BMWK-DLR / IGF: Aluminium-Pillars als neues Material im Advanced Packaging - AlPacka
Prof. Karla Hiller
Silvia Braun, Fraunhofer ENAS
Projektbegleitender Ausschuss: NB Technologies GmbH, ams-OSRAM International GmbH, EDC Electronic Design Chemnitz GmbH, Microfab Service GmbH, Chemnitzer Werkstoffmechanik GmbH, viimagic GmbH, SGS Institut Fresenius GmbH, IoLiTec Ionic Liquids Technologies GmbH, Carl Zeiss SMT GmbH, CiS Forschungsinstitut für Mikrosensorik GmbH, Berliner Nanotest und Design GmbH, Finetech GmbH & Co. KG, IHP Leibniz Institut für innovative Mikroelektronik
01.11.2023 to 30.04.2026
This project aims to achieve Aluminum pillar bonding using ultrasonic Flip Chip bonding. The process includes the electroplating of Al pillars and its simulation. Furthermore, the bonding process will be simulated regarding the pressure deviation for different design to gain a better understanding of the main influencing factors at different designs. Utilizing simulations at different stages, the electrode design can be optimized prior actual wafer fabrication. The goal is to demonstrate the bonding of different devices using the Al pillars.