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Center for Microtechnologies

Cooperation between ZfM and Fraunhofer ENAS

Since 1998 a strong co-operation exists between the Fraunhofer Institute for Electronic Nano System ENAS (till June 30th 2008 Chemnitz Branch of Fraunhofer Institute for Reliability and Microintegration). Prof. Buller pointed out in his talk during the ground breaking ceremony of the building of Fraunhofer ENAS: "With the new building and the new equipment in Chemnitz we support developments in nano and micro system technology, which belongs to German key technologies. This will help Saxon businessmen to transfer research results in products ready for the market in short time."

Building of Fraunhofer ENAS

The main focus of the institute is the smart systems integration. Smart systems are self-sufficient intelligent technical systems or subsystems with advanced functionality, enabled by underlying micro- nano- and bio-systems and other components. They are able to sense, diagnose, describe, qualify and manage a given situation, their operation being further enhanced by their ability to mutually address, identify and work in consort with each other. They are highly reliable, often miniaturized, networked, predictive and energy autonomous.

The main research activities of the Fraunhofer ENAS can be divided in the following topics:

  • Multi Device Integration:
    development of MEMS/NEMS, prototyping of sensor and actuator devices, integration of such devices together with micro and nanoelectronic components to systems, design of components and systems, development and implementation of test and characterization of MEMS/NEMS
  • System Packaging: core competence in development and application of wafer bonding processes for MEMS packaging (chip and wafer bonding including combinations of new materials and bonding at low temperatures), 3D-patterning technologies for silicon and non silicon materials, CMP (chemical mechanical polishing)
  • Back-end of Line (BEOL): advanced metallization systems for the leading edge technology, 3D-integration and interconnects, new materials (cupper, low k materials, CNTs) for advanced metallization, simulation of process and equipment
  • Reliability of Micro and Nanosystems: thermo-mechanical reliability of micro and nano components in high tech systems, core competence combination of thermo-mechanical simulation with advanced experimental methods
  • Printed Functionalities: utilizing inkjet and mass printing technologies for efficient industrial fabrication processes of printed components for smart systems, technology development and adapted measurement technique

The department managers of the department Multi Device Integration and Back-end of Line work as honorary professors at the Technische Universität Chemnitz. In general the strategic alliance between the Fraunhofer ENAS and the Center for Microtechnologies as described ensures strong synergies in the technology and device development.

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