Publications in 2018
Publications of our scientific work
Frank Schettler, TU Chemnitz
Year 2018
Books
| Otto,T.: Chapter Leitprojekt “Go Beyond 4.0”: Individualisierte Massenfertigung. in the book: Digitalisierung: Schlüsseltechnologien für Wirtschaft & Gesellschaft, 1st edition, ed. by Reimund Neugebauer (2018) pp 223-238 (ISBN 978-3-662-55889-8) |
| Poliks,M.D.; Blaudeck,T.: Hierarchical, Hybrid and Roll-to-Roll Manufacturing for Device Applications (Proceedings MRS Fall Meeting 2016, Symposium PM5), MRS Advances volume 2 issue 18, ed. by Poliks, M.D.; Blaudeck, T. (Ed.) (2018) (ISSN 2059-8521) |
| Dimino,I.; Amendula,G.; Pecora,R.; Concilio,A.; Gratias,A.; Schueller,M.: Chapter On the Experimental Characterization of Morphing Structures. in the book: Morphing Wing Technologies - Large Commercial Aircraft and Civil Helicopters, pp 683-712 (ISBN 978-0-08-100964-2) |
| Willert,A.; Tran-Le,A.-T.; Mitra,K.Y.; Clair,M.; Costa,C.M.; Lanceros-Méndez,S.; Baumann,R.R.: Chapter Printing Techniques for Batteries. in the book: Printed Batteries: Materials, Technologies and Applications, , 264 Pages, Apr 2018, ed. by Senentxu Lanceros-Méndez (Editor), Carlos Miguel Costa (Editor): (2018) pp 21-55 (ISBN 978-1-119-28742-1) |
| Baum,M.; Lorenz,J.; Fader,R.; Rommel,M.; Danyluk,S.; Gillner,A.; Stollenwerk,J.; Blaesi,B.: Chapter Strukturierungsverfahren. in the book: Angewandte Nanotechnologie, ed. by Haas,K.-H.; Tovar,G. (2018) pp 72-96 (ISBN 978-3-8396-0918-7) |
Papers
| Pacheco-Sanchez,A; Fuchs,F.; Mothes,S; Zienert,A.; Schuster,J.; Gemming,S: Feasible Device Architectures for Ultrascaled CNTFETs. IEEE Transactions on Nanotechnology, 17, 1 (2018) p 100 |
| Hartmann,M.; Schubel,R.; Claus,M.; Jordan,R.; Schulz,S.E.; Hermann,S.: Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs. IOP Nanotechnology, 29 (2018) p 035203 (9pp) |
| Hafez,M.; Haas,S.; Loebel,K.-U.; Reuter,D.; Ramsbeck,M.; Schramm,M.; Horstmann,J.-T.; Otto,T.: Characterisation of MOS Transistors as an Electromechanical Transducer for Stress. Phys. Status Solidi A , 2018 (2018) pp 680-693 |
| Arnold,B.; Wohlrab,D.; Meinecke,C.; Reuter,D.; Mehner,J.: Design, Manufacturing and Test of a High-Precision MEMS Inclination Sensor for Navigation Systems in Robot-Assisted Surgery. International Journal of Biomedical Science and Engineering, 6, 1 (2018) pp 1-6 |
| Christian Schliebe; Julian Noll; Sebastian Scharf; Thomas Gemming; Andreas Seifert; Stefan Spange; Daniel Lehmann; Dietrich R.T.Zahn; Benjamin Fiedler; Joachim Friedrich; Blaudeck,T.; Heinrich Lang: Nitrogen-containing porous carbon materials by twin polymerization. Colloid and Polymer Science, 296, 3 (2018) p 413–426 (ISSN 0303-402X) |
| E.I.Zenkevich; A.S.Stupak; Blaudeck,T.; Stefan Krause; Christian von Borczyskowski: Formation of excited states and photoluminescence quenching in nanocomposites of semiconductor Quantum dots and dye molecules (Формирование возбужденных состояний и тушение фотолюминсценции в нанокомпозитах «полупроводниковая квантовая точка – молекула красителя»). 6. Physikerkongress der Republik Belarus (VI-ой КОНГРЕСС ФИЗИКОВ БЕЛАРУСИ - Посвященный Году науки в Республике Беларусь), Minsk, 2017 Nov 20-23; Programm (ПРОГРАММА), 6, 1 (2018) pp 9-9 (ISBN 978-985-7137-40-4) |
| Huber,M.; Zienert,A.; Schuster,J.; Schreiber,M.: Modeling of current-voltage characteristics of BFO based memristors. DPG-Frühjahrstagung, Berlin (Germany), 2018 Mar 11-16; Talk; Abstract in: Verhandlungen der DPG |
| Teichert,F.; Wagner,C.; Croy,Alexander; Schuster,J.: Influence of defect-induced deformations on electron transport in carbon nanotubes. DPG-Frühjahrstagung der SKM, Berlin (Germany), 2018 Mar 11-16; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Otto,T.; Kurth,S.; Voigt,S.; Morschhauser,A.; Meinig,M.; Hiller,K.; Moebius,M.; Vogel,M.: Integrated Microsystems for Smart Applications. Sens. Mater., 30, 4 (2018) pp 767-778 |
| Pousaneh,E.; Preuss,A.; Assim,Khaybar; Rueffer,T.; Korb,M.; Tittmann-Otto,J.; Hermann,S.; Schulz,S.E.; Lang,H.: Tetranuclear Y and Gd 2-Acetylcyclopentanoate Clusters: Synthesis and Their Use as Spin-Coating Precursors for Metal Oxide Film Formation for Field-Effect Transistor Fabrication. Journal of Rare Earths, p in press |
| Meinecke,C.; Korten,T.; Heldt,G.; Reuter,D.; Diez,St.; Schulz,S.E.: Fabrication and Operation of Protein-Powered Biocomputation Devices based on Nanostructured Networks. Smart System Integration, Dresden, 2018 Apr 11-12; Proceedings, pp 102-109 (ISBN 978-3-95735-082-4) |
| Ruelke,S.; Zorn,W.; Meinig,M.; Wecker,J.; Reuter,D.; Deicke,F.; Clausner,A.; Werner,T.: Functional Integration - Structure-Integrated Wireless Sensor Technology Targeting Smart Mechanical Engineering Applications. Smart System Integration, Dresden, 2018 Apr 11-12; Proceedings |
| Haugwitz,T.; Erben,J.; Neumann,N.; Reuter,D.; Plettemeier,D.: Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization. Silicon Photonics: From Fundamental Research to Manufacturing, Strasbourg (France), 2018 April 23 - 26; Proc. SPIE, 10686 (2018) |
| Pousaneh,E.; Korb,M.; Dzhagan,V.; Weber,M.; Noll,J.; Mehring,M.; Zahn,D.R.T.; Schulz,S.E.; Lang,H.: β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation. Dalton Transactions, 47, 30 (2018) p 10002–10016 |
| Stupak,Alexander P.; Blaudeck,T.; Zenkevich,E.I.; Krause,S.; von Borczyskowsi,Christian: The nature of non-FRET photoluminescence quenching in nanoassemblies from semiconductor quantum dots and dye molecules . Phys. Chem. Chem. Phys., 20, 27 (2018) pp 18579-18600 |
| Grossmann,T.D.; Kurth,S.; Otto,T.: Metamaterial based Sensor Approach for Passive Structural Health Monitoring of Lightweight Structures. 14. Chemnitzer Fachtagung Mikrosystemtech, Chemnitz, 2018 Oct 23-24 |
| Hofmann,L.; Zienert,A.; Schuster,J.; Schulz,S.E.: Pulse Current Electrochemical Deposition of Copper for Through Silicon Vias in MEMS: Experiment and Simulation. Mikrosystemtechnik in Deutschland, pp 46-47 (ISBN ISSN 2191-7183) |
| Hertel,S.; Schulte,W.; Weiser,M.; Becker,M.; Wiemer,M.; Otto,T.: Electrochemical deposition of reactive material systems for assembly and packaging applications. Mikro-Nano-Integration 2018, Dortmund, 2018 Oct 22-23; Proceedings, 92 (2018) pp 38-43 (ISBN ISBN 978-3-8007-4789-4) |
| Hertel,S.; Wuensch,D.; Wiemer,M.; Otto,T.; Friedrich,S.: Elektrochemische Abscheidung für die Leiterplatte. Elektronische Baugruppen und Leiterplatten 2018, Fellbach, 2018 Feb 20.-21.; Proceedings, 340 (2018) pp 203-209 (ISBN ISBN 978-3-96144-026-9) |
| Stoeckel,C.; Meinel,K.; Melzer,M.; Otto,T.: THIN FILM PIEZOELECTRIC ALUMINUM NITRIDE FOR PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCERS. IEEE Sensors 2018, Neu Dehli, Indien, October 28 - 31 |
| Martin,J.; Saupe,R.; Langenickel,J.; Moebius,M.; Heinrich,K.; Weiss,A.; Otto,T.: Nanostructures for smart systems. Semiconductor Technology International Conference (CSTIC) , Shanghai, China, 2018 Mar 11-12; IEEE Xplore, pp 1-4 (ISBN 978-1-5386-5308-1 ) |
| Streit,P.; Nestler,J.; Shaporin,A.; Graunitz,J.; Otto,T.: Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems. Journal of Micromechanics and Microengineering, 28, 6 (2018) (ISSN 09601317) |
| Teichert,F.; Zienert,A.; Schuster,J.; Schreiber,M.: Electronic transport through defective semiconducting carbon nanotubes. Journal of Physics Communications, 2 (2018) p 105012 (ISSN 2399-6528) |
| Du,N.; Manjunath,N.; Li,Y.; Menzel,S.; Linn,E.; Waser,R.; You,T.; Buerger,D.; Skorupa,I.; Walczyk,D.; Walczyk,C.; Schmidt,O.G.; Schmidt,H.: Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching. Physical Review Applied, 10, 5 (2018) pp 054025 - 054032 |
| Du,N.; Kiani,M.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Security aspects of BiFeO3 based memristive devices. MemoCIS 2018, Dresden (Germany), 2018 Sept 20-21; Poster |
| Du,N.; Kiani,M.; Li,Y.; Buerger,D.; Skorupa,I.; Schmidt,O.G.; Schmidt,H.: Implementation of deep learning using BiFeO3 based memristive devices. International Conference on Memristive Materials, Devices & Systems, Peking (China), 2018 Jul 3-6; Talk |
| Du,N.; Buerger,D.; Skorupa,I.; Schmidt,H.: Security aspects of BFO based memristive devices. SURREALIST Workshop 2018, Bremen (Germany), 2018 Jun 01; Talk |
| Kiani,M.; Du,N.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Novel neuromorphic circuit to drive perovskite oxide memristive artificial synapse. MemoCIS 2018, Dresden (Germany), 2018 Sept 20-21; Poster |
| Kiani,M.; Manjunath,N.; Du,N.; Buerger,D.; Skorupa,I.; Ecke,R.; Schmidt,O.G.; Schmidt,H.: Nonvolatile Impedance Switching in Electroforming-free BFO Memristors. CIMTEC 2018, Perugia (Italy), 2018 Jun 9-14; Talk |
| Rayapati,V.R.; Du,N.; Buerger,D.; Patra,R.; Skorupa,I.; Matthes,P.; Stoecker,H.; Schulz,S.E.; Schmidt,H.: Electroforming-free resistive switching in polycrystalline YMnO3 thin films. Journal of Applied Physics, 124, 14 (2018) pp 144102-1 - 144102-7 |
| Rayapati,V.R.; Buerger,D.; Mulyanto,B.; Zhai,B.; Du,N.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Modeling and design of BFO crossbar-structures. MemoCIS 2018, Dresden (Germany), 2018 Sept 20-21; Poster |
| Rayapati,V.R.; Buerger,D.; Du,N.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Resistive switching in yttrium manganite thin films. University of Electronic Science and Technology of China (UESTC), Chengdu (China), 2018 Jul 10; Talk (invited) |
| Rayapati,V.R.; Du,N.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Compositional dependent electroforming free and electroforming resistive switching in yttrium manganite thin films. International Conference on Memristive Materials, Devices & Systems, Peking (China), 2018 Jul 3-6; Talk |
| Rayapati,V.R.; Du,N.; Buerger,D.; Patra,R.; Skorupa,I.; Kowol,C.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Non-volatile memristive switching in multiferroic yttrium manganite thin films. MAM2018, Mailand (Italy), 2018 Mar 18-21; Talk |
| Du,N.; Kiani,M.; Buerger,D.; Rayapati,V.R.; Ecke,R.; Schulz,S.E.; Skorupa,I.; Schmidt,H.: Implementation of deep learning using BiFeO3 based memristive devices. University of Electronic Science and Technology of China (UESTC), Chengdu (China), 2018 Jul 10; Talk (invited) |
| Buerger,D.; Rayapati,V.R.; Du,N.; Skorupa,I.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Sputter-deposition of BFO-memristors on 8”-wafers: Technological barriers on the track to mass production. University of Electronic Science and Technology of China (UESTC), Chengdu (China), 2018 Jul 10; Talk (invited) |
| Buerger,D.; Rayapati,V.R.; Bankwitz,J.; Skorupa,I.; Du,N.; Ecke,R.; Schulz,S.E.; Schmidt,H.: Stoichiometry of PLD-grown and magnetron-sputtered memristive BiFeO3 thin films. International Conference on Memristive Materials, Devices & Systems, Peking (China), 2018 Jul 3-6; Poster |
| Buerger,D.; Baitule,S.; Rebohle,L.; Schulz,S.E.; Schmidt,H.: Flash lamp annealing of memristive BiFeO3 thin films simulated with COMSOL Multiphysics. MAM2018, Mailand (Italy), 2018 Mar 18-21; Talk |
| Buerger,D.; Rayapati,V.R.; Bankwitz,J.; Mulyanto,B.; Skorupa,I.; Bartzsch,H.; Gottfried,C.; Ecke,R.; Schulz,S.E.; Schmidt,H.: PLD- and Magnetron sputtering of memristive BiFeO3. MemoCIS 2018, Dresden (Germany), 2018 Sept 20-21; Poster |
| Buerger,D.; Schulz,S.E.; Schmidt,H.: Von resistiv bis memristiv – Rekonfigurierbare Perowskitschalter. Science meets Industry, Dresden (Germany), 2018 Mar 8; Talk |
| Dittrich,C.; Forke,R.; Hiller,K.; Kreutziger,P.; Kuerschner,R.; Meinecke,C.; Reuter,D.; Weidlich,S.; Streit,P.; Hahn,S.: Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau.. 14. Fachtagung Mikrosystemtechnik, Chemnitz, 2018 Oct 23-24; Proceedings, pp 12-17 (ISBN 978-3-00-060648-9) |
| Dittmar,N.; Kuechler,M.; Meinecke,C.; Reuter,D.; Otto,T.: Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff. . 14. Fachtagung Mikrosystemtechnik, Chemnitz, 2018 Oct 23-24; Proceedings, pp 125-130 (ISBN 978-3-00-060648-9) |
| Heldt,G.; Meinecke,C.; Steenhusen,S.; Korten,T.; Gross,M.; Domann,G.; Lindberg,F.; Reuter,D.; Diez,St.; Linke,H.; Schulz,S.E.: Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices.. 34th European Mask and Lithography Conference, Grenoble (France), 2018 Jun 19-20; SPIE Proceedings , 10775 (2018) |
| Moebius,M.; Martin,J.; Hartwig,M.; Baumann,R.R.; Otto,T.: Visualization of mechanical loads with semiconductor nanocrystals. European Advanced Materials Congress, Stockholm (Sweden), 2018 Aug 20-23; Proceedings (ISBN 978-91-88252-12-8) |
| Wuensch,D.; Schroeder,T.; Baum,M.; Hiller,K.; Forke,R.; Wiemer,M.; Weidenmueller,J.; Dogan,O.; Goertz,M.: 3D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate. Elektronische Baugruppen und Leiterplatten EBL 2018, Fellbach, 2018 Feb 20-21; Proceedings, DVS-Berichte Band 340 (2018) pp 249-254 (ISBN 978-3-96144-026-9) |
| Teichert,F.; Wagner,C.; Croy,A.; Schuster,J.: Influence of defect-induced deformations on electron transport in carbon nanotubes. Journal of Physics Communications, 2 (2018) p 115023 (ISSN 2399-6528) |
| Rodemund,T.S.: Elektronentransport in Graphen-Nanobändern mit Kantenrauheit. Bachelor Thesis, TU Chemnitz (Germany) |
| Noerdemann,A.: Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren. Bachelor Thesis, TU Chemnitz (Germany) |
| Teichert,F.: Quantum transport in defective carbon nanotubes at mesoscopic length scales. Dissertation, TU Chemnitz (Germany) |
| Fuchs,F.; Gemming,S.; Schuster,J.: NiSi2-Si interfaces and their role in tunneling based field-effect transistors: from the atomic structure to device characteristics. DPG-Frühjahrstagung der SKM, Berlin (Germany), Mar 11-16; Talk; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Heinze,G.; Fuchs,F.; Gemming,S.; Schuster,J.: Molecular Dynamics Simulation of the Oxidation Process of Thin Silicon Nanowires . DPG-Frühjahrstagung der SKM, Berlin (Germany), Mar 11-16; Poster; Abstract in: Verhandlungen der DPG (ISSN 0420-0195) |
| Boettger,S.; Joehrmann,N.; Bonitz,J.; Wunderle,B.; Schulz,S.E.; Hermann,S.: Scaling up Integration of Carbon Nanotubes into Micro-Electro-Mechanical Systems. Smart Systems Integration (SSI), Dresden, 2018 Apr 11-12; Proceedings, pp 243-249 (ISBN 978-3-95735-082-4) |
| Boettger,S.; Bonitz,J.; Kini,M.; Schulz,S.E.; Hermann,S.: Adding CNT-based functionality to MEMS: A technology demonstration for strain and IR sensors on wafer scale. Mikro-Nano-Integration 2018, Dortmund, 2018 Oct 22-23; Proceedings, 7 (2018) pp 19-22 (ISBN 978-3-8007-4789-4) |
| Hermann,S.; Mothes,S.; Hartmann,M.; Tittmann-Otto,J.; Schroeter,M.: Modeling and Technology Platform for Analog High Frequency Carbon Nanotube Transistors. DATE, Dresden, 2018 Mar 20; Talk |
| Hartmann,M.; Toader,M.,; Schubel,R.; Claus,M.; Jordan,R.; Schulz,S.E.; Hermann,S.: Performance Improvements of CNTFETs by Polymer-based Doping Control. NanoS&T, Potsdam , 2018 Oct 24-26; Talk |
| Meinecke,C.; Korten,T.; Heldt,G.; Reuter,D.; Diez,St.; Schulz,S.E.: Nanofabricated Networks used for Protein-Powered Biocomputation Devices . CAS 2018, 41st International Semiconductor Conference, Sinaia, Romania, 2018 Oct 10-12 |
| Sharma,A.; Almeida,M.; Matthes,P.; Koehler,N.; Busse,S.; Mueller,M.; Exner,H.; Schulz,S.E.; Zahn,D.R.T.; Salvan,G.: Magnetic Tunnel Junctions: Laser Annealing Versus Oven Annealing. IEEE Transactions on Magnetics, 99 (2018) |
| Sharma,A.; Almeida,M.; Busse,S.; Mueller,M.; Matthes,P.; Exner,H.; Schulz,S.E.; Zahn,D.R.T.; Salvan,G.: Novel Method of Setting Exchange Bias in Tunnel Magnetoresistance Devices with Laser Annealing. DPG-Frühjahrstagung, Berlin (Germany), 2018, Mar 11-16 |
| Sharma,A.; Almeida,M.; Selyshchev,O.; Dzhagan,V.; Matthes,P.; Schulz,S.E.; Zahn,D.R.T.; Salvan,G.: Spectroscopic Ellipsometry of Diffusion in Magnetic Multilayer Stacks. Joint European Magnetic Symposia (JEMS), Mainz (Germany), 2018 Sep 3-7; Poster |
| Matthes,P.; Almeida,M.; Koehler,N.; Busse,S.; Mueller,M.; Sharma,A.; Salvan,G.; Exner,H.; Schulz,S.E.: Magnetic Tunnel Junctions – Laser Annealing vs. Oven Annealing. EMSA – 12th European Magnetic Sensors and Actuators Conference, Athens,Greece, 2018 Jul 1-4; Talk |
| Sharma,A.; Almeida,M.; Matthes,P.; Ecke,R.; Schulz,S.E.; Zahn,D.R.T.; Salvan,G.: Magneto-optical Spectroscopy and Spectroscopic Ellipsometry of Co60Fe20B20 Thin Films. 10th Workshop Ellipsometry (WSE 10), Chemnitz (Germany), 2018 Mar 19-21; Talk |
| Hofmann,C.: Strukturierungsprozess für tiefe Nanogräben. Mikroelektronik Nachrichten, 70 (2018) |
| Rothe,T.: Stochastische Untersuchung von Oberflächeninteraktionen hochenergetischer Teilchen. Bachelor Thesis, TU Chemnitz (Germany) |
| Schmidt,H.: Boolean and Fuzzy logics realized with electroforming-free complementary BiFeO3 memristors. MemoCIS 2018, Dresden (Germany), 2018 Sept 20-21 |
| Schmidt,H.; Du,N.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.: Emerging Applications for Electroforming-free Perovskite Memristors. CIMTEC 2018 (14th International Ceramics Congress), Perugia (Italy), 2018 Jun 4-8; Talk |
| Schmidt,H.; Du,N.; Buerger,D.; Skorupa,I.; Ecke,R.; Schulz,S.E.: Transport properties of electroforming-free perovskite memristors. EMRS 2018 European Materials Research Society, Warschau (Polen), 2018 Sept 17-20; Invited Talk |
| Schmidt,H.: Electronic and ionic transport in metal/dielectric semiconducting oxide/metal structures. Technologies for Oxide Electronics, Spring School 2018, St. Feliu de Guixols (Spanien), 2018 Mar 15-17; Invited Talk |
| A.Kossmann; D.Adner; S.Schulze; Blaudeck,T.; Hermann,S.; C.Tegenkamp; Schulz,S.E.; H.Lang: Integration of covalent and non-covalent functionalized SWCNTs in FETs. ChemOnTubes, Biarritz, 2018 Apr 22-26 |
| Weigel,P.; Schueller,M.; Gratias,A.; Lipowski,M.; ter Meer,T.; Bardet,M.: Design of a Synthetic Jet Actuator for Separation Control. Aerospace Europe 6th CEAS Conference; CEAS Aeronautical Journal |
| Gratias,A.; Boettger,F.; Holland,M.; Schueller,M.: SAMPL - Secure Additive Manufacturing Platform. Fraunhofer Direct Digital Manufacturing Conference, DDMC, Berlin (Germany), 2018 Mar 14 |
| Rizzi,L.; Zienert,A.; Schuster,J.; Koehne,M.; Schulz,S.E.: Electrical Conductivity Modeling of Graphene-based Conductor Materials. ACS Appl. Mater. Interfaces, 10 (2018) pp 43088-43094 (ISSN 1944-8244) |
| Georg Heinze: Molekulardynamische Simulation der Oxidation dünner Siliziumnanodrähte: Einfluss von Draht- und Prozessparametern auf die Struktur. Bachelor Thesis, TU Chemnitz (Germany) |
| Thomas Joseph: Simulation of Thin Silicon Layers: Impact of Orientation, Confinement and Strain. Master Thesis, TU Chemnitz (Germany) |
| Moritz Engl: Atomistische Simulationen der Diffusionsprozesse in SiGe Verbindungen. Bachelor Thesis, TU Chemnitz (Germany) |
| Monteiro Diniz Reis,D.; Rzepka,S.; Hiller,K.: Reliability Testing of Integrated Low-Temperature PVD PZT Films. 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018); Microelectronics Reliability, 88–90 (2018) pp 835-839 (ISSN 00262714) |
| Weissbach,M.; Auerswald,E.; Hildebrandt,M.; Rzepka,S.: Multiscale residual stress analysis in thin film layers. Konferenz Smart Systems Integration SSI, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 515-518 (ISBN 978-3-95735-082-4) |
| Gadhiya,G.; Braemer,B.; Rzepka,S.: Automated Virtual Prototyping for Fastest Time-to-Market of New System in Package Solutions. 7th Electronic System-Integration Technology Conference (ESTC) 2018, Dresden (Germany), 2018 Sep 18-21; Proceedings, pp 1-7 |
| Roessel,K.; Berger,B.; Mussenbrock,T.; Melzer,M.; Stoeckel,C.; Zimmermann,S.: MEMS based IEDF/IADF sensing: Kinetic analysis of the ion dynamics inside the sensor. 71st Annual Gaseous Electronics Conference, Portland, Oregon, 2018 Nov 5-9; Proceedings |
| C.Zeiner; M.Polomoshnov; M.Mueller; E.Sowade; A.Guenther; N.Neumann; Seifert,T.; Blaudeck,T.; Hermann,S.; Baumann,R.R.; Wiemer,M.; Otto,T.: Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors . Smart Systems Integration (SSI), Dresden, 2018 Apr 11-12 pp 39-45 (ISBN 978-3-95735-082-4) |
| Auersperg,J.; Auerswald,E.; Collet,C.; Dean,T.; Vogel,D.; Winkler,T.; Rzepka,S.: Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor. Microelectronics Reliability, 87 (2018) pp 238-244 |
| Auersperg,J.; Albrecht,J.; Rzepka,S.: On the TSV Delamination Risk Dependence on TSV Distance and Silicon Crystal Orientation. 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE, Toulouse (France), 2018 Apr 15-18; Proceedings (ISBN 978-1-5386-2359-6, 978-1-5386-2358-9, 978-1-5386-2360-2) |
| Dudek,R.; Hildebrandt,M.; Kreyssig,K.; Rzepka,S.; Novak,M.; Beart,K.; Gruebl,W.; Schuch,B.: Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen. 9. DVS/GMM-Tagung, Fellbach (Germany), 2018 Feb 20-21; Proceedings DVS Berichte Elektronische Baugruppen und Leiterplatten EBL 2018, 340 (2018) pp 84-94 (ISBN 978-3-96144-026-9) |
| Dudek,R.; Hildebrandt,M.; Kreyssig,K.; Rzepka,S.; Novak,M.; Gruebl,W.; Schuck,B.: Long-Term Thermal Fatigue Testing of Solder Joints and Related Fatigue Life Predictions. EuroSimE 2018, Toulouse (France), 2018 Apr 15-18; Proceedings (ISBN 978-1-5386-2359-6, 978-1-5386-2358-9, 978-1-5386-2360-2) |
| Dudek,R.; Hildebrandt,M.; Rzepka,S.; Fries,T.; Doering,R.; Seiler,B.; Ortmann,R.W.: Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. Microelectronics Reliability, 83 (2018) pp 162-172 (ISSN 0026-2714) |
| Dudek,R.; Doering,R.; Rzepka,S.; Herberholz,T.; Feil,D.; Seiler,B.; Scheiter,L.; Schellenberg,C.; Fritzsche,S.: Stress Analyses in HPC-Soldered Assemblies by Optical Measurement and FEA. ESTC, 7th Electronics System-Integration Technology Conference, Dresden (Germany), 2018 Sep 18-21; Proceedings |
| Dudek,R.; Doering,R.; Hildebrandt,M.; Tank,F.; Rzepka,S.: 3rd level reliability" – Test- and simulation results on new test setups. 6th 'European Expert Workshop on Reliability of Electronics and Smart Systems' (EuWoRel), Berlin (Germany), 2018 Oct 1-2; Proceedings |
| Dudek,R.; Otto,A.; Doering,R.; Schroeder,T.; Baum,M.; Rzepka,S.; Murayama,K.; Herberholz,T.; Seiler,B.; Wilke,K.; Trodler,J.: Analyses on Transient Liquid Phase Interconnects. ECPE Workshop “The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management”, Nuremberg (Germany), 2018 Nov 20-21 |
| Dudek,R.; Hildebrandt,M.; Kreyssig,K.; Rzepka,S.; Doering,R.; Seiler,B.; Fries,T.; Zhang,M.; Ortmann,R.W.: 3rd Level” Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use. EPTC (Electronics Packaging Technology Conference) 2018, Singapore, 2018 Dec; Proceedings |
| Hager,M.; Gromala,P.; Wunderle,B.; Rzepka,S.: Affordable and Safe high performance vehicle computers with ultra-fast on-board Ethernet for automated driving. 22nd International Forum on Advanced Microsystems for Automotive Applications, Berlin (Germany), 2018 Sep 11-12; in: Dubbert, J., Müller, B., Meyer, G.: Advanced Microsystems for Automotive Applications 2018 - Lecture Notes in Mobility, Smart Systems for Clean, Safe and Shared Road Vehicles, 1 (2018) pp 56-68 (ISBN 978-3-319-99761-2, 978-3-319-99762-9 (eBook), 2196-5544) |
| Rzepka,S.; Otto,A.; Vogel,D.; Dudek,R.: Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches. ASME Journal of Electronic Packaging, 140 (March 2018), 1 (2018) pp 010903-1-12 (ISSN 1043-7398) |
| Rzepka,S.; Dudek,R.; Wunderle,B.: Thermo-mechanical Reliability of the High-Performance Vehicle Computers Enabling Fully Autonomous Driving. ASME InterPACK 2018 (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems), San Francisco/CA (USA), 2018 Aug 28-30 |
| Rzepka,S.: High-speed Connectivity, Temperature Management, Reliability and Functional Safety of the High Performance Vehicle Computers. SIA CESA 5.0 - International Conference on Automotive Electronics Components and Systems, Paris (France), 2018 Dec 5-6 |
| Schacht,R.; Rzepka,S.: Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung. 9. GMM/DVS-Fachtagung Elektronische Baugruppen und Leiterplatten, Fellbach (Germany), 2018 Feb 21; DVS-Berichte 340, pp 167-173 (ISBN 978-3-96144-026-9) |
| Schacht,R.; Rzepka,S.: Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation. 17th IEEE ITHERM Conference, San Diego (USA), 2018 Mai 31; Proceedings (ISBN 978-1-5386-1272-9) |
| Schacht,R.: Transient Coupled Electro-Thermal SPICE System Simulation Using the Example of a D²PAK Application. ECPE Workshop - The Future of Simulation in Power Electronics Packaging for Thermal and Stress Management, Nürnberg (Germany), 2018 Nov 20 |
| Otto,A.; Rzepka,S.; Wunderle,B.: Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications. InterPACK 2018, San Francisco, CA (USA), 2018 Aug 27- 30; Proceedings of the ASME 2018 – International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Projekte Trace & CosmoDU |
| Otto,A.; Schroeder,T.; Dudek,R.; Wang,W.-S.; Baum,M.; Wiemer,M.; Doering,R.; Kurian,J.J.; Murayama,K; Oi,K.; Koyama,T.; Rzepka,S.: Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (Industrie-Projekt mit Fa. Shinko), Nuremberg (Germany), 2018 Jun 5-7 |
| Mitra,D.; Mitra,K.Y.; Dzhagan,V.; Pillai,N.; Zahn,R.T.; Baumann,R.R.: Work Function and Conductivity of Inkjet-Printed Silver Layers: Effect of Inks and Post-treatments. Journal of Electronic Materials, Jan 2018, 47, 3 (2018) pp 2135-2142 (ISBN 0361-5235, 1543-186X (Online ISSN)) |
| Correia,V.; Mitra,K.Y.; Castro,H.; Rocha,J.G.; Sowade,E.; Baumann,R.R.; Lanceros-Mendez,S.: Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development. Journal of Manufacturing Processes, Jan 2018, 31 (2018) pp 364-371 (ISSN 1526-6125) |
| Cherian,D.; Mitra,K.Y.; Hartwig,M.; Malinowski,P.E.; Baumann,R.R.: Fabrication of Organic Photo Detectors Using Inkjet Technology and Its Comparison to Conventional Deposition Processes. IEEE Sensors Journal, Jan 2018, 18, 1 (2018) pp 94-105 (ISBN 1530-437X, 1558-1748, 2379-9153) |
| Oliveira,J.; Correia,V.; Sowade,E.; Etxebarria,I.; Rodriguez,R.D.; Mitra,K.Y.; Baumann,R.R.; Lanceros-Mendez,S.: Indirect X-ray Detectors Based on Inkjet-Printed Photodetectors with a Screen-Printed Scintillator Layer. ACS Appl. Mater. Interfaces, Mar 2018, 10 (2018) p 12904−12912 |
| Mitra,K.Y.; Sunil,K.; Hartwig,M.; Sowade,E.; Xu,Z.; Baumann,R.R.; Zichner,R.: Process Development of Large Area R2R Printing and Sintering of Conductive Patterns by Inkjet and Infra-Red Technologies Tailored for Printed Electronics. Journal of Imaging Science and Technology, Jul 2018, 62, 4 (2018) pp 040407 (1-12) (ISBN 1062-3701 (Print), 1943-3522 (Online)) |
| Willert,A.; Tran-Le,A-T.; Mitra,K.Y.; Clair,M.; Costa,C.M.; Lanceros-Méndez,S.; Baumann,R.R.: Printed Batteries: Materials, Technologies and Applications. Printed Batteries: Materials, Technologies and Applications, Chapter 2 - Printing Techniques for Batteries, Feb 2018, pp 22-55 (ISBN 978-1-119-28789-6) |
| Likotiko,E.; Petrov,D.; Mwangoka,J.; Hilleringmann,U.: Real time solid waste monitoring using cloud and sensors technologies. The Online Journal of Science 2018, 8, 1 (2018) pp 106-116 |
| Vollbrecht,J.; Oechsle,P.; Stepen,A.; Hoffmann,F.; Paradies,J.; Meyers,T.; Hilleringmann,U.; Schmidtke,J.; Kitzerow,H.: Liquid crystalline dithienothiophene derivatives for organic electronics. Organic Electronics, 61 (2018) pp 266-275 (ISSN 1566-1199) |
| Meyers,T.; Reker,J.; Vidor,F.F.; Hilleringmann,U.: Deposition methods for C8-BTBT in flexible TFTs. Smart Systems Integration, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 442-445 (ISBN 978-3-95735-082-4 ) |
| Reker,J.; Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade process. Smart Systems Integration 2018, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 472-475 (ISBN 978-3-95735-082-4 ) |
| Geneiss,V.; Lueke,T.; Hedayat,C.; Wolf,M.; Janek,F.; Meissner,T.; Barth,M.; Eberhardt,W.; Zimmermann,S.; Otto,T.: Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed- Signal Systems with MID Technology. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden (Germany), Apr 11-12; Proceedings, pp 488-491 (ISBN 978-3-95735-082-4) |
| Hangmann,C.; Hedayat,C.; Hilleringmann,U.; Otto,T.: Stochastic Analyzes and Monte-Carlo Simulations of nonlinear and non-ideal Mixed-Signal Phase-Locked Loops. Smart System Integration - International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 492-495 (ISBN 978-3-95735-082-4) |
| Drude,D.; Schoeenhoff,M.; Hilleringmann,U.: Modular thermoelectric generator for universal waste heat recovery. IDTechEx Europe, Berlin (Germany), 2018 Apr 11-12; Proceedings/Talk |
| Meyers,T.; Reker,J.; Vidor,F.F.; Schirmer,M.; Mai,T.; Gerngross,M.; Kaiser,C.; Hilleringmann,U.: Characterization of an amorphous perfluorinated copolymer as dielectric for flexible electronics. The 44th International Conference on Micro and Nano Engineering (MNE2018), Copenhagen (Denmark) , 2018 Sep 24-27; Proceedings |
| Reker,J.; Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Inverter circuits in complementary technology using inorganic nanoparticle-based TFTs. 2018 Fall Meeting European Materials Research Society (E-MRS), Warsaw (Poland) , 2018 Sep 17-20; Proceedings |
| Meyers,T.; Reker,J.; Temme,J.; Vidor,F.F.; Hilleringmann,U.: Self-aligned organic thin-film transistors for flexible electronics. 5th SMEOS Conference, Skukuza (South Africa) , 2018 Oct 8-10; Proceedings |
| Meyers,T.; Reker,J.; Vidor,F.F.; Vollbrecht,J.; Kitzerow,H.; Paradies,J.; Hilleringmann,U.: Improved organic thin-film transistor performance by dielectric layer patterning. 5th SMEOS Conference, Skukuza (South Africa) , 2018 Oct 8-10; Proceedings |
| Reker,J.; Meyers,T.; Vidor,F.F.; Hilleringmann,U.: Inorganic p-channel thin-film transistors using CuO nanoparticles. 5th SMEOS Conference, Skukuza (South Africa) , 2018 Oct 8-10; Proceedings |
| Hilleringmann,U.; Reker,J.; Vidor,F.F.; Meyers,T.; Bezuidenhout,P.H.; Joubert,T.-H.: Nanoparticles and Organic Semiconductors for Flexible Electronics. 5th SMEOS Conference, Skukuza (South Africa), 2018 Oct 8-10; Proceedings |
| Vidor,F.F.; Meyers,T.; Reker,J.; Mueller,K.; Wirth,G.I.; Hilleringmann,U.: Mechanical deformation on nanoparticle-based thin-film transistors. 5th SMEOS Conference, Skukuza (South Africa), 2018 Oct 8-10; Proceedings |
| Petrov,D.; Meyers,T.; Reker,J.; Hilleringmann,U.: Doctor blade system for the deposition of thin semiconducting films. 5th SMEOS Conference, Skukuza (South Africa) , 2018 Oct 8-10; Proceedings |
| Schwabe,T.; Balke,A.; Bezuidenhout,P.H.; Reker,J.; Meyers,T.; Joubert,T.-H.; Hilleringmann,U.: Oxygen detection with zinc oxide nanoparticle structures. 5th SMEOS Conference, 8.-10. Oct. 2018, , Skukuza (South Africa), 2018 Oct 8-10; Proceedings |
| Meyers,T.; Reker,J.; Petrov,D.; Vidor,F.F.; Hilleringmann,U.: Influence of the electrode material on the performance of BTBT-based thin-film transistors. 7. GMM Workshop Mikro-Nano-Integration, Dortmund (Germany) , 2018 Oct 22-23; Proceedings |
| Reker,J.; Meyers,T.; Petrov,D.; Vidor,F.F.; Hilleringmann,U.: Performance analysis of CuO nanoparticle-based thin-film transistors. 7. GMM Workshop Mikro-Nano-Integration, Dortmund (Germany), 2018 Oct 22-23; Proceedings |
| Petrov,D.; Narayan,R.S.; Hilleringmann,U.: Portable Sensor System for UV-Irradiation Measurements. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI 2018), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 468-471 (ISBN 978-3-95735-082-4) |
| Becker,T.E.; Vidor,F.F.; Wirth,G.I.; Meyers,T.; Reker,J.; Hilleringmann,U.: Time Domain Electrical Characterization in Zinc Oxide Nanoparticle Thin-Film Transistors. 2018 IEEE 19th Latin-American Test Symposium (LATS), Sao Paulo (Brazil), 2018 Mar 12-14; Proceedings |
| Schmidt,M.; Metz,G.; Hedayat,C.; Otto,T.; Petrov,D.: RFID Units for a Product Based Control of Industrial Production Systems. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems (SSI 2018), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 484-487 (ISBN 978-3-95735-082-4) |
| Heinrich,K.; Martin,J.; Langenickel,J.; Selbmann,F.; Otto,T.: Integration of quantum dot sensitized solar cells onto technical textiles. European Advanced Materials Congress, Stockholm (Sweden), 2018 Aug 20-23; proceedings, p 118 (ISBN ISBN 978-91-88252-12-8) |
| Al Farisi,M.S.; Hertel,S.; Wiemer,M.; Otto,T.: Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Toward Microsystems Application. Micromachines 2018, art. 589, 9, 11 (2018) (ISSN 2072-666X) |
| Vogel,K.; Roscher,F.; Wiemer,M.; Zimmermann,S.; Otto,T.: Reactive bonding with oxide based reactive multilayers. Smart Systems Integration Conference 2018 (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 71-78 (ISBN 978-3-95735-082-4) |
| Heinrich,K.; Martin,J.; Mehlhorn,H.; Langenickel,J.; Selbmann,F.; Hartwig,M.; Otto,T.: Challenges in transferring quantum dot sensitized solar cells on technical textiles. Smart Systems Integration Conference 2018 (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 416-419 (ISBN 978-3-95735-082-4) |
| Baum,M.; Saeidi,N.; Vogel,K.; Schroeder,T.; Selvam,K.G.M.; Wiemer,M.; Otto,T.: An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization . International Ultrasonic Symposium, Kobe (Japan), 2018 Oct 22-25; Proceedings, 18326814 (2018) (ISBN 1948-5727, 1948-5719, 978-1-5386-3425-7, 978-1-5386-3426-4) |
| Schueller,M.; Lipowski,M.; Weigel,P.; Symmank,C.; Meynerts,L.; Walther,M.; Dziuba,F.; Otto,T.; Goetze,U.; Kroll,L.: Active flow control in wind turbines - integration technologies and assessment of economic effects. Smart Systems Integration Conference 2018 (SSI), Proceedings, pp. 500-503 , Dresden (Germany), 2018 Apr 11-12; Proceedings, pp 500-503 (ISBN 978-3-95735-082-4) |
| Hedayat,C.; Hilleringman,U.; Lange,S.; Schroeder,D.; Otto,T.: Induktive Ortungsverfahren zur Lokalisierung von Kleinstfunksensoren in kleinen Messvolumina. 23th Leibniz-Conference 2018 – Lokaliserungstechniken für IoT, Telematik und Industrie 4.0, Lichtenwalde (Germany), 2018 Nov 22-23; Proceedings, Abstracts der Konferenzbeiträge |
| Zimmermann,S.; Haase,M.; Lang,N.; Roepke,J.; Schulz,S.E.; Otto,T.: The role of plasma analytics in leading-edge semiconductor technologies. Volume 58, Issue 5 18th Topical Conference for Plasma Technology , Göttingen (Germany), 2017 Feb 20–22; Contributions to Plasma Physics 2018, 58, 5 (2018) pp 367-376 (ISSN 1521-3986) |
| Selbmann,F.; Baum,M.; Wiemer,M.; Joseph,Y.; Otto,T.: Parylene as a dielectric material for electronic applications in space. 2018 IEEE, 68th Electronic Components and Technology Conference (ECTC 2018), San Diego, CA, USA, 2018 May 29-Jun 1; Proceedings, 17991851 (2018) pp 2205-2210 (ISBN 2377-5726, 978-1-5386-4999-2, 978-1-5386-5000-4) |
| Wolf,M.; Janek,F.; Meissner,T.; Wigger,B.; Barth,M.; Guenter,T.; Eberhardt,W.; Zimmermann,A.; Geneiss,V.; Lueke,T.; Hedayat,C.; Otto,T.: Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing. 13th International Congress Molded Interconnect Devices (MID), 6 pages, Würzburg (Germany), 2018 Sep 25-26; Proceedings, IEEE Xplore Digital Library, 18232735 (2018) (ISBN 978-1-5386-4933-6, 978-1-5386-4932-9, 978-1-5386-4934-3) |
| Al Farisi,M.S.; Hertel,S.; Wiemer,M.; Otto,T.: Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl Ionic Liquid for microsystems application. International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Kuwana (Japan), 2018 Apr 17-21; Proceedings, Conference Proceedings, IEEE xplore, pp 415-418 |
| Otto,T.: Trends and Tendencies, New Examples,. Smart Systems Integration (SSI), Dresden (Germany), 2018 Apr 11-12; Proceedings, Microsystems Technology in Germany 2018, pp 16-17 (ISSN 2191-7183) |
| Hiller,K.; Helke,C.; Seifert,M.; Seiler,J.; Kurth,S.; Meinig,M.; Wecker,J.: Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten. 14. Chemnitzer Fachtagung Mikrosystemtechnik, Chemnitz, 2019 Oct 23-24; Proceedings, pp 1-7 (ISBN ISBN 978-3-00-060648-9) |
| Hertel,S.; Wiemer,M.; Otto,T.: Galvanische Aluminium-Abscheidung auf unerschiedlichen Startschichten für die Leiterplatten- und Mikrosystemtechnik. Jahrbuch der Oberflächentechnik, 74 (2018) pp 50-64 (ISBN ISBN 978-3-87480-349-6) |
| Meinecke,C.; Korten,T.; Heldt,G.; Reuter,D.; Diez,S.; Schulz,S.E.: Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer. 14. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik, Chemnitz, 2018 Oct 23.-24.; Proceedings, pp 110-115 (ISBN 978-3-00-060648-9) |
| Thalheim,R.; Polomoshnov,M.; Zichner,R.: Printing of dielectric and conductive patterns on non-planar surfaces using dispensing and inkjet. 34th International Conference on Digital Printing Technologies (NIP), Dresden (Germany), 2018 Sep 23-27; Talk |
| Thalheim,R.; Zichner,R.: Functional inkjet printing on 3D-objects. The Inkjet Conference 2018, Düsseldorf (Germany), 2018 Oct 16-17; Talk |