Industrielle Gemeinschaftsforschung (IGF): Induktives Sinterwerkzeug für den Multi-Die-Attach leistungselektronischer Komponenten - InduMDA

Power modules are important components, for instance, in electric drives or converters for energy systems. To meet the increasing demands of the electronics industry for performance and miniaturization in combination with new materials such as SiC or GaN, continuous developments in heat dissipation, electrical conductivity and ampacity are required. Packaging technologies, especially between die and substrate (die attach), play a major role. Therefore, the goal is to develop an inductive sintering process at chip level that, in contrast to convective particle sintering, allows components to be bonded without global heating at low pressure application and in a short process time. A similar technology for single die sintering has already been developed in the preliminary project InSight. The goal of InduMDA is to transfer these findings to an industrially relevant multi-die sintering process. The sub-steps to achieve this goal are the development of an inductive sintering tool, the optimization of the paste to increase the efficiency of the inductive sintering process, and the adaptation as well as optimization of the existing process conditions to the multi-die setup. The research project will provide a novel heating and bonding process in the rapidly growing field of particle sintering to numerous small and medium-sized German companies from the relevant value-added stages of raw materials, systems, equipment, application and integration in the fields of power electronics, microelectronics, microsystems technology and mechanical engineering.