Publications
For publications of years before 2003 please see our annual reports.
Year 2023
Papers
| Cirulis I.; Zschenderlein U.; Braun S.; Radestock M.; Pantou R.; Vogel,K.; Selbmann,F.; Kurth,S.; Wunderle,B.; Kuhn H.: Investigation of Gold and Aluminum Flip-chip Bonding for Quantum Device Integration. 24th IEEE European Microelectronics Packaging Conference (EMPC), Hinxton (UK), 2023 September 11-14 |
| Dick,D.; Fuchs,F.; Gemming,S.; Schuster,J.: Investigating the influence of stoichiometry fluctuations on the electronic properties of ultra-scaled HBTs. DPG-Frühjahrstagung , Dresden (Germany), 2023 Mar 26-31; Poster presentation |
| Dittmar,N.; Andleeb,S.; Bonitz,J.; Helke,C.; Haase,M.; Reuter,D.: Transferring reflowed photoresist structures into Si3N4 on Si by reactive ion etching. PESM, Grenoble (France), 2023 Jun 19-20; Proceedings, 13th (2023) p P07 |
| Dittmar,N.; Berger,B.; Melzer,M.; Kuechler,M.; Meinecke,C.; Haase,M.; Reuter,D.: Measuring Ion Energy Distributions by Retarding Field Energy Analyzer and Using Low-Energy Ions for Si-ALE by Cl2. IITC/MAM , Dresden (Germany), 2023 May 22-25; Proceedings, 26th (2023) p P19 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Schermer,S.: Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023 May 30 - June 02 pp 795-799 |
| Franz,M.; Daniel,M.; Xiao,H.; Schulz,S.E.: Poster: Development of a Cobalt Atomic Layer Deposition Process using Co2(CO)6HC≡CC5H11 as Precursor. EUROCVD/Baltic ALD 2023, Leuven, 29.5.-02.06.2023; Zenodo |
| Franz,M.; Junghans,R.; Schulz,S.E.: Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden, 22.-25.05.2023; Proceedings of the IEEE ... International Interconnect Technology Conference., pp 1-3 (ISSN 2380-6338) |
| Franz,M.; Junghans,R.; Schulz,S.E.: Poster: Fabrication of local areas of high aspect ratio silicon structures using metal-assisted chemical etching - MACE. 2023 IEEE International Interconnect Technology Conference (IITC) & IEEE Materials for Advanced Metallization Conference (MAM), Dresden, 22.-25.05.2023; Zenodo |
| Franz,M.; Safian Jouzdani,M.; Kassner,L.; Daniel,M.; Stahr,F.; Schulz,S.E.: Low temperature atomic layer deposition of cobalt using dicobalt hexacarbonyl-1-heptyne as precursor. Beilstein Journal of Nanotechnology, 14 (2023) pp 951-963 (ISSN 2190-4286) |
| Fuchs,F.; Schuster,J.: Atomistic and network models for graphene based macromaterials: role of intercalation, defects and dopants . DPG-Frühjahrstagung, Dresden, 2023 Mar 26-31; Talk; Abstract in: Verhandlungen der DPG |
| Haase,M.; Dittmar,N.; Kuechler,M.; Helke,C.; Reuter,D.: On the feature extraction of time-resolved optical emission spectra. PESM, Grenoble (France), 2023 Jun 19-20; Proceedings, 13th (2023) p P09 |
| Haase,M.; Dittmar,N.; Kuechler,M.; Reuter,D.: A simple analytical model to describe time-resolved concentrations of plasma species. IITC/MAM, Dresden (Germany), 2023 May 22-25; Proceedings, 26th (2023) p 11.3 |
| Havryliuk,Y.; Dzhagan,V.; Anatolii,K.; Selyshchev,O.; Hann,J.; Zahn,D.R.T.: Raman Spectroscopy and Thermoelectric Characterization of Composite Thin Films of Cu2ZnSnS4 Nanocrystals Embedded in a Conductive Polymer PEDOT:PSS. Nanomaterials, 13, 1 (2023) p 41 |
| Helke,C.; Reinhardt,M.; Arnold,M.; Schwenzer,G.; Haase,M.; Wachs,M.; Gossler,C.; Goetz,J.; Keppeler,D.; Wolf,B.; Schaeper,J.; Salditt,Tm; Moser,T.; Schwarz,U.T.; Reuter,D.: On the Fabrication and Characterization of Polymer-Based Waveguide Probes for Use in Future Optical Cochlear Implants. Materials, 16, 1 (2023) pp 1-17 |
| Herd,T.; Streiter,R.; Langer,J.; Voigt,S.; Rothe,T.: Cable detection and position estimation in a camera-based drone guidance system for autonomous sensor node attachment on transmission lines. Smart Systems Integration Conference and Exhibition, Bruges (Belgium), 2023 March 28-30; Proceedings (accepted) |
| Hoffmann,M.; Schmitt,P.; Wittemeier,S.; Schaller,F.; Shaporin,A.; Stoeckel,C.; Geneiss,V.; Forke,R.; Hedayat,C.; Hilleringman,U.; Kuhn,H.; Zimmermann,S.: Storing MEMS interfaces without electrical auxiliary energy for long-time monitoring. 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS), Muenchen (Germany), 2023 Jan 15-19; Proceedings |
| Hofmann,C.; Kroll,M.; Hiller,K.: Induktives Solid-Liquid-Interdiffusionsbonden auf Basis miniaturisierter Induktionsspulen für die Mikrosystemtechnik. Schweissen und Schneiden, 8 (2023) pp 554 - 561 |
| Huber,M.; Hu,X.; Zienert,A.; Schuster,J.: Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing . DPG-Frühjahrstagung, Dresden (Germany), 2023 Mar 26-31; Talk; Abstract in: Verhandlungen der DPG |
| Huber,M.; Zienert,A.; Schuster,J.: Modeling a Wet Wafer Surface Processing Chain. IITC / MAM, Dresden (Germany), 2023 May 22-25; Poster presentation |
| Huber,M.; Zienert,A.; Schuster,J.: Modeling a Wet Wafer Surface Processing Chain. IITC / MAM, Dresden (Germany), 2023 May 22-25; 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), pp 1-3 |
| Jaeckel,L.; Zienert,A.; Lorenz,E.; Huber,M.; Schuster,J.: Multi-scale simulation of epitaxial processes. IITC / MAM, Dresden (Germany), 2023 May 22-25; Poster presentation |
| Joehrmann,N.; Stoeckel,C.; Wunderle,B.: MEMS Cantilever on High-Cycle Fatigue Testing of thin Metal Films. EuroSimE, Graz, Austria, 16-19 April 2023; 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) |
| Langenickel,J.; Selbmann,F.; Meinecke,C.; Weiss,A.; Roscher,F.; Reuter,D.; Kuhn,H.: Fabrication and integration of quantum dot based emitters for smart mechanical watches. Smart Systems Integration Conference (SSI), Bruges (Belgium), 2023 March 28-30 |
| Margherita Bolognesi; Mario Prosa; Michael Toerker; Laura Lopez Sanchez; Martin Wieczorek; Alexander Elferink; Emilia Benvenuti; Paola Pellacani; Morschhauser,A.; Mark Whatton; Etienne Haenni; David Kallweit; Franco Marabelli; Jeroen Peters; Stefano Toffanin: A fully Integrated Miniaturized Optical Biosensor for Fast and Multiplexing Plasmonic Detection of high- and Low-molecular Weight Analytes. Advanced Materials, p Accepted Author Manuscript 2208719 |
| Meinecke,C.; Heldt,G.; Blaudeck,T.; Lindberg,F.W.; van Delft,F.C.M.J.M.; Rahman,M.A.; Salhotra,A.; Mansson,A.; Linke,H.; Korten.T.; Diez,S.; Reuter,D.; Schulz,S.E.: Nanolithographic Fabrication Technologies for Network-Based Biocomputation Devices. Materials, 16, 1 (2023) |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Characterization of the ion angle distribution function in low-pressure plasmas using a microelectromechanical system. DPG-Frühjahrstagung 2023 der Sektion Materie und Kosmos (SMuK), Dresden, Germany, 2023 Mar 20-24 |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Measurement of the ion angle distribution function in low-pressure plasmas using a microelectromechanical system. plasma etch and strip in microtechnology - PESM2023, Grenoble, France, 2023 June 19-20; Proceedings |
| Nong,J.P.; Nawroth,P.; Selbmann,F.; Bremer,M.; Guenther,B.; Adam,J.; Joseph,Y.; Fischer,S.: Lignin sulfonate-based hydrogel films for ion sensing. European Polymer Journal, 196 (2023) p 112317 |
| Nong,J.P.; Nawroth,P.; Selbmann,F.; Joseph,Y.; Fischer,S.: Binding of lignin sulfonate hydrogel to glass surfaces for application as sensor material. Spring Meeting of the American Chemical Society (ACS Spring), , Indianapolis (USA), 2023 March 26-30 |
| Rochala,P.; Hofmann,C.; Kroll,M.; Panhale,S.; Javed,R.; Hiller,K.: Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components. Electronics, 12, 3247 (2023) pp 1-24 |
| Rodemund,T.; Teichert,F.; Hentschel,M.; Schuster,J.: Quantum transport in graphene nanoribbon networks: complexity reduction by a network decimation algorithm. New Journal of Physics, 25 (2023) p 013001 |
| Roehlig,D.; Kuhn,E.; Thraenhardt,A.; Blaudeck,T.: Simultaneous occurrence and compensating effects of multi-type disorder in two-dimensional photonic structures. Nano Select, 4, 6 (2023) pp 368-385 |
| Roehlig,D.; Kuhn,E.; Thraenhardt,A.; Blaudeck,T.: Front Cover: Nano Select 06/2023. Nano Select 06/2023, 4, 6 (2023) pp 353-353 |
| Rothe,T.; Sayyed,M.; Langer,J.; Gottfried,K.; Schuster,J.; Stoll,M.: Towards knowledge-enhanced process models for semiconductor fabrication. IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM), Dresden, Germany pp 1-3 |
| Rothe,T.; Schaal,S.; Langer,J.; Schuster,J.; Sampurno,J.; Philipossian,A.; Stoll,M.; Gottfried,K.; Kuhn,H.: Can empirical physics models improve machine learning performance using planarization data?. 21st European Advanced Process Control and Manufacturing Conference (apc|m), Bruges (Belgium), 2023 March 28-30; Oral presentation |
| Rothe,T.; Zienert,A.; Gottfried,K.; Schuster,J.; Shaporin,A.; Langer,J.; Stoll,M.; Kuhn,H.: Towards knowledge-enhanced process modeling for CMP. European CMP & WET Users Group Meeting, Buchs (Switzerland), 2023 Apr 20-21; Oral Presentation |
| Scharf,S.; Notz,S.; Abdeldayem,M.; Thomas,R.; Weber,M.; Mehring,M.; Franz,M.; Rittrich,D.; Schulz,S.E.; Lang,H.: Alkaline earth metal and lanthanide ethylene glycol carboxylates for metal oxide layer formation by spin coating. Materials Chemistry and Physics, 301 (2023) p 127634 (ISSN 0254-0584) |
| Schlagmann,M.; Stoenner,J.; Selbmann,F.; Hess,S.; Otto,T.: Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming. Smart Systems Integration Conference (SSI), Bruges (Belgium), 2023 March 28-30 |
| Selbmann,F.; Paul,S.D.; Satwara,M.; Roscher,F.; Wiemer,M.; Kuhn,H.; Joseph,Y.: Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates. Micromachines, 14(2) (2023) p 415 |
| Selbmann,F.; Roscher,F.; Top M.; Hoffmann M.; Toerker E.; Wiemer,M.; Joseph Y.; Kuhn H.: Ultra-Thin Paryleen PCBs for Highly Flexible Sensors and Considerations for Their Mass Production. FLEX Conference & Exhibition, San Francisco (USA), 2023 July 11-13 |
| Selbmann,F.; Roscher,F.; Wiemer,M.; Kuhn,H.; Joseph,Y.: Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems. 24th IEEE European Microelectronics Packaging Conference (EMPC), Hinxton (UK), 2023 September 11-14 |
| T.Joseph; Fuchs,F.; Schuster,J.: Electronic structure simulation of thin silicon layers: Impact of orientation, confinement, and strain. Physica E: Low-dimensional Systems and Nanostructures, 146 (2023) p 115522 (ISSN 1386-9477) |
| Zienert,A.; Langer,J.; Rothe,T.; Wachner,D.; Hofmann,L.; Gottfried,K.: Automatic Analysis of CMP Dishing in Via Arrays from AFM Images. European CMP & WET Users Group Meeting, Buchs (Switzerland), 2023 Apr 20-21; Oral Presentation |
| Zienert,A.; Langer,J.; Wachner,D.; Hofmann,L.; Gottfried,K.; Schuster,J.: Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023 May 22-25; Proceedings, pp 1-3 |
| Zienert,A.; Langer,J.; Wachner,D.; Hofmann,L.; Gottfried,K.; Schuster,J.: Automatic Detection of Via Arrays in AFM Images for CMP Dishing Evaluation. 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), Dresden (Germany), 2023 May 22-25; Oral presentation |
