| Braun,S.; Loebel,S.; Haumann,I.; Becker,M.; Suess,K.-T.: Aluminium als Material für die Leiterplattentechnik – Neuerungen in der prozesstechnischen Umsetzung
. Elektronische Baugruppen und Leiterplatten, Fellbach, 2024 Mar 05-06; GMM Fachbericht 107, 12 (2024) pp 177-183 (ISBN 978-3-8007-6266-8) |
| Braun,S.; Wiemer,M.; Schulz,S.E.: Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level. Micromachines, 15, 746 (2024) pp 1-18 |
| Behl,C.; Behlert,R.; Seiler,J.; Helke,C.; Shaporin,A.; Hiller,K.: Characterization of Thin AlN/Ag/AlN-Reflector Stacks on Glass Substrates for MEMS Applications. Micro, 4, 1 (2024) pp 142-156 |
| Schermer,S.; Helke,C.; Reinhardt,M.; Hartmann,S.; Tank,F.; Wecker,J.; Heldt,G.; Voigt,A.; Reuter,D.: Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach. Micro and Nano Engineering, 23, 100264 (2024) pp 1-6 |
| Bickmann,C.; Meinecke,C.; Korten,T.; Sekulla,H.; Helke,C.; Blaudeck,T.; Reuter,D.; Schulz,S.E.: Fabrication of switchable biocompatible, nano-fluidic devices using a thermoresponsive polymer on nano-patterned surfaces. Micro and Nano Engineering, 23, 100265 (2024) pp 1-5 |
| Forke,R.; Tsukamoto,T.; Shaporin,A.; Weidlich,S.; Buelz,D.; Hahn,S.; Tanaka,S.; Hiller,K.: Advancement in the MEMS Gyroscope from a Vibrating Tuning Fork to a Tuned Ring with Comb Electrodes. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: High Sensitivity Mode-Localized Ring Resonator With Tunable Sensitivity. 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), Hiroshima (Japan), 2024 Mar 25-28; Proceedings (ISBN 979-8-3503-1669-8) |
| Tsukamoto,T.; Forke,R.; Weidlich,S.; Buelz,D.; Shaporin,A.; Hiller,K.; Tanaka,S.: Mode Localization and Frequency Modulation Sensing Using Superposed in-Phase and Anti-Phase Oscillations. IEEE MEMS, Austin, TX (USA), 2024 Jan 21-25; Proceedings (ISBN 979-8-3503-5792-9) |
| Roehlig,D.; Kuhn,E.; Teichert,F.; Traehnhardt,A.; Blaudeck,T.: Function phononic crystals. Europhysics Letters, 145, 2 (2024) p 26001 (ISBN 0295-5075, 1286-4854) |
| Shaporin,A.; Wecker,J.; Runge,J.; Voigt,S.; Melzer,M.; Kurth,S.; Hiller,K.: High precision electrostatic MEMS actuators for in-plane Fabry-Pérot gas sensors. 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania, Italy, 2024 Apr 7-10; Proceedings, pp 1-5 |
| Tank,F.; Wecker,J.; Stoeckel,C.; Helke,C.; Schermer,S.; Shaporin,A.; Hiller,K.; Reuter,D.: Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP). SPIE OPTO, San Francisco, California, United States, 2024 Jan 27 - Feb 1; Proceedings Volume 12889, Integrated Optics: Devices, Materials, and Technologies XXVIII |
| Haase,M.; Dittmar,N.; Kneidinger,A.; Schuster,P.; Bachhuber,F.; Helke,C.; Reuter,D.: Combining nano-scale imprint lithography and reactive ion etching to fabricate high-quality surface relief gratings. Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII, Proc. SPIE 12898 (2024) p 128980L |
| Helke,C.; Seiler,J.; Meinig,M.; Grossmann,T.D.; Bonitz,J.; Haase,M.; Zimmermann,S.; Ebermann,M.; Kurth,S.; Reuter,D.; Hiller,K.: Integration of (Poly-Si/Air)n Distributed Bragg Reflectors in a 150 mm Bulk Micromachined Wafer-Level MOEMS Fabrication Process.. IEEJ Trans Elec Electron Eng. |
| Langenickel,J.; Rodrıguez,L.P.; Martin,J.; Moebius,M.; Michaelis,D.; Munzert,P.; Weiss,A.; Danz,N.: Fabrication and characterization of quantum dot based LEDs with enhanced emission properties by micro cavities. SPIE OPTO, San Francisco, California, United States, 2024 Jan 25-30; Proceedings Volume 12906, Light-Emitting Devices, Materials, and Applications XXVIII |
| Hofmann,C.; Wuensch,D.; Otto,T.; Kraeusel,V.; Landgrebe,D.; Froehlich,A.; Kroll,M.; Kimme,J.: Verfahren zum Erwärmen einer Vielzahl von elektrisch leitfähigen Strukturen sowie Vorrichtung zur Verwendung in dem Verfahren. DE 10 2019 206 248 A1
AT 521456 B1 |
| Jaeckel,L.; Zienert,A.; Zeun,A.; Seidel,A.-S.; Schuster,J.: Surface chemistry models for low temperature Si epitaxy process simulation in a single-wafer reactor . Journal of Vacuum Science & Technology A, 42, 2 (2024) p 022702 |
| Huber,M.; Schuster,J.; Schmidt,O.G.; Kuhn,H.; Karnaushenko,D.: A Mechanical–Electrical Model to Describe the NegativeDifferential Resistance in Membranotronic Devices. Phys. Status Solidi Rapid Res. Lett., p 2300397 |
| Lorenz,E.; Gehre,J.; Jaeckel,L.; Schuster,J.: Harnessing Particle Raytracing for Real-Time Vapor Deposition Simulations in Evolving Topographies
. MNE, Berlin, 2023 Sep 26; Proceedings |
| Cirulis,I.; Zschenderlein,U.; Braun,S.; Radestock,M.; Pantou,R.; Vogel,K.; Selbmann,F.; Kurth,S.; Wunderle,B.; Kuhn,H.: Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration. 24th European Microelectronics and Packaging Conference EMPC, Cambridge, 2023 September 11-14; Proceedings, 24 (2023) pp 1-5 (ISBN 978-0-9568086-9-1) |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Wiemer,M.; Fischer,T.; Hanisch,A.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Schulz,S.E.; Ghosal,S.; Hofmann,L.: Process and Design Challenges for Hybrid Bonding. ESC Transaction, 112, 3 (2023) pp 73-81 |
| Dubey,V.; Wuensch,D.; Gottfried,K.; Kinner,R.; Suroshe,R.; Kuechler,M.; Stephan,R.; Schermer,S.; Helke,C.; Haase,M.; Reuter,D.; Wiemer,M.; Schulz,S.E.: Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), Singapore, 2023 Dec 5-8; IEEE Xplore, pp 469-473 |
| Kuenzel,P.; Forke,R.; Hiller,K.; Schwarz,U.; Ziegenhardt,R.; Voigt,S.; Weidlich,S.; Shaporin,A.; Hahn,S.; Kuechler,M.; Kuhn,H.: Technologien mit hohem Aspektverhältnis für Vibrationssensoren mit großer Bandbreite, hoher Empfindlichkeit und geringem Rauschen. Mikrosystemtechnik Kongress, Dresden (Germany), 2023 Okt 23-25; Proceedings, pp 797-801 (ISBN ISBN 978-3-8007-6203-3) |
| Roehlig,D.; Kuhn,E.; Thraenhardt,A.; Blaudeck,T.: Simultaneous occurrence and compensating effects of multi-type disorder in two-dimensional photonic structures. Nano Select, 4, 6 (2023) pp 368-385 (ISSN 2688-4011) |
| Arnold,M.G.; Gessmann-Nuissl,D.; Blaudeck,T.; Karnaushenko,D.; Schmidt,O.G.: Miniaturized Smart Systems Securing Credence Attributes and Responsibility in Products and Supply Chains. 2023 Smart Systems Integration Conference and Exhibition (SSI), Brugge (Belgium), 2023 Mar 28-30; Proceedings, pp 1-5 (ISBN 979-8-3503-2506-5, 979-8-3503-0231-8) |
| Thalheim,R.; Willert,A.; Mitra,D.; Zichner,R.: Novel and Efficient Methodology for Drop Placement Accuracy Testing of Robot-Guided Inkjet Printing onto 3D Objects. 568; Machines 2023, 11, 5 (2023) (ISSN 2075-1702) |
| Sayyed,M.A.; Donekal,V.; Rothe,T.; Haase,M.; Langer,J.; Kuhn,H.: Virtual Metrology Model for Partially Labelled Data: Application of Semi-Supervised Learning. Dresden Microelectronics Academy (DMA), Poster |
| Moeller,H.; Knoll,H.; Hille,P.; Rzepka,S.: Simulation driven investigation of production related thermo-mechanical effects for the behavior of a SO16-System-in-Package sensor. International Conference and Exhibition on Smart Systems Integration (SSI) 2023, Bruges (Belgium), 2023 Mar 28-30; Poster, Proceedings of the Smart Systems Integration Conference and exhibition, Conference Record Number: 58917, pp 181-183 (ISBN 979-8-3503-0231-8) |
| Moagar-Poladian,G.; Mitra,K.Y.; Mitra,D.; Thalheim,R.; Zichner,R.; Moagar-Poladian,V.; Pachiu,C.; Dumbravescu,N.; Vasilache,D.: Semiconductor-to-Metal-like Transition Behavior under Temperature Variation for Inkjet Printed PEDOT:PSS Tracks Embedded in Polymer. Physica Status Solidi A 2023, 220, 17 (2023) pp 2300266 (1 - 10) (ISSN 1862-6300) |
| Mitra,M.; Mitra,K.Y.; Thalheim,R.; Zichner,R.: Inkjet-Printed Flexible Thin-Film Thermal Sensors for Detecting Elevated Temperature Range. Physica Status Solidi A 2023, pp 2300562 (1-10) (ISBN 1862-6300, 1862-6319) |
