Within this research field we develop novel processes for nanopatterning, 3D micromachining, and fabricating integrated optical devices. These advanced techniques are pivotal in shaping the future of electronics, photonics, and various interdisciplinary fields. Each plays a crucial role in pushing the boundaries of miniaturization and enhancing the performance of electronic devices.
Nanopatterning involves the precise manipulation of materials at the nanoscale by electron beam lithography and nanoimprint lithography. Nanopatterning is essential for creating nanoscale features in integrated circuits, optical devices and NEMS.
3D micromachining extends the capabilities of traditional micromachining processes by enabling the fabrication of three-dimensional structures. This technique is particularly valuable in the creation of complex microelectromechanical systems (MEMS) integrated optics and microfluidic devices. Important processes are gray scale lithography, deep reactive ion etching and wet etching.
Integrated optical devices integrate various optical components on a single chip. These devices leverage nanopatterning and 3D micromachining techniques to fabricate waveguides, resonators, gratings and other optical elements with precise dimensions. The integration of these components enhances the performance of optical communication systems, sensors, and imaging devices. Photonic integrated circuits (PIC), for example, is a notable area where integrated optical devices are making significant strides, allowing for the efficient integration of photonic elements with existing electronic components.
The synergy of nanopatterning, 3D micromachining, and integrated optical devices opens up new possibilities for developing compact, high-performance systems with applications ranging from telecommunications to healthcare.
Research Topics
- Nanopatterning
- 3D Micromachining
- Fabrication of integrated optical devices
Selected Publications
Helke,C.; Reinhardt,M.; Arnold,M.; Schwenzer,G.; Haase,M.; Wachs,M.; Gossler,C.; Goetz,J.; Keppeler,D.; Wolf,B.; Schaeper,J.; Salditt,T; Moser,T.; Schwarz,U.T.; Reuter,D.: On the Fabrication and Characterization of Polymer-Based Waveguide Probes for Use in Future Optical Cochlear Implants, Materials, 16, 1 (2023) pp 1-17
Langenickel,J.; Selbmann,F.; Meinecke,C.; Weiss,A.; Roscher,F.; Reuter,D.; Kuhn,H.: Fabrication and integration of quantum dot based emitters for smart mechanical watches, Smart Systems Integration Conference (SSI), Bruges (Belgium), 2023 March 28-30
Helke,C.; Canpolat-Schmidt,C.H.; Heldt,G.; Schermer,S.; Hartmann,S.; Voigt,A.; Reuter,D.: "Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit" , Micro and Nano Engineering , 100189, 19 (2023) pp 1-6 (ISBN ISSN 2590-0072)
Meinecke,C.; Heldt,G.; Blaudeck,T.; Lindberg,F.W.; van Delft,F.C.M.J.M.; Rahman,M.A.; Salhotra,A.; Mansson,A.; Linke,H.; Korten.T.; Diez,S.; Reuter,D.; Schulz,S.E.: Nanolithographic Fabrication Technologies for Network-Based Biocomputation Devices, Materials, 16, 1 (2023)
Haase,M.; Dittmar,N.; Kuechler,M.; Reuter,D.: A simple analytical model to describe time-resolved concentrations of plasma species, IITC/MAM, Dresden (Germany), 2023 May 22-25; Proceedings, 26th (2023) p 11.3