SAB: Miniaturisiertes modulares digitales 3D+-Sensorsystem mit optimierter AVT für die intelligente Zustandsüberwachung – MIMODI-3D+

With new approaches in sensor technology, packaging and connection technology, as well as data acquisition and processing, the MIMODI project can make a significant contribution to improving predictive condition and process monitoring on highly dynamic systems. In cooperation, the project partners AMAC, viimagic, ZfM and ENAS are developing a particularly small, thin and yet sensitive MEMS (< 400 µm) as a sensor element for a broadband (20 kHz) vibration sensor with significantly improved performance parameters compared to the state of the art.

One of the innovations of this project is that the sensor element can enable a combined measurement of vibration (V) and shock (S) by combining different stiffnesses. The primary sensor system consists of the MEMS and a proprietary sensor ASIC developed at AMAC. This MSSC-ASIC will be completely revised in the project, the design will be adapted to the properties of the new MEMS (MEMS-ASIC-Co-Design), and the production will be carried out in a particularly thin technology (? 360 ?m). Together with the MEMS, the new ASIC is mounted as a stack setup in a miniaturized housing. This requires the development of an innovative package by the partner viimagic. The vibration sensor in the SMD housing forms the basis for the single-axis 1D+ sensor module.  Due to the modular design of optimized 1D+ sensors, both single-axis and three-axis (combination of 3x 1D+ sensors) intelligent sensor modules can be built. Furthermore, AMAC develops the hardware and firmware of the intelligent sensor module with digital data preprocessing in a microprocessor or, at a higher level, in an FPGA.