidel,S.; Otto,T.: Emerging applications: PICs as a platform for lab on chip devices. PIC Magazine |
| Sophia Dempwolf; Hofmann,L.; Christopher Bowers; Daniela Guenther; Roy Knechtel; Schulz,S.E.; Ronny Gerbach: Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors. International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo (Japan), 2017 May 16-18; Proceedings |
| Hofmann,L.; Reuter,D.; Wuensch,D.; Hiller,K.; Schulz,S.E.: Emerging 3D integration technologies for MEMS fabrication (invited talk) . MEMS Manufacturing, Santa Clara (USA), 2017 Aug 2-3; Proceedings |
| Moebius,M.; Martin,J.; Hartwig,M.; Baumann,R.R.; Otto,T.: Detection of mechanical loads in lightweight structures using quantum dots photoluminescence. Smart Systems Integration, Cork (Ireland), 2017 Mar 08; Proccedings, pp 423-426 (ISBN 978-3-95735-057-2) |
| Hann,J.; Helke,C.; Fischer,F.; Lakatos,M.; Heerwig,A.; Nestler,J.; Meritg,M.; Gessner,T.: Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration. Material Today:Proceedings, 4, 7 (2017) p 7114–7121 |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime. Computational Materials Science, 138 (2017) pp 49-57 (ISSN 0021-9991) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: DFTB-based recursive Green’s function algorithms for electron transport in quasi-1D systems. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Teichert,F.; Wagner,C.; Croy,Alexander; Schuster,J.: Influence of defect-induced deformations on electron transport in carbon nanotubes. Materials for Advanced Metallization, Dresden (Germany), 2017 Mar 26-29; Poster presentation; Abstract in: MAM 2017 Abstract Book |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electron transport in defective metallic and semiconducting carbon nanotubes: An improved RGF-based O(N) approach. International Workshop on Computational Nanotechnology, Windermere (United Kingdom), 2017 Jun 5-9; Poster presentation; Abstract in: Abstract Book |
| Kuechler,M.; Reuter,D.: Fluidik-Chips—ein neues Forschungswerkzeug in den Geowissenschaften. Evaporations-Workshop, TU Freiberg, Institut für Bohrtechnik und Fluidbergbau, Agricola-Strasse 22, Freiberg, 2017-Okt-23 |
| Melzer,M.; Charan K.Nichenametla; Colin Georgi; Heinrich Lang; Schulz,S.E.: Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor. RSC Advances, 7 (2017) pp 50269-50278 |
| Hofmann,L.; Zienert,A.; Schuster,J.; Schulz,S.E.: Elektrochemische Pulsstromabscheidung von Kupfer für Si-Durchkontakte in MEMS: Experiment und Simulation. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, p 4 (ISBN 978-3-8007-4491-6) |
| Arnold,B.; Meinecke,C.; Reuter,D.; Otto,T.; Mehner,J.: Design, Herstellung und Charakterisierung von hochpräzisen Beschleunigungssensoren, gefertigt mittels HARMS Technologie und integrierter Elektrodenabstandsverringerung . MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 582-585 (ISBN ISBN 978-3-8007-4491-6) |
| Pleul,M.; Meinecke,C.; Streit,P.; Albers,J.; Kuerschner,R.; Schubert,E.; Reuter,D.; Otto,T.: Robuster Vibrationssensor zur Zustandsüberwachung an Schienenfahrzeugen. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 840-843 (ISBN ISBN 978-3-8007-4491-6) |
| Sommer O.; Arnold,M.; Reuter,D.; Hiller,K.; Wozniak,G.: Latest investigations of the Fat-Edge/Edge-Thinning effect in coating processes. Tagungsband zum XXIII internationalen Symposium "Research-Education-Technology", pp 167-173 (ISBN 978-3-9817740-2-3) |
| Helke,C.; Hiller,K.; Erben,J.; Reuter,D.; Meinig,M.; Kurth,S.; Nowak,C.; Kleinjans,H.; Otto,T.: Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: an example for Match 1:1-, eBeam-, and nanoimprint lithography. 33rd European Mask and Lithography Conference, Dresden, 2017 Jun 26-27; Proceedings, Vol. 10446 (2017) pp 1-9 |
| Helke,C.; Hiller,K.; Werner,T.; Reuter,D.; Meinig,M.; Kurth,S.; Nowak,C.; Kleinjans,H.; Otto,T.: Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers. SPIE Optics+Photonics/ Nanoengineering: Fabrication, Properties, Optics, and Devices XIV, San Diego (USA), 2017 Aug 5-10; Proceedings, Vol.10354 (2017) pp 1-11 |
| Meinecke,C.; Till Korten; Heldt,G.; Reuter,D.; Stefan Diez: Fabrication and Operation of Kinesin-1-Powered Biocomputation Networks. New Directions in Biocomputation, Dresden, 2017 Sep 12-13; Abstract Book, p 21 |
| Blaudeck,T.; Hermann,S.; Hartmann,M.; Boettger,S.; Tittmann-Otto,J.; Heldt,G.; Reuter,D.; Schulz,S.E.: Scalable Fabrication of Carbon Nanotube Field-Effect Transistors. New Directions in Biocomputation, Dresden, 2017 Sep 12-13; Abstract Book, pp 37-38 |
| Hu,X.; Schuster,J.; Schulz,S.E.: Reactive molecular dynamics simulations of metallic Cu and Cu oxides ALD. Joint EuroCVD-21 BalticALD-15, Linkoping, 2017 June 11-14 |
| Hu,X.; Schuster,J.; Schulz,S.E.: Reactive dynamics simulation of metallic Cu and Cu oxide ALD from the (nBu3P)2Cu(acac) precursor. Material for Advanced Metallization (MAM), Dresden, 2017 Mar 26-29 |
| Jaeckel,L.; Schuster,J.; Schulz,S.E.: Optimization of ALD processes using computational fluid dynamics simulations. Joint EuroCVD 21 - BalticALD 15, Linköping (Schweden), 2017 June 11-14; Poster presentation |
| Jaeckel,L.: ALD process optimization using computational fluid dynamics. ALD Lab Saxony Symposium @ SEMICON Europa, München, 2017 Nov 14; Talk |
| Grossmann,T.D.; Hartwig,M.; Symmank,C.; Schmidt,A.; Schueller,M.; Kurth,S.; Goetze,U.; Baumann,R.R.; Otto,T.: Realisierung von smarten Strukturen mit sensorischer Funktion durch Integration elektromagnetischer Resonatoren in hybride Materialien. 4SMART-Symposium, Braunschweig, 2017 Jun 21-22; In: Wiedemann, M.; Melz, T.(ed.): Smarte Strukturen und Systeme, pp 119-129 (ISBN 978-3-8440-5083-7) |
| Goetze,U.; Symmank,C.; Schmidt,A.; Grossmann,T.D.; Schueller,M.; Kurth,S.; Otto,T.: Integrierte Geschäftsmodell- und Technologieentwicklung für smarte Systeme und Strukturen. 4SMART-Symposium, Braunschweig, 2017 Jun 21-22; In: Wiedemann, M.; Melz, T. (ed.): Smarte Strukturen und Systeme, pp 401-413 (ISBN 978-3-8440-5083-7) |
| Grossmann,T.D.; Hartwig,M.; Heinrich,M.; Decker,R.; Symmank,C.; Schmidt,A; Kurth,S.; Baumann,R.R.; Kroll,L.; Otto,T.: Realisation of Sensitive Functionality by the Integration of Electromagnetic Resonators in Composite Materials . 3rd International MERGE Technologies Conference (IMTC), Chemnitz, 2017 Sep 21-22 (ISBN 978-3-95735-066-4) |
| Grossmann,T.D.; Hartwig,M.; Heinrich,M.; Decker,R.; Symmank,C.; Schmidt,A.; Kurth,S.; Goetze,U.; Baumann,R.R.; Kroll,L.; Otto,T.: Realisation of Sensitive Functionality by the Integration of Electromagentic Resonators in Composite Materials. Technologies for Lightweight Structures (TLS) |
| Moebius,M.; Martin,J.; Otto,T.: Development and integration of film-based sensors for load detection in lightweight structures. International MERGE Technologies Conference, Chemnitz, 2017 Sep 21-22; 3rd International MERGE Technologies Conference (IMTC), pp 145-146 (ISBN 978-3-95735-066-4) |
| Ghosh,J.; Reuter,D.; Salvan,G.: I-V Characteristics of CuPc-based Laterally Stacked Nanostructures Fabricated by Semiconductor Processing. Nanofim 2017, Uttar Pradesh, India, 2017 Nov 16-17 |
| Popova,I.; Lestev,A.; Fedorov,M.; Rakityansky,O.; Ivanov,V.; Semenov,A.; Forke,R.; Shaporin,A.; Hiller,K.; Koehler,D.; Konietzka,S.: Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches. Smart Systems Integration, Cork (Irland), 2017 Mar 8-9; Proceedings, pp 378-381 (ISBN 978-3-95735-057-2) |
| Wagner,C.; Schuster,J.; Schreiber,Michael; Schleife,André: Ab initio calculations and strain-dependent scaling of excitons in carbon nanotubes. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk, Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Foerster,A.; Wagner,C.; Schuster,J.; Friedrich,J.: Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes - An alternative initial step. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 35 (2017) p 01B113 |
| Wagner,C.; Schuster,J.; Schleife,André: Excitonic effects in strained Carbon nanotubes. ETSF Young Researchers’ Meeting, Tarragona (Spain), 2017 Jun 05-09; Talk, Proceedings |
| Wagner,C.; Schuster,J.: Modellierung axial verspannter CNT-Transistoren für Sensoren. Mikrosystemtechnik Kongress 2017 (MST 2017) „MEMS, Mikroelektronik, Systeme“, Unterschleißheim bei München (Germany), 2017 Oct 22-24; Poster, Proceedings, p 556 (ISBN 978-3-8007-4491-6) |
| Arnold,B.; Wohlrab,D.; Meinecke,C.; Mehner,J.; Otto,T.: Design, fabrication and characterization of a high-precision MEMS tilt sensor for surgical robot navigation . European Medical and Biological Engineering Conference (EMBEC) & Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere (Finland), 2017 Jun 11-15; Proceedings, p 167ff |
| Arnold,B.; Wohlrab,D.; Meinecke,C.; Mehner,J.: Development of a high-precision MEMS tilt sensor for navigation systems in robot-assisted surgery. BMTMedPhys 2017, Dresden (Germany), 2017 Sep 10-13; Biomed. Eng.-Biomed. Tech., 62(s1): (2017) pp 27-31 |
| Zienert,A.; Hofmann,L.; Schuster,J.; Schulz,S.E.: TSV Metallization without Additives by Periodic Pulse Reverse Plating. 2017 Advanced Metallization Conference (AMC), Austin (TX), 2017 Sep 13-14; Oral Presentation |
| Wecker,J.; Kurth,S.; Meinig,M.; Otto,T.; Bauch,A.; Weigel,R.; Kissinger,D.; Hackner,A; Prechtel,U.: Millimeterwellen-Sensorsystem zur Messung der Sauerstoffkonzentration in Gasen. MikroSystemTechnik Kongress, München, 2017 Oct 23-25; Proceedings, pp 120-123 (ISBN 978-3-8007-4491-6) |
| Koehler,N.; Liedke,M.O.; Attallah,A.G.; Butterling,M.; Anwand,W.; Wagner,A.; Krause-Rehberg,R.; Schulz,S.E.: Investigation of pore and network formation in spin-on ultra low-k dielectrics by spectroscopic techniques. Advanced Metallization Conference, Austin, TX (USA), Sept. 13-14; Poster presentation |
| Liedke,M.O.; Koehler,N.; Butterling,M.; Attallah,A.G.; Krause-Rehberg,R.; Hirschmann,E.; Schulz,S.E.; Wagner,A.: In-situ investigations of the curing process in ultra low-k materials. 12th International Workshop on Positron and Positronium Chemistry, Lublin (Poland), Aug. 28 - Sept. 1; Talk |
| Brinza,I.; Weigel,P.; Schloesser,P.: Testing of Active Flow Control actuators at harsh environment. 6th CEAS Air and Space Conference - Aerospace Europe 2017, Bucharest (Romania), 2017 Oct 16-20; Proceedings |
| Weigel,P.; Schueller,M.; ter Meer,T.; Bardet,M.: Design of a Synthetic Jet Actuator for Separation Control. 6th CEAS Air and Space Conference - Aerospace Europe 2017, Bucharest (Romania), 2017 Oct 16-20; Proceedings |
| Streit,P.; Nestler,J.; Schulze,R.; Shaporin,A.; Otto,T.: Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system. 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Dresden, 2017 Apr 2-5; Proceedings |
| Schloesser,P.; Meyer,M.; Schueller,M.; Weigel,P.; Bauer,M.: Fluidic actuators for separation control at the engine/wing junction. Aircraft Engineering and Aerospace Technology, 89, 5 (2017) pp 709-718 |
| Baum,M.; Wuensch,D.; Hiller,K.; Forke,R.; Hahn,S.; Reuter,D.; Wiemer,M.; Otto,T.: Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor. Microelectronics Symposium, 2017 Pan Pacific, Kauai, HI, USA, 2017 Feb 6-9 ; Proceedings (ISBN 978-1-944543-01-3) |
| Wuensch,D.; Martinka,R.; Schubert,I.; Baum,M.; Wiemer,M.; Otto,T.: Temporary wafer bonding - key technology for MEMS devices. Microelectronics Symposium, 2017 Pan Pacific, Kauai, HI, USA, 2017 Feb 6-9; Proceedings (ISBN 978-1-944543-01-3) |
| Schroeder,T.; Wuensch,D.; Baum,M.; Hiller,K.; Wiemer,M.; Otto,T.; Weidenmueller,J.; Oezgue,D.; Utz,A.; Goertz,M.: 3D Packaging Technologies for Smart Medical Implants. Smart Systems Integration Conference, Cork, Ireland, 2017 Mar 8-9; Proceedings, pp 41-47 (ISBN 978-3-95735-057-2) |
| Wuensch,D.; Wiemer,M.; Otto,T.: TEMPORARY WAFER BONDING USING ROOM TEMPERATURE MECHANICAL RELEASE FOR MEMS DEVICES. WaferBond, Leuven, 2017 Nov 27-29; Proceedings, pp 57-58 |
| Baum,M.; Froemel,J.; Wang,W.-S.; Wiemer,M.; Otto,T.: CU-CU LOW TEMPERATURE BONDING WITH SURFACE PRE-TREATMENT METHODS. WaferBond, Leuven (Belgien), 2017 Nov 27-29; Proceedings, pp 39-40 |
| Huber,M.; Zienert,A.; Berger,H.-R.; Schuster,J.: Characterization and optimization of devices for active flow control. DPG-Frühjahrstagung, Dresden (Germany), 2017 Mar 19-24; Talk; Abstract in: Verhandlungen der DPG |
| Kelling,J.; Zahn,P.; Schuster,J.; Gemming,S.: Elastic and piezoresistive properties of nickel carbides from first principles. Phys. Rev. B, 95 (2017) p 024113 |
| Schuster,J.: ALD process optimization by equipment simulation. EFDS workshop , Dresden, 2017 Jan 17-18; Talk |
| Optimization of Thin Film Deposition Processes and Equipment Based on Simulation. GMM Workshop, Erlangen, 2017 Dec 13; Talk |
| Schuster,J.: Optimization of Thin Film Deposition Processes and Equipment Based on Simulation. GMM-Workshop, Erlangen, 2017 Dec 13; Talk |
| Langenickel,J.; Weiss,A.; Otto,T.: Influence of processing atmosphere for QD-LEDs. Smart Systems Integration, Cork, 2017 Mar 08; Proceedings |
| Selbmann,F.; Saeidi,N.; Mohandas,P.M.; Baum,M.; Wiemer,M.; Jerke,M.; Joseph,Y.; Otto,T.: Thin film encapsulations for medical applications. Mikrosystemtechnikkongress, München, 2017 Oct 23-25; Proceedings |
| Selbmann,F.; Baum,M.; Hecker,C.; Roscher,F.; Enderlein,T.; Wiemer,M.; Joseph,Y.; Otto,T.: Investigations on Parylene C for its Integrability into MEMS. Smart Systems Integration SSI, Cork, Irland, 2017 Mar 8-9; Proceedings |
| Hertel,S.; Wuensch,D.; Wiemer,M.; Otto,T.: Galvanische Abscheidung von Aluminium für die Mikrosystem- und Leiterplattentechnik. MikroSystemTechnik Kongress , Unterschleißheim, 23.-25.10.2017; Proceedings , pp 666-669 (ISBN 978-3-8007-4491-6) |
| Tittmann-Otto,J.; Hartmann,M.; Ullrich,J.; Schulz,S.E.; Hermann,S.: Charge traps in carbon nanotube-based field-effect transistors. Workshop on Charge Trappung Defects in Semiconductors and Insulators, York, UK, 2017 Mar 20-21; Proceedings, 2017 (2017) p 24 |
| Langenickel,J.; Meyer,M.; Weiss,A.; Otto,T.: Integration of LEDs based on Quantum Dots within Lightweight Structures. IMTC, Chemnitz, 2017 Sep 21; Proceedings |
| Lorenz,E.; Schuster,J.; Schulz,S.E.: Multiscale Simulation of Barrier/Seed PVD. MAM, Dresden (Germany), 2017 Mar 26-39; Materials for Advanced Metallization (MAM); Talk |
| Lorenz,E.; Wislicenus,M.; Uhlig,B.; Schuster,J.; Schulz,S.E.; Preusse,A.: Multiscale simulation methods for the optimization of BEOL metallization processes. 2017 Advanced Metallization Conference; Poster |
| Hartmann,M.; Toader,M.; Schubel,R.; Jordan,R.; Schulz,S.E.; Hermann,S.: Performance enhancement of carbon nanotube FETs via polymer-based doping control. Trends in Nanotechnology (TNT), Dresden (Germany), 2017 June 5-9; Talk |
| Matthes,P.; Almeida,M.; Ecke,R.; Schulz,S.E.: Magnetfeldsensorik: Dünnschichttechnologien und Anwendungsbereiche. Dünnschichtsysteme für MEMS und Sensoren, Renningen (Deutschland), 2017 Apr 26-27; Vortrag |
| Hu,X.; Schuster,J.; Schulz,S.E.: Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper. The Journal of Physical Chemistry C, 121, 50 (2017) pp 28077-28089 |
| Taeuber,D.; Goldmann,M.; Rayapati,V.R.; Buerger,D.; Skorupa,I.; Scheblykin,I.G.; Schmidt,H.: Optical characterization of polycrystalline YMnO3 films. DPG Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Poster |
| Rayapati,V.R.; Bogusz,A.; Du,N.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: Nonvolatile resistive switching to 10^6 OFF/ON resistance ratio in yttrium manganite thin films with downscaled top electrodes. DPG-Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk |
| Rayapati,V.R.; Du,N.; Buerger,D.; Skorupa,I.; Ecke,R.; Schmidt,O.G.; Schmidt,H.: Improved endurance of nonvolatile resistive switching to 106 OFF/ON resistance ratio in yttrium manganite thin films with e-beam evaporated Al top electrodes. Materials for Advanced Metallization (MAM), Mainz (Germany), 2017 Mar 26-29; Poster |
| Kiani,M.; Du,N.; Mayr,C.G.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: Memristive BFO with metallic electrodes as artificial synapse in machine learning circuits. Materials for Advanced Metallization (MAM), Dresden (Germany), 2017 Mar 26-29; Talk |
| Kiani,M.; Du,N.; Mayr,C.G.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: BFO based memristor as artificial synapse in machine learning circuits. DPG Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Poster |
| Kiani,M.; Du,N.; Mayr,C.G.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,O.G.; Schmidt,H.: Memristive BFO as artificial synapse in machine learning circuits. Workshop „Materialien für nichtflüchtige Speicher“, Mainz (Germany), 2017 Jun 26; Talk |
| Du,N.; Manjunath,N.; Li,Y.; You,T.; Buerger,D.; Skorupa,I.; Walczyk,D.; Walczyk,C.; Schroeder,T.; Menzel,S.; Linn,E.; Waser,R.; Schmidt,O.G.; Schmidt,H.: Resistive switching dynamics in electroforming-free BiFeO3 based memristors. DPG Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Talk |
| Du,N.; Buerger,D.; Skorupa,I.; Schmidt,O.G.; Schulz,S.E.; Schmidt,H.: Resistive switching dynamics in memristive BiFeO3 with metallic top and bottom electrodes. Materials for Advanced Metallization (MAM), Dresden (Germany), 2017 Mar 26-29; Poster |
| Du,N.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,H.: Resistive switching dynamics in memristive BiFeO3 device. Workshop „Materialien für nichtflüchtige Speicher“, Mainz (Germany), 2017 Jun 26; Talk |
| Du,N.; Buerger,D.; Skorupa,I.; Schulz,S.E.; Schmidt,H.: Resistive switching in memristive BiFeO3 devices. EMN Meeting on Memristive Switching & Network, Mailand (Italien), 2017 Aug 14-18; Talk |
| Du,N.; Kiani,M.; Schmidt,H.: Impedance of bulk-functionalized PolCarr@-BioChips. • Jahrestagung der BIOMEDIZINISCHEN TECHNIK undDreiländertagung der MEDIZINISCHEN PHYSIK, Dresden (Germany), 2017 Sep 10-13; Talk |
| Buerger,D.; Baunack,S.; Thomas,J.; Oswald,S.; Wendrock,H.; Rebohle,L.; Schumann,T.; Skorupa,W.; Blaschke,D.; Gemming,T.; Schmidt,O.G.; Schmidt,H.: Evidence for self-organized formation of logarithmic spirals during explosive crystallization of amorphous Ge:Mn layers. DPG Frühjahrstagung der SKM, Dresden (Germany), 2017 Mar 19-24; Poster |
| Buerger,D.: Ge:Mn nanonets and microspirals. Workshop "Advanced materials processing using ion implantation and thermal treatment", Jena (Germany), 2017 Dec 05; Talk |
| Buerger,D.; Rayapati,V.R.; Du,N.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Electroforming-free memristive switching in YMnO3 thin films with Al top electrodes with 10^6 Roff/Ron ratio. Advanced Metallization Conference 2017 (AMC), Austin, Texas (USA), 2017 Sep 13-14; Poster |
| Weidenmueller,J; Dogan,O; Stanitzki,A.; Baum,M.; Wuensch,D.; Wiemer,M.; Goertz,M.: Sensor components of a miniaturized implant for haemodynamic controlling. BMTMedPhys 2017, Dresden (Germany), 2017 Sept 11-13; Biomedical Engineering / Biomedizinische Technik, 62, S1 (2017) p S37 (ISBN ISSN (Online) 1862-278X, ISSN (Print) 0013-5585) |
| Schroeder,T.; Baum,M.; Wuensch,D.; Wiemer,M.; Otto,T.: 3D packaging for an implantable hemodynamic control system. BMTMedPhys 2017, Dresden (Germany), 2017 Sept 11-13; Biomedical Engineering / Biomedizinische Technik, 62, S1 (2017) p S356 (ISBN ISSN (Online) 1862-278X, ISSN (Print) 0013-5585) |
| Auersperg,J.; Auerswald,E.; Collet,C.; Dean,T.; Vogel,D.; Winkler,T.; Rzepka,S.: Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor. 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE, Dresden (Germany), 2017 Apr 2-5; Proceedings (ISBN 978-1-5090-4344-6) |
| Albrecht,J.; Weissbach,M.; Auersperg,J.; Rzepka,S.: Method for Assessing the Delamination Risk in BEoL Stacks around Copper TSV Applying Nanoindentation and Finite Element Simulation. 19th Electronics Packaging Technology Conference EPTC, Singapore (Republic of Singapore), 2017 Dez 6-9; Proceedings (ISBN 978-1-5386-3042-6) |
| Dudek,R.; Auersperg,J.; Doering,R.; Rzepka,S.: Thermomechanische Zuverlässigkeitsprognostik in AVT und Packaging unter Nutzung damagemechanischer Methoden. 5. GMM Workshop „PackMEMS 5.0“, Freiburg (Germany), 2017 May; Proceedings |
| Dudek,R.; Doering,R.; Otto,A.; Rzepka,S.; Stegmeier,S.; Kiefl,S.; Lunding,A.; Eisele,R.: FE Analyses and Power Cycling Tests on the Thermo-Mechanical Performance of Silver Sintered Power Semiconductors with Different Interconnection Technologies. IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm, Orlando (USA), 2017 May 30-Jun 2; Proceedings, pp 1145-1152 |
| Dudek,R.; Hildebrandt,M.; Rzepka,S.; Fries,T.; Doering,R.; Seiler,B.; Novak,M.; Ortmann,R.W.: A Combined Simulation and Optical Measurement Technique for Investigation of System Effects on Components Solder Fatigue. EMPC, Warsaw (Poland), 2017 Sep; Proceedings |
| Dudek,R.; Doering,R.; Hildebrandt,M.; Albrecht,J.; Rzepka,S.: Mounting Effects on Board Level Reliability. 5th European Expert Workshop on Reliability of Electronics and Smart Systems (EuWoRel), Berlin (Germany), 2017 Sep 26-27; Proceedings |
| Otto,A.; Doering,R.; Scheiter,L.; Armengaud,E.; Rzepka,S.: Thermo-Mechanical and Mechanical Robustness of the INCOBAT Smart Battery Management System. SSI Conference 2017, Cork (Ireland), 2017 Mar 7-9; Proceedings |
| Otto,A.; Dudek,R.; Rzepka,S.; Abo Ras,M.; von Essen,T.; Bast,M.; Mueter,U.; Lunding,A.: Reliability Investigation on SiC based Diode and MOSFET Modules Developed for High Power Conversion in Medical X-Ray Applications. PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg (Germany), 2017 May 16-18; Proceedings, pp 1-8 |
| Rzepka,S.; Otto,A.; Vogel,D.; Dudek,R.: Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches. International Electronic Packaging Technical Conference and Exhibition, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, San Francisco (USA), 2017 Aug 29-Sep 1; Proceedings, p V001T05A008 (ISBN 978-0-7918-5809-7) |
| Mitra,K.Y.; Sternkiker,C.; Martinez-Domingo,C.; Sowade,E.; Ramon,E.; Carrabina,J.; Gomes,H.L.; Baumann,R.R.: Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application. Flex. Print. Electron, 10.02.2017, 2, 1 (2017) pp 015003 (1-10) |
| Gokhale,P.; Mitra,D.; Sowade,E.; Mitra,K.Y.; Gomes,H.L.; Ramon,E.; Al-Hamry,A.; Kanoun,O.; Baumann,R.R.: Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment. Nanotechnology, 15.11.2017, pp 495301-495314 |
| Chen,J.-J.; Lin,G.-Q.; Wang,Y.; Sowade,E.; Baumann,R.R.; Feng,Z.-S.: Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating. Applied Surface Science, 396 (2017) pp 202-207 |
| Cherian,D.; Mitra,K.Y.; Hartwig,M.; Malinowski,P.E.; Baumann,R.R.: Fabrication of Organic Photo Detectors using Inkjet Technology and its Comparison to Conventional Deposition Processes. IEEE Sensors Journal, 30.10.2017, 18, 1 (2017) pp 94-105 (ISSN 1530-437X) |
| Mitra,K.Y.; Polomoshnov,M.; Martinez-Domingo,C.; Mitra,D.; Ramon,E.; Baumann,R.R.: Fully Inkjet-Printed Thin-Film Transistor Array Manufactured on Paper Substrate for Cheap Electronic Applications. Journal of Advanced Electronic Materials, 31.10.2017, 1700275, 3, 12 (2017) pp 1 - 9 |
| Ahmadraji,T.; Gonzalez-Macia,L.; Ritvonen,T.; Willert,A.; Ylimaula,S.; Donaghy,D.; Tuurala,S.; Suhonen,M.; Smart,D.; Morrin,A.; Efremov,V.y.; Baumann,R.R.: Biomedical Diagnostics Enabled by Integrated Organic and Printed Electronics. Anal. Chem. 2017, 89, 14 (2017) p 7447−7454 |
| Godlinski,D.; Zichner,R.; Zoellmer,V.; Baumann,R.R.: Printing technologies for the manufacturing of passive microwave components: antennas. IET Microwaves Antennas & Propagation, 11, 14 (2017) pp 2010-2015 (ISSN 1751-8725) |
| Kaupmann,P.; Pinter,S.; Franz,J.; Streiter,R.; Otto,T.: Design of a 2D MEMS Micromirror with Indirect Static Actuation. IEEE Sensors 2017 Conference, Glasgow (UK), 2017 Oct 29-Nov 1; Proceedings (ISBN 978-1-5090-1012-7) |
| Kaupmann,P.; Pinter,S.; Franz,J.; Streiter,R.; Otto,T.: A Novel Gyroscopic Actuation Concept for 2D MEMS Micromirrors. Eurosensors Conference 2017, Paris (France), 2017 Sep 3-6; Proceedings, 1, 4 (2017) p 546 |
| Martin,J.; Shetty,K.; Reimann,N.; Neukirchner,S.; Fuegmann,U.; Illing-Guenther,H.; Nestler,D.; Huebler,A.C.; Nendel,K.; Kroll,L.; Otto,T.: Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics. 3rd International MERGE Technologies Conference , Chemnitz (Germany), 2017 Sept 21-22; Proceedings, p 121 (ISBN 978-3-95735-066-4) |
| Berner,T.; Schulze,R.; Shaporin,A.; Forke,R.; Otto,T.: MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 594-597 (ISBN 978-3-8007-4491-6) |
| Rost,F.; Arnold,B.; Decker,R.; Mehner,J.; Kroll,L.; Rzepka,S.; Otto,T.: Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 858-861 (ISBN ISBN 978-3-8007-4491-6) |
| Louriki,L.; Staffeld,P.; Kaelberer,T.; Otto,T.: Multilayer Micromechanics Process with Thick Functional Layers (EPyC40). Eurosensors Conference 2017, Paris (France), 2017 Sept 3-6; Proceedings, 1, 4 (2017) p 296 |
| Louriki,L.; Staffeld,P.; Kaelberer,T.; Otto,T.: Silicon Sacrificial Layer Technology for the Production of 3D MEMS (EPyC Process). Eurosensors Conference 2017, Paris (France), 2017 Sept 3-6; Proceedings, 1, 4 (2017) p 295 |
| Luo,J.; Cerretti,G.; Krause,B.; Zhang,L.; Otto,T.; Jenschke,W.; Ullrich,M.; Tremel,W.; Voit,B.; Poetschke,P.: Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: switching from p-type to n-type by the addition of polyethylene glycol. Journal Polymer 108 (2017), pp 513-520 |
| Hett,T.; Kraemmer,S.; Hilleringmann,U.; Kalt,H.; Zrenner,A.: High-Q whispering gallery microdisk resonators based on silicon oxynitride. Journal of Luminescence, 191 (2017) pp 131-134 (ISSN 0022-2313) |
| Hilleringmann,U.; Vidor,F.F.; Meyers,T.: Complementary field-effect transistors for flexible electronics. SPIE 10036, Fourth Conference on Sensors, MEMS, and Electro-Optic Systems, Skukuza, Kruger National Park (South Africa), 2017 Feb 3; Proceedings, 100360K (2017) |
| Likotiko,E.; Petrov,D.; Mwangoka,J.; Hilleringmann,U.: Real time solid waste monitoring using cloud and sensors technologies. International Science and Technology Conference; Proceedings, pp 441-450 (ISSN 2146-7382) |
| Meyers,T.; Vidor,F.F.; Brassat,K.; Lindner,J.K.N.; Hilleringmann,U.: Low-voltage DNTT based thin-film transistors and inverters for flexible electronics. Microelectronic Engineering, 174 (2017) pp 35-39 |
| Reker,J.; Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process. 13th IEEE Africon 2017, Kapstadt (Südafrika), 2017 Sep 18-20; Proceedings (ISBN 2153-0033 ) |
| Schoenhoff,M.; Hilleringmann,U.; De Boor,J.: Mass Production of Magnesium Silicide as a TEG Material. 13th IEEE Africon, Kapstadt (Südafrika), 2017 Sep 18-20; Proceedings, pp 1009-1013 (ISSN 2153-0033) |
| Vidor,F.F.; Meyers,T.; Hilleringmann,U.: Integration of ZnO nanoparticle transistor on freestanding flexible substrates. SPIE 10036, Fourth Conference on Sensors, MEMS, and Electro-Optic Systems, Skukuza, Kruger National Park (South Africa), 2017 Feb 3; Proceedings |
| Meyers,T.; Vollbrecht,J.; Vidor,F.F.; Reker,J.; Kitzerow,H.-S.; Hilleringmann,U.: Organische Dünnschichttransistoren für AMOLED-Applikationen. 7. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 781-784 (ISBN 978-3-8007-4491-6) |
| Reker,J.; Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren. 7. MikroSystemTechnik Kongress, München (Germany), 2017 Oct 23-25; Proceedings, pp 544-547 (ISBN 978-3-8007-4491-6) |
| Mitra,K.Y.; Sunil,K.; Sowade,E.; Baumann,R.R.: Significantly improved performance of all IJP TFTs on flexible substrates using polymeric interlayer for better charge transport. European Material Research Society EMRS, Warsaw (Poland), 2017 Sep 18-21; Talk |
| Hartwig,M.; Polomoshnov,M.; Zichner,R.; Baumann,R.R.: Investigation on inkjet printing for electromagnetic compatibility application. IMTC International MERGE Technologies Conference, Chemnitz (Germany), 2017 Sept 21-22; Talk |
| Willert,A.; Meuser,C.; Baumann,R.R.: Printed Batteries and Conductive Patterns on Technical Textiles. ICFPE - International Conference on Flexible and Printed Electronics 2017, Jeju Island (Korea), 2017 Sep 4-7; Talk |
| Willert,A.; Zichner,R.; Thalheim,R.; Baumann,R.R.; Otto,T.: Go Beyond 4.0 – Towards Digital Fabrication Based on Printing. IMTC 2017 Lightweight Structures, 3rd International MERGE Technologies Conference, Chemnitz (Germany), 2017 Sept 21-22; KB Poster and other (ISBN 978-3-95735-066-4) |
| Willert,A.; Baumann,R.R.: Development History and Current Achievements of Printed Primary Batteries. 33nd International Conference on Digital Printing Technologies (NIP) - Printing for Fabrication 2017, Denver, Colorado (USA), 2017 Nov 5-9; Proceedings, p 21 (ISBN 978-0-89208-329-9) |
| Willert,A.; Baumann,R.R.: Printed Electronics – from Lab to Fab. 5th Workshop of Flexible and Printed Electronics, Lodz (Poland), 2017 Nov 17; Talk |
| Willert,A.; Helmert,M.; Baumann,R.R.: The BatMat project: printed power sources. 3D Printing Electronics Conference, Eindhoven (Niederlande), 2017 Jan 24; Talk |
| Willert,A.; Meuser,C.; Baumann,R.R.: Application Customized Printed Primary Batteries. Printing Future Days 2017, Chemnitz (Germany), 2017 Okt 4-6; Talk |
| Zichner,R.: Ready for the Internet of Things Reliable and Capable of being Integrated Printed Antennas for optimized Wireless Communication in Packaging. Smart Packaging 2017, Köln (Germany), 2017 Sep 19-20; Talk |
| Mitra,D.; Baumann,R.R.: Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates. Printing Future Days 2017, Chemnitz (Germany), 2017 Okt 4-6; Proceedings, pp 111-115 (ISBN 978-3-86135-627-1) |
| Hartwig,M.; Polomoshnov,M.; Zichner,R.; Baumann,R.R.: Investigation on inkjet printing for electromagnetic applications. Printing Future Days 2017, Chemnitz (Germany), 2017 Okt 4-6; Poster and other, p 107 (ISBN 978-3-86135-627-1) |
| Meuser,C.; Zeiner,C.; Willert,A.; Baumann,R.R.: Printed Battery Applications on Technical Textiles. Printing Future Days 2017, Chemnitz (Germany), 2017 Okt 4-6; Proceedings, p 109 (ISBN 978-3-86135-627-1) |
| Mitra,K.Y.; Kapadia,S.; Challa,G.D.; Baumann,R.R.: Implementation of alternative fabrication routes for developing vertical stacked All-inkjet-printed Thin Film-transistors suitable for flexible electronic applications. International Microelectronics and Packaging IMAPS Poland 2017 Conference, Warsaw (Poland), 2017 Sep 11-13 |
| Stiehl,C.; Enderlein,T.; Otto,T.; Nestler,J.: Novel concept of integrated micro actuation of membranes in liquid environments. Smart Systems Integration, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 487-490 (ISBN 978-3-95735-057-2) |
| Hertel,S.; Schroeder,T.; Wuensch,D.; Wiemer,M.: Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden. Galvanotechnik, 108, 8 (2017) pp 1550-1561 |
| Hofmann,C.; Kurth,F.; Wiemer,M.; Otto,T.; Hiller,K.: Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel. Smart Systems Integration Conference SSI, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 391-394 (ISBN 978-3-95735-057-2) |
| Kurth,F.; Hofmann,C.; Hertel,S.; Braun,P.; Schroeder,T.; Wiemer,M.: Integration of self-healing agent into MEMS bonding frames. Smart Systems Integration Conference SSI, Cork (Ireland), 2017 Mar 8-9; Proceedings, pp 395-398 (ISBN 978-3-95735-057-2) |
| Martin,J.; Shetty,K.; Reimann,N.; Neukirchner,S.; Fuegmann,U.; Illing-Guenther,H.; Nestler,D.; Huebler,A.C.; Nendel,K.; Kroll,L.; Otto,T.: Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics. Technologies for Lightweight Structures, Special Issue: 3rd International MERGE Technologies Conference (IMTC), 1, 2 (2017) pp 128-137 (ISSN 2512-4587) |