SAB: Technologieplattform für innovative, kompakte und vollintegrierte System in Package - KoVoPack

In the joint project, processes and systems as well as demonstrators for a technological platform are being developed. This platform makes it possible to produce fully integrated and compact system-in-package solutions in the optical, RF and radar application areas. In the above-mentioned areas of application, there is a need to significantly improve the functional parameters of the hardware used and to produce highly compact, compact solutions in the smallest of spaces. This requires the integration of new materials and substrates and the use of new composite techniques. At the same time, compatibility with existing CMOS production, production of SAW RF components, as well as environmental compatibility and conservation of resources must be ensured.

An initial focus of the project is the process, technology and plant development for binary and ternary phase change materials (PCM) based on GeTe and GeSbTe for the production of RF switches and optical filters.

In contrast to CMOS RF switches, an improvement in the Ron-Coff switching ratio is expected here. In contrast to classical spectrometers and MEMS solutions, no moving components are required for optical applications. Another focus is on Surface Acoustic Wave (SAW) components, which are also used, for example, for RF applications (filters), but also for sensor applications. Here, the focus is on the development and processing of new substrate and composite materials, such as Si/LiTaO3, Si/LiNbO3.All of these and many other applications require a package that is as compact and hermetically sealed as possible; Often, a minimum internal pressure is required in the package to achieve maximum performance. The third focus of the project is the research and development of compact solutions for encapsulation and electrical contacting based on wafer composite techniques and their characterization.