BMWE-DLR / IGF: Induktives Waferbonden von Mikrosystemen mittels innovativer aluminiumbasierter Fügezusatzwerkstoffe – InduAlloy

The reduction in process times and thermal load on the devices enables new wafer stack concepts, higher integration densities, and significant energy savings. InduAlloy will provide German SMEs across value chain stages—from precursor materials and sputtering to structuring, components, equipment, and applications—with access to research capabilities, such as alloy development, experimental setups, high-frequency engineering, and simulation, to address the interdisciplinary challenge of materials engineering, electrical process engineering, and microtechnology. Typically, these capabilities are not in-house.