BMBF: Verbesserung der Performance von Ics durch Integration von Kupfer und low-k Dielektrika - PERFECT
Dr. Stefan E. Schulz
Prof. Thomas Geߟner
Infineon Technologies AG Munich, DaimlerChrysler AG Ulm, Dresden University of Technology, University of Hannover
01.11.2000 to 28.02.2004
Application of Copper interconnects for mobile communication IC?s, power devices and micrometer wave devices; Integration of organic low k dielectrics into Copper Damascene metallization