| Forke,R.; Shaporin,A.; Hahn,S.; Weidlich,S.; Kuechler,M.; Wuensch,D.: On the Feasibility of the BDRIE-HS* Technology for a MEMS Gyroscope. 2025 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Lindau (Germany), 2025 May 10-13; Proceedings (ISBN 979-8-3503-8932-6) |
| Huber,M.; Zienert,A.; Schuster,J.: Evolution of water layers on wafer surfaces during bond chamber evacuation. J. Vac. Sci. Technol. B, 43, 4 (2025) p 043001 |
| Shaporin,A.; Forke,R.; Wecker,J.; Tank,F; Seifert,T.; Hiller,K.; Schumann,A.-K.; Stoeckel,C.; Reuter,D.: Optomechanical Inertial Sensors Based on Ring Resonators: Design Approaches and Technology. 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025 Apr 6-9; Proceedings, 26 (2025) pp 1-6 |
| Dick,D.; Fuchs,F.; Gemming,S.; Schuster,J.: Quantum confinement and stoichiometry fluctuations in nm-thin SiGe layers. DPG Frühjahrestagung, Regensburg, 2025 Mar 16-21; Abstract in: Verhandlungen der DPG |
| Manoharan,G.; Hann,J.; Selyshchev,O.; Meinecke,C.; Otto,T.; Schulz,S.E.; Zahn,D.R.T.; Blaudeck,T.: FluidFM Deposition of Semicondutor Quantum Dots From Aqueous Dispersions. Nano Select, p 0:e70011 |
| Havryliuk,Y.; Dzhagan,V.; Ivakhno-Tsehelnyk,O.; Karnaukhov,A.; Hann,J.; Zahn,D.R.T.: Raman spectra and Seebeck coefficient of Cu2ZnSnS4 nanocrystals/PEDOT:PSS composite films. Thin Solid Films, 815 (2025) p 140618 |
| Franz,M.; Jaeckel,L.; Hu,X.; Kassner,L.; Thurm,C.; Rittrich,D.; Helke,C.; Schuster,J.; Daniel,M.; Stahr,F.; Rueffer,N.; Kretschmer,R.; Schulz,S.E.: Low-temperature ALD of metallic cobalt using the CoCOhept precursor: Simulation-assisted process development for deposition on temperature sensitive 3D-structures. Journal of Vacuum Science & Technology A, 43, 2 (2025) p 022412 (ISSN 0734-2101) |
| Qu,J; Hu,X.; Deconinck,M; Liu,L; Cheng,Y; Zhao,R; Wang,M; Zhang,H; Vaynzof,Y; Schuster,J.; Cabot,A; Leistner,K; Li,F: Trisodium Citrate-Assisted Synthesis of Edge-Abundant Nickel-Iron Layered Double Hydroxides for Efficient Oxygen Evolution Reaction. ChemCatChem, 17 (2025) p e202401667 |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Characterization of the ion angle distribution function in low-pressure plasmas using a micro-electromechanical system. 1st German-Japanese Plasma Processing Workshop for Advanced Microelectronics, Bochum, 2025 Feb 13-14 |
| Marc Stevens; Fuchs,F.; AndréHermannsdorfer; Teichert,F.; Martin Koehne; Schuster,J.; Hermann,S.: Wafer level drop casting and AlCl3 doping for highly conductive thin graphene paths. Diamond and Related Materials, 153 (2025) (ISSN 0925-9635) |
| Melzer,M.; Meinel,K.; Stoeckel,C.; Hemke,T.; Mussenbrock,T.; Zimmermann,S.: Characterization of the ion angle distribution function in low-pressure plasmas using a micro-electromechanical system. Journal of Vacuum Science & Technology A, 43 (2025) p 013002 |
| Moeller,H.; Inamdar,A.; van Driel,W.D.; Bredberg,J.; Hille,P.; Knoll,H.; Vandevelde,B.: Chapter Digital Twin Technology in Electronics. in the book: Recent Advances in Microelectronics Reliability, ed. by van Driel,W. D.; Presse.K.; Soyturk,M. (2024) pp 283-322 |
| Mishra,M.; Dubey,V.; Hackett,T.A.; Kashyap,M.K.: Chapter Artificial Intelligence and Machine Learning in Clinical Research and Patient Remediation. in the book: Artificial Intelligence and Machine Learning in Healthcare, ed. by Yadav,D.K.; Gulati,A. (2024) pp 39-57 (ISBN 978-981-99-6471-0, 978-981-99-6474-1, 978-981-99-6472-7) |
| Stoeckel,C.; Mulay,S.; Meinel,K.; Seiler,J.; Ullmann,D.; Reuter,D.: Chapter Piezoelektrische, mikromechanische Ultraschallwandler mit adaptiver akustischer Kanalgeometrie und Chipgröße. in the book: 17. Dresdner Sensor-Symposium (ISBN ISBN 978-3-910600-04-1) |
| Saeidi,N.: Capacitive Micromachined Ultrasonic transducers: overview and application example underwater object detection.
Mikromechanische Ultraschallwandler (MUT). GMA/ITG-Fachtagung Sensoren und Messsysteme 2024, Nürnberg, 2024 Jun 11-12 |
| Saeidi,N.; Valente,V.: CMOS/MEMS Integration Approaches for Miniaturized Sensors.. |
| Vishwanatha,M.; Selvam,K.; Saeidi,N.; Wiemer,M.; Kuhn,H.: Object detection using Capacitive Micromachined Ultrasonic Transducers (CMUTs). Smart Systems Integrations Conference (SSI), , Hamburg, 2024 April 16-18 |
| Andleeb,A.; Sudhil Deshpande,V.; Selvam,K.; Saeidi,N.; Guttman,M.; Deutschbein,C.: Design and Modeling of Mesoscale Polymere Based Acoustic Lenses for Miniaturized Ultrasonic Transducers . Smart Systems Integrations Conference (SSI), , Hamburg, 2024 April 16-18 |
| Selvam,K.; Saeidi,N.; Morschhauser,A.; Schermer,S.; Zhou,C.; Kinner,R.; Wiemer,M.; Kuhn,H.: Preliminary Investigation of Using Perminex Resist for Low Temperature Adhesive Bonding . Smart Systems Integrations Conference (SSI), , Hamburg, 2024 April 16-18 |
| Saeidi,N.; Selvam,K.; Vishwanatha,V.; Wiemer,M.; Kuhn,H.: High temperature liquid level monitoring using Capacitive Micromachined Ultrasound Transducer (CMUT). IEEE, Taipei, Taiwan, 2024 September 22-26 ; 2024 IEEE Ultrasonics, Ferroelectrics, and Frequency Control Joint Symposium (UFFC-JS) (ISSN 1099-4734) |
| Vishwanatha,M.; Selvam,K.; Saeidi,N.; Wiemer,M.; Kuhn,H.: Underwater sensing applications using Capacitive Micromachined Ultrasonic Transducers (CMUTs). IEEE, Taipei, Taiwan, 2024 September 22-26 (ISSN 1099-4734) |
| Diex,K.; Jaeckel,T.; Wuensch,D.; Vogel,K.; Bonitz,J.; Hanisch,A.; Wiemer,M.; Schulz,S.E.: Investigations on low-temperature thermocompression bonding of passivated aluminum for enhanced wafer-level packaging and heterogeneous integration. 2024 Smart Systems Integration Conference and Exhibition (SSI), Hamburg (Germany), 2024 Apr 16-18; Proceedings (ISBN 979-8-3503-8877-0, 979-8-3503-8878-7) |
| Blangiardi,F.; Beltrán,B.R.; Zhao,Z.; Streiter,R.; Roessler,M; Langer,J.; Heinkel,U.; Kuhn,H.: Exploring Data Fusion for AI-Based People Counting in a Static Public Transport Vehicle Using Multiple IR-UWB Transceivers. 2024 Sensor Data Fusion: Trends, Solutions, Applications (SDF), Bonn (Germany), 2024 Nov 25-27; Proceedings (ISBN 979-8-3315-2744-0, 979-8-3315-2745-7) |
| Saupe,R.; Martin,J.; Otto,R.; Weiss,A.; Stock,V.; Shimizu,Y.: Advanced Spectral Sensing Methods for Process Monitoring Applications. 2024 Conference of Science and Technology for Integrated Circuits (CSTIC), , Shanghai (China), 2024 Mar 17-18; Proceedings (ISBN 979-8-3503-6219-0, 979-8-3503-6220-6) |
| Huber,M.; Hu,X.; Zienert,A.; Schuster,J.; Schulz,S.E.: Modeling the temporal evolution and stability of thin evaporating films for wafer surface processing. The Journal of Chemical Physics, 157, 8 (2024) (ISBN 0021-9606, 1089-7690) |
| Kozłowska,A.; Leśniewska-Matys,K.; Stankiewicz,,R.; Bogucki,O.; Saeidi,N.; Selvam,K.; Wiemer,M.; Kuhn,H.; Panda,J.; Kalbac,M.; Ehsani,M.; Joseph,Y.: Preliminary optical characterization of integrated electrically biased suspended graphene membranes. SPIE OPTO, San Francisco (California, United States), 2024 Mar 12; Proceedings Volume 12888, 2D Photonic Materials and Devices VII; 1288802 (2024), 12888 (2024) |
| Hedayat,C.: Mit unserer Technologie wäre Airpower möglich. Magazin Macwelt, 8 (2024) pp 14-15 |
| Schroeder,D.; Hedayat,C.; Weiss,A.; Kuhn,H.: Near-Field Scanning Applied to Automotive Use-Cases and the Combination with Field Simulations. 4th European Automotive Reliability, Test and Safety Workshop (eARTS), The Hague (Netherlands), 2024 May 23-24; Proceedings |
| Schroeder,D.; Hedayat,C.; Weiss,A.; Kuhn,H.: A Hybrid Approach Using Near-Field Scanning in Combination with Field Simulations. ETTC 2024 - European Test and Telemetry Conference, Nürnberg (Germany), 2024 Jun 11-13; Proceedings, Chapter HIL & HTB - challenges and solutions (ISBN 978-3-910600-02-7) |
